CN104766816B - 电子组件搬送方法及装置 - Google Patents

电子组件搬送方法及装置 Download PDF

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Publication number
CN104766816B
CN104766816B CN201410304776.2A CN201410304776A CN104766816B CN 104766816 B CN104766816 B CN 104766816B CN 201410304776 A CN201410304776 A CN 201410304776A CN 104766816 B CN104766816 B CN 104766816B
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CN
China
Prior art keywords
transported
electronic building
building brick
component
rotating disk
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Expired - Fee Related
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CN201410304776.2A
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English (en)
Chinese (zh)
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CN104766816A (zh
Inventor
王安田
黄子葳
黄清泰
黄建桦
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All Ring Tech Co Ltd
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All Ring Tech Co Ltd
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations

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  • Specific Conveyance Elements (AREA)
CN201410304776.2A 2014-01-02 2014-06-30 电子组件搬送方法及装置 Expired - Fee Related CN104766816B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103100101A TW201528399A (zh) 2014-01-02 2014-01-02 電子元件搬運方法及裝置
TW103100101 2014-01-02

Publications (2)

Publication Number Publication Date
CN104766816A CN104766816A (zh) 2015-07-08
CN104766816B true CN104766816B (zh) 2018-01-02

Family

ID=53648571

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CN201410304776.2A Expired - Fee Related CN104766816B (zh) 2014-01-02 2014-06-30 电子组件搬送方法及装置

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CN (1) CN104766816B (https=)
TW (1) TW201528399A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615914B (zh) * 2016-01-18 2018-02-21 天正國際精密機械股份有限公司 晶體管搬運檢測之結構
TWI640465B (zh) * 2016-02-04 2018-11-11 萬潤科技股份有限公司 Electronic component packaging carrier tape guiding method and device
TWI618666B (zh) * 2017-01-05 2018-03-21 All Ring Tech Co Ltd 載盤及使用該載盤的電子元件量測方法及裝置
TWI752602B (zh) * 2020-08-25 2022-01-11 萬潤科技股份有限公司 電子元件搬送方法及裝置
CN113716278B (zh) * 2021-09-10 2023-04-25 深圳市华腾半导体设备有限公司 一种分光用高效转盘输送系统
CN116553168B (zh) * 2022-01-27 2026-01-27 安益隆展业股份有限公司 用于检测电子元件的取料设备及其方法
CN116705674B (zh) * 2022-02-25 2026-02-06 安益隆展业股份有限公司 元件处理设备及其元件载盘装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200521050A (en) * 2003-12-23 2005-07-01 Tokyo Weld Co Ltd Work transferring and transporting apparatus and work transferring and transporting method
CN203064682U (zh) * 2012-08-20 2013-07-17 万润科技股份有限公司 电子元件的搬运载盘构造
CN204130511U (zh) * 2014-01-02 2015-01-28 万润科技股份有限公司 电子组件搬送装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4448297B2 (ja) * 2002-12-27 2010-04-07 株式会社荏原製作所 基板研磨装置及び基板研磨方法
JP2010195592A (ja) * 2010-03-18 2010-09-09 Olympus Corp 浮上ユニット及び基板検査装置
WO2013084296A1 (ja) * 2011-12-06 2013-06-13 上野精機株式会社 電子部品搬送装置
JP2013168417A (ja) * 2012-02-14 2013-08-29 Nitto Denko Corp 基板搬送方法および基板搬送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200521050A (en) * 2003-12-23 2005-07-01 Tokyo Weld Co Ltd Work transferring and transporting apparatus and work transferring and transporting method
CN203064682U (zh) * 2012-08-20 2013-07-17 万润科技股份有限公司 电子元件的搬运载盘构造
CN204130511U (zh) * 2014-01-02 2015-01-28 万润科技股份有限公司 电子组件搬送装置

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Publication number Publication date
CN104766816A (zh) 2015-07-08
TW201528399A (zh) 2015-07-16
TWI563585B (https=) 2016-12-21

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Granted publication date: 20180102

Termination date: 20210630