CN104701441A - 发光装置 - Google Patents
发光装置 Download PDFInfo
- Publication number
- CN104701441A CN104701441A CN201410734249.5A CN201410734249A CN104701441A CN 104701441 A CN104701441 A CN 104701441A CN 201410734249 A CN201410734249 A CN 201410734249A CN 104701441 A CN104701441 A CN 104701441A
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- China
- Prior art keywords
- light
- particle
- seal member
- emitting device
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
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- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical group OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- 239000010456 wollastonite Substances 0.000 description 1
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- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract
本发明的实施方式的发光装置(100)具备:上表面(11)具有凹部(15)的基体(10)、设置于所述凹部(15)的发光元件(20)和设置于所述凹部(15)的密封部件(30),所述密封部件(30)含有进行了表面处理的粒子(40)或与分散剂共存的粒子(40),所述密封部件(30)的边缘部的至少一部分,是处于所述凹部的边缘(17)附近且所述粒子(40)或所述粒子的凝聚体(41)中的至少任一种集中分布的区域。
Description
技术领域
本发明涉及一种具备发光元件和对其进行密封的密封部件的发光装置。
背景技术
目前,有一种发光装置,其通过在包封件的凹部配置发光元件,用金属丝与发光元件和引线框连接,进一步在凹部填充密封树脂并使其固化来制造(例如参照专利文献1、2)。
现有技术文献
专利文献1:日本特开2010-080620号公报
专利文献2:日本特开2011-222718号公报
非专利文献:
非专利文献1:BM.Weon,JH.Je,Self-Pinning by Colloids Confined at aContact Line,Phys.Rev.Lett.110,028303(2013)
发明内容
发明所要解决的课题
但是,在这种发光装置中,由于密封树脂的液态母材具有高的润湿性,存在密封树脂意外地从包封件的凹部向上表面濡湿扩展的问题。
因此,本发明是鉴于这种情况而开发的,其目的在于,提供一种抑制了密封部件从基体的凹部向上表面的濡湿扩展的发光装置。
用于解决课题的技术方案
为了解决上述课题,本发明的实施方式的发光装置的特征在于,具备:上表面具有凹部的基体、设置于所述凹部的发光元件和设置于所述凹部的密封部件,所述密封部件含有进行了表面处理的粒子、或与分散剂共存的粒子,所述密封部件的边缘部的至少一部分,是处于所述凹部的边缘附近且集中分布有所述粒子或所述粒子的凝聚体中的至少任一种的区域。
发明的效果
根据本发明,能够抑制密封部件向基体上表面的濡湿扩展。
附图说明
图1是本发明一实施方式的发光装置的概略俯视图(a)、和其A-A剖面中的概略剖面图(b)。
图2是对抑制本发明实施方式中的密封部件的濡湿扩展的原理进行说明的概略图(a)及(b)。
图3是表示本发明一实施方式的发光装置的密封部件中的、进行了表面处理的粒子的含量和向基体上表面的濡湿扩展的关系的坐标图。
图4是本发明一实施方式的发光装置的概略俯视图(a)、和其B-B剖面中的概略剖面图(b)。
图5是本发明一实施例的发光装置的密封部件的边缘部利用扫描型电子显微镜观察的上表面观察图像。
图6是图5所示的密封部件的边缘部的能量分散型X射线分析的数据。
图7是图5所示的密封部件的边缘部利用扫描型电子显微镜观察的剖面观察图像。
符号说明
10:基体(11:上表面、15:凹部、17:边缘)
20:发光元件
30:密封部件
35:密封部件的母材
40:进行了表面处理的粒子、或与分散剂共存的粒子
41:进行了表面处理的粒子的凝聚体、或与分散剂共存的粒子的凝聚体
50:荧光体
60:覆膜
100、200:发光装置
具体实施方式
下面,适当参照附图对发明的实施方式进行说明。但是,以下说明的发光装置是用于将本发明的技术思想具体化的装置,只要没有特定的记载,本发明并不限定于以下的说明。另外,在一实施方式、实施例中说明的内容也可以适用于其它实施方式、实施例。另外,各附图表示的部件的大小或位置关系等,有时为了使说明更明确而做了放大。
<实施方式1>
图1(a)是实施方式1的发光装置的概略俯视图,图1(b)是表示图1(a)中的A-A剖面的概略剖面图。
如图1所示,实施方式1的发光装置100具备:基体10、发光元件20和密封部件30。基体10在上表面11具有凹部15。发光元件20设置于凹部15。密封部件30设置于凹部15。
更详细而言,发光装置100为表面安装型LED。发光装置100具备:在上表面11形成有凹部15的基体10、收纳于凹部15的两个发光元件20、和覆盖其所有发光元件20并填充于凹部15的密封部件30。基体10为具有导电部件和保持该导电部件的成形体的包封件。导电部件为正负一对引线电极。成形体为白色的树脂成形体。基体的凹部15的底面的一部分由导电部件的上表面构成。两个发光元件20各自为LED元件,用粘接剂粘接在基体的凹部15的底面,用金属丝与导电部件连接。密封部件30以树脂为母材35。密封部件30含有荧光体50。荧光体50集中分布于凹部15的底面侧。
而且,密封部件30含有进行了表面处理的粒子40。另外,密封部件30的边缘部的至少一部分,是处于凹部的边缘17附近且粒子40或其凝聚体41中的至少任一种集中分布的区域。
具有这种结构的发光装置100抑制了因密封部件的液态母材具有的高润湿性引起的密封部件30从基体的凹部15向上表面11的濡湿扩展。
需要说明的是,处于基体的凹部的边缘17附近、且粒子40或其凝聚体41中的至少任一种集中分布的密封部件30的区域,可以为密封部件30的边缘部的一部分,但优选为密封部件30的边缘部的一半以上(例如边缘部的全周长的一半以上),更优选为密封部件30的边缘部的大致全部(例如边缘部的全周长的大致全长)。
另外,在本说明书中,基体的凹部15的边缘17具体而言是指基体的凹部15的内壁面和上表面11的边界部。进而,所谓基体的凹部的边缘17附近,为上述边界部的附近,不仅包含基体的凹部15的内壁面侧、而且也包含基体的上表面11侧。
在本实施方式中,进行了表面处理的粒子40也可以取代为与分散剂共存的粒子。该情况下,能够得到同样的作用、效果。该与分散剂共存的粒子通过在密封部件上配合粒子和用于使该粒子分散的分散剂而得到,例如成为吸附有分散剂的粒子。
下面,通过粒子40或其凝聚体41中的至少任一种,对抑制密封部件30向基体上表面11的濡湿扩展的原理进行说明。
图2(a)及(b)是对抑制本发明中的密封部件的濡湿扩展的原理进行说明的概略图。一般认为,抑制密封部件的濡湿扩展的原理包含两个阶段。参照图2(a)对第1阶段进行说明。第1阶段,是通过在液态的密封部件的母材35中,使粒子间的相互作用少、即,使凝聚性受到抑制的粒子40分散优选大致均匀地分散的阶段。固化前的密封部件30滴加在基体的凹部15内时,在凹部的边缘17附近形成新月端部。在存在于该新月端部的前端(空气(气体)、密封部件的母材(液体)、基体(固体)的三相连接的接触点的附近)的粒子40和存在于相邻的新月端部的前端的粒子40之间产生毛细管力。该毛细管力的作用是以使存在于相邻的新月端部的前端的粒子40相互靠近的方式起作用。而且,通过该毛细管力沿着密封部件30的边缘部(本例中,也是基体的凹部的边缘17)连续地起作用,抑制滴加在基体的凹部15内的固化前的密封部件30的濡湿扩展。特别是通过该毛细管力贯穿密封部件30的边缘部的大致全部(本例中,也为基体的凹部的边缘17的大致整个区域)起作用,可以有效地抑制固化前的密封部件30的濡湿扩展。需要说明的是,由于该毛细管力在粒子的分散性高的胶体溶液中容易显现(例如参照上述非专利文献1),因此,通过对粒子40实施抑制粒子的凝聚的表面处理、或与粒子40一起配合分散剂,能够使毛细管力高效地显现。
参照图2(b)对第2阶段进行说明。第2阶段是促进密封部件30的固化而进行加热的阶段。在使密封部件30固化的过程中,上述新月端部非常薄,密封部件的母材35中的低沸点成分(例如,如果为有机硅树脂,则为低沸点硅氧烷)最快地挥发。由于因该挥发引起的新月端部的表面张力变化,在固化前的密封部件30中产生向新月端部流动的表面张力流。而且,运送至新月端部的固化前的密封部件30,由于通过上述毛细管力抑制了濡湿扩展,因此返回到内侧,其结果是,在新月端部产生对流。在该过程中,在新月端部,通过对流而运送的粒子40利用上述毛细管力而进行排列,或通过粒子浓度的局部上升而凝聚。这样,聚集在密封部件30的边缘部的粒子40通过加热而体积膨张,进一步抑制粘度、表面张力均降低了的密封部件30的濡湿扩展。
如上所述,固化的密封部件30的边缘部的至少一部分,成为粒子40或其凝聚体41中的至少任一种集中分布的区域。需要说明的是,由于上述毛细管力依赖于粒子的分散性,因此从抑制密封部件30的濡湿扩展的观点出发,优选粒子40比粒子的凝聚体41多,但上述毛细管力在粒子的凝聚体41中也起作用。另外,在使密封部件30固化的过程中,粒子40凝聚,其结果是,有时在固化的密封部件30中观测到大量粒子的凝聚体41。
需要说明的是,在本说明书中,所谓“集中分布”是指在特定的区域以高密度存在,但并不否定在该特定的区域以外的区域以低密度存在。另外,“集中分布”优选的实施方式之一为,在特定的区域以高密度存在,并且在其它区域不存在。
下面,对发光装置100的优选实施方式进行说明。
(粒子40)
粒子40配合于密封部件的母材35中,具有抑制密封部件30向基体上表面11的濡湿扩展的作用。以下对该粒子40进行详述。需要说明的是,在将粒子40与后述的填充剂或荧光体在表述上区别的情况下,粒子40称为第1粒子,其它填充剂或荧光体称为第2粒子、第3粒子等。
粒子40可以使用例如粒径为1nm以上且100μm以下的粒子,但优选为纳米粒子(可以定义为粒径为1nm以上且100nm以下的粒子)。只要粒子40为纳米粒子,就能够以少量的配合得到上述毛细管力,抑制密封部件30向基体上表面11的濡湿扩展。其中,粒子40更优选粒径为5nm以上且50nm以下。粒子的凝聚体41为粒子40凝聚而成。由于粒子的凝聚体41大于粒子40,因此,容易观测,可以通过观测其的存在推测粒子40的存在。粒子的凝聚体41的直径例如为100nm~300μm左右,优选为100nm以上且100μm以下。另外,粒子40或其凝聚体41有时具有使发光元件20的光散射的作用,特别是在粒子40为纳米粒子的情况下,可以通过瑞利散射使蓝色光等短波长光的散射增大。另外,通过该瑞利散射的产生,容易激发荧光体50,能够减少荧光体50的配合量,缩减发光装置的成本。进而,也能够提高密封部件30的透射率,提高光的取出效率。需要说明的是,粒子40的粒径可以由平均粒径(D50)进行定义。粒子40或其凝聚体41的直径可以利用激光衍射/散射法、图像分析法(扫描型电子显微镜(SEM)、透射型电子显微镜(TEM))、动态光散射法、X射线小角散射法等进行测定。更具体而言,可以将使用SEM等对剖面进行观察而求得的D50设定为粒子40或其凝聚体41的粒径。
粒子40的形状没有特别限定,可以为不定形破碎状等,但由于为球状,能够通过将粒子间的接触设为最小而抑制凝聚,故优选。另外,粒子40如果为板状,则可以对密封部件30赋予气体阻隔性。
粒子40没有特别限定,即可以为有机物,也可以为无机物。从发光装置的光取出效率的观点出发,优选粒子40为透光性的物质。另外,从焊锡耐热性的观点出发,优选粒子40的熔点为260℃以上。具体而言,作为有机物,优选聚甲基丙烯酸酯和其共聚物、聚丙烯酸酯和其共聚物、交联聚甲基丙烯酸酯、交联聚丙烯酸酯、聚苯乙烯和其共聚物、交联聚苯乙烯、环氧树脂、有机硅树脂、非晶氟树脂等树脂。另外,设定为也包含用选自它们中的至少1种树脂涂敷无机粒子形成的芯·壳型的粒子的物质。由于这种有机物的粒子通过共聚使折射率与密封部件的母材35一致,因此,即使凝聚也可保持透光性等,光学上的影响少。另一方面,作为无机物,优选氧化硅、氧化铝、氧化锆、氧化钛、氧化锌、氧化镁、氧化镓、氧化钽、氧化铌、氧化铋、氧化钇、氧化铱、氧化铟、氧化锡等氧化物。这种无机物的粒子在耐热性、耐光性方面优异,另外,导热性比较高。其中,氧化硅、氧化铝、氧化锆、氧化钛容易获得,比较廉价。此外,粒子40也可以使用与后述的荧光体50相同的物质。
优选对粒子40实施表面处理(即通过表面处理在粒子40的表面形成附着物)。由此,抑制粒子40的凝聚,换句话说,提高了粒子40的分散性,容易显现上述毛细管力,容易抑制密封部件30向基体上表面11的濡湿扩展。这种粒子40的表面处理可列举:长链脂肪族胺和其衍生物、长链脂肪族脂肪酸和其衍生物、硅烷偶联剂、具有胺基和/或羧基的硅氧烷化合物、具有选自硅烷醇基、氢硅烷基、醇基的至少一个的硅氧烷化合物、具有选自硅烷醇基、烷氧基、氢硅烷基中的至少一个和乙烯基甲硅烷基的硅氧烷化合物、单缩水甘油醚末端硅氧烷化合物、单羟基醚末端硅氧烷化合物、有机硅氮烷化合物、有机钛酸酯化合物、异氰酸酯化合物、环氧化合物、磷酸及磷酸酯化合物等(即,通过表面处理,使这些衍生物和/或化合物附着于粒子40的表面)。另外,作为分散剂,除上述表面处理材料之外,可列举:具有酸性基团或碱性基团的高分子化合物、含氟表面活性剂、多元醇化合物、聚环氧乙烷衍生物、聚环氧丙烷衍生物、多元脂肪酸衍生物、硅烷偶联剂的水解物、季铵盐化合物等。粒子40为纳米粒子的情况下,优选实施表面处理,粒子40为微米粒子的情况下,也优选配合分散剂。
图3是表示实施方式1的发光装置100的密封部件中的、进行了表面处理的粒子的含量和向基体上表面的濡湿扩展的关系的坐标图。需要说明的是,图3中的密封部件的濡湿扩展产生率,是将濡湿扩展至后述发光装置的单片化工序中基体10的上表面的切断位置(即,基体10的上表面和端面所成的角)设为“产生”,将低于其的濡湿扩展设为“未产生”而计算的。如图3所示,如果粒子40和/或其凝聚体41的含量为0.05wt%以上,则容易得到抑制密封部件30向基体上表面11的濡湿扩展的作用。在得到抑制密封部件30的濡湿扩展的作用的观点上,粒子40和/或其凝聚体41的含量的上限值没有特别限定,但若粒子40和/或其凝聚体41的含量超过50wt%,则有可能产生密封部件30的过度的粘度上升或白浊、粒子40的过度的凝聚等。因此,粒子40和/或其凝聚体41的含量优选为0.05wt%以上且50wt%以下。特别是通过粒子40和/或其凝聚体41的含量为0.1wt%以上且20wt%以下,可稳定地得到在良好地保持密封部件30的各种特性的同时抑制密封部件30向基体上表面11的濡湿扩展的作用。更优选的粒子40和/或其凝聚体41的含量为0.2wt%以上且2.0wt%以下,进而可以为0.2wt%以上且低于0.5wt%。需要说明的是,粒子40和/或其凝聚体41的含量相当于粒子40的配合量,作为密封部件相对于母材35之比,用重量百分率表示。这样,以粒子40的极少的配合量抑制了密封部件30向基体上表面11的濡湿扩展,这在发光装置的制造中为大的优点。
在发光装置100中,基体10的端面为被切断的面。产生密封部件从基体的凹部向上表面的没有意义的濡湿扩展的情况下,有时难以使密封部件的上表面向上方形成凸起的面,难以提高光束,或有时产生密封部件向导电部件上的濡湿扩展引起的焊锡濡湿不良等,特别视为问题的是,与基体的单片化有关的障碍。有的发光装置直到密封工序结束,一直为多个基体纵横相连的状态,其后进行单片化来制造。在该发光装置的单片化工序中,将跨越邻接的基体的上表面而形成的密封部件用切片机等进行切断时,有可能在切断部产生密封部件的毛边。这样的密封部件的毛边成为发光装置的外观或配光变差、大量保管时的损伤等的原因。这样,抑制密封部件向基体上表面的濡湿扩展,对伴随基体的切断而制造的发光装置特别有意义。
另外,有机硅类树脂为比较柔软的树脂,难以用切片机等进行切断,如果有必要将其切断,则发光装置的单片化工序变得繁琐。因此,抑制密封部件30向基体上表面11的濡湿扩展,对密封部件的母材35为有机硅树脂、改性有机硅树脂、有机硅改性树脂、或杂化有机硅树脂的发光装置更有意义。
<实施方式2>
图4(a)是实施方式2的发光装置的概略俯视图,图4(b)是表示图4(a)中的B-B剖面的概略剖面图。
如图4所示,实施方式2的发光装置200具备基体10、发光元件20和密封部件30。基体10在上表面11具有凹部15。发光元件20设置于凹部15。密封部件30设置于凹部15。
更详细而言,发光装置200为表面安装型LED。发光装置200具备:在上表面11上形成有凹部15的基体10、收纳在凹部15的一个发光元件20、和覆盖该发光元件20而填充于凹部15的密封部件30。基体10为具有导电部件和保持其导电部件的成形体的封装。导电部件为正负一对引线电极。成形体为白色的树脂成形体。基体的凹部15的底面的一部分由导电部件的上表面构成。发光元件20为LED元件,用粘接剂粘接在基体的凹部15的底面,用金属丝与导电部件连接。密封部件30以树脂为母材35。密封部件30含有荧光体50。荧光体50偏在于凹部15的底面侧。
而且,密封部件30含有进行了表面处理的粒子40。另外,密封部件30的缘部的至少一部分,是处于凹部的边缘17附近且粒子40或其凝聚体41中的至少任一种集中分布的区域。
具有这种构成的发光装置200也抑制密封部件30从基体的凹部15向上表面11的濡湿扩展。需要说明的是,在本实施方式中,进行了表面处理的粒子40取代与分散剂共存的粒子,也可以得到同样的作用、效果。与该分散剂共存的粒子通过在密封部件上配合粒子和用于使该粒子分散的分散剂而得到,例如成为吸附有分散剂的粒子。
在发光装置200中,粒子40或其凝聚体41中的至少任一种也存在于密封部件30的外边缘、即密封部件30的边缘部的外侧的附近。以存在于该密封部件30的外边缘的粒子40和/或其凝聚体41阻塞密封部件30的方式起作用,可以更进一步抑制密封部件30向基体上表面11的濡湿扩展。
在发光装置200中,密封部件30的上表面向上方成为凸起的面。由于密封部件30抑制集中分布于其边缘部的粒子40和/或通过其凝聚体41向基体上表面11的濡湿扩展,因此,容易增大母材35的量,使上表面容易向上方形成凸起的面。由此,容易得到光的取出效率优异的发光装置。
在发光装置200中,在基体的上表面11上形成无机物的覆膜60。该覆膜60用于抑制导电部件因外部气体或水分引起的劣化。覆膜60从其功能上来说至少在导电部件上形成即可,通常是在基体的凹部15内安装发光元件20之后,贯穿基体10的上表面侧的大致整个区域而形成。覆膜60例如由氧化铝、氧化硅、氮化铝、氮化硅或它们的混合物构成。覆膜60的膜厚优选为1nm以上且50nm以下,更优选为2nm以上且25nm以下。覆膜60的形成方法可以为溅射法等,但优选能够以高精度形成大致均匀的厚度的膜的原子层堆积(ALD;Atomic Layer Deposition)法。这样的无机物的覆膜60表面能量比较大,容易使密封部件30向基体上表面11上濡湿扩展。因此,为了抑制密封部件30向基体上表面11的濡湿扩展,对于在基体的上表面11上形成无机物的覆膜60的发光装置特别有意义。
下面,对本发明的发光装置的各构成要素进行说明。
(基体10)
基体为成为安装发光元件的筐体或底座的部件。基体主要由与发光元件电连接的导电部件和保持该导电部件的成形体构成。基体有封装件的方式或配线基板的方式。具体而言,基体可列举在引线框上通过转移成形或注塑成形等而将树脂成形体一体成形而成的基体、印刷有导电性糊料的陶瓷印刷电路基板层叠、煅烧而成的基体等。基体的上表面优选大致平坦,但也可以弯曲。在基体的上表面形成有凹部。凹部既可以通过使成形体自身洼下去而形成,也可以通过在大致平坦的成形体的上表面另外形成框状的突起,而将该凸部的内侧作为凹部。凹部的俯视形状可列举矩形、带有圆角的矩形、圆形、椭圆形等。优选为了使成形体容易从模具中脱模,并且为了将发光元件的光高效地取出,凹部的侧壁面优选从凹部底面朝向上方以凹部扩径的方式倾斜(包含弯曲)(倾斜角例如距凹部底面95°以上且120°以下)。凹部的深度没有特别限定,例如优选为0.05mm以上且2mm以下、进一步优选0.1mm以上且1mm以下,更优选为0.25mm以上且0.5mm以下。
(导电部件)
导电部件可以使用与发光元件连接且可导电的金属部件。具体而言,可列举由金、银、铜、铁、铝、钨、钴、钼、铬、钛、镍、钯、或它们的合金、磷青铜、掺入铁的铜等形成的引线电极或配线。另外,导电部件可以在其表层上设置银、铝、铑、金、铜、或它们的合金等镀金或光反射膜,其中,优选光反射性最优异的银。
(成形体)
成形体可列举以脂环聚酰胺树脂、半芳香族聚酰胺树脂、聚对苯二甲酸乙二醇酯、聚对苯二甲酸环己酯、液晶聚合物、聚碳酸酯树脂、间规聚苯乙烯、聚苯醚、聚苯硫醚、聚醚砜树脂、聚醚酮树脂、聚芳酯树脂等热可塑性树脂、聚双马来酰亚胺三嗪树脂、环氧树脂、环氧改性树脂、有机硅树脂、有机硅改性树脂、聚酰亚胺树脂、聚氨酯树脂等热固化性树脂为母材的材料。另外,可以在这些母材中混入作为填充剂或着色颜料的玻璃、二氧化硅、氧化钛、氧化镁、碳酸镁、氢氧化镁、碳酸钙、氢氧化钙、硅酸钙、硅酸镁、硅灰石、云母、氧化锌、钛酸钡、钛酸钾、硼酸铝、氧化铝、氧化锌、碳化硅、氧化锑、锡酸锌、硼酸锌、氧化铁、氧化铬、氧化锰、碳黑等粒子或纤维。此外,成形体也可以由含有氧化铝、氮化铝或它们的混合物的陶瓷等形成。与上述树脂材料相比,通常,这样的陶瓷表面能量大,密封部件容易向基体上表面濡湿扩展。
(发光元件20)
发光元件可以使用LED(发光二极管)元件等半导体发光元件。发光元件只要是在由各种半导体构成的元件构造中设置有正负一对电极的发光元件即可。特别优选能够高效地激发荧光体的氮化物半导体(InxAlyGa1-x-yN、0≤x、0≤y、x+y≤1)的发光元件。此外,也可以为镓砷系、镓磷系半导体的发光元件。就正负一对电极设置于同一面侧的发光元件而言,将各电极用金属丝与导电部件连接的面朝上安装,或将各电极用导电性粘接剂与导电部件连接的面朝下(倒装芯片)安装。就正负一对电极各自设置于相互相反的面的发光元件而言,下面电极用导电性粘接剂与导电部件粘接,上面电极用金属丝与导电部件连接。一个发光装置所搭载的发光元件的个数可以为一个,也可以为多个。多个发光元件可以串联或并联连接。
(密封部件30)
密封部件为密封发光元件的部件。就密封部件的母材而言,只要是具有电绝缘性、可透过从发光元件射出的光(优选透射率70%以上)、固化前具有流动性的材料即可。具体而言,可列举:有机硅树脂、环氧树脂、酚醛树脂、聚碳酸酯树脂、丙烯酸树脂、TPX树脂、聚降冰片烯树脂、或它们的改性树脂或混合树脂。其中,有机硅树脂或其改性树脂由于耐热性或耐光性优异,固化后的体积收缩少,因此优选。密封部件优选在其母材中含有填充剂或荧光体等,但也可以不含有。
(填充剂)
填充剂可以使用扩散剂或着色剂等。具体而言,可列举:二氧化硅、氧化钛、氧化镁、碳酸镁、氢氧化镁、碳酸钙、氢氧化钙、硅酸钙、氧化锌、钛酸钡、氧化铝、氧化铁、氧化铬、氧化锰、玻璃、碳黑等。填充剂的形状可列举球状、不定形破碎状、针状、柱状、板状(含有鳞片状)、纤维状或树枝状等(后述的荧光体也同样)。另外,也可以为中空或多孔质的形状。
(荧光体50)
荧光体吸收从发光元件射出的一次光的至少一部分,并射出与一次光不同的波长的二次光。具体而言,可列举:用铈赋活的钇铝石榴石、用铕和/或铬赋活的含氮铝硅酸钙、用铕赋活的赛纶陶瓷、用铕赋活的硅酸盐、用锰赋活的氟化硅酸钾等。由此,能够形成射出可视波长的一次光及二次光的混色光(例如白色系)的发光装置、或被紫外光的一次光激发而射出可视波长的二次光的发光装置。
(金属丝)
金属丝为将发光元件的电极和导电部件进行电连接的部件。金属丝可以使用金、铜、银、铂、铝或它们的合金的金属线。特别优选不易产生来自密封部件的应力引起的断裂、且热电阻等优异的金线。另外,为了得到高的光取出效率,也可以是至少表面由银构成。
(粘接剂)
粘接剂为将发光元件固定于基体上的部件。绝缘性粘接剂可以使用环氧树脂、有机硅树脂、聚酰亚胺树脂、或它们的改性树脂或混合树脂等。作为导电性粘接剂,可以使用银、金、钯等导电性糊料、或金-锡等焊锡、低熔点金属等滤材。
实施例
下面,对本发明的实施例进行详述。需要说明的是,不言而喻,本发明并不仅限定于以下所示的实施例。
<实施例1>
实施例1的发光装置为具有图1所示例的发光装置100的结构的俯视式的SMD型LED。
基体是大小为长3.0mm、宽3.0mm、厚度0.52mm的正方体状,为在正负一对(第1及第2)的引线电极上将成形体一体地成形而构成的包封件。该基体通过将多组引线电极经由悬挂式引线纵横连接而成的加工金属板(引线框)设置于模具内、注入液态的成形体的构成材料并使其固化、脱模后,进行切断(单片化)来制作。需要说明的是,在本实施例中,基体的切断是在发光元件的密封工序后进行的。
第1及第2引线电极各自为对表面实施了银的镀敷的最大厚度0.2mm的铜合金的板状小片。第1及第2引线电极的下表面的露出区域与成形体的下表面实质上为同一面,构成基体的下表面。第1及第2引线电极各自在基体的端面露出其一部分(被切断的悬挂式引线部)。在该露出部,形成有作为齿形结构起作用的凹陷。
成形体为从上面看的外形为长3.0mm、宽3.0mm的正方形状,最大厚为0.52mm,是含有氧化钛的环氧树脂制成的。在成形体的上表面即基体的上表面的大致中央形成有直径2.48mm、深度0.32mm的上面看为圆形状的凹部。凹部的侧壁面的倾斜角度为离凹部底面95°。
第1及第2引线电极的上面构成凹部的底面的一部分。在第1引线电极的上面,用作为有机硅树脂的粘接剂粘接有两个发光元件。该两个发光元件各自为在蓝宝石基板上层叠有氮化物半导体的元件结构的、可以发出蓝色(中心波长约460nm)光的长350μm、宽550μm、厚度120μm的LED元件。另外,两个发光元件各自的p、n电极的一个用金属丝与第1引线电极的上面连接,p、n电极的另一个用金属丝与第2引线电极的上面连接。金属丝为线径25μm的金线。
另外,在第2引线电极的上面,用作为银糊料的导电性粘接剂粘接有长150μm、宽150μm、厚度85μm的对置电极结构的齐纳二极管即保护元件。另外,保护元件其上面电极用金属丝与第1引线电极的上面连接。
在基体的凹部填充有密封部件,且包覆发光元件。密封部件以苯基有机硅树脂为母材、其中含有用铈赋活的钇铝石榴石(YAG:Ce)的荧光体、二氧化硅的填充剂(粒径6μm)和氧化锆的粒子。氧化锆粒子的粒径约为5nm,进行硅氧烷化合物的表面处理,相对于母材的树脂配合0.2wt%。密封部件的上表面与基体的上表面大致为同一面,成为大致平坦面(严格地说,因固化收缩而有一些凹面)。利用分配器等向基体的凹部内滴加液态的构成材料、通过加热使其固化,从而形成该密封部件。需要说明的是,荧光体偏在于凹部的底面侧。
图5是实施例1的发光装置的密封部件的边缘部用扫描型电子显微镜(日立制作所社制S-4800)扫描的上面观察图像。图6是图5所示的密封部件的边缘部的能量分散型X射线(EDX)分析的数据。图7是图5所示的密封部件的边缘部利用扫描型电子显微镜的剖面观察图像。如图5及图6所示,密封部件的边缘部的至少一部分处于基体的凹部的边缘附近,成为氧化锆的粒子或该粒子的凝聚体中的至少任一种集中分布的区域。另外,该情况在图7(特别是用箭头表示的部分)也可以确认。
如以上那样构成的实施例1的发光装置,能够产生与实施方式1的发光装置100同样的效果。
工业实用性
本发明的发光装置能够在液晶显示器的背光光源、各种照明器具、大型显示器、广告或目标导向等各种显示装置、以及数码摄像机、传真机、复印机、扫描仪等中的图像读取装置、放映机装置等中进行利用。
Claims (10)
1.一种发光装置,其具备:
上表面具有凹部的基体、设置于所述凹部的发光元件和设置于所述凹部的密封部件,
所述密封部件含有进行了表面处理的粒子或与分散剂共存的粒子,
所述密封部件的边缘部的至少一部分,是处于所述凹部的边缘附近且集中分布有所述粒子或所述粒子的凝聚体中的至少任一种的区域。
2.如权利要求1所述的发光装置,其中,
所述粒子为纳米粒子。
3.如权利要求1或2所述的发光装置,其中,
所述粒子和/或所述粒子的凝聚体的含量为0.05wt%以上且50wt%以下。
4.如权利要求3所述的发光装置,其中,
所述粒子和/或所述粒子的凝聚体的含量为0.1wt%以上且2wt%以下。
5.如权利要求1~4中任一项所述的发光装置,其中,
所述基体的端面为被切断的面。
6.如权利要求5所述的发光装置,其中,
所述密封部件的母材为有机硅树脂、改性有机硅树脂、有机硅改性树脂或杂化有机硅树脂。
7.如权利要求1~6中任一项所述的发光装置,其中,
所述密封部件的上表面是面向上方且凸起的面。
8.如权利要求1~7中任一项所述的发光装置,其中,
在所述基体的上表面上形成有无机物的覆膜。
9.如权利要求1~8中任一项所述的发光装置,其中,
所述密封部件的母材为苯基有机硅树脂,
所述粒子为氧化锆。
10.如权利要求1~9中任一项所述的发光装置,其中,
所述密封部件的边缘部的一半以上,是处于所述凹部的边缘附近且集中分布有所述粒子或所述粒子的凝聚体中的至少任一种的区域。
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TW201528556A (zh) | 2015-07-16 |
US20150162509A1 (en) | 2015-06-11 |
JP2015109354A (ja) | 2015-06-11 |
EP2882001B1 (en) | 2018-04-25 |
US20170162765A1 (en) | 2017-06-08 |
KR20150065595A (ko) | 2015-06-15 |
TWI761689B (zh) | 2022-04-21 |
TWI668884B (zh) | 2019-08-11 |
CN104701441B (zh) | 2018-09-11 |
JP6237174B2 (ja) | 2017-11-29 |
EP2882001A1 (en) | 2015-06-10 |
US9960326B2 (en) | 2018-05-01 |
KR102222316B1 (ko) | 2021-03-04 |
TW201937758A (zh) | 2019-09-16 |
US9653662B2 (en) | 2017-05-16 |
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