DE102012211335A1 - Klebeband für die Kapselung einer organischen elektronischen Anordnung - Google Patents

Klebeband für die Kapselung einer organischen elektronischen Anordnung Download PDF

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Publication number
DE102012211335A1
DE102012211335A1 DE102012211335.5A DE102012211335A DE102012211335A1 DE 102012211335 A1 DE102012211335 A1 DE 102012211335A1 DE 102012211335 A DE102012211335 A DE 102012211335A DE 102012211335 A1 DE102012211335 A1 DE 102012211335A1
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Germany
Prior art keywords
adhesive
getter material
getter
adhesive tape
layer
Prior art date
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Withdrawn
Application number
DE102012211335.5A
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German (de)
English (en)
Inventor
Minyoung Bai
Jan Ellinger
Anika Petersen
Klaus Keite-Telgenbüscher
Judith Grünauer
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Tesa SE
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Tesa SE
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Priority to DE102012211335.5A priority Critical patent/DE102012211335A1/de
Priority to PCT/EP2013/060895 priority patent/WO2014001005A1/de
Priority to KR1020157002573A priority patent/KR102013435B1/ko
Priority to EP13727834.7A priority patent/EP2867318B1/de
Priority to CN201380040109.1A priority patent/CN104508063B/zh
Priority to JP2015518932A priority patent/JP2015529934A/ja
Priority to US14/411,585 priority patent/US9543549B2/en
Priority to TW102120099A priority patent/TWI580756B/zh
Publication of DE102012211335A1 publication Critical patent/DE102012211335A1/de
Priority to JP2018145579A priority patent/JP2018199821A/ja
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Packages (AREA)
  • Photovoltaic Devices (AREA)
DE102012211335.5A 2012-06-29 2012-06-29 Klebeband für die Kapselung einer organischen elektronischen Anordnung Withdrawn DE102012211335A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102012211335.5A DE102012211335A1 (de) 2012-06-29 2012-06-29 Klebeband für die Kapselung einer organischen elektronischen Anordnung
PCT/EP2013/060895 WO2014001005A1 (de) 2012-06-29 2013-05-27 Klebeband für die kapselung einer organischen elektronischen anordnung
KR1020157002573A KR102013435B1 (ko) 2012-06-29 2013-05-27 유기 전자 장치를 캡슐화하기 위한 접착 테이프
EP13727834.7A EP2867318B1 (de) 2012-06-29 2013-05-27 Klebeband für die kapselung einer organischen elektronischen anordnung
CN201380040109.1A CN104508063B (zh) 2012-06-29 2013-05-27 用于封装有机电子组件的胶带
JP2015518932A JP2015529934A (ja) 2012-06-29 2013-05-27 有機電子的装置をカプセル化するための接着テープ
US14/411,585 US9543549B2 (en) 2012-06-29 2013-05-27 Adhesive tape for encapsulating an organic electronic arrangement
TW102120099A TWI580756B (zh) 2012-06-29 2013-06-06 用於封裝有機電子組件的膠帶
JP2018145579A JP2018199821A (ja) 2012-06-29 2018-08-02 有機電子的装置をカプセル化するための接着テープ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012211335.5A DE102012211335A1 (de) 2012-06-29 2012-06-29 Klebeband für die Kapselung einer organischen elektronischen Anordnung

Publications (1)

Publication Number Publication Date
DE102012211335A1 true DE102012211335A1 (de) 2014-01-02

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DE102012211335.5A Withdrawn DE102012211335A1 (de) 2012-06-29 2012-06-29 Klebeband für die Kapselung einer organischen elektronischen Anordnung

Country Status (8)

Country Link
US (1) US9543549B2 (enExample)
EP (1) EP2867318B1 (enExample)
JP (2) JP2015529934A (enExample)
KR (1) KR102013435B1 (enExample)
CN (1) CN104508063B (enExample)
DE (1) DE102012211335A1 (enExample)
TW (1) TWI580756B (enExample)
WO (1) WO2014001005A1 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
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DE102014208111A1 (de) * 2014-04-29 2015-10-29 Tesa Se Verfahren zur Herstellung einer Verklebung auf Permeat sensiblen Oberflächen
WO2015162013A1 (de) * 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und verfahren zum lagern einer dünnglasfolie
WO2016066435A1 (de) * 2014-10-29 2016-05-06 Tesa Se Klebemassen mit aktivierbaren gettermaterialien
CN107405893A (zh) * 2014-12-18 2017-11-28 荷兰应用自然科学研究组织Tno 包括亚微米吸收颗粒的阻挡薄膜层压件和包括这种层压件的电子器件
JP2017536449A (ja) * 2014-10-29 2017-12-07 テーザ・ソシエタス・ヨーロピア シラン系水捕捉剤を含むｏｌｅｄ適合接着剤
EP3258516A1 (de) 2016-06-15 2017-12-20 odelo GmbH Leuchteinheit mit organischer leuchtdiode (oled) sowie verfahren zu deren herstellung
EP3258515A1 (de) 2016-06-15 2017-12-20 odelo GmbH Leuchteinheit mit organischer leuchtdiode (oled) für fahrzeuganwendungen sowie verfahren zu deren herstellung
DE102018203276A1 (de) 2018-03-06 2019-09-12 Tesa Se Indikatortape
US10566584B2 (en) 2014-06-23 2020-02-18 Schott Ag Electrical storage system with a sheet-like discrete element, sheet-like discrete element, method for producing same, and use thereof
US10673025B2 (en) 2014-12-01 2020-06-02 Schott Ag Electrical storage system comprising a sheet-type discrete element, discrete sheet-type element, method for the production thereof, and use thereof

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201436855A (zh) * 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
JP6273858B2 (ja) * 2014-01-24 2018-02-07 三菱ケミカル株式会社 湿度感受性部材の封止体
KR20150097359A (ko) 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치
DE102014207074A1 (de) * 2014-04-11 2015-10-15 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
CN103956435A (zh) * 2014-04-28 2014-07-30 上海大学 一种有机发光二极管的胶带封装结构
PL3212728T3 (pl) * 2014-10-29 2019-02-28 Tesa Se Masy klejące z wielofunkcyjnymi wodnymi wyłapywaczami siloksanów
US20160137889A1 (en) * 2014-11-18 2016-05-19 E I Du Pont De Nemours And Company Bondply adhesive composition
KR102456654B1 (ko) * 2014-11-26 2022-10-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
EP3234035B1 (en) * 2014-12-18 2021-06-02 BASF Coatings GmbH Radiation curable composition comprising hydrophilic nanoparticles
JP2016160343A (ja) * 2015-03-02 2016-09-05 富士フイルム株式会社 粘着シート、粘着フィルム、有機発光装置、および、粘着剤組成物
DE102015222027A1 (de) * 2015-11-09 2017-05-11 Tesa Se Barriereklebemasse mit polymerem Gettermaterial
EP3440015B1 (en) * 2016-04-04 2021-07-14 Disruptive Materials AB Highly porous magnesium carbonate and method of production thereof
DE102016207075A1 (de) 2016-04-26 2017-10-26 Tesa Se Repositionierbares feuchtigkeitshärtendes Klebeband
PL3450333T3 (pl) * 2016-04-27 2023-02-20 Kyeong Keun Song Urządzenie uszczelniające do zabezpieczania materiału opakowaniowego
WO2017218476A2 (en) 2016-06-16 2017-12-21 3M Innovative Properties Company Nanoparticle filled barrier adhesive compositions
KR102407014B1 (ko) 2016-06-16 2022-06-10 쓰리엠 이노베이티브 프로퍼티즈 컴파니 나노입자 충전된 배리어 접착제 조성물
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
TWI627764B (zh) * 2016-12-02 2018-06-21 Mitsubishi Electric Corp Solar battery module and solar battery module manufacturing method
KR102671369B1 (ko) 2016-12-02 2024-06-04 삼성디스플레이 주식회사 플렉시블 유기 발광 표시 장치 및 그 제조방법
US10902310B2 (en) 2016-12-14 2021-01-26 Trackonomy Systems, Inc. Wireless communications and transducer based event detection platform
US10445634B2 (en) 2016-12-14 2019-10-15 Trackonomy Systems, Inc. Fabricating multifunction adhesive product for ubiquitous realtime tracking
US11138490B2 (en) 2016-12-14 2021-10-05 Ajay Khoche Hierarchical combination of distributed statistics in a monitoring network
US10885420B2 (en) 2016-12-14 2021-01-05 Ajay Khoche Package sealing tape types with varied transducer sampling densities
US11003978B2 (en) 2016-12-14 2021-05-11 Ajay Khoche Programmable network node roles in hierarchical communications network
TWI649392B (zh) * 2016-12-21 2019-02-01 住華科技股份有限公司 黏著劑薄片以及偏光板組件
EP3339388B1 (en) * 2016-12-22 2022-01-26 3M Innovative Properties Company Pressure-sensitive adhesive compositions for manufacturing electronic devices
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
KR102549995B1 (ko) * 2017-05-05 2023-06-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중합체 필름 및 그러한 필름을 포함하는 디스플레이 디바이스
KR102316563B1 (ko) 2017-05-22 2021-10-25 엘지디스플레이 주식회사 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법
WO2018217026A1 (ko) * 2017-05-24 2018-11-29 주식회사 엘지화학 유기전자장치
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US20150162568A1 (en) 2015-06-11
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