CN104582238B - 一种pcb板及其制造方法 - Google Patents
一种pcb板及其制造方法 Download PDFInfo
- Publication number
- CN104582238B CN104582238B CN201310499370.XA CN201310499370A CN104582238B CN 104582238 B CN104582238 B CN 104582238B CN 201310499370 A CN201310499370 A CN 201310499370A CN 104582238 B CN104582238 B CN 104582238B
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- CN
- China
- Prior art keywords
- wire
- instrument connection
- back drill
- test
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Monitoring And Testing Of Exchanges (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310499370.XA CN104582238B (zh) | 2013-10-22 | 2013-10-22 | 一种pcb板及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310499370.XA CN104582238B (zh) | 2013-10-22 | 2013-10-22 | 一种pcb板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN104582238A CN104582238A (zh) | 2015-04-29 |
CN104582238B true CN104582238B (zh) | 2018-01-02 |
Family
ID=53097143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201310499370.XA Active CN104582238B (zh) | 2013-10-22 | 2013-10-22 | 一种pcb板及其制造方法 |
Country Status (1)
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CN (1) | CN104582238B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106771824A (zh) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | 一种应用于镭射孔偏移测试点的pcb板及其方法 |
CN106961796B (zh) * | 2017-04-05 | 2019-03-05 | 深圳崇达多层线路板有限公司 | 一种便于检测背钻孔精度的pcb的制作方法 |
CN109061435B (zh) * | 2018-06-29 | 2020-06-19 | 苏州浪潮智能科技有限公司 | 一种背钻加工能力的检测装置及方法 |
CN111722087A (zh) * | 2020-06-30 | 2020-09-29 | 生益电子股份有限公司 | 一种背钻偏位测试板及测试方法 |
CN114383491A (zh) * | 2021-11-26 | 2022-04-22 | 广州美维电子有限公司 | 机械钻孔的快速偏位检查方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103096643A (zh) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | 检测pcb背钻孔的方法和pcb在制板 |
CN203015289U (zh) * | 2012-12-28 | 2013-06-19 | 广州兴森快捷电路科技有限公司 | 具有盲孔内层偏位检测结构的印刷电路板 |
CN103260348A (zh) * | 2013-04-01 | 2013-08-21 | 广州兴森快捷电路科技有限公司 | 高速pcb板以及差分过孔阻抗控制方法 |
-
2013
- 2013-10-22 CN CN201310499370.XA patent/CN104582238B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103096643A (zh) * | 2011-11-03 | 2013-05-08 | 北大方正集团有限公司 | 检测pcb背钻孔的方法和pcb在制板 |
CN203015289U (zh) * | 2012-12-28 | 2013-06-19 | 广州兴森快捷电路科技有限公司 | 具有盲孔内层偏位检测结构的印刷电路板 |
CN103260348A (zh) * | 2013-04-01 | 2013-08-21 | 广州兴森快捷电路科技有限公司 | 高速pcb板以及差分过孔阻抗控制方法 |
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Publication number | Publication date |
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CN104582238A (zh) | 2015-04-29 |
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GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 401332 founder PCB Industrial Park, Xiyong micro electronics industrial park, Shapingba District, Chongqing Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 401332 founder PCB Industrial Park, Xiyong micro electronics industrial park, Shapingba District, Chongqing Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220914 Address after: 401332 Chongqing city Shapingba District No. 367 West Xi Yong Zhen Yong Lu Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: New founder holdings development Co.,Ltd. Address before: 401332 founder PCB Industrial Park, Xiyong micro electronics industrial park, Shapingba District, Chongqing Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |