CN104865792A - 转印方法及热纳米压印装置 - Google Patents

转印方法及热纳米压印装置 Download PDF

Info

Publication number
CN104865792A
CN104865792A CN201510155419.9A CN201510155419A CN104865792A CN 104865792 A CN104865792 A CN 104865792A CN 201510155419 A CN201510155419 A CN 201510155419A CN 104865792 A CN104865792 A CN 104865792A
Authority
CN
China
Prior art keywords
film
fine pattern
processed
forming
mask layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510155419.9A
Other languages
English (en)
Chinese (zh)
Inventor
细见尚希
古池润
山口布士人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Co Ltd filed Critical Asahi Chemical Co Ltd
Publication of CN104865792A publication Critical patent/CN104865792A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2033/00—Use of polymers of unsaturated acids or derivatives thereof as moulding material
    • B29K2033/04—Polymers of esters
    • B29K2033/08—Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Laminated Bodies (AREA)
  • Drying Of Semiconductors (AREA)
CN201510155419.9A 2012-05-08 2013-04-30 转印方法及热纳米压印装置 Pending CN104865792A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012106937 2012-05-08
JP2012-106937 2012-05-08
JP2012135005 2012-06-14
JP2012-135005 2012-06-14
CN201380024210.8A CN104271332B (zh) 2012-05-08 2013-04-30 转印方法及热纳米压印装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201380024210.8A Division CN104271332B (zh) 2012-05-08 2013-04-30 转印方法及热纳米压印装置

Publications (1)

Publication Number Publication Date
CN104865792A true CN104865792A (zh) 2015-08-26

Family

ID=49550676

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201510155419.9A Pending CN104865792A (zh) 2012-05-08 2013-04-30 转印方法及热纳米压印装置
CN201380024210.8A Expired - Fee Related CN104271332B (zh) 2012-05-08 2013-04-30 转印方法及热纳米压印装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201380024210.8A Expired - Fee Related CN104271332B (zh) 2012-05-08 2013-04-30 转印方法及热纳米压印装置

Country Status (9)

Country Link
US (1) US20150111005A1 (enExample)
EP (2) EP2848391B1 (enExample)
JP (2) JP5560377B2 (enExample)
KR (2) KR101531143B1 (enExample)
CN (2) CN104865792A (enExample)
IN (1) IN2014MN02313A (enExample)
MY (1) MY171653A (enExample)
TW (2) TWI598211B (enExample)
WO (1) WO2013168634A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105818556A (zh) * 2016-03-25 2016-08-03 南京京晶光电科技有限公司 一种采用纳米压印工艺在基材表面加工cd纹的方法
CN108987573A (zh) * 2017-06-05 2018-12-11 Tcl集团股份有限公司 量子点薄膜的转印方法
TWI656965B (zh) * 2016-04-20 2019-04-21 奇景光電股份有限公司 壓印設備及壓印方法
CN109808319A (zh) * 2017-11-20 2019-05-28 Tcl集团股份有限公司 一种印章及其制备方法与量子点转印方法
US10549494B2 (en) 2016-04-20 2020-02-04 Himax Technologies Limited Imprinting apparatus and imprinting method
TWI889807B (zh) * 2020-05-01 2025-07-11 日商東京威力科創股份有限公司 圖案形成方法及圖案形成系統

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI436405B (zh) * 2011-06-23 2014-05-01 旭化成電子材料股份有限公司 And a method for producing a layered product for forming a fine pattern and a fine pattern forming layer
JP6441036B2 (ja) * 2014-11-13 2018-12-19 旭化成株式会社 転写方法
TWI696108B (zh) * 2015-02-13 2020-06-11 日商半導體能源研究所股份有限公司 功能面板、功能模組、發光模組、顯示模組、位置資料輸入模組、發光裝置、照明設備、顯示裝置、資料處理裝置、功能面板的製造方法
JP6637243B2 (ja) * 2015-03-09 2020-01-29 デクセリアルズ株式会社 防曇防汚積層体、及びその製造方法、物品、及びその製造方法、並びに防汚方法
US10471646B2 (en) * 2015-05-19 2019-11-12 The University Of Massachusetts Methods and system for mass production, volume manufacturing of re-entrant structures
HK1253950A1 (zh) 2015-07-07 2019-07-05 Illumina, Inc. 经由纳米压印的选择性表面图案化
JP6502284B2 (ja) * 2016-02-26 2019-04-17 富士フイルム株式会社 感光性転写材料及び回路配線の製造方法
KR101816838B1 (ko) * 2016-07-08 2018-01-09 주식회사 기가레인 나노 임프린트용 레플리카 몰드, 그 제조방법 및 나노 임프린트용 레플리카 몰드 제조장치
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
KR102743032B1 (ko) 2016-10-14 2024-12-17 삼성디스플레이 주식회사 임프린트용 가압 롤러 및 이를 이용한 임프린트 방법
JP6837352B2 (ja) * 2017-02-28 2021-03-03 芝浦機械株式会社 転写装置および転写方法
KR20180105433A (ko) * 2017-03-15 2018-09-28 주식회사 기가레인 임프린트 장치 및 임프린트 방법
KR102569627B1 (ko) * 2017-03-16 2023-08-22 위니베르시떼 덱스-마르세이유 나노임프린트 리소그래피 프로세스 및 그것으로부터 획득가능한 패터닝된 기재
US11571841B2 (en) * 2017-05-08 2023-02-07 Ykk Corporation Plastic molded product
JP7104577B2 (ja) * 2018-07-06 2022-07-21 キヤノン株式会社 平坦化層形成装置、平坦化層の製造方法、および物品製造方法
JP7196820B2 (ja) * 2019-11-11 2022-12-27 豊田合成株式会社 ホットスタンプ装置
KR20250153308A (ko) * 2019-12-02 2025-10-24 에베 그룹 에. 탈너 게엠베하 스탬프를 분리하는 방법 및 장치
US11728199B2 (en) * 2019-12-23 2023-08-15 Asmpt Nexx, Inc. Substrate support features and method of application
US11520228B2 (en) * 2020-09-03 2022-12-06 International Business Machines Corporation Mass fabrication-compatible processing of semiconductor metasurfaces
EP4057065A1 (en) * 2021-03-10 2022-09-14 Obducat AB Method for pattern transfer
CN115167072B (zh) * 2022-01-24 2025-08-22 广东粤港澳大湾区国家纳米科技创新研究院 一种快速制备光刻胶掩膜的压印方法
KR102982418B1 (ko) 2022-03-29 2026-06-25 삼성디스플레이 주식회사 임프린트 장치
WO2025090161A1 (en) * 2023-10-26 2025-05-01 Applied Materials, Inc. Roll-based thin film loading system for manufacturing
WO2025188303A1 (en) * 2024-03-06 2025-09-12 University Of Houston System, Board Of Regents Dielectric polymer films

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797193A (zh) * 2004-12-30 2006-07-05 中国科学院电工研究所 纳米级别图形的压印制造方法及其装置
US20090046362A1 (en) * 2007-04-10 2009-02-19 Lingjie Jay Guo Roll to roll nanoimprint lithography
US20090087506A1 (en) * 2007-09-27 2009-04-02 Hitachi, Ltd. Belt-shaped mold and nanoimprint system using the belt-shaped mold
CN101930169A (zh) * 2009-06-26 2010-12-29 显示器生产服务株式会社 压印模具分离装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5135394B2 (enExample) 1972-09-01 1976-10-01
EP1362682A1 (en) * 2002-05-13 2003-11-19 ZBD Displays Ltd, Method and apparatus for liquid crystal alignment
JP2006164365A (ja) * 2004-12-06 2006-06-22 Tdk Corp 樹脂マスク層形成方法、情報記録媒体製造方法および樹脂マスク層形成装置
JP2007144995A (ja) * 2005-10-25 2007-06-14 Dainippon Printing Co Ltd 光硬化ナノインプリント用モールド及びその製造方法
FR2893610B1 (fr) * 2005-11-23 2008-07-18 Saint Gobain Procede de structuration de surface d'un produit verrier, produit verrier a surface structuree et utilisations
WO2008091571A2 (en) * 2007-01-22 2008-07-31 Nano Terra Inc. High-throughput apparatus for patterning flexible substrates and method of using the same
JP4943876B2 (ja) 2007-01-30 2012-05-30 東芝機械株式会社 熱ナノインプリント方法
US20080229941A1 (en) * 2007-03-19 2008-09-25 Babak Heidari Nano-imprinting apparatus and method
JP5106933B2 (ja) * 2007-07-04 2012-12-26 ラピスセミコンダクタ株式会社 半導体装置
JP2009190300A (ja) * 2008-02-15 2009-08-27 Toppan Printing Co Ltd インプリント法
JP5388539B2 (ja) * 2008-10-28 2014-01-15 旭化成イーマテリアルズ株式会社 パターン形成方法
JP4551957B2 (ja) * 2008-12-12 2010-09-29 株式会社東芝 磁気記録媒体の製造方法
KR20100068830A (ko) * 2008-12-15 2010-06-24 삼성전자주식회사 임프린트 몰드, 임프린트 장치 및 패턴 형성 방법
JP2010284814A (ja) * 2009-06-09 2010-12-24 Fuji Electric Device Technology Co Ltd スタンパの製造方法
JP5469941B2 (ja) 2009-07-13 2014-04-16 東芝機械株式会社 転写装置および転写方法
JP5372708B2 (ja) * 2009-11-09 2013-12-18 株式会社日立産機システム 微細構造転写装置
JP2011165855A (ja) * 2010-02-09 2011-08-25 Toshiba Corp パターン形成方法
JP2013110135A (ja) * 2010-03-12 2013-06-06 Bridgestone Corp 光硬化性転写シートを用いた凹凸パターンの形成方法、及びその方法に用いる装置
JP2011240643A (ja) * 2010-05-20 2011-12-01 Bridgestone Corp 樹脂製フィルムを用いた凹凸パターンの形成方法、その方法に使用する装置
JP5349404B2 (ja) * 2010-05-28 2013-11-20 株式会社東芝 パターン形成方法
EP2657299A4 (en) * 2011-06-21 2014-03-12 Asahi Kasei E Materials Corp INORGANIC COMPOSITION FOR TRANSMITTING A MICROROLE STRUCTURE
JP5872369B2 (ja) * 2012-04-19 2016-03-01 旭化成イーマテリアルズ株式会社 微細凹凸パターン付き基材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797193A (zh) * 2004-12-30 2006-07-05 中国科学院电工研究所 纳米级别图形的压印制造方法及其装置
US20090046362A1 (en) * 2007-04-10 2009-02-19 Lingjie Jay Guo Roll to roll nanoimprint lithography
US20090087506A1 (en) * 2007-09-27 2009-04-02 Hitachi, Ltd. Belt-shaped mold and nanoimprint system using the belt-shaped mold
CN101930169A (zh) * 2009-06-26 2010-12-29 显示器生产服务株式会社 压印模具分离装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105818556A (zh) * 2016-03-25 2016-08-03 南京京晶光电科技有限公司 一种采用纳米压印工艺在基材表面加工cd纹的方法
TWI656965B (zh) * 2016-04-20 2019-04-21 奇景光電股份有限公司 壓印設備及壓印方法
US10549494B2 (en) 2016-04-20 2020-02-04 Himax Technologies Limited Imprinting apparatus and imprinting method
CN108987573A (zh) * 2017-06-05 2018-12-11 Tcl集团股份有限公司 量子点薄膜的转印方法
CN108987573B (zh) * 2017-06-05 2020-01-24 Tcl集团股份有限公司 量子点薄膜的转印方法
CN109808319A (zh) * 2017-11-20 2019-05-28 Tcl集团股份有限公司 一种印章及其制备方法与量子点转印方法
CN109808319B (zh) * 2017-11-20 2020-09-22 Tcl科技集团股份有限公司 一种印章及其制备方法与量子点转印方法
TWI889807B (zh) * 2020-05-01 2025-07-11 日商東京威力科創股份有限公司 圖案形成方法及圖案形成系統

Also Published As

Publication number Publication date
MY171653A (en) 2019-10-22
JP5560377B2 (ja) 2014-07-23
JP6162640B2 (ja) 2017-07-12
KR20150041161A (ko) 2015-04-15
KR101881200B1 (ko) 2018-07-24
KR101531143B1 (ko) 2015-06-23
US20150111005A1 (en) 2015-04-23
TW201505818A (zh) 2015-02-16
JPWO2013168634A1 (ja) 2016-01-07
EP2848391B1 (en) 2018-09-19
EP2979845A1 (en) 2016-02-03
EP2848391A1 (en) 2015-03-18
IN2014MN02313A (enExample) 2015-08-07
CN104271332B (zh) 2016-04-13
TWI495558B (zh) 2015-08-11
JP2014187376A (ja) 2014-10-02
TWI598211B (zh) 2017-09-11
KR20140144716A (ko) 2014-12-19
WO2013168634A8 (ja) 2014-01-16
EP2848391A4 (en) 2015-04-29
TW201408469A (zh) 2014-03-01
CN104271332A (zh) 2015-01-07
WO2013168634A1 (ja) 2013-11-14

Similar Documents

Publication Publication Date Title
CN104271332B (zh) 转印方法及热纳米压印装置
KR101381489B1 (ko) 수지 몰드
CN104210046B (zh) 微细图案形成用积层体
JP5597263B2 (ja) 微細構造積層体、微細構造積層体の作製方法及び微細構造体の製造方法
CN103650106B (zh) 微细凹凸结构转印用铸模
JP5658001B2 (ja) 樹脂モールド
US8846186B2 (en) Layered product for metamaterial transfer and metamaterial transferred substrate
US20110291330A1 (en) Replication method and articles of the method
JP5813418B2 (ja) 微細パターンの製造方法
JP5820639B2 (ja) 微細マスク形成用積層体、及び加工対象物の加工方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160516

Address after: Japan's Tokyo Chiyoda jimbocho Kanda a chome 105 times

Applicant after: Asahi Kasei Kogyo K. K.

Address before: Japan's Tokyo Chiyoda jimbocho Kanda a chome 105 times

Applicant before: Asahi Chemical Corp.

WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150826

WD01 Invention patent application deemed withdrawn after publication