CN104471791A

CN104471791A - Offsetting shielding and enhancing coupling in metallized smart cards

Info

Publication number: CN104471791A
Application number: CN201380006299.5A
Authority: CN
Inventors: 大卫·芬恩
Original assignee: Feinics Amatech Teoranta Ltd
Current assignee: Feinics Amatech Teoranta Ltd
Priority date: 2012-01-23
Filing date: 2013-01-23
Publication date: 2015-03-25
Also published as: KR20140117614A; EP2807700A1; JP2015513712A; WO2013110625A1; MX2014008936A; BR112014018042A8; CA2860909C; BR112014018042A2; CA2860909A1; AU2013211649A1

Abstract

A dual-interface smart card having a booster antenna (BA) with coupler coil (CC) in its card body (CB), and a metallized face plate (202, 302) having a window opening (220, 320) for the antenna module (AM). Performance may be improved by one or more of making the window opening substantially larger than the antenna module, providing perforations through the face plate, disposing ferrite material between the face plate and the booster antenna. Additionally, by one or more of modifying contact pads (CP) on the antenna module (AM), disposing a compensating loop (CL) under the booster antenna, offsetting the antenna module with respect to the coupler coil, arranging the booster antenna as a quasi-dipole, providing the module antenna (MA) with capacitive stubs, and disposing a ferrite element (FE) in the antenna module between the module antenna and the contact pads.

Description

Counteracting shielding in metallization smart card is coupled with enhancing

Technical field

The present invention's (in some respects) relates to " secure file ", such as E-Passport, electronics ID card and smart card (data medium), this secure file has RFID (radio-frequency (RF) identification) chip or chip module (CM) and operates with noncontact mode (ISO14443), this secure file comprise also can in contact mode (ISO7816-2) operate double nip (DI or DIF) card, and more specifically, relate to the coupling improved in smart card between assembly, such as improve the module antenna (MA) that is connected with RFID chip (CM) and in the card (CB) of smart card and with being coupled between module antenna (MA) gain antenna inductively (BA), thus improve the mutual of RFID chip (CM) and outside RFID reader thereupon.

The present invention's (in some respects) relates to passive RFID smart card, and it has the conducting metal or metal layer that shield the electromagnetic field generated by reader.Especially, the interface card based on reaction coupled operate is related to.

Background technology

Based on the object that this discusses, the antenna that RFID transponder generally includes substrate, is laid in the RFID chip (or chip module) in substrate or in substrate and is laid in substrate or in substrate.Transponder can form the basis of secure file (such as E-Passport, smart card or national ID card).

Chip module can only with noncontact mode (such as ISO14443) operation, or can be also can double nip (DIF) module that operates of (such as ISO7816-2) and noncontact mode in contact mode.Chip module can obtain energy from the RF signal provided by the external RF ID reader communicated with.

The substrate that can be called as " inlay (inlay) substrate " (for E-Passport) or " card " (for smart card) can comprise one or more material layers, such as polyvinyl chloride (PVC), Merlon (PC), polyethylene (PE), PET (PE of doping), PET-G (derivative of PE), Teslin ^tM, paper or cotton/noil etc.When mentioning " inlay substrate " herein, unless there are contrary clearly, should notice that it comprises " card ", and vice versa.

Chip module can be lead frame type chip module or expoxy glass cake core module.Expoxy glass pattern block can use perforation plating to be metallized on side (contact side) or both sides, to promote the interconnection with antenna.When mentioning " chip module " herein, unless there are contrary clearly, should notice that it comprises " chip ", and vice versa.

Antenna can be autoadhesion (or from adhering to) wire.Conventional method antenna conductor being mounted to substrate uses ultrasonic wave generator (sonotrode) (ultrasonic wave) instrument, its vibration, to be fed to (feed) and to be embedded in by wire in substrate or on the surface of the substrate bonding with capillary guiding line.The typical pattern of antenna is generally rectangle, to have the form of plane (two dimension) coil (helical) of multiturn number.The terminal (or petiolarea or contact pad) that hot pressing (TC) bonding is connected to chip module such as can be passed through in the two ends of antenna conductor.For example, see US6,698,089 and US6,233,818, it is incorporated herein by reference.

There is a problem in any layout antenna being merged into chip module (Anneta module), namely compared to more traditional antenna, (it is formed by embedding number circle (such as 4 circles or 5 circles) wire in the inlay substrate of secure file or the periphery of card, in this case, whole antenna area can be approximately 80mm × 50mm (being roughly 20 times of following antenna area)), whole antenna area very little (being probably such as 15mm × 15mm).When antenna and chip module merge, the entity obtained can be called " Anneta module ".

some prior aries

US8,261,997 (NXP) disclose a kind of carrier assembling for holding RFID transponder chips, and this carrier assembles the attachment side had for being attached to subscriber equipment, and for receiving the fore side of RF signal in the operation use of this RFID transponder chips.

Conductive shielding layer is provided in attachment side.The effectiveness of this layer is that transponder shields by effectively from the material on the surface by providing transponder thereon.Screen has some detuning effects in resonance frequency, but once consider this detuning effect in Antenna Design, then because providing the surface of RFID transponder on this its (namely, the RFID transponder comprising carrier of the present invention assembling is applicable to actual any surface), difficulty has any further detuning effect.

Magnetosphere comprises ferrite material thin slice (foil) or ferrite-plate.

Conductive shielding layer comprises a kind of material be selected from group, and this group comprises: copper, aluminium, silver, gold, platinum, conducting resinl and silver ink.

EP1854222A2 (NXP) discloses a kind of mobile communication equipment (1,10), this equipment comprises shield assembly, electromagnetic shielding between the second area (B, B1, B2) that this shield assembly provides first area (A) inner and/or outside with this communication equipment (1,10) or decay.In described first area (A), arrange antenna (4) and at least one ferrite (6), wherein, ferrite (6) is provided to described antenna (4) mutual, and guides the magnetic flux between described first area (A) and described second area (B, B1, B2).

US20120055013 (Finn; 2012: " S32 ") disclose micro-structural, such as join domain, contact pad, antenna, coil, capacitor board etc., it can utilize nanostructure (such as nano particle, nano wire and nanotube) to be formed.Laser may be used for assisting micro-structural forming process, and may be used in substrate, form other functions, such as, for holding groove or the passage of micro-structural.Intelligent mobile phone paster (MPS) is installed on mobile phone, and it has self bonding shielding element, and this element comprises the core layer with ferrite particle.

EP02063489A1 (Tyco) discloses a kind of antenna element and manufactures the method for this antenna element.Provide a kind of antenna equipment forming the more simple and easy manufacture used in the label of RFID (radio-frequency (RF) identification) system.This antenna equipment (10) has the stratiform magnetic element that (A) is formed by the magnetic composite comprising magnetic material and polymeric material, and the antenna conductor that (B) provides on a surface of this stratiform magnetic element.

sheet metal composite card

US2009/0169776 (2009; Herslow) disclose composite card, it comprises safe floor, this safe floor comprise be formed in card center or card in intracardiac card core layer place or core layer in hologram or diffraction grating.Hologram can carry out embossment by using diffraction pattern to the appointed area of core layer and plated metal thin layer is formed in this embossed layer.Other layer can be attached to upper surface and the lower surface of core layer selectively and symmetrically.In the stage selected by formation card, laser can be used remove the selected portion of the metal be formed in embossed layer, with the pattern selected to holographic region or information.When the card processed is attached to large material sheet or this large material sheet a part of, this card can by " laser processing ", whereby can simultaneously and " laser processing " that relatively inexpensively realize all cards on this thin slice.Alternatively, after this thin slice is die cut to card, often opening card can by separately " laser processing ", to produce required alphanumeric information, bar code information or graph image.

metal card

US2011/0189620 (2011; Herslow) a kind of method and apparatus for the selection area by the metal level processed for the formation of metal card of annealing to selected metallic region is disclosed, therefore, described selection area becomes soft and has ductility, and other parts of metal level keep hard.That soften, ductile selected metallic region can be come by embossment with the power reduced with the wearing and tearing reduced embossment equipment and damage.Alternatively, the metal level of having annealed can stand extra procedure of processing to form assembling, can by embossment after this assembling.The method can comprise use fixture to keep metal level, and this fixture has window region, and this window region is provided for heat and can be applied in the region of the metal level in softening window region.Fixture comprises part for cooling the extra-regional metal level of window and for preventing the temperature of the extra-regional metal level of window to be raised to device higher than preset limit value.

ferrite

US8,158,018 (2012, TDK) ferrite cemented body of the present invention is disclosed, it comprises the Fe.sub.2O.sub.3 by the 52-54mol% as oxidising equivalents, the principal component of 35-42mol%MnO and 6-11mol%ZnO composition, and comprise the Co of specific quantity, Ti, the additive of Si and Ca, and be 200mT and frequency is in the magnetic domain of 100kHz in magnetic flux metric density, this ferrite cemented body has the temperature higher than 120 degrees Celsius, at such a temperature, power loss is minimum value (bottom temp), and under this bottom temp, power loss is 350kW/m.sup.3 or less.

US7,948,057 (2011; TDK) disclose ferrite base, winding embedded ferrite resin layer and the embedded ferrite resin layer of IC to be laminated, ferrite base has ferrite first protuberance, this ferrite first protuberance projects to ferrite resin layer from the surface of ferrite base, winding winding in ferrite resin layer is around the first protuberance, and in this resin bed, IC is overlapping with the first protuberance.According to this configuration, high integration can be realized, and IC is disposed in the overlapping position of ferrite first protuberance (height of this ferrite first protuberance changes to some extent because thermal expansion is a little) and ferrite resin layer (thickness of this ferrite resin layer because of the first protuberance thinning and change to some extent because thermal expansion is a little), because the change of thermal expansion by the gap between winding and IC minimizes, and realize better electrical characteristic stability.

US6,817,085 (2004; TDK) a kind of method manufacturing multi-layer ferrite chip inducer array is disclosed, this multi-layer ferrite chip inducer array comprises element body, and this element body is by being formed with the laminate surface of ferrite layer and the perpendicular mode lamination ferrite layer of component mounting surface and conductor layer.The method is also included in element body and arranges multiple coil form inner conductor (wherein the coiling direction of coil form inner conductor parallels with component mounting surface), form the ferrite lamina with through hole and the conductive pattern using multiple coil form inner conductor and have an electric conducting material to print this ferrite lamina.

US6,329,958 (2001; TDK) disclose a kind of antenna structure, this antenna structure is formed by arrange current limiting structure on a conducting surface.Current confinement structure can be formed by Ferrite Material, and it can have the form comprising band shape, bulk (tile) or patterned deposition layer.Conductive surface can be relevant to vehicle or structure.When applying voltage between the part on surface, current confinement structure changes the path adopted by the electric current on or below conductive surface.

Summary of the invention

The object of the invention is to improve being coupled between RFID reader with the chip module in the smart card with metal or metal layer.Usually, in order to improve the object be coupled between smart card with external RF ID (electromagnetism) reader, various amendment and/or interpolation can be carried out, to offset the shield effectiveness of metal or metallized card substrate during electromagnetic coupled to the structure of this type of smart card.Double nip (DI) smart card has contact pad (CP), and this CP extends through the opening in metal level, for docking with external contact (electricity) reader.

Usually, Smart Card with Dual Interface comprises the gain antenna (BA) with coupling coil (CC) being arranged in its card (CB), and metallization panel (202,302), this metallization panel has the window (220,320) of the Anneta module (AM) for having module antenna (MA).Can be minimized (overall performance can improve) by the one in following or many persons by the decay that causes of metallization panel:

Window is made to be greater than in fact Anneta module (AM);

There is provided by the perforation of described panel, between described panel and gain antenna, lay Ferrite Material;

Contact pad (CP) in amendment Anneta module (AM);

Compensation circuit (CL) is laid in gain antenna (BA) below;

Relative to coupling coil (CC) offset antenna module (AM);

Gain antenna is arranged the dipole (quasi-dipole) that is as the criterion;

Condenser type short-term is provided to module antenna (MA); And

Ferrite component (FE) is laid in Anneta module (AM), between module antenna (MA) and contact pad (CP).

According to the embodiment of the present invention, smart card has metallization panel and card, this metallization panel has the window for containing antenna module, this card has the gain antenna comprising coupling coil, wherein, the reference dimension of described window is substantially equal to the size of Anneta module, and the feature of this smart card is that window is greater than Anneta module in fact.Window can at least large than Anneta module 10%, causes there is gap between the inward flange of window and Anneta module.Ferrite layer can be laid between panel and gain antenna.Multiple perforation can be formed in the panel, around at least one extension in window and panel periphery.Panel material quantity in region near thereabout or panel periphery can be reduced 25-50% by least some in these perforation.Compensation circuit can be laid in the rear of gain antenna.Compensation circuit can have gap and two free ends, can comprise electric conducting material (such as copper), and can comprise ferrite.

Can comprise in following characteristics in smart card one or more:

Gain antenna can be configured to the accurate dipole that tool is with or without coupling coil;

Gain antenna can be provided with extended line (extension);

Gain antenna can comprise two overlapping gain antennas;

Gain antenna can mainly be provided in the top of smart card;

Module antenna can offset from coupling coil.

Smart card can also comprise at least one in following characteristics:

Ferrite component can be laid between module antenna and the contact pad of Anneta module;

Condenser type short-term may be added to module antenna;

Module antenna can comprise two coils be separated;

Module antenna can comprise two windings connected according to accurate dipole arrangement;

Perforation in the contact pad of Anneta module.

According to the embodiment of the present invention, a kind of minimized method of coupling attenuation that the panel because of the smart card that metallizes is caused, this metallization smart card has the gain antenna with coupling coil in its card, the method can comprise following in one or many persons:

Offer the window being greater than Anneta module in the panel;

Perforation by panel is provided;

Ferrite Material is provided between panel and gain antenna;

Compensation circuit is laid below gain antenna.

Anneta module can offset relative to coupling coil.Gain antenna can be arranged the dipole that is as the criterion; Module antenna can be provided with condenser type short-term; Ferrite can be provided in Anneta module, between module antenna and contact pad.Contact pad can cropped (trim) or punching.

Accompanying drawing explanation

With detailed reference to disclosed execution mode, and with accompanying drawing (FIG), non-limiting example of the present invention is described.Accompanying drawing is the form of schematic diagram substantially.For clarity, some elements in figure can be given prominence to, and omit other element.Although mainly describe of the present invention under the background of various exemplary execution mode, should be understood that, be not intended to the present invention is confined to these specific execution modes, and, the single feature of different execution mode can be bonded to each other.Any word (legend, annotation, Reference numeral etc.) occurred in accompanying drawing is incorporated herein by reference.

Fig. 1 is the cross-sectional view of double nip (DI) smart card and reader.

Figure 1A is for having the schematic plan of the gain antenna (BA) of coupling coil (CC).

Fig. 2 is the schematic cross section with metallized smart card.

Fig. 2 A is the Some illustrative perspective view with metallized smart card.

Fig. 3 A, B, C are the schematic plan of the execution mode of panel (ML) for smart card.

Fig. 4 A is the schematic diagram of the layer with compensation circuit, and this compensation circuit has gap.

Fig. 4 B is the schematic diagram of the layer with compensation circuit, and this compensation circuit does not have gap.

Fig. 5 is the plane graph of the exemplary configurations of contact pad (CP) on modular belt (MT).

Fig. 5 A is the schematic diagram that exemplary contact shield office and layout are shown.

Fig. 6 A illustrates the outer peripheral plane graph extending contact pad (CP).

Fig. 6 B is the outer peripheral plane graph that cutting contact pad (CP) is described.

Fig. 6 C is the plane graph that the gap increased between contact pad (CP) is described.

Fig. 6 D is the plane graph in the gap illustrated between amendment contact pad (CP).

Fig. 7 A illustrates the plane graph punched to contact pad (CP).

Fig. 7 B illustrates cross-sectional view thinning for contact pad (CP).

Fig. 8 A is the plane graph of the bottom surface of specification module band (MT).

Fig. 8 B illustrates the plane graph punched to contact pad (CP).

Fig. 9 A illustrates the plane graph punched to contact pad (CP).

Fig. 9 B illustrates the plane graph punched to contact pad (CP).

Figure 10 A is the plane graph of the bottom surface of modular belt (MT) for Anneta module (AM), it illustrates antenna structure (AS) and has two antenna part (MA1, MA2).

Figure 10 B is the explanatory view of antenna structure (AS).

Embodiment

By the content being described numerous embodiments to illustrate that the present invention instructs, and described execution mode should be construed as illustrative but not determinate.Apart from contrary instruction, proposed any size and material or technique should be interpreted as it is roughly property and exemplary.

In hereafter main contents, can discuss as the example of the various features of invention disclosed herein and execution mode using the transponder of the form of secure file (its can for smart card or national ID card).Obviously, many features and execution mode can be applied to (being incorporated into easily) other forms of secure file, such as E-Passport.As used herein, any one in term " transponder ", " smart card ", " data medium " etc. can be interpreted as referring to any other equipment similar operated under ISO14443 or similar RFID standard.

Typical data medium described herein can comprise: (i) Anneta module (AM), it has RFID chip or chip module (CM) and module antenna (MA), (ii) card (CB) and (iii) gain antenna (BA), it is laid on card (CB), to strengthen being coupled between module antenna (MA) and the antenna of external RF ID " reader ".When mentioning " chip module " herein, apart from contrary clearly, should notice that it comprises " chip ", vice versa.Module antenna (MA) can comprise lead loop, the conductive trace (trace) of etching or printing in modular belt (MT) substrate for Anneta module (AM), or can be directly incorporated on chip self.

Gain antenna (BA) can be formed by being embedded in by wire in inlay substrate or card (CB).But, it should be understood that, antenna can utilize except by wire, the technique embedded is in the substrate formed, such as addition (additive) technique or cancellation (subtractive) technique, such as printed antenna structure, coil windings technology (such as US6, 295, disclosed in 720), the antenna substrate be separated is formed and is transferred to the antenna structure of inlay substrate (or layer of inlay substrate), from the antenna structure that Conductive Layer Etch (comprising laser-induced thermal etching) goes out in substrate, the electric conducting material etc. laid in substrate or in formation passage in the substrate.When mentioning " inlay substrate " in this article, apart from clear and definite contrary, should notice that it comprises " card " (vice versa), and for any other substrate of secure file.

Following description majority is under the background of double nip (DI, DIF) smart card, and majority relates to the contactless operation of this Smart Card with Dual Interface.Proposed many instructions can be applied to the E-Passport etc. only with contactless operating mode.Usually, proposed any roughly property of being of a size of herein, and proposed material is intended to be exemplary.

Usually, being coupled between module antenna (MA) and the antenna of outside RFID reader is enhanced by being incorporated in card (CB) by gain antenna (BA).In some respects, gain antenna (BA) is similar with card antenna (CA).But, compared to the card antenna (CA) be directly electrically connected with RFID chip or chip module (such as at US7,980, in 477), inductively, this module antenna (MA) can be connected with RFID chip (CM) for gain antenna (BA) and the module antenna (MA) in Anneta module (AM).This type of induction (electromagnetism) coupling is compared to being directly electrically connected more difficult realization.Gain antenna (BA) can be called card antenna (CA).Gain antenna (BA) can have coupling coil (CC) associated with it, and this coupling coil is arranged to close to module antenna (MA), and with module antenna (MA) close-coupled.

As used herein, term " coupling " (and its distortion) refer between two elements, depend on and generate electromagnetic field by point element and by another element, (comprise it to combine, above-mentioned arbitrary can be described as " inductively ") is coupled to the induction of this reaction (alternately), magnetic, condenser type or reactance.Refer to that two elements are electrically connected to each other according to, term " connection " (and its distortion) corresponding thereto, the mutual flowing by the electronics between two elements wherein between two elements produces.Normally, two each other element be not inductively electrically connected to each other.Element (the module antenna MA of such as laying located adjacent one another and coupling coil CC) for lead loop is usual each other inductively, and is not electrically connected between the two elements.Corresponding thereto according to, module antenna MA is electrically connected with RFID chip (CM) element usually.The winding of gain antenna BA and coil (such as outer winding OW, internal layer winding IW and coupling coil CC element) are electrically connected to each other usually, but also can present each other inductively.Module antenna MA is not electrically connected each other with coupling coil CC, but each other inductively (or " transformer coupled ").

Gain antenna BA disclosed herein (and other features) can increase with condenser type and the useful effect between Anneta module AM inductively and outside contactless formula reader (" reading ") distance.Owing to reading distance approximate only several centimetres usually, therefore increasing by 1 centimetre will represent great improvement.

By the content being described numerous embodiments to illustrate that the present invention instructs, and described execution mode should be construed as illustrative but not determinate.In hereafter main contents, can discuss as the example of the various features of invention disclosed herein and execution mode using the transponder of secure file form (its can for smart card or national ID card).Obviously, many features and execution mode can be applied to (being incorporated into easily) other forms of secure file, such as E-Passport.As used herein, any one in term " transponder ", " smart card ", " data medium " etc. can be interpreted as referring to any other equipment similar operated under ISO14443 or similar RFID standard.

Typical data medium described herein can comprise: (i) Anneta module (AM), it has RFID chip or chip module (CM) and module antenna (MA), (ii) card (CB) and (iii) gain antenna (BA), it is laid on card (CB), to strengthen being coupled between module antenna (MA) and the antenna of external RF ID " reader ".When mentioning " chip module " herein, apart from contrary clearly, should notice that it comprises " chip ", vice versa.Module antenna (MA) can comprise lead loop, the conductive trace of etching or printing in modular belt (MT) substrate for Anneta module (AM), or can be directly incorporated on chip self.

Gain antenna (BA) can be formed by being embedded in by wire in inlay substrate or card (CB).But, it should be understood that, antenna can utilize except by wire, the technique embedded is in the substrate formed, such as additive process or subtractive processes, such as printed antenna structure, coil windings technology (such as US6,295, disclosed in 720), formed in the antenna substrate be separated and be transferred to the antenna structure of inlay substrate (or layer of inlay substrate), the antenna structure that substrate goes out from Conductive Layer Etch (comprising laser-induced thermal etching), the electric conducting material etc. laid on substrate or in formation passage in the substrate.When mentioning " inlay substrate " in this article, apart from clear and definite contrary, should notice that it comprises " card " (vice versa), and for any other substrate of secure file.

Usually, being coupled between module antenna (MA) and the antenna of outside RFID reader is enhanced by being incorporated in card (CB) by gain antenna (BA).In some respects, gain antenna (BA) is similar with card antenna (CA).But, compared to the card antenna (CA) be directly electrically connected with RFID chip or chip module (such as at US7,980, in 477), inductively, this module antenna (MA) can be connected with RFID chip (CM) for gain antenna (BA) and module antenna (MA).This type of is inductively compared to being directly electrically connected more difficult realization.

Fig. 1 is the cross-sectional view of the part of exemplary smartcard, and this smart card has the Anneta module AM in the groove that is laid in card CB.Anneta module AM has chip module CM.Anneta module AM has contact pad CP, docks for carrying out contact with external contact formula reader (ISO7816).Anneta module AM has module antenna MA, for carrying out contactless docking with outside contactless formula reader (ISO14443).Gain antenna BA is laid near the periphery of card CB, and has coupling coil CC, and it is laid near the groove in card CB.By laying Anneta module AM in a groove, the coupling coil CC close-coupled of module antenna MA and gain antenna BA.Coupling coil CC can be arranged to be positioned at below module antenna MA, instead of around this module antenna MA.

As shown in US2012/0074233, such as Fig. 3 A wherein and Fig. 4 A, gain antenna BA (or card antenna CA) can comprise outer winding OW (or D) and internal layer winding IW (or E), they each other paraphase connect into the dipole that is as the criterion.Coupling coil (CC) does not illustrate.

As US13/600, shown in 140, such as Fig. 3 and Fig. 4 wherein, accurate dipole gain antenna BA can also comprise interior coupling coil CC.Coupling coil CC is not shown in detail, and is represented by some dotted lines.(some details that coupling coil CC constructs, and how it can be arranged (clockwise, counterclockwise) and how can be connected in Fig. 3 A-3D with outer winding OW and internal layer winding IW and set forth with multiple direction.)

Figure 1A is the schematic plan of the Smart Card body CB with gain antenna BA and Anneta module AM.Gain antenna BA has the coupling coil CC with its merging.Following abbreviation is there will be in figure.

CB-card or inlay substrate

BA-gain antenna or card antenna (CA)

Outer winding-general 2-3 the circle of OW-BA

Internal layer winding-general 2-3 the circle of IW-BA

CC-coupling coil-general 10 circles

The inner of IE-OW, IW or CC

The outer end of OE-OW, IW or CC

Below can be annotated:

(IE a) is " free end " in the inner of outer winding (OW)

The outer end (OE, f) of internal layer winding (IW) is " free end "

The outer end (OE, b) of OW is connected with one end of CC

The inner (IE, e) of IW is connected with the other end of CC

Outer winding OW can by from IE (a) to OE (b), clockwise (CW) places

Internal layer winding IW can by from IE (e) to OE (f), clockwise (CW) places

Gain antenna BA comprises outer winding OW and internal layer winding IW, and the two extends around the periphery of card CB in fact.Each in internal layer winding and outer winding has inner IE and outer end OE.Outer end OE (b) of outer winding OW is connected via coupling coil CC with the inner IE (e) of internal layer winding IW.The inner IE (a) of outer winding OW can be left with outer end OE (f) of internal layer winding IW not to be connected, as " free end ".The whole gain antenna BA comprising outer winding OW, coupling coil CC and internal layer winding IE is open loop circuit, and can be called as " accurate dipole "-outer winding OW forms a pole of dipole, internal layer winding IW form another pole of dipole-should " accurate dipole " by coupling coil CC center-fed.

Gain antenna BA can utilize such as, border (periphery) around card CB (or inlay substrate or data carrier substrates, formed by thermoplastics) lay the insulation of (such as ultrasonic bonds), discrete copper conductor formed.Gain antenna BA comprises outer winding OW (or coil, and internal layer winding IW (or coil D), E), and comprise coupling coil CC, although be described " end " of these various coil parts, but above-mentioned all elements can be formed by a continuous long wire (the autoadhesion wires of such as 80 μm), and this wire can be placed on card CB or be embedded in this card CB.More particularly,

-outer winding OW can be formed to have many (such as 2-3) circles and has inner IE at " a " point and have the helical of outer end OE at " b " point.Outer winding OW is adjacent to the periphery (border) of (being positioned in fact) card CB.The inner IE (" a ") of outer winding OW is free end.

-coupling coil CC can be formed to have many (such as general 10) circles and the helical with " c " and " d " two ends.End " c " can be outer end OE or is inner IE, and end " d " can be inner IE or outer end OE.

-internal layer winding IE can be formed to have many (such as 2-3) circles and the helical with inner IE " e " and outer end OE " f ".Internal layer winding IW is adjacent to the periphery of (being positioned in fact) card CB, in the inside of outer winding OW.The outer end OE (" f ") of internal layer winding IW is free end.In figure 3, internal layer winding IW is shown as dotted line, to make explanation clear.

The inner IE of-outer winding OW is " free end ", because it is left is not connected.Similarly, the outer end OE of internal layer winding IW is left " free end " that do not connect.

Utilize traditional wire embedded technology, outer winding OW, coupling coil CC and internal layer winding IW can be formed as a continuous print structure.It should be understood that and mentioned coupling coil CC is connected with the end of outer winding (OW) and internal layer winding (IW), should not be interpreted as the entity that its hint coupling coil CC is the separation with end.On the contrary, under the background of a continuous structure forming outer winding OW, coupling coil CC and internal layer winding IW, " end " can be construed as meaning corresponding to and be interpreted as in this context " connecting " by the position-term " connection " of other positions for actual end.

The size of card CB can be roughly 54mm × 86mm.The outside dimension of the outer winding OW of gain antenna BA can be roughly 80 × 50mm.Diameter (d) for the formation of the wire of gain antenna BA can be roughly 100 μm (including, but are not limited to 80 μm, 112 μm, 125 μm).

Internal layer winding IW can be laid in outer winding OW, as shown, is laid on the given surface of card CB (or layer of multilayer inlay substrate).Alternatively, these two windings of gain antenna BA can be laid on the relative surface of card CB, be in alignment with each other in fact (in the case, they will be " top " winding and " bottom " winding, but not " skin " winding and " internal layer " winding).Two windings of gain antenna BA can local coupling, to make the voltage caused in them can paraphase each other.Coupling coil CC can be positioned on the same surface of card CB with outer winding and internal layer winding.

The pitch of turn of the outer winding OW of gain antenna BA and the circle line (turn) of internal layer winding IW can be 0.2mm (200 μm), makes the space between the adjacent turn line of outer winding OW or internal layer winding IW with roughly one diameter of wire.(in other words the pitch of turn of coupling coil CC can be equal to or less than in fact, be not more than) pitch of turn-such as 0.15mm (150 μm) of at least one in outer winding OW and internal layer winding IW, make, between the adjacent turn line of coupling coil (CC), there is the space being less than a diameter of wire.Autoadhesion copper conductor may be used for gain antenna BA.The pitch of turn of skin/internal layer winding OW/IW and coupling coil CC can be roughly the 2x (twice) of diameter of wire (or width of conductive trace or path (track)), makes to have the space being approximately 1 diameter of wire (or track width) between the adjacent turn line of helical.The pitch of turn of outer winding OW and internal layer winding IW can be mutually the same in fact, or they can be different from each other.

Wire for the more multiturn number of coupling coil CC can be accommodated in given region-such as, by placing two " road (course) " wire in the groove of definition for the laser ablation in the region of the coupling coil CC of this number of turn, one road is located on another road and (if necessary, there is dielectric film therebetween).

Substrate or the card CB with the gain antenna BA be formed thereon can be prepared by the first manufacturer, and form intermediate products (it does not have Anneta module AM, can be called as " data carrier arrangement ").Subsequently, the second manufacturer can go out (or formation) groove (see Fig. 1) in card CB, in the inside grinding of coupling coil CC, and is installed in this groove by Anneta module AM (having its module antenna MA).(certainly, data carrier arrangement can be provided by the first manufacturer when groove is formed.)

Can for making additional reference about some accompanying drawings in the application of DIF (double nip-contact and contactless) smart card and description below, these applications are incorporated herein by reference, such as:

13/730,811 or publication number in 12/28/2012 submission are the application of 2012/0074233

Card antenna CA in Figure 1A card CB, contact and non-contact reader

Card antenna CA in Figure 1B card CB, the ferrite in card CB

Ferrite component FE between module antenna MA in Fig. 1 D AM and contact pad CP

Fig. 3 A, 4A accurate dipole gain antenna BA, does not have coupling coil CC

Ferrite in Fig. 4 I, J card CB

Fig. 6 A has ferritic mobile phone paster MPS

Fig. 6 B ferrite shielding element 670, there is adhesive both sides

Fig. 8 (13/730,811) card antenna CA is mainly positioned at the first half of card CB

in the application of 13/600,140 of 8/30/2012 submission

Fig. 2 A gain antenna BA, does not have coupling coil CC

Fig. 3 gain antenna BA, has coupling coil CC

Fig. 3 A-3D is for the various configurations of coupling coil CC

Fig. 4 has the BA of CC, has the Anneta module AM of module antenna MA

Fig. 5 H has the gain antenna of extended line

Fig. 5 I-K two gain antennas

Fig. 6 A-C is laid in the BA of the first half of card CB

The structure of metallization card

Some smart cards (comprising double nip (DI) smart card) have metal (or metallization) top layer, or " panel ", the substantially general size with card.This metal level is set technically and unwilling, because will obviously reduce being coupled between card with outside contactless formula reader.However, this feature is important concerning realizing several object.

Fig. 2 be summarize very much, briefly, schematic cross-sectional view, which illustrate some illustrative layers of exemplary " metal " (or metallization) smart card.Only for reference object but not for showing particular order, layer is numbered.Can rearrange layer.Some layers can be omitted.Some layers go for intelligent non-metal card or metallization smart card.Some layers can comprise more than one layer.Some layers can be also laminated with other.

Layer 1 printing thin, covers anti-zoned layer etc.

The metal level that layer 2 is separated or metallization metals thin slice

Layer 3 has the gain antenna BA of coupling coil CC

Layer 4 card CB

Layer 5 metallization or non-metallic smart card on compensation framework (being positioned at the card back side)

Layer 6 printing thin, pad below anti-zoned layer, magnetic stripe etc.

Showing chip module (CM) is laid in window " W " (opening), extend to smart card, extend through metallization metals thin slice (layer 2) from the front surface (end face, as observed) of smart card and arrive card (layer 4).Chip module (CM) has contact pad (CP) at its front surface, for docking with external contact formula reader.Chip module can be double nip (DI) Anneta module (AM), and it has the module antenna (MA) for docking with outside contactless formula reader via the gain antenna (BA) with coupling coil (CC).Anneta module (AM) can be arranged in the interior zone of coupling coil (CC).Comparison diagram 1.

Fig. 2 A shows the exemplary stack (series of layers) for the smart card 200 that metallizes, and this metallization smart card 200 has with lower floor, structure and assembly.Exemplary dimensions can be shown.All sizes are approximate.Thickness refers to the vertical dimension in figure.

-top layer 202 can be metal (or metallization) layer 202, such as 250 μm thick stainless steels, and can be called as " panel ".Contrast " layer 1 ".This top layer 202 can be equally large with whole smart card, such as, be roughly 50mm × 80mm.

-adhesive phase 203, such as 40 μm thick polyurethane.

-ferrite material layer 204, such as 60 μm thick soft (flexibility) ferrite laminas.

-adhesive phase 205, such as 40 μm thick polyurethane.

-plastic material layer 208, such as 50-100 μm thick PVC, it can play the effect (layer below and assembly being separated with layer above and assembly) of partition.

-plastic material layer 210, such as 150-200 μm thick PVC, it can play the effect of card (CB).Contrast " layer 4 ".

-wire 212, the such as wire of 112 μm of diameters, form the gain antenna (BA) with coupling coil (CC).Comparison diagram 1.For clearly demonstrating, the cross-sectional view of a wire is only shown.

-plastic material layer 214, such as 150 μm thick PVC, it can comprise printing, magnetic stripe etc.

-plastic material layer 216, such as 50 μm thick PVC, it can as cover layer.

The integral thickness of-smart card 200 (layer 202,203,204,208,210,214,216) can be roughly 810 μm (0.81mm).

Window 220 (" W ") can extend in smart card, extends through intermediate layer arrive card layer 210 from panel 202.Double nip (DI) Anneta module (AM) with module antenna (MA) can be laid in window 220.Comparison diagram 1.Window 220 can extend fully through layer 210, and in this case, Anneta module (AM) can be supported by layer 214 below.

The coupling coil (CC) of gain antenna (BA) can around window 220, thus with module antenna (MA) close-coupled of Anneta module (AM).Comparison diagram 1.Alternatively, coupling coil (CC) can be laid in card (CB), thus below the module antenna (MA) being positioned at Anneta module (AM).

Anneta module (AM) roughly can be measured as 12 × 13mm (and roughly 0.6mm is thick).Window 220 (" W ") in panel 202 can roughly identical with the size of Anneta module (AM)-namely, be roughly 12 × 13mm.In this " benchmark " configuration, chip enable distance can be roughly 15mm.(chip enable distance-like is similar to reading distance, and represents chip module can be activated (for reading) ultimate range by external reader).General recommendations, read distance and be the bigger the better, 15mm is not very good, 20mm or 25mm can be better.Chip enable distance in metallization smart card is limited by the decay of the electromagnetic field be associated with gain antenna, and this decay is owing to metal decking 202 (layer 1).

According to feature of the present invention, the window 220 in panel 202 is made into obviously to be greater than Anneta module (AM), shields to offset and strengthens coupling, thus increases active distance.Such as, given Anneta module (AM) is roughly measured as 12 × 13mm,

-window 220 can expand general 1mm to surrounding, to make the gap (GAP) that there is 1mm in Anneta module (AM) surrounding.This makes window measurement be 14 × 15mm, and increases the area (this area is interval area) of 30%.Gap (1mm) is probably 10% of the sectional dimension of (12 × 13mm) window do not expanded.The chip enable distance obtained can be roughly 20mm (adding 33% than datum line 15mm).

-window 220 can expand general 2mm to surrounding, to make the gap (GAP) that there is 1mm in Anneta module (AM) surrounding.This makes window measurement be 16 × 17mm, and increases the area (this area is interval area) of 75%.Gap (2mm) is probably 20% of the sectional dimension of (12 × 13mm) window do not expanded.The chip enable distance obtained can be roughly 22mm (adding 50% than datum line 15mm).

Sum up (all numerals are roughly numeral) providing the result of gap and expansion window to carry out in the following table.

More at large, the size of window 220 can increase (compared to the nominal dimension that it is roughly equal with nominal (nominal) size of Anneta module AM) at least 10%, nearly at least 100%, comprising roughly 30% in above-mentioned example and 75% value.

Gap (GAP) between Anneta module (AM) and the inward flange of window 220 can allow to have between the coupling coil of gain antenna (BA) (CC) and the module antenna (MA) of Anneta module (AM) and obviously better be coupled.Active distance realizes the growth of nearly 50%.The gap size of 1mm and 2mm comes into question, and it represents window respectively and increases 10% and 20%.More at large, gap can be at least 0.5mm, comprises nearly at least 3mm.

Ferrite layer 204 also can improve coupling by reducing the coupling attenuation that cause because of panel 202, the electromagnetic field between the module antenna MA contributing to concentration gain antenna BA and Anneta module AM.Desirably ferrite layer 204 to be positioned as close to the downside of panel 202.The not separative ferrite layer 204 (and adhesive phase 203) of tool, but ferrite particle or powder can mix with adhesive, and on the downside being sprayed or cover panel 202, thus reduce intermediary adhesive layer 203.Alternatively, not with the form of the layer 204 be separated, Ferrite Material can be embedded in the ferrite particle (comprising nano particle) in lower floor's (such as spacer layer 208 or card layer 210 (in some configurations, spacer layer 208 can be omitted)).

Spacer layer 208 also can improve coupling by reducing the coupling attenuation that cause because of panel 202, simply by by actual for panel 202 remain on from gain antenna 212 enough away from position (in the restriction of the form factor of smart card).

Except increase the feature of window 220 in panel 202 except, ferrite 204 between panel and layer/assembly below and spacer layer 208, various for improving the extra feature be coupled, in the layer that can be incorporated in smart card and/or Anneta module, such as, but not limited to:

metal card

-counter plate punches, as with reference to the more detailed description of figure 3A, B, C

-afford redress framework below gain antenna (BA).Equivalent beds 5 (Fig. 2, above) and Fig. 4 A, 4B (hereafter)

for card layer

-strategic locations in card (CB) lays ferrite, such as, in Figure 1B, 4I, 4J of US20120074233 disclosed

-gain antenna (BA) or card antenna (CA) are configured to the accurate dipole without coupling coil (CC), and settle Anneta module AM with the internal layer winding IW making module antenna MA only cover gain antenna, Fig. 3 A, 4A and 13/600 of Fig. 2 C and US20120074233 of such as US20120038445, disclosed in Fig. 2 A of 140

-gain antenna (BA) is configured to the accurate dipole with coupling coil (CC), such as 13/600, disclosed in Fig. 3, the 3A-D, 4 of 140.Comparison diagram 1,1A (above)

-provide " extended line " to gain antenna (BA), such as 13/600, disclosed in Fig. 5 H of 140

-overlapping gain antenna (BA) is provided, such as, in Fig. 5 I, J, K of 13/600,140 disclosed in

-mainly in the top of smart card, provide gain antenna (BA), will under " embossment " portion be left freedom, such as 13/600, Fig. 6 A, the B of 140, C, 13/730, Fig. 8 and 61/697 of 811, disclosed in Fig. 6 D of 825

-by module antenna (MA) from coupling coil (CC) skew, to make their and non-coaxial, as submit in 12/15/2012 61/737,746 Fig. 7 A, B, C in disclosed

-to be formed in the mode except the mode shown in Figure 1A (above) and to connect winding and the coupling coil (CC) of gain antenna (BA), such as in 12/15/2012 submit to 61/737,746 Fig. 8 A-C in disclosed

for Anneta module (AM)

-ferrite component is laid in module antenna (MA) and Anneta module (AM) contact pad (CP) between, such as, in Fig. 1 D of US20120074233 and Fig. 7 C, D, E disclosed

-condenser type short-term is added into module antenna (MA), such as, in Fig. 2 A, B of US20120038445 and US20120074233 disclosed in

-cutting and/or punching are carried out, such as 61/693 to the contact pad (CP) of Anneta module (AM), disclosed in Fig. 2-5 of 262

-module antenna (MA) is formed as two coils be separated, such as, in Fig. 6 A of 61/693,262 disclosed in

-two windings of module antenna (MA) are connected according to accurate dipole arrangement, such as, in Fig. 6 B of 61/693,262 disclosed in

Utilize the various combinations of these features, the benchmark active distance of 15mm can be increased to general 28mm, or more, improve general 100%, and corresponding improvement has been carried out to the reliability of the communication between chip module (CM) to outside contactless formula reader.Within the scope of the invention, these features cited hereinabove can be integrated into and not metallize in the smart card of (not having metal decking), activate significantly to improve and read distance.

manufacture

Intermediate products can comprise ferrite 204 (it adheres to spacer layer 208 below with adhesive 205) and card layer 210, and gain antenna 212 is embedded in this card layer 210.These intermediate products can be described as pre-laminated heap or " primary laminate product (prelaminate) ", and can have the thickness of roughly 450 μm.

Primary laminate product can be delivered to the second manufacturer, and this second manufacturer will apply panel 202, bottom PVC thin slice 214 and bottom cover layer 216.Panel 202 can be formed opening 220 by punch in advance (or utilizing other machines processing mode).The lamination obtained can have the pre-laminated thickness of roughly 940 μm (0.94mm), and lamination (heating and pressing) afterwards finally has the thickness of roughly 890 μm (0.89mm).

In laminating technology, can first material plug be inserted in window 220, extend upwardly to (and making the lower surface of smart card generates indenture) in window 220 to prevent subsurface material (ferrite 204, partition PVC208, card PVC210 etc.).The material of embolism can be PVC or be metal " filler rod (slug) ", and it is removed to make opening from panel, etc.

Typically, after lamination, embolism (if metal plug) is removed.If embolism is PVC, original place can be stayed.Afterwards, the groove for Anneta module can by machining in the layer of smart card (ferrite 204, partition PVC208, card PVC210), and carefully (in the nature of things) does not damage coupling coil (CC) simultaneously.

counter plate (202) punches

The panel (202) that can be described as " metal layer " (" ML ") can be perforated to improve coupling, and this measure generally completed before panel being added into lamination heap, such as, jointly form window (220).In other words, for offsetting the shielding because the metal layer on smart card causes, can punch to metal layer, remove the material on the position of such as window (220) surrounding and so on, this window (220) is roughly located immediately at coupling coil (CC) top and/or is positioned at the around peripheral of metal layer ML, above the outer winding OW that this metal layer ML is roughly located immediately at gain antenna BA and internal layer winding IW.In these positions, metal layer ML is punched (such as forming groove and hole), electromagnetic field can be allowed to operate better, such as, by promoting the radiation of electromagnetic flux line.The design of perforation can increase the aesthetic feeling of smart card, and can provide optics (visual) security feature.

Fig. 3 A show can around the periphery of panel 302 (comparing 202), such as formed the pattern of the perforation (or opening) with elongated gap 322 form by laser-induced thermal etching.Gap 322 can (or under) alignment on gain antenna BA (Fig. 1), to strengthen being coupled between gain antenna BA and the antenna of outside contactless formula reader (Fig. 1).

Fig. 3 A show can around the periphery of the opening 320 (comparing 220) in panel 302 (comparing 202, is still " layer 2 "), the pattern such as being formed the perforation (or opening) with hole 324 form by laser-induced thermal etching.These perforation can (or under) alignment on coupling coil CC (Fig. 1), to strengthen being coupled between coupling coil CC (212) and the module antenna MA of Anneta module AM.

Fig. 3 B shows the replacement pattern of the perforation (or opening) 322 and 324 in metal layer (panel) 302.Herein, the perforation 322 around the periphery of panel A has the form in hole, and around the apertured form of perforation 324 tool of window 320.

Fig. 3 C shows the replacement pattern of the perforation (or opening) 324 in metal layer (panel) 302.Herein, opening 324 is the segmental arc of several increased radius, and distribution (concentrating) is around window 320.

Perforation (or opening) 322 and 324 (being no matter gap or hole or other shapes) can be arranged according to pattern attractive in appearance, and can as safety (anti-counterfeiting) measure.Visual contrast material (preferably nonmetal, such as artificial (plastics) shell) can be filled in the perforation (or opening) 322 and 324 in panel 302.

The size of card CB can be (roughly 50mm × 80mm),

Width 85.47mm-85.72mm

Height 53.92mm-54.03mm

Thickness 0.76mm+0.08mm

Panel 302 (or metal layer ML) roughly can be measured as 86mm × 54mm.Opening 320 (or " W ") in panel 320 roughly can be measured as 8mm × 10mm.(in the discussion of Fig. 2 A, other exemplary dimensions for the window 220 in Anneta module AM and panel 202 are shown by list.) in other words the outer peripheral areas of card CB (or metal layer ML) can extend 5-10mm-from the edge of card CB (or metal layer), not whole card periphery is whole.

As shown in figs.3 a and 3b, multiple (such as 20-60 is individual, or more) opening 322 can be laid at the near peripheral regions of panel 302.Opening 322 can reduce the metal material quantity roughly 25%-50% in outer peripheral areas, thus allows gain antenna BA better with being coupled between outside contactless formula reader.

Similarly, multiple (such as 10-30 is individual, or more) opening 324 can be laid near the window 320 in panel 302.Opening B can reduce the metal material quantity roughly 25%-50% in this region, thus make between coupling coil CC and the module antenna MA of Anneta module AM be coupled better.

To card layer other or replace amendment

compensation circuit

Fig. 4 A shows conductivity " compensation circuit " CL and can be laid (in the layer 5 of such as Fig. 2) at gain antenna BA (layer 3) rear, and the periphery around card CB extends.Compensation circuit CL can for having the open loop of two free ends and the gap between them (" gap ").Compensation circuit CL can be made up of copper coating, can be printed on the first-class of supporting layer.

Fig. 4 B shows compensation circuit CL can comprise Ferrite Material, and in this case, because ferrite is not electric conductor (compared to copper), loop can close, and does not have gap and free end.

Compensation circuit can be called " framework ".Compensation framework on the back side of gain antenna BA (Fig. 1) can contribute to stable resonance frequency.

Except gain antenna BA, can also using compensation loop CL.Gain antenna BA can be embedded in the side of inlay substrate, and compensates framework and can be ink-jet printed or bond the opposite side being attached to this inlay substrate.Compensation circuit CL can use subtractive processes (etching away material) or additive process (deposition materials) to be mounted.

ferrite

Ferrite layer can be laminated on together, and combines with the copper compensation circuit CL on the back side of gain antenna BA, can the resonance frequency of constant gain antenna BA.On some position, path can be interrupted (having gap).

Lamination and temperature may be used for ferrite particle to be sintered together becomes a continuous print path.At temperature and very high laminated under pressure ferrite ion to produce thin card material film (such as PC PVC PET), thus generate the ferrite inlay with antenna.This inlay can be made up of some layers of ferrite.The temperature applied and pressure can make particles sintering and form ferritic insulating barrier.

By ferrite nano particles or powder deposition in inlay substrate, to make magnetic lines of flux bend, and compensate the effect of the shielding caused because of any metal level close to RFID antenna in the metallization of the printed layers in Smart Card body or card; And formed and there is the pre-laminated inlay of gain antenna, or there is the transponder of or several lower floor's ferrite layers, this ferrite layer together with RFID component lamination to form compound inlay layer.

By wet shot or dry spray, ferrite nano particles or powder can be applied to basalis.When wet shot, ferrite suspends in liquid dispersion, and this liquid dispersion is by carrying out ultrasonic process to prepare to the particle in solvent or moisture/surfactant liquids.Particle can also have solid and be coated with the suspension in a liquid of support particle.The grade of filtration and sonicated can be passed through, determine the average crystallite particle size of ferrite spheroid over time, become.(sonicated is that one utilizes sound (being generally ultrasonic energy) to stir the behavior of the particle in sample.)

Carrying out sintering to nanoscale ferrite particle can occur in during involutory stratification carries out heat lamination, this synthesis layer composition inlay.Laminating technology is included in heated under pressure and cooling.Be may be used for strengthening ferromagnetic characteristic by some layers of ferrite of substrate or sheet metal cover.Different from large ferrite particle, nano particle has much lower sintering temperature, matches with the glass transition temperature of synthesis substrate.Extra heat treated may be needed after lamination.

be incorporated in the additional features in card

As mentioned above, multiple additional features can various compound mode be incorporated in Smart Card body (no matter being metallization smart card class or non-metallic (typically) smart card class), to strengthen the electromagnetic coupled of module antenna and outside contactless formula reader via gain antenna, thus the level increasing to " satisfactory " with reading distance will be activated.These enhancings can be mainly used in offsetting the negative effect caused by other assemblies of smart card, other assemblies described such as metal decking (202,302) (discuss in detail above), or the metal contact pad (CP) on Anneta module (AM), it can also be modified to strengthen coupling, as hereafter talked out.Some features about card can comprise:

-be laid in ferrite in card (CB) strategic locations on, such as, in Figure 1B, 4I, 4J of US20120074233 disclosed; And

-for the various configurations of gain antenna (BA), its several change is mentioned hereinbefore.

Laser-induced thermal etching and the amendment to Anneta module

To use laser-induced thermal etching but not chemical etching carrys out such as removing materials (metal) from layer, such as, in order to form the module antenna MA of Anneta module AM, very simply introduce.To the description that this technique is more detailed can be 1/23/2012 submission 61/589,434, in 4/4/2012 submit to 61/619,951 and in 8/25/2012 submit to 61/693, find in 262.

Describe chemical etching in the finite size of iso standard chip card module in patent application US2010/0176205 and there is the antenna of 10 to 12 circles.This type of Anneta module with contact and non-contact interface is implanted in card, for gain antenna inductively, to communicate with noncontact mode with reader.

Due to the restriction (such as 13mm × 11.8mm) in smart card module size, form the space of circle line limited amount around silicon chip center of antenna, this silicon chip adheres to and is bonded to module substrate.This substrate is made up of expoxy glass usually, and the supine side of module has contact metallization layer, and has bonding metal layer on the ventricumbent side of module.

By the minimum pitch of turn (or spacing) that another restriction of chemical etching establishment induction antenna is between path, it uses lithography process economically to realize.100 μm are roughly at the best pitch of turn (or spacing) between (adjacent) path of the antenna of etching of bringing of super (super) 35mm.(as used herein, term " pitch of turn " can refer to the spacing between adjacent conductive path, but not the center between its traditional path center line is to center size, or the path quantity of per unit length.)

Antenna structure (such as module antenna) can be formed by laser-induced thermal etching copper coating rolled-up stock, and this product forms the integration section of RFID smart card chip module.Use laser-induced thermal etching can solve restriction pitch of turn factor, it can utilize traditional chemical etching to realize, and result is that the circle line quantity forming antenna can be generally increased by a large, and brings performance advantage.Relative to chemical etching, use laser-induced thermal etching that the footmark (foot-print) of the antenna of the laser-induced thermal etching with the electrical characteristics identical in fact compared with the antenna of the chemical etching of large regions with needs can also be caused significantly to reduce, and use standard adhesive tape can be allowed antenna chip module easily to be placed and stick in the groove that provides in card.

The material of laser-induced thermal etching can comprise: standard prepreg laminate (110 μm), this product is made up of the solidification halogen-free epoxy resin (17 μm+17 μm) of expoxy glass and double-sided copper-clad sheet metal, and this product may be used for manufacturing contactless and Smart Card with Dual Interface module by row and column on the chip carrier band of super 35mm.Belt carrier can be provided with sprocket and index hole for transmission, and can implement perforation with perpendicular interconnection before laser processing, thus electrical connection top metal layer and substrate layer.

Use UV or green glow nanosecond or picosecond laser, to equal the path spacing of the width (being roughly 25 μm) of laser beam dimensionally, the antenna structure laser-induced thermal etching (insulation technology) being arranged in each Module sites is covered " seed " layer (the ventricumbent side of prepreg) to the copper that thickness is 17 μm.In supine side, contact area also by laser-induced thermal etching, can think that the chemical plating (electroless-plating) of copper and the plating (electro-plating) of nickel and gold are prepared.After carrying out laser-induced thermal etching to copper seed layer, the band with antenna sites being positioned at ventricumbent side is further processed: sandblasting to remove the particle of remaining laser ablation, and is prepared for electroplate adhesion; Deposit carbon body (carbon) is to support that the perforation of perpendicular interconnection is electroplated; Dry film application and photomask technique; Nickel and nickel phosphorus (Ni/NiP ~ 9 μm) or nickel (Ni ~ 9 μm) and porpezite/gold or gold (Pd/Au or Au-0.1 μm/0.03 μm or 0.2 μm), to increase the thickness of path on band both sides, are electroplated in case oxidation by chemical depositing copper (Cu ~ 6 μm).

By using pre-preg layers rolled-up stock both sides having the standard of copper seed layer, likely before band is electroplated with copper electroless plating and with nickel and gold, laser-induced thermal etching is carried out to the Anneta module in the contact pad on supine side and ventricumbent side.The major advantage of this technology is the size of the feature pitch of turn (spacing) reduced between path, and increases the permission quantity of circle line in the restricted area of standard intelligent card chip module thereupon.

amendment contact pad (CP)

Foregoing in 8/25/2012 submit to 61/693,262 disclose the various modes (Fig. 2 A-D, 3A-B, 4A-B, 5A-B with reference to wherein) of modifying to offset the electromagnetic coupled decay that may cause because of metal contact pad (CP) to the contact pad (CP) of double nip (DI) Anneta module (AM).In the example (Fig. 3 A) illustrated wherein, can punch at least some contact pad (CP), such as formation hole or groove are to reduce so-called " covering " of coupling coil CC, thus realize the good effect reading distance (increase and read distance).Perforation in contact pad (CP) plays a part with the opening 324 in panel 302 similar.Two features (to contact pad punching, counter plate punching) all can be implemented.

As used in this article, term " overlay area " (or " covering ") finger touch pad (CP) is to the overlapping degree of module antenna (MA), and this contact pad (CP) is positioned at the opposite side of modular belt relative to module antenna (MA).Overlay area (can not have overlap between 0%, time such as outside the periphery that MA is all positioned at CP) with (in fact all overlapping close to 100%, time such as within the periphery that module MA is all positioned at contact pad (CP), but this numeral is reduced to slightly lower than 100% by the gap between pad) between.Associated, term " coil exposed " refers to the degree that the module antenna (A) in the region being positioned at contact pad (CP) exposes, such as, by the gap between contact pad.Coil exposed can between close to 0% (unique exposure be by pad between the exposure in gap) and 100% (time such as outside the periphery that module antenna MA is all positioned at contact pad) between.

Fig. 5 (compared to 61/693, Figure 1A of 262) describes the representative configuration of contact pad (CP) in modular belt (MT) supine side.Contact pad (CP) can comprise conductive material layer; such as layers of copper (usually also comprise for the protection of other conductive layers), this conductive material layer is etched (chemically or with laser (melting)) to present desired pad pattern.The overall dimensions of Anneta module (AM) can be roughly 15mm × 15mm.The overall dimensions of card (CB) can be roughly 50mm × 80mm.Overall dimensions and the pattern of contact pad (CP) can be specified by ISO7816.Such as, pattern contacts pad (CP) can occupy in modular belt (MT) supine side the region being roughly measured as 10mm × 13mm, and its thickness can be roughly 30 μm.Fig. 5 shows 7 contact pads (CP), and it is exposed by the opening in modular belt MT.

In Figure 5, modular belt MT is laid in shown in broken lines relative to the module antenna (MA) on the opposite side of contact pad (CP).In this example, overlay area is essentially 100%, and (module antenna MA is touched pad (CP) and all covers, except the small―gap suture between adjacent pads), and coil exposed is essentially 0% (having minimal coil to expose in the small―gap suture only between adjacent pads).Therefore, contact pad CP can shield in (decay) gain antenna BA (or card antenna CA) and Anneta module (AM) between module antenna (MA) signal.

US8,100,337 (2012, SPS) electronic module (11) with double interface communication is disclosed, be used in particular for chip card, first described module comprises substrate (27), this substrate (27) is provided with electronics contact jaw sub-block (17), it allows to run by contacting with the contact of reader, and secondly described module comprises antenna, this antenna comprises at least one circle line (13) and its terminal is connected with the terminal of microelectronic chip, and this microelectronic chip is positioned in the one side of module (11).The feature of this module (11) is that antenna turns line (13) is positioned in fact outside the region that electronics contact (17) covers, and is not formed shielding to the signal for antenna to make the electronics contact of terminal block.This can be applied to especially the chip card manufacturing and there is contact and contactless double interface communication.

Claim 1.For an electronic module with double interface communication for chip card, described module comprises:

Substrate, comprises electronics contact jaw sub-block, and it allows to run by contacting with the contact of reader; And

Antenna, comprises at least one circle line, on the surface being positioned at electronic module and its terminal be connected with the terminal of microelectronic chip, this microelectronic chip is positioned in the one side of module,

Wherein, at least one circle line of antenna is positioned on the first area on the surface of electronic module, be positioned in fact outside second area that electronics contact covers, described module has multiple projection, described projection is positioned at outside the region of electronics contact of terminal block, one side relative with the face of carrying antenna turns line in substrate.

As at US8,100, pointed by 337, and use the language more consistent with the patent application of the present invention and applicant's co-applications, when Anneta module (AM) communicates with noncontact mode with external reader, contact pad (CP) may cause signal " shielding " (or decay), thus distance is read in restriction.Although limited reading distance (being such as only several centimetres) may be for security reasons expect, this type shielding may by reading distance limit such as, to small distance unsatisfactory, 3cm.More valuably, the reading distance of 5cm may be expected, to provide enough fail safes and to improve the communication between external reader and Anneta module (AM), comprise the communication with the smart card (SC) merging this Anneta module (AM).

US6,778,384 (2002, Toppan) show the example of the Anneta module with module antenna (8) and contact pad (7), wherein:

-overlay area is essentially 100%

-coil exposed is essentially 0%

US8,100,337 (2012, SPS) show the example of the Anneta module with module antenna (13) and contact pad (17), wherein:

-overlay area is essentially 0%

-coil exposed is essentially 100%

US8,100,337 disclose the problem that may cause when antenna is all positioned at outside contact region, and propose following solution

Circle line 13 due to antenna is positioned at outside the region of contact 17, there is no direct push action being arranged in the region on the circle line 13 of antenna, and therefore there is the risk that potential substrate 27 is bending, or at least unfavorable to the bonding quality between circle line 13 and adhesive 31, this will damage the life-span of adhesive power and card.For remedying this risk, the invention provides (in being even more useful out of shape) multiple protruding 33, described protruding 33 and being positioned at the same side with electronics contact 17, but being suspended from the region on antenna turns line 13.(the 5th hurdle, 7-18 is capable)

solve shielding problem

Disclosed in each in following execution mode (example), technology can be mixed with each other (depending on the circumstances), to reach effective solution.Total target increases to read distance, and it (or cannot) can result from minimizings " overlay area " and increase " coil exposed ".

Fig. 6 A (compared to 61/693, Fig. 2 A of 262) describes one group of contact pad CP, and wherein the outward flange of at least some contact pad CP is extended and exceeds their original borders (outward flange is represented by dotted lines).In this example, the feature that coil covers is to be increased, such as, increase as more than 100% by initial 100%, such as 110%.In this example, coil exposed is still in fact 0%.Can think, extending edge can have disadvantageous effect (reduce and read distance) to reading distance.

Being extended at edge with the region increasing single pad is useful when pad being used as the interconnection of element, module antenna MA, capacitive element etc. on the downside of this element such as modular belt MT.

Imagination, such as, following contact pad is layout/layout as shown in Figure 5A.Note, contact C4 and C8 can connect with the two ends (LA, LB) of module antenna MA.

Fig. 6 B (compared to 61/693, Fig. 2 B of 262) describes one group of contact pad CP, is wherein cut into by the outward flange of at least some contact pad CP and is positioned in their original borders (outward flange is represented by dotted lines).In this example, decrease coil and cover, such as, be reduced to 90% by initial 100%.In this example, add coil exposed, such as, increase to 5% by 0% on initial virtual.Can think, can there be small beneficial effect (increase and read distance) at cutting edge to reading distance.

Fig. 6 C is (compared to 61/693, Fig. 2 C of 262) describe one group of contact pad CP, wherein the inward flange of contact pad adjacent at least some in contact pad CP is carried out cutting, thus there is the effect in the gap between the selected contact pad in increase contact pad.In this example, decrease coil and cover, such as, be reduced to 90% by initial 100%.In this example, add coil exposed, such as, increase to 5% by 0% on initial virtual.Can think, increasing gap can have small beneficial effect (increase and read distance) to reading distance.

* original gap=~ 150 μm

* amended gap=~ 300 μm

Fig. 6 D (compared to 61/693, Fig. 2 D of 262) describes the alternative of Fig. 6 C, and not being wherein increases the overall gap between adjacent touch pad, but modifies in an irregular pattern to their inward flange.In this example, decrease coil and cover, such as, be reduced to 95% by initial 100%.In this example, add coil exposed, such as, increase to 3% by 0% on initial virtual.Can think, increasing gap can have small beneficial effect (increase and read distance) to reading distance.

In the aforementioned exemplary set forth in above-mentioned Fig. 6 A, B, C, D, some outward flanges of some contact pads or inward flange are moved by " original " position from them.Compared with Fig. 5, it is as the example in " home position ".

In the following example, the edge of contact pad usually keeps complete in their home position, thus maintains in fact this Center.

Fig. 7 A (compared to 61/693, Fig. 3 A of 262) shows the example of to punch at least some contact pad (such as formed hole or groove).In this example, decrease coil and cover, such as, be reduced to 90% by initial 100%.In this example, add coil exposed, such as, increase to 5% by 0% on initial virtual.Can think, can to reading the useful effect of distance (increase and read distance) to contact pad punching.

In fig. 7, in the one in contact pad, show the regular array of multiple circular perforations (or hole) of arranging according to row array and column array.Can by perforation brokenly, alternately, ground, the standard of the interweaving layout such as randomly.Circular perforations can have the exemplary diameter of 35 μm, and arranges with the exemplary pitch of turn of 70 μm or 140 μm or 40 μm (offseting 35 μm of hole rows).Some perforation can be groove or elongated hole, as shown in another contact pad.The hole with other shapes (such as rectangle, irregular shape, elongated shape) can be formed in some contact pads.

Fig. 7 B (compared to 61/693, Fig. 3 B of 262) shows example thinning for the selected areas of at least some contact pad.In this example, coil covers and is reduced by " effectively ", such as, be reduced to 95% by initial 100%.In this example, coil exposed is increased by " effectively ", such as, increase to 2% by 0% on initial virtual.Can thinking, making that contact pad is thinning can have useful effect (increase and read distance) to reading distance.

In figure 7b, module antenna MA is shown as and is etched, and has conductor wire (path), but not the module antenna MA of the coiled wires shown in Fig. 1.

Fig. 8 A (compared to 61/693, Fig. 4 A of 262) shows and is laid in module antenna MA below modular belt MT and chip CM.In this example, module antenna MA is coiling (wound) lead loop, has two ends a, b, and each end and respective adhesive pad BP bond.

Fig. 8 B (compared to 61/693, Fig. 4 B of 262) shows the supine one side of the modular belt MT shown in Fig. 8 A.At this, in contact pad CP, form the pattern (comparing with Fig. 3 A) of hole or perforation.The pattern of perforation is arranged with coaxial circles.This pattern will be visible to (smart card SC's) user.In this example, coil covers and is reduced by " effectively ", such as, be reduced to 95% by initial 100%.In this example, coil exposed is increased by " effectively ", such as, increase to 2% by 0% on initial virtual.Can think can have useful effect (increase and read distance) to reading distance to contact pad punching in this way.

Fig. 9 A (compared to 61/693, Fig. 5 A of 262) shows another example to contact pad CP punching.In this example, bore a hole visible, and arrange according to the pattern of mark (logo), the such as mark of Chase Bank (Chase Bank).

Fig. 9 B (compared to 61/693, Fig. 5 B of 262) shows another example to contact pad CP punching.In this example, bore a hole visible, and arrange according to the pattern of mark, the such as mark of Deutsche Bank (Deutsche Bank).

The pattern of the perforation in contact pad can be visible to user, and in metallization card, can be formed to imitate or perforation 324 (such as, being its less version or its continuity etc.) around window 320 in supplementary panel 302.

In above-mentioned set forth example, modify to realize to increase the target (by reducing the coupling attenuation between module antenna MA and gain antenna BA, this coupling attenuation can owing to contact pad CP) reading distance to the contact pad CP of Anneta module AM.In some cases, coil covers, and (or effective coil covers) is reduced, and coil exposed (or effective coil exposed) is increased.In some instances, contact pad (comprising inner edges and outward flange) maintains their original positions.In some instances, the Center of contact pad is kept.Gap between contact pad and the perforation in contact pad CP larger, make coil exposed more, thus reading distance can be improved.

some other aspects of Anneta module AM

Figure 10 A (compared to 61/693, Fig. 6 A of 262) describes below the modular belt MT for Anneta module AM.Show the antenna structure AS for module antenna MA, it comprises two module antenna part MA1 and MA2.Show two module antenna part MA1 and MA2.These two module antenna part MA1, MA2 can be arranged coaxially with each other, as internal antenna structure and outside antenna structure.Two module antenna part MA1, MA2 can be coiled wire-wound coil or patterning path, or one can for coiled wire-wound coil and another one is pathway pattern.Two module antenna part MA1, MA2 can be interconnected amongst one another in any suitable manner, to realize effective result.Such as, two module antenna part MA1, MA2 can in any suitable manner be connected to each other.

Figure 10 B (compared to 61/693, Fig. 5 A of 262) describes the exemplary antenna arrangements AS that can be used for Anneta module AM, and it has two parts (contrast MA1, MA2) interconnected amongst one another, and this antenna structure comprises:

-outer section OS, has outer end 7 and inner 8

-Nei layer segment IS, has outer end 9 and inner 10

The outer end 7 of-outer section OS is connected with the inner 10 of interior layer segment IS

The inner 8 of-outer section OS is left with the outer end 9 of interior layer segment IS not to be connected

-this formation so-called " accurate dipole " antenna structure AS.Contrast Figure 1A.

Zero is to have illustrated that this kind is arranged, to be used as the gain antenna BA in the card CB of smart card SC in 13/205,600 (open in 2/16/2012, publication number is 2012/0038445) of 8/8/2011 submission

Zero is to have illustrated that this kind is arranged, to be used as the gain antenna BA in the card CB of smart card SC in 13/310,718 (open in 3/29/2012, publication number is 2012/0074233) of 12/3/2011 submission

Contact pad CP described herein and antenna structure AS can use UV nanosecond or picosecond laser, utilization is formed the laser-induced thermal etching (insulation technology) that the copper on modular belt MT covers " seed " layer.The thickness of Seed Layer can be roughly 17 μm.For antenna structure AS, the spacing between path dimensionally can be equal with the width of laser beam, is roughly 30 μm.The width of path itself can be 30-50 μm.Can be holed by laser-impact is formed in perforation (as above those).

Copper seed layer is carried out laser-induced thermal etching with contact pad CP or antenna structure AS is carried out patterning and/or punching after, modular belt MT can be further processed as follows:

-sandblasting to remove the particle of remaining laser ablation, and is prepared for electroplate adhesion;

-deposit carbon body is to support that the perforation of perpendicular interconnection is electroplated;

The application of-dry film and photomask technique;

-electroplating deposition copper (Cu ~ 6 μm) is to increase the thickness of the Seed Layer of the patterning (for CP or AS) on band both sides;

By nickel and nickel phosphorus (Ni/NiP ~ 9 μm) or nickel (Ni ~ 9 μm) and porpezite/gold or gold (Pd/Au or Au-0.1 μm/0.03 μm or 0.2 μm) electroless plating in case oxidation.

Although the execution mode with reference to limited quantity describes the present invention, these execution modes should not be regarded as the restriction to scope of the present invention, and should as the example of some execution modes.Based on disclosure set forth herein, those skilled in the art can envision other possible modification, amendment and enforcement, and these modification, amendment and enforcement fall into protection scope of the present invention equally.

Claims

1. a smart card, this smart card has metallization panel (202,302) and card (CB), this metallization panel has the window (220,320) for containing antenna module (AM), and this card (CB) has the gain antenna (BA) comprising coupling coil (CC), wherein, the reference dimension of described window is substantially equal to the size of described Anneta module, it is characterized in that

Described window is greater than in fact described Anneta module.

2. smart card according to claim 1, wherein:

Described window is than described Anneta module at least large 10%.

3. smart card according to claim 1, this smart card also comprises:

Gap (GAP) between the inward flange and described Anneta module of described window.

4. smart card according to claim 1, this smart card also comprises:

Be laid in the ferrite layer (204) between described panel and described gain antenna.

5. smart card according to claim 1, this smart card also comprises:

Multiple perforation (322,324), is arranged in described panel (320), and extends around at least one in the periphery of described window (320) and described panel.

6. smart card according to claim 5, wherein:

Panel material quantity in the region of the described periphery of described thereabout or described panel is reduced 25-50% by least some in described perforation.

7. smart card according to claim 1, this smart card also comprises:

Be laid in the compensation circuit (CL) at the rear of described gain antenna (BA).

8. smart card according to claim 7, wherein, described compensation circuit (CL) has at least one in following features:

This compensation circuit (CL) has gap and two free ends;

This compensation circuit (CL) comprises electric conducting material, such as copper; And

This compensation circuit (CL) comprises ferrite.

9. smart card according to claim 1, this smart card also comprises at least one in following features:

Be laid in the ferrite in the strategic locations in described card (CB);

Described gain antenna (BA) is configured to the accurate dipole without coupling coil (CC);

Described gain antenna (BA) is configured to the accurate dipole with coupling coil (CC);

Described gain antenna (BA) is provided with extended line;

Described gain antenna (BA) comprises two overlapping gain antennas;

Described gain antenna (BA) is mainly provided in the top of described smart card; And

Described module antenna (MA) offsets from described coupling coil.

10. smart card according to claim 1, this smart card also comprises at least one in following features:

Ferrite component (FE) between the contact pad (CP) being laid in described module antenna (MA) and described Anneta module (AM);

Be added into the condenser type short-term of described module antenna (MA);

Described module antenna (MA) comprises two coils be separated;

Described module antenna (MA) comprises two windings connected according to accurate dipole arrangement.

11. smart cards according to claim 1, this smart card also comprises:

Be arranged in the perforation of the described contact pad (CP) of described Anneta module (AM).

12. 1 kinds by the panel (202 because of the smart card that metallizes, 302) the minimized method of the coupling attenuation caused, this metallization smart card has the gain antenna (BA) with coupling coil (CC) in its card (CB), the method comprise following in one or more:

The window (220) being greater than described Anneta module (AM) is offered in described panel;

Perforation by this panel is provided;

Ferrite Material is provided between described panel and described gain antenna (BA); And

Compensation circuit (CL) is laid in the below of described gain antenna (BA).

13. methods according to claim 12, the method also comprises:

Described Anneta module (AM) is offset relative to described coupling coil (CC).

14. methods according to claim 12, the method also comprise following in one or more:

Described gain antenna (BA) is arranged the dipole that is as the criterion;

Condenser type short-term is provided to described module antenna (MA); And

Between described module antenna (MA) and described contact pad (CP), ferrite is provided in described Anneta module (AM).

15. methods according to claim 12, the method also comprises:

Cutting or punching are carried out to the contact pad (CP) of described Anneta module (AM).