CN104609146B - Separated silicon wafer conveying device and silicon wafer conveying method - Google Patents
Separated silicon wafer conveying device and silicon wafer conveying method Download PDFInfo
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- CN104609146B CN104609146B CN201510051096.9A CN201510051096A CN104609146B CN 104609146 B CN104609146 B CN 104609146B CN 201510051096 A CN201510051096 A CN 201510051096A CN 104609146 B CN104609146 B CN 104609146B
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- conveyer belt
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Abstract
The invention relates to a conveying device and method, in particular to a separated silicon wafer conveying device. The separated silicon wafer conveying device comprises a silicon wafer set conveying device, a vertical conveying device and a horizontal transition conveying device, wherein the vertical conveying device and the horizontal transition conveying device share the same conveyor belt, and pressing wheels are arranged at the joint of the vertical conveying device and the horizontal transition conveying device. Through holes are formed in the conveyor belt. The vertical conveying device is provided with a silicon wafer suction cup which is installed on the back face of the conveyor belt, and air holes are formed in the silicon wafer suction cup, correspond to the through holes in the conveyor belt and are connected with an air suction device. A push spray nozzle is installed at the tail end of the silicon wafer set conveying device. The spraying direction of the push spray nozzle faces the vertical conveying device. Separated single silicon wafers are pushed onto the conveyor belt through the push spray nozzle, the single silicon wafers are sucked through the through holes in the conveyor belt by means of negative pressure, all the silicon wafers are conveyed through the conveyor belt, the structure of the conveying device is simplified, positioning is accurate, the suction negative pressure is small, and the conveying process is stable.
Description
Technical field
The present invention relates to a kind of transporter and method, specially silicon chip burst transporter and silicon chip transfer approach.
Background technology
Existing silicon chip burst transporter, is mainly piecewise separated the silicon chip group 100 of stacking with water knife, after separation
Single silicon chip is fixed by sucker, and sucker is again transplanted on the silicon chip of monolithic on horizontal conveyer belt, is dried and is packed.
The transporter complex structure of this structure, the especially telecontrol equipment of sucker, equivalent to a mechanical hand, need
Accurate divertical motion control.
The content of the invention
For above-mentioned technical problem, the present invention provides a kind of transporter of simple structure, and concrete technical scheme is：
Silicon chip burst transporter, including silicon chip group transporter, vertical transporter and horizontal transition transporter, institute
The silicon chip group transporter end stated is connected with vertical transporter, and vertical transporter shares same with horizontal transition transporter
One conveyer belt, vertical transporter has pinch roller with the junction of horizontal transition transporter；There are through hole, institute on described conveyer belt
The vertical transporter stated also has silicon wafer sucking disc, and described silicon wafer sucking disc is arranged on the back side of conveyer belt, described silicon wafer sucking disc
On have pore, described pore is corresponding with the through hole on conveyer belt, and described pore is connected with air extractor；Silicon chip group transmission dress
The end put is provided with silicon chip burst water knife, and silicon chip group transporter end is also equipped with pushing shower nozzle, described push shower nozzle
Injection direction is towards vertical transporter.
Described push shower nozzle has three, including two upper push shower nozzles being mounted above arranged side by side and pushes away under lower section
Shower nozzle is sent, towards the single silicon chip first half, lower push shower nozzle is towards single silicon chip lower half for upper push shower nozzle.
The surface of described conveyer belt is smooth flat structure, and there is a groove at the back side, described groove and vertical transporter
With the engagement of horizontal transition transporter drive gear, the back side also includes platform, has through hole to transmit belt surface on described platform
Connect with the back side, described platform surface is smooth structure.
Wear-resistant pad is embedded with described silicon wafer sucking disc pore.
Described silicon wafer sucking disc includes front and rear panels, and described header board has a pore that two rows are vertically arranged, it is described after
To there is two vertical grooves, two described vertical grooves are connected respectively plate with aspirating hole, the aspirating hole and air extractor
Connection.
Described conveyer belt is two, corresponding with two aerofluxuss hole sites of header board respectively.
Also include permeable hole, described permeable hole insertion front and rear panels on described silicon wafer sucking disc.Permeable hole not by
Conveyer belt is blocked.
Silicon chip transfer approach, comprises the following steps：
（1）The silicon chip group of stacking is sent to silicon chip group transporter end, and after silicon chip burst water knife separates one is formed
The single silicon chip of blade independence；
（2）Push shower nozzle and single silicon chip is pushed into the conveyer belt swung at vertical transporter by air-flow or current
On, the through hole on conveyer belt is connected with the pore on silicon wafer sucking disc, is formed negative-pressure adsorption power and is adsorbed single silicon chip in conveyer belt
Surface on；
（3）Single silicon chip is moved with conveyer belt to horizontal transition transporter, in vertical transporter and horizontal transition
Single silicon chip is fitted on a moving belt, until single silicon chip as conveyer belt is arrived by pinch roller the junction of transporter
On horizontal transition transporter.
Silicon chip burst transporter and transfer approach that the present invention is provided, the single silicon chip after burst is pushed by shower nozzle is pushed
To on conveyer belt, the through hole on conveyer belt is adsorbed single silicon chip by negative pressure, and by conveyer belt whole transmission are completed, and is simplified
The structure of transporter, and registration, absorption negative pressure is little, and transmit process is stable.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the present invention；
Fig. 2 is the side structure schematic view of the present invention；
Fig. 3 is the partial structural diagram of the present invention；
Fig. 4 is the conveyer structure schematic diagram of the present invention；
Fig. 5 is the conveyer belt cross section structure schematic diagram of the present invention；
Fig. 6 is the silicon wafer sucking disc configuration schematic diagram of the present invention.
Specific embodiment
The specific embodiment of the present invention is described with reference to the drawings：
As depicted in figs. 1 and 2, silicon chip burst transporter, including silicon chip group transporter 5, the and of vertical transporter 12
Horizontal transition transporter 11, the described end of silicon chip group transporter 5 is connected with vertical transporter 12, vertical transporter
12 share same conveyer belt 1 with horizontal transition transporter 11, are commutated by multiple rollers, and vertical transporter 12 is somewhat
Incline, horizontal transition transporter 11 is arcuate structure, gradually vertical toward horizontal direction transition from what is be slightly tilted, vertical transmission
Device 12 has pinch roller 2 with the junction of horizontal transition transporter 11；There is through hole 103 on described conveyer belt 1, described is vertical
Transporter 12 also has silicon wafer sucking disc 6, and described silicon wafer sucking disc 6 is arranged on the back side of conveyer belt 1, on described silicon wafer sucking disc 6
There is pore 61, described pore 61 is corresponding with the through hole 103 on conveyer belt 1, and described pore 61 is connected with air extractor 67；Silicon
The end of piece group transporter 5 is provided with silicon chip burst water knife 3, and the end of silicon chip group transporter 5 is also equipped with pushing shower nozzle 4,
The described injection direction of push shower nozzle 4 is towards vertical transporter 12.Single silicon chip 200 after burst can be all the time by transmission
Band 1 is transmitted, and then from the follow-up transporter that horizontal transition transporter 11 enters level, simplifies transporter
Structure.
As shown in Figures 2 and 3, described push shower nozzle 4 has three, including two upper push being mounted above arranged side by side
Shower nozzle 41 and the lower push shower nozzle 42 of lower section, upper push shower nozzle 41 is towards the first half of single silicon chip 200, the lower direction of push shower nozzle 42
The lower half of single silicon chip 200.Three push shower nozzles 4, are distributed up and down, it is ensured that stable by the propelling movement of single silicon chip 200.
Through push single silicon chip 200 not only can be caused accurately to fit to the effect of being accurately positioned to be played on conveyer belt 1, can also be subtracted
Adsorb negative pressure less, it is not necessary to which larger negative pressure will be far from the single silicon chip 200 of conveyer belt and adsorb.
As shown in Figure 4 and Figure 5, the surface of described conveyer belt 1 is smooth flat structure, and there is groove 101 at the back side, described
Groove 101 is engaged with vertical transporter 12 and the drive gear of horizontal transition transporter 11, and the back side also includes platform 102, institute
There is through hole 103 to connect the surface of conveyer belt 1 with the back side on the platform 102 stated, the described surface of platform 102 is smooth structure.Pass
Sending can be so that single silicon chip 200 be fitted in the surface of conveyer belt 1 with 1 surface smooth structure, and it is negative to ensure that through hole 103 is present
Pressure.The surface of platform 102 is to ensure to be fitted with the surface of silicon wafer sucking disc 6 for smooth structure.
As shown in fig. 6, being embedded with wear-resistant pad 62 at the described pore 61 of silicon wafer sucking disc 6.The platform of wear-resistant pad 62 and conveyer belt 1
It is sliding relation between 102, wear-resistant pad 62 is made using metal material, coefficient of friction can be reduced, increases the service life.
Described silicon wafer sucking disc 6 includes header board 63 and back plate 64, and described header board 63 has the pore 61 that two rows are vertically arranged
, described back plate 64 pairs should have two vertical grooves 65, and two described vertical grooves 65 are connected respectively with aspirating hole 66, described
Aspirating hole 66 is connected with air extractor 67.The pumping of air extractor 67 forms negative pressure, and two steam vents produce two absorption affinities in left and right, protect
Card absorption stability.
Described conveyer belt 1 is two, corresponding with the position of two steam vent 61 of header board 63 respectively.
Also include permeable hole 68, the described insertion header board 63 of permeable hole 68 and back plate 64 on described silicon wafer sucking disc 6.It is permeable
Do not blocked by conveyer belt 1 in hole 68.When single silicon chip 200 is moved to conveyer belt 1, between single silicon chip 200 and conveyer belt 1
Water can discharge to both sides and permeable hole 68 simultaneously, increasing water discharge capacity and ensure that single silicon chip 200 will not be cheap in moving.
Silicon chip transfer approach, comprises the following steps：
（1）The silicon chip group 100 of stacking is sent to the end of silicon chip group transporter 5, the shape after silicon chip burst water knife 3 separates
Into blocks of independent single silicon chip 200；
（2）Push shower nozzle 4 and single silicon chip 200 is pushed into the biography swung at vertical transporter 12 by air-flow or current
Send on band 1, the through hole 103 on conveyer belt 1 is connected with the pore 61 on silicon wafer sucking disc 6, form negative-pressure adsorption power by single silicon chip
200 absorption are on the surface of conveyer belt 1；
（3）Single silicon chip 200 is moved with conveyer belt 1 to horizontal transition transporter 11, vertical transporter 12 with
The junction of horizontal transition transporter 11 is fitted in single silicon chip 200 on conveyer belt 1, until single silicon chip by pinch roller 2
200 move on horizontal transition transporter 11 with conveyer belt 1.
Claims (6)
1. silicon chip burst transporter, including silicon chip group transporter（5）, it is characterised in that：Also include vertical transporter
（12）With horizontal transition transporter（11）, described silicon chip group transporter（5）End and vertical transporter（12）Connection,
Vertical transporter（12）With horizontal transition transporter（11）Share same conveyer belt（1）, vertical transporter（12）With water
Flat transitional transmission device（11）Junction have pinch roller（2）；Described conveyer belt（1）On have through hole（103）, described vertical biography
Send device（12）Also silicon wafer sucking disc（6）, described silicon wafer sucking disc（6）Installed in conveyer belt（1）The back side, described silicon chip inhales
Disk（6）On have pore（61）, described pore（61）With conveyer belt（1）On through hole（103）Correspondence, described pore（61）With
Air extractor（67）Connection；Described conveyer belt（1）For two, respectively with header board（63）Two steam vents（61）Position correspondence；
Described silicon wafer sucking disc（6）Including header board（63）And back plate（64）, described header board（63）There is the gas that two rows are vertically arranged
Hole（61）, described back plate（64）To there is two vertical grooves（65）, described two vertical grooves（65）Respectively with pumping
Hole（66）Connection, the aspirating hole（66）With air extractor（67）Connection；
Silicon chip group transporter（5）End silicon chip burst water knife is installed（3）, silicon chip group transporter（5）Also install end
There is push shower nozzle（4）, described push shower nozzle（4）Injection direction is towards vertical transporter（12）.
2. silicon chip burst transporter according to claim 1, it is characterised in that：Described push shower nozzle（4）There are three,
Including two upper push shower nozzles being mounted above arranged side by side（41）With the lower push shower nozzle of lower section（42）, upper push shower nozzle（41）
Towards single silicon chip（200）The first half, lower push shower nozzle（42）Towards single silicon chip（200）Lower half.
3. silicon chip burst transporter according to claim 1, it is characterised in that：Described conveyer belt（1）Surface be
Smooth flat structure, there is groove at the back side（101）, described groove（101）With vertical transporter（12）With horizontal transition transmission
Device（11）Drive gear is engaged, and the back side also includes platform（102）, described platform（102）On have through hole（103）By conveyer belt
（1）Surface connects with the back side, described platform（102）Surface is smooth structure.
4. silicon chip burst transporter according to claim 1, it is characterised in that：Described silicon wafer sucking disc（6）Pore
（61）Place is embedded with wear-resistant pad（62）.
5. the silicon chip burst transporter according to any one of claim 1 to 4, it is characterised in that：Described conveyer belt（1）
For two, respectively with header board（63）Two steam vents（61）Position correspondence.
6. silicon chip burst transporter according to claim 5, it is characterised in that：Described silicon wafer sucking disc（6）On also wrap
Include permeable hole（68）, described permeable hole（68）Insertion header board（63）And back plate（64）；Permeable hole（68）Not by conveyer belt（1）
Block.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510051096.9A CN104609146B (en) | 2015-02-02 | 2015-02-02 | Separated silicon wafer conveying device and silicon wafer conveying method |
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| CN201510051096.9A CN104609146B (en) | 2015-02-02 | 2015-02-02 | Separated silicon wafer conveying device and silicon wafer conveying method |
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| CN104609146A CN104609146A (en) | 2015-05-13 |
| CN104609146B true CN104609146B (en) | 2017-05-17 |
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| CN106180111A (en) * | 2016-08-24 | 2016-12-07 | 高佳太阳能股份有限公司 | A kind of feeding device of automatic machine for inserting silicon wafers |
| CN107968063A (en) * | 2017-11-21 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | The underwater automatic charging device of silicon chip |
| CN107946212A (en) * | 2017-11-21 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | The underwater automatic sheet-fetching plug-in sheet machine of silicon chip |
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| CN108545225A (en) * | 2018-05-25 | 2018-09-18 | 王林和 | Can auto plate separation, sealing, points warm paste packing machine |
| CN108861443B (en) * | 2018-05-29 | 2019-12-31 | 泰顺县维富玩具有限公司 | Material conveying device for bamboo furniture |
| CN109607287B (en) * | 2018-12-30 | 2020-05-22 | 无锡深南电路有限公司 | Lean on formula to one side and do not have and hinder receipts board device |
| CN109607285B (en) * | 2018-12-30 | 2020-05-22 | 无锡深南电路有限公司 | PCB small board collecting system |
| CN114455355A (en) * | 2022-03-21 | 2022-05-10 | 芜湖启迪睿视信息技术有限公司 | Single-chip separation equipment for irregular flaky objects |
| CN115841975B (en) * | 2023-01-31 | 2023-09-29 | 中润新能源(滁州)有限公司 | High-stability light silicon wafer conveying frame equipment |
| CN118268841A (en) * | 2024-06-04 | 2024-07-02 | 济南西电特种变压器有限公司 | Transformer disassembling equipment |
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| JP3525621B2 (en) * | 1996-05-10 | 2004-05-10 | 株式会社日立製作所 | Paper sheet separation device |
| ES1048690Y (en) * | 2001-02-01 | 2002-02-01 | Vivas Leon Benmayor | CHARGER DOWNLOADED PRINTED CIRCUITS. |
| DE102010045098A1 (en) * | 2010-09-13 | 2012-03-15 | Rena Gmbh | Device and method for separating and transporting substrates |
| CN201838565U (en) * | 2010-09-21 | 2011-05-18 | 江西赛维Ldk太阳能高科技有限公司 | Automatic wet silicon slice distributing device |
| CN102420269A (en) * | 2011-09-30 | 2012-04-18 | 无锡市南亚科技有限公司 | Dry-method automatic separation mechanism of silicon sheets |
| CN202717397U (en) * | 2012-08-22 | 2013-02-06 | 张家港市超声电气有限公司 | Negative pressure type plate parting machine |
| CN104016153B (en) * | 2014-06-19 | 2017-01-18 | 张家港市超声电气有限公司 | Substrate distribution device |
| CN204473791U (en) * | 2015-02-02 | 2015-07-15 | 无锡市南亚科技有限公司 | Silicon chip burst conveyer |
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