CN104609146A - Separated silicon wafer conveying device and silicon wafer conveying method - Google Patents
Separated silicon wafer conveying device and silicon wafer conveying method Download PDFInfo
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- CN104609146A CN104609146A CN201510051096.9A CN201510051096A CN104609146A CN 104609146 A CN104609146 A CN 104609146A CN 201510051096 A CN201510051096 A CN 201510051096A CN 104609146 A CN104609146 A CN 104609146A
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- conveyer
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- belt conveyor
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Abstract
The invention relates to a conveying device and method, in particular to a separated silicon wafer conveying device. The separated silicon wafer conveying device comprises a silicon wafer set conveying device, a vertical conveying device and a horizontal transition conveying device, wherein the vertical conveying device and the horizontal transition conveying device share the same conveyor belt, and pressing wheels are arranged at the joint of the vertical conveying device and the horizontal transition conveying device. Through holes are formed in the conveyor belt. The vertical conveying device is provided with a silicon wafer suction cup which is installed on the back face of the conveyor belt, and air holes are formed in the silicon wafer suction cup, correspond to the through holes in the conveyor belt and are connected with an air suction device. A push spray nozzle is installed at the tail end of the silicon wafer set conveying device. The spraying direction of the push spray nozzle faces the vertical conveying device. Separated single silicon wafers are pushed onto the conveyor belt through the push spray nozzle, the single silicon wafers are sucked through the through holes in the conveyor belt by means of negative pressure, all the silicon wafers are conveyed through the conveyor belt, the structure of the conveying device is simplified, positioning is accurate, the suction negative pressure is small, and the conveying process is stable.
Description
Technical field
The present invention relates to a kind of conveyer and method, be specially silicon chip burst conveyer and silicon chip transfer approach.
Background technology
Existing silicon chip burst conveyer, mainly stacked silicon chip group 100 be separated piecewise with water cutter, the single silicon chip after separation is fixed by sucker, and the silicon chip of monolithic is transplanted on the belt conveyor of level by sucker again, carries out drying and packing.
The conveyer complex structure of this structure, the especially running gear of sucker, be equivalent to a manipulator, needs accurate divertical motion to control.
Summary of the invention
For above-mentioned technical matters, the invention provides the simple conveyer of a kind of structure, concrete technical scheme is:
Silicon chip burst conveyer, comprise silicon chip group conveyer, vertical conveyer and horizontal transition conveyer, described silicon chip group conveyer end is connected with vertical conveyer, vertical conveyer and horizontal transition conveyer share same belt conveyor, and there is pinch roller the junction of vertical conveyer and horizontal transition conveyer; Described belt conveyor there is through hole, described vertical conveyer also has silicon wafer sucking disc, and described silicon wafer sucking disc is arranged on the back side of belt conveyor, and described silicon wafer sucking disc has pore, described pore is corresponding with the through hole on belt conveyor, and described pore is connected with air extractor; The end of silicon chip group conveyer is provided with silicon chip burst water cutter, and silicon chip group conveyer end is also provided with propelling movement shower nozzle, and described propelling movement shower nozzle injection direction is towards vertical conveyer.
Described propelling movement shower nozzle has three, and comprise two and arranged side by side be arranged on the upper propelling movement shower nozzle of top and the lower propelling movement shower nozzle of below, upper propelling movement shower nozzle is towards the single silicon chip first half, and lower propelling movement shower nozzle is towards single silicon chip lower part.
The surface of described belt conveyor is smooth flat structure, there is groove at the back side, described groove engages with vertical conveyer and horizontal transition conveyer driven wheel, the back side also comprises platform, described platform has through hole be communicated with the back side on belt conveyor surface, described platform surface is smooth structure.
Described silicon wafer sucking disc pore place is embedded with wear-resistant pad.
Described silicon wafer sucking disc comprises front and rear panels, the pore that described header board has two rows vertically to arrange, and described rear plate is to there being two vertical grooves, and described two vertical grooves are communicated with aspirating hole respectively, and described aspirating hole is connected with air extractor.
Described belt conveyor is two, corresponding with two deflation hole positions of header board respectively.
Described silicon wafer sucking disc also comprises permeable hole, the through front and rear panels of described permeable hole.Permeable hole is not blocked by belt conveyor.
Silicon chip transfer approach, comprises the following steps:
(1) stacked silicon chip group is sent to silicon chip group conveyer end, after silicon chip burst water cutter separates, form slices independently single silicon chip;
(2) push shower nozzle single silicon chip propelling movement to be swung on the belt conveyor at vertical conveyer place by air-flow or current, the through hole on belt conveyor is communicated with the pore on silicon wafer sucking disc, forms negative-pressure adsorption power and is adsorbed on the surface of belt conveyor by single silicon chip;
(3) single silicon chip is moved to horizontal transition conveyer along with belt conveyor, single silicon chip is fitted on a moving belt by pinch roller in the junction of vertical conveyer and horizontal transition conveyer, until single silicon chip is along with conveyer belt is on horizontal transition conveyer.
Silicon chip burst conveyer provided by the invention and transfer approach, single silicon chip after burst is pushed on belt conveyor by pushing shower nozzle, single silicon chip is adsorbed by negative pressure by the through hole on belt conveyor, whole transmission is completed by belt conveyor, simplify the structure of conveyer, and registration, absorption negative pressure is little, and transport process is stablized.
Accompanying drawing explanation
Fig. 1 is perspective view of the present invention;
Fig. 2 is side-looking structural representation of the present invention;
Fig. 3 is local structure schematic diagram of the present invention;
Fig. 4 is conveyer structure schematic diagram of the present invention;
Fig. 5 is belt conveyor cross section structure schematic diagram of the present invention;
Fig. 6 is silicon wafer sucking disc detonation configuration schematic diagram of the present invention.
Detailed description of the invention
Accompanying drawings the specific embodiment of the present invention:
As depicted in figs. 1 and 2, silicon chip burst conveyer, comprise silicon chip group conveyer 5, vertical conveyer 12 and horizontal transition conveyer 11, described silicon chip group conveyer 5 end is connected with vertical conveyer 12, vertical conveyer 12 shares same belt conveyor 1 with horizontal transition conveyer 11, commutated by multiple roller, vertical conveyer 12 tilts a little, horizontal transition conveyer 11 is arcuate structure, vertical toward horizontal direction transition from what tilt a little gradually, vertical conveyer 12 has pinch roller 2 with the junction of horizontal transition conveyer 11, described belt conveyor 1 there is through hole 103, described vertical conveyer 12 also has silicon wafer sucking disc 6, described silicon wafer sucking disc 6 is arranged on the back side of belt conveyor 1, described silicon wafer sucking disc 6 there is pore 61, described pore 61 is corresponding with the through hole 103 on belt conveyor 1, and described pore 61 is connected with air extractor 67, the end of silicon chip group conveyer 5 is provided with silicon chip burst water cutter 3, and silicon chip group conveyer 5 end is also provided with and pushes shower nozzle 4, and described propelling movement shower nozzle 4 injection direction is towards vertical conveyer 12.Single silicon chip 200 after burst can one to transmit straight through belt conveyor 1, then enters the follow-up conveyer of level from horizontal transition conveyer 11, simplifies the structure of conveyer.
As shown in Figures 2 and 3, described propelling movement shower nozzle 4 has three, comprise two and arranged side by side be arranged on the upper propelling movement shower nozzle 41 of top and the lower propelling movement shower nozzle 42 of below, upper propelling movement shower nozzle 41 is towards single silicon chip 200 first half, and lower propelling movement shower nozzle 42 is towards single silicon chip 200 lower part.Three push shower nozzles 4, distribute up and down, can ensure stable by single silicon chip 200 propelling movement.Single silicon chip 200 not only can be made to fit to accurately on belt conveyor 1 through propelling movement to play accurate positioning action, absorption negative pressure can also be reduced, do not need larger negative pressure the single silicon chip 200 away from belt conveyor to be adsorbed.
As shown in Figure 4 and Figure 5, the surface of described belt conveyor 1 is smooth flat structure, there is groove 101 at the back side, described groove 101 engages with vertical conveyer 12 and horizontal transition conveyer 11 driven wheel, the back side also comprises platform 102, described platform 102 has through hole 103 be communicated with the back side on belt conveyor 1 surface, described platform 102 surface is smooth structure.Belt conveyor 1 smooth surface structure can make single silicon chip 200 be fitted in the surface of belt conveyor 1, and ensures that through hole 103 exists negative pressure.Platform 102 surface for smooth structure be fit with the surface of silicon wafer sucking disc 6 to ensure.
As shown in Figure 6, described silicon wafer sucking disc 6 pore 61 place is embedded with wear-resistant pad 62.Be sliding relation between the platform 102 of wear-resistant pad 62 and belt conveyor 1, adopt metallic material to make wear-resistant pad 62, can friction coefficient be reduced, increase the service life.
Described silicon wafer sucking disc 6 comprises header board 63 and rear plate 64, the pore 61 that described header board 63 has two rows vertically to arrange, described rear plate 64 is to there being two vertical grooves 65, and described two vertical grooves 65 are communicated with aspirating hole 66 respectively, and described aspirating hole 66 is connected with air extractor 67.Air extractor 67 is bled formation negative pressure, and two deflation holes produce two adsorption affinitys in left and right, ensure absorption stability.
Described belt conveyor 1 is two, corresponding with two deflation hole 61 positions of header board 63 respectively.
Described silicon wafer sucking disc 6 also comprises permeable hole 68, the described through header board of permeable hole 68 63 and rear plate 64.Permeable hole 68 is not blocked by belt conveyor 1.When single silicon chip 200 is moved to belt conveyor 1, the water between single silicon chip 200 and belt conveyor 1 can be discharged to both sides and permeable hole 68 simultaneously, increasing water discharge capacity and ensure that single silicon chip 200 can not be cheap in moving.
Silicon chip transfer approach, comprises the following steps:
(1) stacked silicon chip group 100 is sent to silicon chip group conveyer 5 end, after silicon chip burst water cutter 3 separates, form slices independently single silicon chip 200;
(2) pushing shower nozzle 4 swings on the belt conveyor 1 at vertical conveyer 12 place by air-flow or current by single silicon chip 200 propelling movement, through hole 103 on belt conveyor 1 is communicated with the pore 61 on silicon wafer sucking disc 6, forms negative-pressure adsorption power and single silicon chip 200 is adsorbed on the surface of belt conveyor 1;
(3) single silicon chip 200 is moved to horizontal transition conveyer 11 along with belt conveyor 1, single silicon chip 200 is fitted on belt conveyor 1 by pinch roller 2 in the junction of vertical conveyer 12 with horizontal transition conveyer 11, until single silicon chip 200 moves on horizontal transition conveyer 11 along with belt conveyor 1.
Claims (8)
1. silicon chip burst conveyer, comprise silicon chip group conveyer (5), it is characterized in that: also comprise vertical conveyer (12) and horizontal transition conveyer (11), described silicon chip group conveyer (5) end is connected with vertical conveyer (12), vertical conveyer (12) shares same belt conveyor (1) with horizontal transition conveyer (11), and vertical conveyer (12) has pinch roller (2) with the junction of horizontal transition conveyer (11); Described belt conveyor (1) there is through hole (103), described vertical conveyer (12) also has silicon wafer sucking disc (6), described silicon wafer sucking disc (6) is arranged on the back side of belt conveyor (1), described silicon wafer sucking disc (6) there is pore (61), described pore (61) is corresponding with the through hole (103) on belt conveyor (1), and described pore (61) is connected with air extractor (67); The end of silicon chip group conveyer (5) is provided with silicon chip burst water cutter (3), and silicon chip group conveyer (5) end is also provided with and pushes shower nozzle (4), and described propelling movement shower nozzle (4) injection direction is towards vertical conveyer (12).
2. silicon chip burst conveyer according to claim 1, it is characterized in that: described propelling movement shower nozzle (4) has three, comprise two and arranged side by side be arranged on the upper propelling movement shower nozzle (4) 1 of top and the lower propelling movement shower nozzle (42) of below, upper propelling movement shower nozzle (41) is towards single silicon chip (200) first half, and lower propelling movement shower nozzle (42) is towards single silicon chip (200) lower part.
3. silicon chip burst conveyer according to claim 1, it is characterized in that: the surface of described belt conveyor (1) is smooth flat structure, there is groove (101) at the back side, described groove (101) engages with vertical conveyer (12) and horizontal transition conveyer (11) driven wheel, the back side also comprises platform (102), described platform (102) has through hole (103) be communicated with the back side on belt conveyor (1) surface, described platform (102) surface is smooth structure.
4. silicon chip burst conveyer according to claim 1, is characterized in that: described silicon wafer sucking disc (6) pore (61) place is embedded with wear-resistant pad (62).
5. the silicon chip burst conveyer according to any one of claim 1 to 4, it is characterized in that: described silicon wafer sucking disc (6) comprises header board (63) and rear plate (64), the pore (61) that described header board (63) has two rows vertically to arrange, described rear plate (64) is to there being two vertical grooves (65), described two vertical grooves (65) are communicated with aspirating hole (66) respectively, and described aspirating hole (66) is connected with air extractor (67).
6. silicon chip burst conveyer according to claim 5, is characterized in that: described belt conveyor (1) is two, corresponding with two deflation holes (61) position of header board (63) respectively.
7. silicon chip burst conveyer according to claim 5, it is characterized in that: described silicon wafer sucking disc (6) also comprises permeable hole (68), described permeable hole (68) through header board (63) and rear plate (64), permeable hole (68) is not blocked by belt conveyor (1).
8. silicon chip transfer approach, is characterized in that, comprises the following steps:
(1) stacked silicon chip group (100) is sent to silicon chip group conveyer (5) end, after silicon chip burst water cutter (3) separates, form slices independently single silicon chip (200);
(2) pushing shower nozzle (4) swings on the belt conveyor (1) at vertical conveyer (12) place by air-flow or current by single silicon chip (200) propelling movement, through hole (103) on belt conveyor (1) is communicated with the pore (61) on silicon wafer sucking disc (6), forms negative-pressure adsorption power and is adsorbed on the surface of belt conveyor (1) by single silicon chip (200);
(3) single silicon chip (200) is moved to horizontal transition conveyer (11) along with belt conveyor (1), single silicon chip (200) is fitted on belt conveyor (1) by pinch roller (2) in the junction of vertical conveyer (12) and horizontal transition conveyer (11), until single silicon chip (200) moves on horizontal transition conveyer (11) along with belt conveyor (1).
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106180111A (en) * | 2016-08-24 | 2016-12-07 | 高佳太阳能股份有限公司 | A kind of feeding device of automatic machine for inserting silicon wafers |
| CN107946212A (en) * | 2017-11-21 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | The underwater automatic sheet-fetching plug-in sheet machine of silicon chip |
| CN107968063A (en) * | 2017-11-21 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | The underwater automatic charging device of silicon chip |
| CN108288596A (en) * | 2018-02-12 | 2018-07-17 | 苏州卓樱自动化设备有限公司 | A kind of separator of silicon chip after cutting |
| CN108545225A (en) * | 2018-05-25 | 2018-09-18 | 王林和 | Can auto plate separation, sealing, points warm paste packing machine |
| CN108861443A (en) * | 2018-05-29 | 2018-11-23 | 安吉森虎家具有限公司 | A kind of material feeding device of bamboo wood furniture |
| CN109607285A (en) * | 2018-12-30 | 2019-04-12 | 无锡深南电路有限公司 | PCB platelet receives plate system |
| CN109607287A (en) * | 2018-12-30 | 2019-04-12 | 无锡深南电路有限公司 | Recumbent is without hurting catcher |
| CN114455355A (en) * | 2022-03-21 | 2022-05-10 | 芜湖启迪睿视信息技术有限公司 | Single-chip separation equipment for irregular flaky objects |
| CN115841975A (en) * | 2023-01-31 | 2023-03-24 | 中润新能源(滁州)有限公司 | High-stability light silicon wafer conveying frame equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107946212A (en) * | 2017-11-21 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | The underwater automatic sheet-fetching plug-in sheet machine of silicon chip |
| CN107968063A (en) * | 2017-11-21 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | The underwater automatic charging device of silicon chip |
| CN108288596A (en) * | 2018-02-12 | 2018-07-17 | 苏州卓樱自动化设备有限公司 | A kind of separator of silicon chip after cutting |
| CN108545225A (en) * | 2018-05-25 | 2018-09-18 | 王林和 | Can auto plate separation, sealing, points warm paste packing machine |
| CN108861443A (en) * | 2018-05-29 | 2018-11-23 | 安吉森虎家具有限公司 | A kind of material feeding device of bamboo wood furniture |
| CN109607285A (en) * | 2018-12-30 | 2019-04-12 | 无锡深南电路有限公司 | PCB platelet receives plate system |
| CN109607287A (en) * | 2018-12-30 | 2019-04-12 | 无锡深南电路有限公司 | Recumbent is without hurting catcher |
| CN109607285B (en) * | 2018-12-30 | 2020-05-22 | 无锡深南电路有限公司 | PCB small board collecting system |
| CN109607287B (en) * | 2018-12-30 | 2020-05-22 | 无锡深南电路有限公司 | Lean on formula to one side and do not have and hinder receipts board device |
| CN114455355A (en) * | 2022-03-21 | 2022-05-10 | 芜湖启迪睿视信息技术有限公司 | Single-chip separation equipment for irregular flaky objects |
| CN115841975A (en) * | 2023-01-31 | 2023-03-24 | 中润新能源(滁州)有限公司 | High-stability light silicon wafer conveying frame equipment |
| CN115841975B (en) * | 2023-01-31 | 2023-09-29 | 中润新能源(滁州)有限公司 | High-stability light silicon wafer conveying frame equipment |
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