CN104471791A - 在金属化智能卡中的抵消屏蔽与增强耦合 - Google Patents
在金属化智能卡中的抵消屏蔽与增强耦合 Download PDFInfo
- Publication number
- CN104471791A CN104471791A CN201380006299.5A CN201380006299A CN104471791A CN 104471791 A CN104471791 A CN 104471791A CN 201380006299 A CN201380006299 A CN 201380006299A CN 104471791 A CN104471791 A CN 104471791A
- Authority
- CN
- China
- Prior art keywords
- antenna
- module
- smart card
- card
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
- Support Of Aerials (AREA)
Applications Claiming Priority (19)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261589434P | 2012-01-23 | 2012-01-23 | |
US61/589,434 | 2012-01-23 | ||
US201261619951P | 2012-04-04 | 2012-04-04 | |
US61/619,951 | 2012-04-04 | ||
US201261624384P | 2012-04-15 | 2012-04-15 | |
US61/624,384 | 2012-04-15 | ||
US201261693262P | 2012-08-25 | 2012-08-25 | |
US61/693,262 | 2012-08-25 | ||
US13/600,140 | 2012-08-30 | ||
US13/600,140 US8991712B2 (en) | 2010-08-12 | 2012-08-30 | Coupling in and to RFID smart cards |
US201261697825P | 2012-09-07 | 2012-09-07 | |
US61/697,825 | 2012-09-07 | ||
US201261732414P | 2012-12-03 | 2012-12-03 | |
US61/732,414 | 2012-12-03 | ||
US201261737746P | 2012-12-15 | 2012-12-15 | |
US61/737,746 | 2012-12-15 | ||
US13/730,811 US9165240B2 (en) | 2009-10-15 | 2012-12-28 | Coupling in and to RFID smart cards |
US13/730,811 | 2012-12-28 | ||
PCT/EP2013/051175 WO2013110625A1 (en) | 2012-01-23 | 2013-01-23 | Offsetting shielding and enhancing coupling in metallized smart cards |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104471791A true CN104471791A (zh) | 2015-03-25 |
Family
ID=47722223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380006299.5A Pending CN104471791A (zh) | 2012-01-23 | 2013-01-23 | 在金属化智能卡中的抵消屏蔽与增强耦合 |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP2807700A1 (es) |
JP (1) | JP2015513712A (es) |
KR (1) | KR20140117614A (es) |
CN (1) | CN104471791A (es) |
AU (1) | AU2013211649A1 (es) |
BR (1) | BR112014018042A8 (es) |
CA (1) | CA2860909C (es) |
MX (1) | MX2014008936A (es) |
WO (1) | WO2013110625A1 (es) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105205527A (zh) * | 2015-09-15 | 2015-12-30 | 武汉天喻信息产业股份有限公司 | 一种金属射频卡 |
CN105493108A (zh) * | 2013-07-31 | 2016-04-13 | 欧贝特科技公司 | 微电路与天线集成耦合的电子实体及其制造方法 |
CN106575373A (zh) * | 2015-07-08 | 2017-04-19 | 安全创造有限责任公司 | 具有双接口能力的金属智能卡 |
CN108496187A (zh) * | 2016-01-26 | 2018-09-04 | 兰克森控股公司 | 用于制造芯片卡模块的方法和芯片卡 |
CN109657762A (zh) * | 2018-12-10 | 2019-04-19 | 天津博苑高新材料有限公司 | 一种制卡基片,其制备方法和含有其的ic卡或电子标签 |
CN109816081A (zh) * | 2017-11-20 | 2019-05-28 | 资本一号服务有限责任公司 | 使用激光电镀或印刷和镀制形成的、用于场供电的短距离通信的天线 |
US10318859B2 (en) | 2015-07-08 | 2019-06-11 | Composecure, Llc | Dual interface metal smart card with booster antenna |
CN113906444A (zh) * | 2019-05-31 | 2022-01-07 | 安全创造有限责任公司 | Rfid装置 |
Families Citing this family (36)
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---|---|---|---|---|
US9697459B2 (en) | 2014-08-10 | 2017-07-04 | Féinics Amatech Teoranta | Passive smart cards, metal cards, payment objects and smart jewelry |
US9475086B2 (en) | 2013-01-18 | 2016-10-25 | Féinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
US9798968B2 (en) | 2013-01-18 | 2017-10-24 | Féinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
US10518518B2 (en) | 2013-01-18 | 2019-12-31 | Féinics Amatech Teoranta | Smart cards with metal layer(s) and methods of manufacture |
US10733494B2 (en) | 2014-08-10 | 2020-08-04 | Féinics Amatech Teoranta | Contactless metal card constructions |
US10552722B2 (en) | 2014-08-10 | 2020-02-04 | Féinics Amatech Teoranta | Smartcard with coupling frame antenna |
US10824931B2 (en) | 2012-08-30 | 2020-11-03 | Féinics Amatech Teoranta | Contactless smartcards with multiple coupling frames |
US11354558B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Contactless smartcards with coupling frames |
US10977542B2 (en) | 2013-01-18 | 2021-04-13 | Amtech Group Limited Industrial Estate | Smart cards with metal layer(s) and methods of manufacture |
US11551051B2 (en) | 2013-01-18 | 2023-01-10 | Amatech Group Limiied | Coupling frames for smartcards with various module opening shapes |
US11354560B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Smartcards with multiple coupling frames |
US11386317B2 (en) | 2013-01-18 | 2022-07-12 | Amatech Group Limited | Transponder chip module with module antenna(s) and coupling frame(s) |
US10599972B2 (en) | 2013-01-18 | 2020-03-24 | Féinics Amatech Teoranta | Smartcard constructions and methods |
EP3547225A1 (en) * | 2013-11-13 | 2019-10-02 | Féinics AmaTech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
EP3123400B1 (en) * | 2014-03-26 | 2020-09-30 | Féinics AmaTech Teoranta | Transponder chip module with coupling frame |
WO2016046184A1 (en) * | 2014-09-22 | 2016-03-31 | Féinics Amatech Teoranta | Passive smart cards, metal cards, payment objects and smart jewelry |
ES2955611T3 (es) * | 2014-09-22 | 2023-12-04 | Feinics Amatech Teoranta | Tarjetas inteligentes de metal híbrido. |
EP3207504A4 (en) * | 2014-10-14 | 2018-10-31 | Confidex Oy | Rfid transponder and rfid transponder web |
EP3491584B1 (en) | 2016-07-27 | 2022-07-13 | Composecure LLC | Overmolded electronic components for transaction cards and methods of making thereof |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
KR101868478B1 (ko) * | 2016-08-17 | 2018-07-23 | 주식회사 아이씨케이 | 비접촉식 카드 기능을 갖는 메탈 카드 |
JP6888402B2 (ja) * | 2017-05-01 | 2021-06-16 | 凸版印刷株式会社 | 基板モジュール |
JP6777836B1 (ja) * | 2017-08-25 | 2020-10-28 | シーピーアイ・カード・グループ−コロラド,インク. | 重量化された取引カード |
MX2021012822A (es) | 2017-09-07 | 2023-03-02 | Composecure Llc | Tarjeta de transaccion con componentes electronicos incorporados y procedimiento para su fabricacion. |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
CA3079539A1 (en) | 2017-10-18 | 2019-04-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
WO2019173455A1 (en) | 2018-03-07 | 2019-09-12 | X-Card Holdings, Llc | Metal card |
AU2019205433B2 (en) * | 2018-05-10 | 2021-04-08 | Composecure, Llc | Dual interface metal smart card with booster antenna |
KR102039900B1 (ko) * | 2018-09-19 | 2019-11-04 | 코나아이 (주) | 메탈 카드 및 메탈 카드 제조 방법 |
FR3089090B1 (fr) * | 2018-11-22 | 2021-03-19 | Smart Packaging Solutions | Procédé de fabrication d’un module souple et module obtenu |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
JP7463858B2 (ja) | 2020-06-08 | 2024-04-09 | Toppanホールディングス株式会社 | デュアルicカード |
WO2022018471A1 (en) | 2020-07-24 | 2022-01-27 | Linxens Holding | Electrical circuit for a smart card chip module, smart card chip module and method for manufacturing a smart card chip module |
EP4258166A4 (en) * | 2020-12-02 | 2024-05-01 | Toppan Inc. | CARD HOLDER, ELECTRONIC COMPONENT FOR CARD HOLDER AND METAL BOARD BASE MATERIAL FOR CARD HOLDER |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1278936A (zh) * | 1997-11-14 | 2001-01-03 | 凸版印刷株式会社 | 复合ic模块及复合ic卡 |
US20030057288A1 (en) * | 2000-05-15 | 2003-03-27 | Siemens Transit Telematic Systems Ag | Carrier element for an antenna |
CN1766913A (zh) * | 2004-10-27 | 2006-05-03 | 富士通株式会社 | 射频标识标签 |
US20090315320A1 (en) * | 2006-09-26 | 2009-12-24 | Advanced Microelectronic And Automation Technology Ltd. | Inlays for security documents |
CN201853247U (zh) * | 2010-09-21 | 2011-06-01 | 上海卡美循环技术有限公司 | 一种高强度抗污高速公路通行卡 |
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DE59701709C5 (de) | 1996-02-12 | 2014-01-09 | Smartrac Ip B.V. | Verfahren und vorrichtung zur kontaktierung eines drahtleiters |
CA2245775C (en) | 1996-02-12 | 2004-04-06 | David Finn | Method and device for bonding a wire conductor |
DE19634661A1 (de) | 1996-08-28 | 1998-03-05 | David Finn | Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung |
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FR2890212B1 (fr) | 2005-08-30 | 2009-08-21 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
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-
2013
- 2013-01-23 CA CA2860909A patent/CA2860909C/en active Active
- 2013-01-23 KR KR1020147023591A patent/KR20140117614A/ko not_active Application Discontinuation
- 2013-01-23 AU AU2013211649A patent/AU2013211649A1/en not_active Abandoned
- 2013-01-23 CN CN201380006299.5A patent/CN104471791A/zh active Pending
- 2013-01-23 WO PCT/EP2013/051175 patent/WO2013110625A1/en active Application Filing
- 2013-01-23 EP EP13704726.2A patent/EP2807700A1/en not_active Withdrawn
- 2013-01-23 MX MX2014008936A patent/MX2014008936A/es not_active Application Discontinuation
- 2013-01-23 JP JP2014552661A patent/JP2015513712A/ja active Pending
- 2013-01-23 BR BR112014018042A patent/BR112014018042A8/pt not_active IP Right Cessation
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CN1278936A (zh) * | 1997-11-14 | 2001-01-03 | 凸版印刷株式会社 | 复合ic模块及复合ic卡 |
US20030057288A1 (en) * | 2000-05-15 | 2003-03-27 | Siemens Transit Telematic Systems Ag | Carrier element for an antenna |
CN1766913A (zh) * | 2004-10-27 | 2006-05-03 | 富士通株式会社 | 射频标识标签 |
US20090315320A1 (en) * | 2006-09-26 | 2009-12-24 | Advanced Microelectronic And Automation Technology Ltd. | Inlays for security documents |
CN201853247U (zh) * | 2010-09-21 | 2011-06-01 | 上海卡美循环技术有限公司 | 一种高强度抗污高速公路通行卡 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105493108B (zh) * | 2013-07-31 | 2019-03-01 | 欧贝特科技公司 | 微电路与天线集成耦合的电子实体及其制造方法 |
CN105493108A (zh) * | 2013-07-31 | 2016-04-13 | 欧贝特科技公司 | 微电路与天线集成耦合的电子实体及其制造方法 |
US10318859B2 (en) | 2015-07-08 | 2019-06-11 | Composecure, Llc | Dual interface metal smart card with booster antenna |
US10534990B2 (en) | 2015-07-08 | 2020-01-14 | Composecure, Llc | Metal smart card with dual interface capability |
CN106575373A (zh) * | 2015-07-08 | 2017-04-19 | 安全创造有限责任公司 | 具有双接口能力的金属智能卡 |
US11301744B2 (en) | 2015-07-08 | 2022-04-12 | Composecure, Llc | Metal smart card with dual interface capability |
US10289944B2 (en) | 2015-07-08 | 2019-05-14 | Composecure, Llc | Metal smart card with dual interface capability |
CN112163660A (zh) * | 2015-07-08 | 2021-01-01 | 安全创造有限责任公司 | 具有双接口能力的金属智能卡 |
CN106575373B (zh) * | 2015-07-08 | 2020-10-20 | 安全创造有限责任公司 | 具有双接口能力的金属智能卡 |
US10748049B2 (en) | 2015-07-08 | 2020-08-18 | Composecure, Llc | Metal smart card with dual interface capability |
CN105205527A (zh) * | 2015-09-15 | 2015-12-30 | 武汉天喻信息产业股份有限公司 | 一种金属射频卡 |
CN108496187A (zh) * | 2016-01-26 | 2018-09-04 | 兰克森控股公司 | 用于制造芯片卡模块的方法和芯片卡 |
CN108496187B (zh) * | 2016-01-26 | 2021-12-28 | 兰克森控股公司 | 用于制造芯片卡模块的方法和芯片卡 |
CN109816081A (zh) * | 2017-11-20 | 2019-05-28 | 资本一号服务有限责任公司 | 使用激光电镀或印刷和镀制形成的、用于场供电的短距离通信的天线 |
US11120322B2 (en) | 2017-11-20 | 2021-09-14 | Capital One Services, Llc | Antenna formed using laser plating or print-and-plating for field-powered short range communications |
US11983595B2 (en) | 2017-11-20 | 2024-05-14 | Capital One Services, Llc | Antenna formed using laser plating or print-and-plating for field-powered short range communications |
CN109657762A (zh) * | 2018-12-10 | 2019-04-19 | 天津博苑高新材料有限公司 | 一种制卡基片,其制备方法和含有其的ic卡或电子标签 |
CN113906444A (zh) * | 2019-05-31 | 2022-01-07 | 安全创造有限责任公司 | Rfid装置 |
Also Published As
Publication number | Publication date |
---|---|
MX2014008936A (es) | 2015-06-02 |
EP2807700A1 (en) | 2014-12-03 |
CA2860909A1 (en) | 2013-08-01 |
JP2015513712A (ja) | 2015-05-14 |
AU2013211649A1 (en) | 2014-07-31 |
WO2013110625A1 (en) | 2013-08-01 |
KR20140117614A (ko) | 2014-10-07 |
CA2860909C (en) | 2021-11-16 |
BR112014018042A2 (es) | 2017-06-20 |
BR112014018042A8 (pt) | 2017-07-11 |
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