CN104508063B - 用于封装有机电子组件的胶带 - Google Patents

用于封装有机电子组件的胶带 Download PDF

Info

Publication number
CN104508063B
CN104508063B CN201380040109.1A CN201380040109A CN104508063B CN 104508063 B CN104508063 B CN 104508063B CN 201380040109 A CN201380040109 A CN 201380040109A CN 104508063 B CN104508063 B CN 104508063B
Authority
CN
China
Prior art keywords
adhesive
absorbent material
adhesive tape
layer
proportion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380040109.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN104508063A (zh
Inventor
M.白
J.埃林杰
J.格伦诺尔
K.凯特特尔根比谢尔
A.彼得森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Publication of CN104508063A publication Critical patent/CN104508063A/zh
Application granted granted Critical
Publication of CN104508063B publication Critical patent/CN104508063B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Packages (AREA)
  • Photovoltaic Devices (AREA)
CN201380040109.1A 2012-06-29 2013-05-27 用于封装有机电子组件的胶带 Active CN104508063B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012211335.5A DE102012211335A1 (de) 2012-06-29 2012-06-29 Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102012211335.5 2012-06-29
PCT/EP2013/060895 WO2014001005A1 (de) 2012-06-29 2013-05-27 Klebeband für die kapselung einer organischen elektronischen anordnung

Publications (2)

Publication Number Publication Date
CN104508063A CN104508063A (zh) 2015-04-08
CN104508063B true CN104508063B (zh) 2017-07-21

Family

ID=48579029

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380040109.1A Active CN104508063B (zh) 2012-06-29 2013-05-27 用于封装有机电子组件的胶带

Country Status (8)

Country Link
US (1) US9543549B2 (enExample)
EP (1) EP2867318B1 (enExample)
JP (2) JP2015529934A (enExample)
KR (1) KR102013435B1 (enExample)
CN (1) CN104508063B (enExample)
DE (1) DE102012211335A1 (enExample)
TW (1) TWI580756B (enExample)
WO (1) WO2014001005A1 (enExample)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201436855A (zh) * 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
JP6273858B2 (ja) * 2014-01-24 2018-02-07 三菱ケミカル株式会社 湿度感受性部材の封止体
KR20150097359A (ko) 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
DE102014207074A1 (de) * 2014-04-11 2015-10-15 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
CN103956435A (zh) * 2014-04-28 2014-07-30 上海大学 一种有机发光二极管的胶带封装结构
DE102014208111A1 (de) * 2014-04-29 2015-10-29 Tesa Se Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen
JP6756624B2 (ja) 2014-06-23 2020-09-16 ショット アクチエンゲゼルシャフトＳｃｈｏｔｔ ＡＧ 板状の別個の要素を有する、蓄電システム、板状の別個の要素、その製造方法、並びにその使用
KR101933961B1 (ko) * 2014-10-29 2018-12-31 테사 소시에타스 유로파에아 다기능성 실록산 물 스캐빈저를 포함하는 접착제 화합물
WO2016066434A1 (de) 2014-10-29 2016-05-06 Tesa Se Oled kompatible klebemassen mit silanwasserfängern
KR101994466B1 (ko) * 2014-10-29 2019-06-28 테사 소시에타스 유로파에아 활성화될 수 있는 게터 물질을 함유하는 접착제 화합물
US20160137889A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Bondply adhesive composition
KR102456654B1 (ko) 2014-11-26 2022-10-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
WO2016087311A2 (de) 2014-12-01 2016-06-09 Schott Ag Elektrisches speichersystem mit einem scheibenförmigen diskreten element, diskretes scheibenförmiges element, verfahren zu dessen herstellung sowie dessen verwendung
EP3234035B1 (en) * 2014-12-18 2021-06-02 BASF Coatings GmbH Radiation curable composition comprising hydrophilic nanoparticles
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
JP2016160343A (ja) * 2015-03-02 2016-09-05 富士フイルム株式会社 粘着シート、粘着フィルム、有機発光装置、および、粘着剤組成物
DE102015222027A1 (de) 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
EP3440016A1 (en) * 2016-04-04 2019-02-13 Disruptive Materials AB Getter material comprising intrinsic composite nanoparticles and method of production thereof
DE102016207075A1 (de) 2016-04-26 2017-10-26 Tesa Se Repositionierbares feuchtigkeitshärtendes Klebeband
PL3450333T3 (pl) * 2016-04-27 2023-02-20 Kyeong Keun Song Urządzenie uszczelniające do zabezpieczania materiału opakowaniowego
EP3258515A1 (de) 2016-06-15 2017-12-20 odelo GmbH Leuchteinheit mit organischer leuchtdiode (oled) für fahrzeuganwendungen sowie verfahren zu deren herstellung
EP3258516A1 (de) 2016-06-15 2017-12-20 odelo GmbH Leuchteinheit mit organischer leuchtdiode (oled) sowie verfahren zu deren herstellung
KR102406867B1 (ko) 2016-06-16 2022-06-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노입자 충전된 배리어 접착제 조성물
CN109415607B (zh) 2016-06-16 2022-08-09 3M创新有限公司 纳米粒子填充的阻隔性粘合剂组合物
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
TWI627764B (zh) * 2016-12-02 2018-06-21 Mitsubishi Electric Corp Solar battery module and solar battery module manufacturing method
KR102671369B1 (ko) 2016-12-02 2024-06-04 삼성디스플레이 주식회사 플렉시블 유기 발광 표시 장치 및 그 제조방법
US11003978B2 (en) 2016-12-14 2021-05-11 Ajay Khoche Programmable network node roles in hierarchical communications network
US10902310B2 (en) 2016-12-14 2021-01-26 Trackonomy Systems, Inc. Wireless communications and transducer based event detection platform
US10885420B2 (en) 2016-12-14 2021-01-05 Ajay Khoche Package sealing tape types with varied transducer sampling densities
US11138490B2 (en) 2016-12-14 2021-10-05 Ajay Khoche Hierarchical combination of distributed statistics in a monitoring network
US10262255B2 (en) 2016-12-14 2019-04-16 Trackonomy Systems, Inc. Multifunction adhesive product for ubiquitous realtime tracking
TWI649392B (zh) * 2016-12-21 2019-02-01 住華科技股份有限公司 黏著劑薄片以及偏光板組件
EP3339388B1 (en) * 2016-12-22 2022-01-26 3M Innovative Properties Company Pressure-sensitive adhesive compositions for manufacturing electronic devices
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
WO2018204693A2 (en) * 2017-05-05 2018-11-08 3M Innovative Properties Company Polymeric films and display devices containing such films
KR102316563B1 (ko) 2017-05-22 2021-10-25 엘지디스플레이 주식회사 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법
KR102001613B1 (ko) * 2017-05-24 2019-07-18 주식회사 엘지화학 유기전자장치
CN107331787B (zh) * 2017-06-26 2019-06-21 京东方科技集团股份有限公司 封装盖板、有机发光显示器及其制备方法
US11591501B2 (en) 2017-12-06 2023-02-28 3M Innovative Properties Company Barrier adhesive compositions and articles
DE102018203276A1 (de) 2018-03-06 2019-09-12 Tesa Se Indikatortape
DE102018208168A1 (de) 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
CN110783492A (zh) * 2018-07-27 2020-02-11 株式会社日本有机雷特显示器 发光显示装置及其制造方法
CN109679510B (zh) * 2018-12-25 2021-04-27 广州市隆创新材料有限公司 一种适合全自动贴合的热熔光学胶膜及其制备方法
JP2022524699A (ja) * 2019-01-18 2022-05-10 日東電工株式会社 ガスおよび／または薬液インジケータ
WO2020247354A1 (en) 2019-06-05 2020-12-10 Trackonomy Systems, Inc. Temperature monitoring in cold supply chains
WO2021051087A1 (en) 2019-09-13 2021-03-18 Trackonomy Systems, Inc. Roll-to-roll additive manufacturing method and device
TWI780494B (zh) * 2019-10-09 2022-10-11 德商卡爾科德寶兩合公司 複合材料在主動和/或被動冷卻的通電系統中用於吸收和分配液體的應用
US11864058B1 (en) 2020-10-04 2024-01-02 Trackonomy Systems, Inc. Flexible tracking device for cables and equipment
US11900195B2 (en) 2020-07-24 2024-02-13 Trackonomy Systems, Inc. Tearing to turn on wireless node with multiple cutouts for re-use
US12124904B2 (en) 2020-09-05 2024-10-22 Trackonomy Systems, Inc. Wireless sensor device with an attachable external sensor probe
US12047841B2 (en) 2020-09-21 2024-07-23 Trackonomy Systems, Inc. Detecting special events and strategically important areas in an IoT tracking system
WO2022072948A1 (en) 2020-10-03 2022-04-07 Trackonomy Systems, Inc. System and method of generating environmental profiles for determining logistics of assets
US11527148B1 (en) 2020-10-04 2022-12-13 Trackonomy Systems, Inc. Augmented reality for guiding users to assets in IOT applications
US12051916B1 (en) 2020-10-05 2024-07-30 Trackonomy Systems, Inc. Method for recharging wireless IOT devices and system thereof
TW202221082A (zh) * 2020-11-17 2022-06-01 明基材料股份有限公司 一種矽膠阻氣膜
CN112322233A (zh) * 2020-11-23 2021-02-05 广东能辉新材料科技有限公司 含改性sis热塑性弹性体的热熔压敏胶及其制备方法
US11869994B2 (en) 2020-12-12 2024-01-09 Trackonomy Systems, Inc. Flexible solar-powered wireless communication device
CN113437242B (zh) * 2021-06-29 2023-06-20 固安翌光科技有限公司 一种封装结构以及光电器件
CN114224306B (zh) * 2021-11-11 2024-03-22 煤炭科学研究总院有限公司 心率检测传感器、防护服和传感器的制作方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
JPH03127488A (ja) * 1989-10-12 1991-05-30 Teijin Ltd 電場発光素子
WO1998021287A1 (en) 1996-11-12 1998-05-22 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
JP2000208252A (ja) 1999-01-14 2000-07-28 Tdk Corp 有機ｅｌ素子
US6803081B2 (en) 2001-06-26 2004-10-12 National Starch And Chemical Investment Holding Corporation Radiation curable adhesive
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
CN1678639A (zh) 2002-07-24 2005-10-05 粘合剂研究公司 可转换的压敏粘合剂胶带及其在显示屏上的用途
US7449629B2 (en) 2002-08-21 2008-11-11 Truseal Technologies, Inc. Solar panel including a low moisture vapor transmission rate adhesive composition
JP2005298703A (ja) 2004-04-13 2005-10-27 Mitsui Chemicals Inc 粘着性フィルム、筐体およびそれを用いた有機ｅｌ発光素子
US20060087230A1 (en) 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
JP2006228519A (ja) * 2005-02-16 2006-08-31 Canon Inc 有機エレクトロルミネッセンス素子及びその製造方法
JP2007197517A (ja) 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
JP2008065994A (ja) * 2006-09-04 2008-03-21 Seiko Epson Corp エレクトロルミネッセンス装置、エレクトロルミネッセンス装置の製造方法並びに電子機器
ES2344966T5 (es) 2006-09-20 2015-11-06 Dow Global Technologies Llc Módulo de dispositivo electrónico que comprende un copolímero multibloque de etileno
DE102006047739A1 (de) 2006-10-06 2008-04-17 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102008003546A1 (de) 2008-01-09 2009-07-16 Tesa Ag Liner mit einer Barriereschicht
JP2009259656A (ja) * 2008-04-18 2009-11-05 Toyo Ink Mfg Co Ltd 封止剤
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
JP2010080293A (ja) * 2008-09-26 2010-04-08 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子封止用粘着フィルム
KR101321683B1 (ko) * 2008-11-28 2013-10-23 미쓰이 가가쿠 가부시키가이샤 유기 ｅｌ 소자의 면 봉지제, 표시 장치의 제조방법 및 표시 장치
JP5201347B2 (ja) 2008-11-28 2013-06-05 株式会社スリーボンド 有機ｅｌ素子封止用光硬化性樹脂組成物
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008062130A1 (de) 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
JP2010182449A (ja) * 2009-02-03 2010-08-19 Fujifilm Corp 有機ｅｌ表示装置
DE102009036970A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036968A1 (de) 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036986B4 (de) 2009-08-12 2011-07-07 Volkswagen AG, 38440 Ausgleichsgetriebe
TWI443166B (zh) * 2010-11-23 2014-07-01 Lg Chemical Ltd 黏著劑組成物
JPWO2012077431A1 (ja) * 2010-12-08 2014-05-19 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子の製造方法

Also Published As

Publication number Publication date
TW201402766A (zh) 2014-01-16
US9543549B2 (en) 2017-01-10
EP2867318B1 (de) 2022-01-12
JP2015529934A (ja) 2015-10-08
CN104508063A (zh) 2015-04-08
EP2867318A1 (de) 2015-05-06
WO2014001005A1 (de) 2014-01-03
KR20150032569A (ko) 2015-03-26
TWI580756B (zh) 2017-05-01
JP2018199821A (ja) 2018-12-20
US20150162568A1 (en) 2015-06-11
DE102012211335A1 (de) 2014-01-02
KR102013435B1 (ko) 2019-08-22

Similar Documents

Publication Publication Date Title
CN104508063B (zh) 用于封装有机电子组件的胶带
KR102238014B1 (ko) 유기 전자 장치를 캡슐화하기 위한 접착 테이프
US10323163B2 (en) Adhesive tape containing getter material
US9593263B2 (en) Liner for protecting adhesive compounds
JP2017515935A5 (enExample)
KR20120058545A (ko) 전자 장치를 캡슐화하는 방법
KR102248140B1 (ko) 얇은 유리 복합체 및 얇은 유리 필름을 저장하는 방법
TW201341496A (zh) 保護黏著劑用襯料
CN107148458A (zh) 包含可活化的吸气剂材料的胶粘剂混合物
TW201436855A (zh) 從平面結構物移除滲透物的方法
CN109642125B (zh) 用于封装电子结构体的胶带

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Norderstedt

Applicant after: Tesa Europe Corporation

Address before: hamburg

Applicant before: Tesa Europe Corporation

COR Change of bibliographic data
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Norderstedt

Patentee after: Tesa AG

Address before: Norderstedt

Patentee before: Tesa Europe Corporation

CP01 Change in the name or title of a patent holder