CN1047685A - 一种导电粘接剂 - Google Patents

一种导电粘接剂 Download PDF

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CN1047685A
CN1047685A CN 89103816 CN89103816A CN1047685A CN 1047685 A CN1047685 A CN 1047685A CN 89103816 CN89103816 CN 89103816 CN 89103816 A CN89103816 A CN 89103816A CN 1047685 A CN1047685 A CN 1047685A
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electrically conducting
conducting adhesive
powder
bonding force
epoxy
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谢志浩
徐福清
郑华均
郭力明
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B05D7/16—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
    • C08F299/065—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes from polyurethanes with side or terminal unsaturations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/02—Emulsion paints including aerosols

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种导电粘接剂，由导电粉粒材料。粘接剂和增塑剂等配制而成。具有导电性。粘接力和固化性。而且改变配比，其电阻率和粘接力也相应改变。并有较宽的选取范围。既可用于金属导体间的粘接。也可涂敷于绝缘材料表面以沟通电路，或者作电磁屏蔽和防射线辐射的涂层。该导电粘接剂具有配制容易。成本低、使用方便、应用范围广等特点。

Description

本发明涉及一种导电粘接剂。
目前国内市场仅有一种可金属导电接触件之间表面涂复的导电膏，其作用是减小两接触面的接触电阻。该导电膏是一种含有锡粉的油状膏体，既没有粘接力，又不能固化，从而其应用范围也就受到了限制。
本发明提出了一种既有导电性能，又能固化粘接的导电粘接剂。
本导电粘接剂由导电粉粒材料（金属或者非金属均可），粘接剂、固化剂和增塑剂等配制而成。其主要点是把石墨或者铁、铝、铜、锡、铅金属粉粒作为该粘接剂的导电材料，也可以是上述两种以上导电材料的混合体，采用环氧树脂作粘接剂，乙二胺（或三乙醇胺）作固化剂，邻苯二甲酸二丁酯作增塑剂，从而实现了其导电性，粘接性和固化性。其重量比：导电粉粒材料可在50～85%之间;环氧树脂可在13.5～45%之间，乙二胺可在1～3.5%之间，邻苯二甲酸二丁脂可在0.5～2%之间。而且配比不同其电阻率和粘接力也不同，这种使该导电粘接剂的电阻率和粘接力有了一定的选取范围。使用时，根据需要选择相应的配方，即可实现相应的电阻率和粘接力。
本发明与现有的导电膏相比，其优点在于具有导电性、粘接力和固化力，其电阻率和粘接力按需要可在一定范围内选取;固化前又具有可塑性，也可作涂复用，涂复层可用作电磁屏蔽和吸收高能射线。该粘接剂还具有配制容易、成本低、使用方便、应用范围广等特点。
实施例一：
采用细度为50μ的石墨粉为导电材料，粘接剂用6101环氧树脂，固化剂用乙二胺，增塑剂用邻苯二甲酸二丁酯。其重量百分比为石墨粉52%;6101环氧树酯43%，乙二胺3.5%，邻苯二甲酸二丁酯1.5%，按上述比例配合制成了电阻率小于3×107欧米/毫米2，抗拉强度大于2公斤/毫米2的导电粘接剂。经用于谢志浩发明的“织机精密探纬装置”（专利号为87209202）后，完全可代替原导电片。
实施例二：
采用细度为100μ的铁粉与锡粉为导电材料，按铁粉70%，锡粉13%，6101环氧树脂15%，三乙醇胺1.3%，邻苯二甲酸二丁酯0.7%的重量比，制成了电阻率小于1×105欧·米/毫米2，抗拉强度大于2.5公斤/毫米2的导电粘接剂。
实施例三：
采用细度为100μ的铅粉为导电材料，按铅粉85%，6101环氧树脂13.5%，乙二胺1.6%，邻苯二甲酸二丁脂0.9%的重量比，制成了电阻率小于3×105欧米/毫米2，抗拉强度大于2.5公斤/毫米2的导电粘接剂。

Claims (3)

1、一种导电粘接剂，其特征在于所述的导电粘接剂由导电粉粒材料、环氧树脂、乙二胺(或三乙醇胺)和邻苯二甲酸二丁酯混合而成。
2、按权利要求1所述的导电粘接剂，其特征在于其重量百分比为：导电粉粒材料50～85%环氧树脂13.5～45%，乙二胺（或三乙醇胺）1～3.5%，邻苯二甲酸二丁酯0.5～2%。
3、按权利要求1或2所述的导电粘接剂，其特征在于所述的导电粉粒材料是粒度为1.2～200微米的石墨粉，或者采用粒度为2～100微米的铁粉、铝粉、铜粉、锡粉、铅粉。
CN 89103816 1989-05-31 1989-05-31 一种导电粘接剂 Pending CN1047685A (zh)

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611905A (en) * 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process
CN1111574C (zh) * 1998-05-08 2003-06-18 松下电器产业株式会社 小孔填充用的导电胶组合物及用它制作的双面及多层印刷电路板和它们的制备方法
CN100365653C (zh) * 2002-07-03 2008-01-30 德国捷德有限公司 用于在芯片卡上产生导电连接的方法
CN101851479A (zh) * 2010-05-17 2010-10-06 山东大学 石墨导电胶在制备检测电极粘结剂中的应用
CN102573313A (zh) * 2012-02-13 2012-07-11 苏州晶讯科技股份有限公司 一种利用贱金属催化油墨制作印刷电路的方法
CN102585602A (zh) * 2012-02-13 2012-07-18 苏州晶讯科技股份有限公司 一种取代贵金属的印刷电路用催化油墨
CN102717062A (zh) * 2012-05-29 2012-10-10 金悦通电子（翁源）有限公司 一种pcb板修补用高可靠性纳米材料
CN102925090A (zh) * 2012-11-28 2013-02-13 上海材料研究所 一种用于电磁屏蔽的导电银胶的制备方法
CN103275641A (zh) * 2013-06-14 2013-09-04 江苏亚龙数码科技有限公司 阻燃导电布胶带及其制作方法
CN103275633A (zh) * 2013-06-14 2013-09-04 江苏亚龙数码科技有限公司 导电铝箔胶带及其制作方法
CN103275634A (zh) * 2013-06-14 2013-09-04 江苏亚龙数码科技有限公司 阻燃防爆导电胶带及其制作方法
CN104312511A (zh) * 2014-11-10 2015-01-28 郭长奇 用于碳晶、碳纤维电子加热板的防电磁辐射胶及制备方法
CN106189970A (zh) * 2016-07-18 2016-12-07 江苏亚龙数码科技有限公司 一种阻燃屏蔽胶黏剂及其制作工艺
CN106221638A (zh) * 2016-08-31 2016-12-14 强新正品（苏州）环保材料科技有限公司 一种耐候导电胶
CN107083221A (zh) * 2017-05-13 2017-08-22 合肥市库仑动力安全科技有限公司 一种用于电磁屏蔽的铝基复合粘结剂
CN108997894A (zh) * 2018-09-17 2018-12-14 佛山皖和新能源科技有限公司 一种导电涂料
CN109233718A (zh) * 2018-10-10 2019-01-18 安徽科纳家居饰材有限公司 一种环氧树脂导电胶的制备方法
CN110198624A (zh) * 2019-05-29 2019-09-03 浙江康廷电子科技有限公司 一种隔热导热吸波材及其制备方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611905A (en) * 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process
CN1111574C (zh) * 1998-05-08 2003-06-18 松下电器产业株式会社 小孔填充用的导电胶组合物及用它制作的双面及多层印刷电路板和它们的制备方法
CN100365653C (zh) * 2002-07-03 2008-01-30 德国捷德有限公司 用于在芯片卡上产生导电连接的方法
CN101851479A (zh) * 2010-05-17 2010-10-06 山东大学 石墨导电胶在制备检测电极粘结剂中的应用
CN101851479B (zh) * 2010-05-17 2013-01-16 山东大学 石墨导电胶在制备检测电极粘结剂中的应用
CN102573313A (zh) * 2012-02-13 2012-07-11 苏州晶讯科技股份有限公司 一种利用贱金属催化油墨制作印刷电路的方法
CN102585602A (zh) * 2012-02-13 2012-07-18 苏州晶讯科技股份有限公司 一种取代贵金属的印刷电路用催化油墨
CN102717062A (zh) * 2012-05-29 2012-10-10 金悦通电子（翁源）有限公司 一种pcb板修补用高可靠性纳米材料
CN102925090A (zh) * 2012-11-28 2013-02-13 上海材料研究所 一种用于电磁屏蔽的导电银胶的制备方法
CN103275633A (zh) * 2013-06-14 2013-09-04 江苏亚龙数码科技有限公司 导电铝箔胶带及其制作方法
CN103275641A (zh) * 2013-06-14 2013-09-04 江苏亚龙数码科技有限公司 阻燃导电布胶带及其制作方法
CN103275634A (zh) * 2013-06-14 2013-09-04 江苏亚龙数码科技有限公司 阻燃防爆导电胶带及其制作方法
CN104312511A (zh) * 2014-11-10 2015-01-28 郭长奇 用于碳晶、碳纤维电子加热板的防电磁辐射胶及制备方法
CN106189970A (zh) * 2016-07-18 2016-12-07 江苏亚龙数码科技有限公司 一种阻燃屏蔽胶黏剂及其制作工艺
CN106221638A (zh) * 2016-08-31 2016-12-14 强新正品（苏州）环保材料科技有限公司 一种耐候导电胶
CN107083221A (zh) * 2017-05-13 2017-08-22 合肥市库仑动力安全科技有限公司 一种用于电磁屏蔽的铝基复合粘结剂
CN108997894A (zh) * 2018-09-17 2018-12-14 佛山皖和新能源科技有限公司 一种导电涂料
CN109233718A (zh) * 2018-10-10 2019-01-18 安徽科纳家居饰材有限公司 一种环氧树脂导电胶的制备方法
CN110198624A (zh) * 2019-05-29 2019-09-03 浙江康廷电子科技有限公司 一种隔热导热吸波材及其制备方法
CN110198624B (zh) * 2019-05-29 2021-07-13 浙江康廷电子科技有限公司 一种隔热导热吸波材及其制备方法

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