CN104583870A - 正型感光性树脂组合物、硬化膜的制造方法、硬化膜、有机el显示装置及液晶显示装置 - Google Patents

正型感光性树脂组合物、硬化膜的制造方法、硬化膜、有机el显示装置及液晶显示装置 Download PDF

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Publication number
CN104583870A
CN104583870A CN201380043962.9A CN201380043962A CN104583870A CN 104583870 A CN104583870 A CN 104583870A CN 201380043962 A CN201380043962 A CN 201380043962A CN 104583870 A CN104583870 A CN 104583870A
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repetitive
positive type
organic compound
type photosensitive
photosensitive organic
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Chinese (zh)
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山田悟
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Liquid Crystal (AREA)
CN201380043962.9A 2012-08-23 2013-07-05 正型感光性树脂组合物、硬化膜的制造方法、硬化膜、有机el显示装置及液晶显示装置 Pending CN104583870A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012183858 2012-08-23
JP2012-183858 2012-08-23
PCT/JP2013/068462 WO2014030441A1 (ja) 2012-08-23 2013-07-05 ポジ型感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置

Publications (1)

Publication Number Publication Date
CN104583870A true CN104583870A (zh) 2015-04-29

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JP (1) JP5914668B2 (ja)
KR (1) KR101746606B1 (ja)
CN (1) CN104583870A (ja)
TW (1) TWI587092B (ja)
WO (1) WO2014030441A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108732868A (zh) * 2017-04-17 2018-11-02 信越化学工业株式会社 正型抗蚀剂膜层合体和图案形成方法
CN109863206A (zh) * 2016-11-02 2019-06-07 东丽株式会社 树脂组合物、树脂片材、固化膜、有机el显示装置、半导体电子部件、半导体器件及有机el显示装置的制造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559081B (zh) * 2014-03-17 2016-11-21 奇美實業股份有限公司 感光性樹脂組成物及其應用
JP6118287B2 (ja) * 2014-03-26 2017-04-19 富士フイルム株式会社 半導体素子及び半導体素子の絶縁層形成用組成物
TWI567500B (zh) * 2014-04-30 2017-01-21 奇美實業股份有限公司 組成物、薄膜及其形成方法、保護膜、隔離壁及顯示元件
US10866512B2 (en) 2015-10-21 2020-12-15 Showa Denko K.K. Positive photosensitive resin composition
JP6588354B2 (ja) * 2016-01-29 2019-10-09 富士フイルム株式会社 感光性樹脂組成物、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置および硬化膜の製造方法
WO2019065262A1 (ja) 2017-09-29 2019-04-04 日本ゼオン株式会社 ポジ型感放射線性樹脂組成物
KR102679663B1 (ko) * 2020-09-08 2024-06-27 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 컬러필터
WO2022080195A1 (ja) 2020-10-13 2022-04-21 日本ゼオン株式会社 感放射線性樹脂組成物
TW202402821A (zh) * 2022-04-28 2024-01-16 日商大阪有機化學工業股份有限公司 聚合物、與硬化性樹脂組合物、使該組合物硬化而成之伸長性絕緣性硬化膜及觸控面板用絕緣性硬化膜、觸控面板、可撓性印刷電路基板用絕緣性硬化膜、及可撓性印刷電路基板

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EP1659127A1 (en) * 2004-11-16 2006-05-24 Shin-Etsu Chemical Co., Ltd. Preparation of sulfide chain-bearing organosilicon compounds
JP2007078796A (ja) * 2005-09-12 2007-03-29 Sumitomo Bakelite Co Ltd 半導体装置
WO2012036000A1 (ja) * 2010-09-16 2012-03-22 日立化成工業株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
CN102540726A (zh) * 2010-12-13 2012-07-04 富士胶片株式会社 正型感光性树脂组成物、硬化膜及其形成方法、层间绝缘膜以及显示装置

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US4497890A (en) * 1983-04-08 1985-02-05 Motorola, Inc. Process for improving adhesion of resist to gold
JP5338258B2 (ja) * 2008-10-30 2013-11-13 Ｊｎｃ株式会社 ポジ型感光性組成物、この組成物から得られる硬化膜、及びこの硬化膜を有する表示素子
JP5507208B2 (ja) 2009-04-08 2014-05-28 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜、層間絶縁膜、有機ｅｌ表示装置、及び液晶表示装置
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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
EP1659127A1 (en) * 2004-11-16 2006-05-24 Shin-Etsu Chemical Co., Ltd. Preparation of sulfide chain-bearing organosilicon compounds
JP2007078796A (ja) * 2005-09-12 2007-03-29 Sumitomo Bakelite Co Ltd 半導体装置
WO2012036000A1 (ja) * 2010-09-16 2012-03-22 日立化成工業株式会社 ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品
CN103097954A (zh) * 2010-09-16 2013-05-08 日立化成株式会社 正型感光性树脂组合物、抗蚀图形的制造方法和电子部件
CN102540726A (zh) * 2010-12-13 2012-07-04 富士胶片株式会社 正型感光性树脂组成物、硬化膜及其形成方法、层间绝缘膜以及显示装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109863206A (zh) * 2016-11-02 2019-06-07 东丽株式会社 树脂组合物、树脂片材、固化膜、有机el显示装置、半导体电子部件、半导体器件及有机el显示装置的制造方法
CN109863206B (zh) * 2016-11-02 2021-08-24 东丽株式会社 树脂组合物、树脂片材、固化膜、有机el显示装置、半导体电子部件及半导体器件
CN108732868A (zh) * 2017-04-17 2018-11-02 信越化学工业株式会社 正型抗蚀剂膜层合体和图案形成方法
CN108732868B (zh) * 2017-04-17 2022-12-13 信越化学工业株式会社 正型抗蚀剂膜层合体和图案形成方法

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KR101746606B1 (ko) 2017-06-13
TW201409179A (zh) 2014-03-01
JP5914668B2 (ja) 2016-05-11
WO2014030441A1 (ja) 2014-02-27
JPWO2014030441A1 (ja) 2016-07-28
KR20150036548A (ko) 2015-04-07
TWI587092B (zh) 2017-06-11

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Application publication date: 20150429