CN1045754A - 含有酸和稳定剂的烟化二氧化硅的水合胶体分散体 - Google Patents
含有酸和稳定剂的烟化二氧化硅的水合胶体分散体 Download PDFInfo
- Publication number
- CN1045754A CN1045754A CN90101525A CN90101525A CN1045754A CN 1045754 A CN1045754 A CN 1045754A CN 90101525 A CN90101525 A CN 90101525A CN 90101525 A CN90101525 A CN 90101525A CN 1045754 A CN1045754 A CN 1045754A
- Authority
- CN
- China
- Prior art keywords
- dioxide
- aqueous colloidal
- colloidal dispersion
- fuming
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 289
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 138
- 235000012239 silicon dioxide Nutrition 0.000 title claims abstract description 128
- 229960001866 silicon dioxide Drugs 0.000 title claims abstract description 127
- 238000001246 colloidal dispersion Methods 0.000 title claims abstract description 95
- 239000002253 acid Substances 0.000 title claims abstract description 37
- 230000036571 hydration Effects 0.000 title abstract description 73
- 238000006703 hydration reaction Methods 0.000 title abstract description 73
- 239000006185 dispersion Substances 0.000 claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 14
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 12
- 239000000908 ammonium hydroxide Substances 0.000 claims description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- 235000007164 Oryza sativa Nutrition 0.000 claims description 5
- 235000009566 rice Nutrition 0.000 claims description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 229960002887 deanol Drugs 0.000 claims description 2
- 239000012972 dimethylethanolamine Substances 0.000 claims description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011707 mineral Substances 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- 238000002156 mixing Methods 0.000 description 48
- 239000004576 sand Substances 0.000 description 10
- 235000013339 cereals Nutrition 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 5
- 241000209094 Oryza Species 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 230000007115 recruitment Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
- C01B33/1417—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water an aqueous dispersion being obtained
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Colloid Chemistry (AREA)
- Curing Cements, Concrete, And Artificial Stone (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Paper (AREA)
- Treating Waste Gases (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32689089A | 1989-03-21 | 1989-03-21 | |
US326,890 | 1999-06-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1045754A true CN1045754A (zh) | 1990-10-03 |
CN1027162C CN1027162C (zh) | 1994-12-28 |
Family
ID=23274175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN90101525A Expired - Lifetime CN1027162C (zh) | 1989-03-21 | 1990-03-21 | 含有酸和稳定剂的烟化二氧化硅的水合胶体分散体 |
Country Status (11)
Country | Link |
---|---|
JP (1) | JP2949633B2 (zh) |
KR (1) | KR0148692B1 (zh) |
CN (1) | CN1027162C (zh) |
AU (1) | AU625980B2 (zh) |
BE (1) | BE1002854A3 (zh) |
BR (1) | BR9001302A (zh) |
CA (1) | CA2012719C (zh) |
DE (1) | DE4006392A1 (zh) |
FR (1) | FR2644768B1 (zh) |
GB (1) | GB2229432B (zh) |
IT (1) | IT1239546B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1089077C (zh) * | 1998-11-04 | 2002-08-14 | 中国科学院山西煤炭化学研究所 | 一种二氧化硅溶胶胶粒表面修饰方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2816076B2 (ja) * | 1993-01-21 | 1998-10-27 | 日本ペイント株式会社 | コロイダル粒子の分散体および水性塗料組成物 |
DE69611653T2 (de) | 1995-11-10 | 2001-05-03 | Tokuyama Corp., Tokuya | Poliersuspensionen und Verfahren zu ihrer Herstellung |
KR19990023544A (ko) * | 1997-08-19 | 1999-03-25 | 마쯔모또 에이찌 | 무기 입자의 수성 분산체와 그의 제조 방법 |
US5944866A (en) * | 1997-09-26 | 1999-08-31 | Lucent Technologies Inc. | Fabrication including sol-gel processing |
US6132298A (en) * | 1998-11-25 | 2000-10-17 | Applied Materials, Inc. | Carrier head with edge control for chemical mechanical polishing |
JP4428473B2 (ja) * | 1999-01-18 | 2010-03-10 | 株式会社東芝 | 気相法無機酸化物粒子の含水固体状物質及び研磨用スラリーの製造方法 |
JP3721497B2 (ja) * | 1999-07-15 | 2005-11-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物の製造方法 |
DE19936478A1 (de) * | 1999-08-03 | 2001-02-15 | Degussa | Sinterwerkstoffe |
EP1349809B1 (en) * | 2000-11-15 | 2008-03-26 | Cabot Corporation | Method of preparing a fumed metal oxide dispersion |
JP4426192B2 (ja) * | 2003-02-14 | 2010-03-03 | ニッタ・ハース株式会社 | 研磨用組成物の製造方法 |
JP5164129B2 (ja) * | 2004-03-29 | 2013-03-13 | ニッタ・ハース株式会社 | 半導体研磨用組成物 |
JP2005286047A (ja) | 2004-03-29 | 2005-10-13 | Nitta Haas Inc | 半導体研磨用組成物 |
GB0407198D0 (en) | 2004-03-30 | 2004-05-05 | British Telecomm | Joint fault detection |
DE102004021092A1 (de) * | 2004-04-29 | 2005-11-24 | Degussa Ag | Verwendung einer kationischen Siliciumdioxid-Dispersion als Textilveredlungsmittel |
DE102005012409A1 (de) * | 2005-03-17 | 2006-09-21 | Wacker Chemie Ag | Wäßrige Dispersionen teilhydrophober Kieselsäuren |
JP4837483B2 (ja) * | 2006-08-04 | 2011-12-14 | 住友大阪セメント株式会社 | 高強度コンクリート用シリカフュームスラリー |
DE102008041466A1 (de) | 2008-08-22 | 2010-02-25 | Wacker Chemie Ag | Wäßrige Dispersionen hydrophober Kieselsäuren |
KR101823170B1 (ko) * | 2009-12-29 | 2018-01-29 | 더블유.알. 그레이스 앤드 캄파니-콘. | 복합 무기 입자 및 이의 제조 방법 및 사용 방법 |
NO342672B1 (en) * | 2016-09-13 | 2018-06-25 | Elkem As | Microsilica slurry and method for producing such slurry |
US20200261334A1 (en) * | 2017-08-09 | 2020-08-20 | Wacker Chemie Ag | A water dispersion and a method for producing a water dispersion, also, an oil-in-water emulsion, a method for producing an oil-in-water emulsion and a method for designing an oil-in-water emulsion |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2984629A (en) * | 1957-11-04 | 1961-05-16 | Cabot Corp | Aqueous dispersions of pyrogenic silica |
US3291626A (en) * | 1962-12-26 | 1966-12-13 | Huber Corp J M | Stabilized pigment slurries |
DE1442656C3 (de) * | 1964-09-25 | 1975-07-17 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Verfahren zur Herstellung einer stabilen Dispersion pyrogen gewonnenen feinteiligen Sillciumdioxids |
GB1326574A (en) * | 1970-10-30 | 1973-08-15 | Degussa | Production of stabilised dispersions of pyrogenic silica |
FR2094790A5 (fr) * | 1970-11-24 | 1972-02-04 | Degussa | Procede pour la preparation de dispersions aqueuses stables de dioxydes de silicium par voie ignee |
US4042361A (en) * | 1976-04-26 | 1977-08-16 | Corning Glass Works | Method of densifying metal oxides |
DE2844052A1 (de) * | 1978-10-10 | 1980-04-30 | Degussa | Waessrige dispersion einer hydrophoben kieselsaeure |
US4321243A (en) * | 1980-08-05 | 1982-03-23 | Cornwell Charles E | Method of producing stabilized aqueous dispersions of silica fume |
-
1990
- 1990-03-01 DE DE4006392A patent/DE4006392A1/de not_active Ceased
- 1990-03-19 GB GB9006122A patent/GB2229432B/en not_active Expired - Fee Related
- 1990-03-20 FR FR9003557A patent/FR2644768B1/fr not_active Expired - Fee Related
- 1990-03-20 KR KR1019900003705A patent/KR0148692B1/ko not_active IP Right Cessation
- 1990-03-20 JP JP2068568A patent/JP2949633B2/ja not_active Expired - Lifetime
- 1990-03-21 BR BR909001302A patent/BR9001302A/pt not_active IP Right Cessation
- 1990-03-21 CN CN90101525A patent/CN1027162C/zh not_active Expired - Lifetime
- 1990-03-21 CA CA002012719A patent/CA2012719C/en not_active Expired - Lifetime
- 1990-03-21 BE BE9000319A patent/BE1002854A3/fr not_active IP Right Cessation
- 1990-03-21 IT IT19748A patent/IT1239546B/it active IP Right Grant
- 1990-03-21 AU AU52010/90A patent/AU625980B2/en not_active Ceased
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1089077C (zh) * | 1998-11-04 | 2002-08-14 | 中国科学院山西煤炭化学研究所 | 一种二氧化硅溶胶胶粒表面修饰方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2644768A1 (fr) | 1990-09-28 |
FR2644768B1 (fr) | 1994-02-11 |
CN1027162C (zh) | 1994-12-28 |
CA2012719C (en) | 1999-06-08 |
KR0148692B1 (ko) | 1998-08-17 |
CA2012719A1 (en) | 1990-09-21 |
BR9001302A (pt) | 1991-04-02 |
GB2229432A (en) | 1990-09-26 |
DE4006392A1 (de) | 1990-09-27 |
AU625980B2 (en) | 1992-07-23 |
GB9006122D0 (en) | 1990-05-16 |
JPH0360420A (ja) | 1991-03-15 |
IT9019748A1 (it) | 1991-09-21 |
BE1002854A3 (fr) | 1991-07-02 |
AU5201090A (en) | 1990-09-27 |
IT1239546B (it) | 1993-11-05 |
GB2229432B (en) | 1992-09-23 |
JP2949633B2 (ja) | 1999-09-20 |
KR900014248A (ko) | 1990-10-23 |
IT9019748A0 (it) | 1990-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C53 | Correction of patent of invention or patent application | ||
COR | Change of bibliographic data |
Free format text: CORRECT: PATENTEE; FROM: CABOT CORPORATION TO: CABOT MICROELECTRONICS CORPORPATION |
|
CP03 | Change of name, title or address |
Address after: Illinois State Patentee after: Cabot Corp. Address before: Massachusetts, USA Patentee before: Cabot Corp. |
|
C56 | Change in the name or address of the patentee |
Owner name: CABOT CORPORATION; CABOT MICROELECTRONICS CORPORPA Free format text: FORMER NAME OR ADDRESS: CABOT MICROELECTRONICS CORPORPATION |
|
CP01 | Change in the name or title of a patent holder |
Patentee after: Cabot Corp. Patentee before: Cabot Corp. |
|
C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
OR01 | Other related matters |