BR112014018042A2 - - Google Patents

Info

Publication number
BR112014018042A2
BR112014018042A2 BR112014018042A BR112014018042A BR112014018042A2 BR 112014018042 A2 BR112014018042 A2 BR 112014018042A2 BR 112014018042 A BR112014018042 A BR 112014018042A BR 112014018042 A BR112014018042 A BR 112014018042A BR 112014018042 A2 BR112014018042 A2 BR 112014018042A2
Authority
BR
Brazil
Application number
BR112014018042A
Other languages
Portuguese (pt)
Other versions
BR112014018042A8 (pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/600,140 external-priority patent/US8991712B2/en
Priority claimed from US13/730,811 external-priority patent/US9165240B2/en
Application filed filed Critical
Publication of BR112014018042A2 publication Critical patent/BR112014018042A2/pt
Publication of BR112014018042A8 publication Critical patent/BR112014018042A8/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
BR112014018042A 2012-01-23 2013-01-23 Deslocando blindagem e aprimorando acoplamento em cartões inteligentes metalizados BR112014018042A8 (pt)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US201261589434P 2012-01-23 2012-01-23
US201261619951P 2012-04-04 2012-04-04
US201261624384P 2012-04-15 2012-04-15
US201261693262P 2012-08-25 2012-08-25
US13/600,140 US8991712B2 (en) 2010-08-12 2012-08-30 Coupling in and to RFID smart cards
US201261697825P 2012-09-07 2012-09-07
US201261732414P 2012-12-03 2012-12-03
US201261737746P 2012-12-15 2012-12-15
US13/730,811 US9165240B2 (en) 2009-10-15 2012-12-28 Coupling in and to RFID smart cards
PCT/EP2013/051175 WO2013110625A1 (en) 2012-01-23 2013-01-23 Offsetting shielding and enhancing coupling in metallized smart cards

Publications (2)

Publication Number Publication Date
BR112014018042A2 true BR112014018042A2 (es) 2017-06-20
BR112014018042A8 BR112014018042A8 (pt) 2017-07-11

Family

ID=47722223

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014018042A BR112014018042A8 (pt) 2012-01-23 2013-01-23 Deslocando blindagem e aprimorando acoplamento em cartões inteligentes metalizados

Country Status (9)

Country Link
EP (1) EP2807700A1 (es)
JP (1) JP2015513712A (es)
KR (1) KR20140117614A (es)
CN (1) CN104471791A (es)
AU (1) AU2013211649A1 (es)
BR (1) BR112014018042A8 (es)
CA (1) CA2860909C (es)
MX (1) MX2014008936A (es)
WO (1) WO2013110625A1 (es)

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US9697459B2 (en) 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US11386317B2 (en) 2013-01-18 2022-07-12 Amatech Group Limited Transponder chip module with module antenna(s) and coupling frame(s)
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
FR3009410B1 (fr) * 2013-07-31 2015-08-28 Oberthur Technologies Entite electronique a couplage integre entre un microcircuit et une antenne et procede de fabrication
EP3547225A1 (en) * 2013-11-13 2019-10-02 Féinics AmaTech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
EP3123400B1 (en) * 2014-03-26 2020-09-30 Féinics AmaTech Teoranta Transponder chip module with coupling frame
WO2016046184A1 (en) * 2014-09-22 2016-03-31 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
ES2955611T3 (es) * 2014-09-22 2023-12-04 Feinics Amatech Teoranta Tarjetas inteligentes de metal híbrido.
EP3207504A4 (en) * 2014-10-14 2018-10-31 Confidex Oy Rfid transponder and rfid transponder web
CN112163660A (zh) * 2015-07-08 2021-01-01 安全创造有限责任公司 具有双接口能力的金属智能卡
US10318859B2 (en) 2015-07-08 2019-06-11 Composecure, Llc Dual interface metal smart card with booster antenna
CN105205527A (zh) * 2015-09-15 2015-12-30 武汉天喻信息产业股份有限公司 一种金属射频卡
FR3047101B1 (fr) * 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
EP3491584B1 (en) 2016-07-27 2022-07-13 Composecure LLC Overmolded electronic components for transaction cards and methods of making thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
KR101868478B1 (ko) * 2016-08-17 2018-07-23 주식회사 아이씨케이 비접촉식 카드 기능을 갖는 메탈 카드
JP6888402B2 (ja) * 2017-05-01 2021-06-16 凸版印刷株式会社 基板モジュール
JP6777836B1 (ja) * 2017-08-25 2020-10-28 シーピーアイ・カード・グループ−コロラド，インク． 重量化された取引カード
MX2021012822A (es) 2017-09-07 2023-03-02 Composecure Llc Tarjeta de transaccion con componentes electronicos incorporados y procedimiento para su fabricacion.
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
CA3079539A1 (en) 2017-10-18 2019-04-25 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US10268946B1 (en) * 2017-11-20 2019-04-23 Capital One Services, Llc Antenna formed using laser plating or print-and-plating for field-powered short range communications
WO2019173455A1 (en) 2018-03-07 2019-09-12 X-Card Holdings, Llc Metal card
AU2019205433B2 (en) * 2018-05-10 2021-04-08 Composecure, Llc Dual interface metal smart card with booster antenna
KR102039900B1 (ko) * 2018-09-19 2019-11-04 코나아이 (주) 메탈 카드 및 메탈 카드 제조 방법
FR3089090B1 (fr) * 2018-11-22 2021-03-19 Smart Packaging Solutions Procédé de fabrication d’un module souple et module obtenu
CN109657762A (zh) * 2018-12-10 2019-04-19 天津博苑高新材料有限公司 一种制卡基片，其制备方法和含有其的ic卡或电子标签
WO2020243148A1 (en) * 2019-05-31 2020-12-03 Composecure, Llc Rfid device
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
JP7463858B2 (ja) 2020-06-08 2024-04-09 Ｔｏｐｐａｎホールディングス株式会社 デュアルｉｃカード
WO2022018471A1 (en) 2020-07-24 2022-01-27 Linxens Holding Electrical circuit for a smart card chip module, smart card chip module and method for manufacturing a smart card chip module
EP4258166A4 (en) * 2020-12-02 2024-05-01 Toppan Inc. CARD HOLDER, ELECTRONIC COMPONENT FOR CARD HOLDER AND METAL BOARD BASE MATERIAL FOR CARD HOLDER

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US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8944810B2 (en) 2010-02-02 2015-02-03 Composecure, Llc Metal card
CN201853247U (zh) * 2010-09-21 2011-06-01 上海卡美循环技术有限公司 一种高强度抗污高速公路通行卡

Also Published As

Publication number Publication date
MX2014008936A (es) 2015-06-02
EP2807700A1 (en) 2014-12-03
CA2860909A1 (en) 2013-08-01
JP2015513712A (ja) 2015-05-14
AU2013211649A1 (en) 2014-07-31
WO2013110625A1 (en) 2013-08-01
KR20140117614A (ko) 2014-10-07
CN104471791A (zh) 2015-03-25
CA2860909C (en) 2021-11-16
BR112014018042A8 (pt) 2017-07-11

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]