KR102039900B1 - A metal card and manufacturing method of it - Google Patents

Abstract

The present invention relates to a metal card and a method for manufacturing the same. The metal card includes an insulating layer which includes a metal layer of SUS material heat-treated to improve strength and resilience, a processing layer of PVC plastic material inserted into a processing layer insertion space formed by performing a computerized numerical control (CNC) machining process on one side of the metal layer, and a ferromagnetic insulator attached to the lower surface of the metal layer; and an inlay layer which includes an antenna coil attached to the lower surface of the insulating layer. The insulating layer may be configured to be formed with one or more non-uniform pieces by chopping the ferromagnetic insulator. The sensitivity of an antenna can be improved.

Description

Metal card and metal card manufacturing method {A METAL CARD AND MANUFACTURING METHOD OF IT}

The present invention relates to a metal card and a method of manufacturing a metal card, and more particularly, to manufacture a card in which the antenna of the metal card is not interfered with the metal sheet through the processing of the plastic processing layer formed on the metal sheet and the insulating sheet. Method and metal card.

In general, credit cards can be used in place of cash, and recently, smart cards with IC chips that can store a large amount of information have been developed, and are actively used not only for payment but also for various membership cards. In this smart card market, special cards using various materials have been developed. In particular, differentiated metal credit cards have been developed for VIP customers, and metal cards have been provided to special customers by implementing high-quality credit cards that display metallic luster.

However, the conventional metal cards are often difficult to operate the antenna during the contactless communication with the reader due to the nature of the metal, the RF function, the use of ATM is often limited. In addition, it is difficult to form patterns and letters on the surface of the metal card because it is produced by using a thin thin metal sheet or by coating a thin metal powder, there was also a problem that the weight of the metal can not feel if formed with too light material. Accordingly, there is a demand for developing a metal card capable of overcoming the limitations of the metal card and expressing the unique weight and aesthetics of the metal.

The metal thin film plastic card of Korean Patent Utility Model No. 20-0382725, which is a prior art, has a metal thin film 12 having a size smaller than that of the core sheet 13 on the upper and lower surfaces of the core sheet 13 made of synthetic resin. A blank 13a is formed around the upper and lower surfaces of the sheet 13, and the blank 13a discloses a card in which the antenna coil 21 is provided along the circumference. However, this prior art is to place the metal in the central portion of the card in order to avoid contact between the antenna and the metal, there is a limit that the overall aesthetic is inferior and it is difficult to express the metal texture throughout the card.

The present invention is an invention designed to solve the above problems, the present invention solves the existing problem that RF communication is not possible due to the metal layer due to the material properties of the metal card, and to manufacture a metal card that can improve the sensitivity of the antenna It is an object to provide a method and a metal card.

According to one embodiment of the present invention, the metal card is inserted into a processing layer insertion space formed by CNC (Computerized Numerical Control) machining on one side of the metal layer and the metal layer of the SUS material heat-treated to improve strength and resilience And an inlay layer comprising a processing layer of a plastic (PVC) material, an insulating layer including a ferromagnetic insulator attached to the lower surface of the metal layer, and an antenna coil attached to the lower surface of the insulating layer, The ferromagnetic insulators can be broken into small pieces to form one or more non-uniform pieces.

Optionally, the metal card may have a ferromagnetic insulator ferrite, and a plurality of sheets including an insulating layer and an inlay layer may be laminated and laminated on opposite sides of the side into which the processing layer is inserted. The metal layer may further process the opposite side to form a processing layer exposed portion to expose a portion of the processing layer, and the processing layer and the plurality of sheets may be first milled to a predefined area in the processing layer exposed portion. Cutting to expose the antenna coil of the inlay layer through the process to form a COB insertion region, the COB insertion region, the connection between the antenna coil and the back of the COB pad to accommodate the COB pad attached to the metal sheet, In addition, the margin space other than the antenna connection space may be formed to be minimized.

In another embodiment, the method may further include at least one adhesive layer for attaching the insulating sheet, and the adhesive layer may be formed of a hot melt sheet, and may be melted during a high temperature process to enter and adhere between the one or more pieces. Ferromagnetic insulators may also be included in powder form.

In one embodiment, the metal card is a primer layer applied on the COB attached metal layer, a print layer for printing card information on the primer-coated metal sheet, and a coating layer for coating the metal sheet printed card information It may further include.

In another embodiment, a metal card manufacturing method including a metal layer, a processing layer, an insulating layer inlay layer, comprising: forming a processed metal layer by inserting a processing layer of a plastic material on one side of the metal layer, including a ferromagnetic insulator Attaching an insulating layer to the lower surface of the metal layer, and attaching an inlay layer including an antenna coil to the lower surface of the insulating layer, wherein the metal sheet, the insulating sheet, and the inlay sheet use one or more adhesive layers. The ferromagnetic insulator may be finely divided into one or more non-uniform pieces.

The present invention effectively connects the antenna and the chip by using the plastic working layer of the metal sheet, thereby increasing the operation efficiency of the chip. According to the present invention, the COB and the antenna coil may be directly contacted while the antenna coil is not in contact with the metal sheet, thereby manufacturing a metal card having improved contactless communication function while preserving the specificity of the metal material. That is, the COB and the antenna can be directly connected to the front surface of the card while using a metal material, unlike the existing metal card, the wireless communication sensitivity is improved and the interference between the metal material and the antenna is not caused.

According to the present invention, the ferrite material, which is a ferromagnetic insulating material, can be implemented in various forms so that the insulating properties and adhesion can be enhanced, thereby achieving efficient adhesion with other sheets and minimizing interference between the antenna and the metal material. RF communication strength can be maximized.

In the card manufacturing method according to the present invention, a plurality of metal cards may be manufactured at one time through a single sheet process by stacking sheets of a large area capable of producing a plurality of cards and cutting them into individual card units.

According to the method for manufacturing a card according to the present invention, in the process of cutting an individual card outline along a surface of a laminated sheet in which a large area sheet including a metal sheet is laminated, it is possible to stably cut the outline by spraying cooling gas at the same time. .

According to the card manufacturing method according to the present invention, in order to prevent the distortion of the sheets generated in the process of cutting the large area sheet by creating a hole in the sheet to fix the individual card while maintaining the alignment of the large area sheet Can be cut

According to the method for manufacturing a card according to the present invention, an insulating layer capable of efficiently controlling magnetic interference generated between a metal layer constituting a metal card and an antenna coil for performing contactless communication can be implemented in a stable sheet form. . Accordingly, according to the manufacturing method according to the present invention, it is possible to manufacture a large amount of metal cards with improved operation performance.

1 is a perspective view of a metal card according to an embodiment of the present invention.
2 is a perspective view of a metal card according to another embodiment of the present invention.
3 is a perspective view of a metal card according to another embodiment of the present invention.
4 is a cross-sectional view illustrating a method of manufacturing a metal card according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view for describing a method of manufacturing a metal card, according to an embodiment of the present invention, as a subsequent process of FIG. 4.
6 is a cross-sectional view for describing a method of manufacturing a metal card, according to another embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a metal card according to an embodiment of the present invention.
8 is a perspective view of a metal card according to another embodiment of the present invention.
9 is a view showing the arrangement of individual metal cards in a large area sheet for manufacturing a metal card according to the present invention.
10 is a view showing an embodiment of a hole formed in the sheet constituting the metal card.
11 is a flowchart illustrating a metal card manufacturing method according to the present invention.
12 is a view showing a cutting process of a metal card sheet in the metal card manufacturing method according to an embodiment of the present invention.
13 and 14 are cross-sectional views of the metal card sheet along the line AA ′ of FIG. 13, FIG. 13 is a cross-sectional view of the metal card sheet before cutting after laminating is completed, and FIG. 14 is a metal card sheet after the cutting process. It is a cross section of.
15A to 15C are cross-sectional views illustrating a metal card equipped with a COB by connecting an inlay layer and a COB in an individual metal card process.
Like reference symbols in the various drawings indicate like elements.

Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, it includes not only "directly connected" but also "indirectly connected" with another member in between. . In addition, when a part is said to "include" a certain component, this means that it may further include other components, without excluding the other components unless otherwise stated.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a metal card 100 according to an embodiment of the present invention. The metal card 100 may include one or more sheets or layers (layers). In one embodiment, the metal card 100 includes a metal layer 110, a plastic processing layer 120, an insulating layer 150, at least one adhesive layer 140, 160, an inlay layer 170, and a printing layer 180. ) May be included. In the drawings, only the above-described components are described, but the present invention is not limited thereto, and other components such as a coating layer and a COB for implementing a metal card may be further added, and a display unit and a biosensor unit may be added for additional functions. And the like may further be included.

In addition, the metal card 100 of the present invention can be manufactured to meet the standard size and thickness according to a predefined standard, the size and thickness of each sheet is determined to the optimum thickness suitable for the operation and wireless communication sensitivity of the metal card It can be implemented to be combined. Furthermore, the sheets constituting the metal card 100 of the present invention may be composed of a large sheet of a size including a plurality of cards to enable mass production, not a sheet for making one card.

The metal layer 110 is a core sheet expressing a material and weight unique to the metal card according to the present invention, and may be formed of SUS (steel use stainless, stainless steel) material. The metal material constituting the metal layer 110 may be selected in consideration of material and weight for expressing the characteristics of the metal, as well as durability, abrasion, and degree of modification to withstand the processing process. In one embodiment, the metal layer 110 made of SUS may be a material resistant to corrosion and capable of heat treatment. The heat treatment refers to an operation step of heating the metal to a certain temperature to improve the properties or metal structure for a certain purpose depending on the cooling rate. The metal layer 110 may have irregularities on part or all of the surface for adhesion. In addition, when the metal layer 110 is manufactured, the metal layer 110 may be processed through a heat treatment process to improve strength and resilience.

In one embodiment, the metal layer 110 of the present invention may be composed of a large sheet including a plurality of cards, and subjected to a laminate process of laminating a plurality of sheets to form a single sheet by applying heat and pressure. After cutting, it can be produced with several cards. The cutting operation of the metal sheet (110s of FIG. 13) including the plurality of cards may use a special processing material, a coolant, and a cutting tool according to metal material characteristics.

The processing layer 120 is a sheet piece made of plastic (PVC), and may be disposed in the processing layer insertion space of the metal layer 110. The processing layer 120 may be used as an apparatus for attaching the antenna of the inlay layer 170 to the COB while being spaced apart from the metal layer 110 due to the characteristics of the metal card 100. By arranging and processing the processing layer 120 of the plastic material on a part of the metal layer 110, direct contact between the metal layer 110 and the antenna may be avoided, and the COB and the antenna may be efficiently connected.

Existing metal cards have been employed to place the antenna in a plastic layer and indirectly communicate with the COB in the metal layer to avoid the antenna contacting the metal layer 110. Another existing metal card has been implemented by cutting a portion of the metal layer to arrange and operate the antenna wire. However, these conventional metal card implementations have a limitation in reducing antenna sensitivity and damaging the aesthetics of the metal card.

The present invention overcomes these problems, the plastic processing layer 120 is disposed in the processing layer insertion space of the metal layer 110, the antenna and COB is spaced apart from the metal layer through the plastic processing layer 120 Implemented to be in direct contact. When the antenna and the COB are directly connected, the wireless connection between the antenna and the chip (COB) in the card enables the entire surface of the card to be made of metal while improving the sensitivity of the antenna. The metal card can be improved to improve the communication function. In addition, unlike the wireless connection method, it is possible to install the COB without configuring a separate free space for wireless communication, thereby improving the durability and stability of the card.

The insulating layer 150 blocks the interference with the metal layer 110 so that the antenna of the inlay layer 170 can be operated. In order to operate the NFC antenna, communication with the opposite antenna reader is required. In this case, a magnetic field is generated in the antenna coil, and the antenna is attached to the back of the metal card, so it is often close to the metal material. In this case, the metal material of the metal sheet changes the self-resonant frequency (SRF) of the antenna coil to worsen the loss, lower the inductance of the antenna coil, and eventually cause communication failure. The cause of this phenomenon is the eddy current (eddy current) that occurs in the metal due to the magnetic field. To eliminate this eddy current, high permeability and high resistive materials must be placed between the metal and the antenna so that the magnetic field lines can be adjusted. The insulating layer 150 is used for this purpose, also referred to as a ferrite sheet. Ferrite can be used to powder iron, oxidize the outer surface to insulate it, and apply pressure to shape it.

The insulating layer 150 and the metal layer 110 may be bonded using the adhesive layers 140 and 160. In one embodiment of the present invention, the adhesive layers 140 and 160 may be hot melt sheets. In this drawing, although the adhesive layers 140 and 160 are illustrated for one card, as shown in FIG. 13, the adhesive layers 140 and 160 may be implemented as a large area adhesive sheets (! 40s and 160s) including a plurality of cards during manufacture. . The hot melt is melted by heating, and a material such as a thermoplastic resin is characterized by being solidified by cooling after melting and heating. Such a material can be used as a film-type hot melt adhesive. In one embodiment, the adhesive layer 140, 160 of the hot melt is an adhesive sheet considering the adhesive strength of the metal layer 110 and the insulating layer 150 of the metal material, unlike the adhesive used for the plastic sheet, Hot melt sheets can be implemented with suitable materials.

Inlay layer 170 is a sheet comprising a radio frequency (RF) antenna coil, the antenna coil included in inlay layer 170 is turned of the coil to exhibit optimized sensitivity through RF communication (eg, NFC) sensitivity test. The number of (Turn) is determined. In addition, the antenna coil of the present invention may be implemented to be directly connected to the chip-on-board (COB) attached to the metal layer 110 through the processing layer 120.

The print layer 180 is a sheet for printing and displaying information on the card, and may be attached to the back of the card. The components 110 to 190 described above attach the processing layer 120 through primary processing of the metal layer 110 (eg, CNC processing to form a processing layer insertion space), and then the entire sheet 110. , 140, 150, 160, 170, 190 may be laminated to be laminated, and then processed to form one card body through a laminate.

2 is a perspective view of a metal card according to another embodiment of the present invention. The metal card 200 according to the present embodiment may include one or more sheets or layers (layers). In addition, as described with reference to FIG. 1, the metal card 200 may include a metal layer 110, a plastic processing layer 120, an insulating layer 150, one or more adhesive layers 140 and 160, an inlay layer 170, and printing. It may include layer 180. The present invention is not limited thereto, and may further include components such as a display unit and a biosensor for implementing a metal card.

In an embodiment, the insulating layer 150 of the metal card 200 may be used in the form of one or more pieces. For example, the insulating layer 150 may be broken to form a non-uniform piece, or may be made of several pieces. As such, when the insulating layer 150 is used in pieces, the hot melt melts when attached to the hot melt and flows into the gaps between the pieces, thereby improving adhesion to the adhesive sheet.

3 is a perspective view of a metal card according to another embodiment of the present invention. The metal card 300 according to the present exemplary embodiment may further include a ferrite 130 in powder form in addition to the insulating layer 150.

Ferrite 130 is a ferromagnetic insulator, when implemented in a powder form not only increases the adhesion but also constitutes an additional insulating layer in addition to the insulating layer 150 may further improve the insulating function between the metal layer 110 and another sheet. . As an embodiment, in the drawings, an embodiment in which ferrite is implemented in a powder form is illustrated, but is not limited thereto. The ferrite may be manufactured in a net form or an amorphous powder form 130. Since the ferrite 130 is a ferromagnetic insulating material, as the ferrite 130 is added, the insulating property of the lower portion of the metal sheet is enhanced, thereby ensuring normal antenna operation in the metal card.

Hereinafter, referring to FIGS. 4 to 6, the processing method of the metal layer 110 and the processing layer 120 according to an embodiment of the present invention will be described in more detail.

4 and 5 are cross-sectional views illustrating a method of manufacturing a metal card according to an embodiment of the present invention. 4 is a diagram illustrating a method of attaching the processing layer 120 by processing the metal layer 110. First, referring to FIG. 4A, a space 210 (eg, a space L1 and a space D1) may be formed in the metal layer 110 such that the processing layer 120 is inserted into the metal layer 110. In one embodiment, the processing layer insertion space 210 may be formed through Computerized Numerical Control (CNC) machining.

Next, as shown in FIG. 4B, the processed layer 120 made of plastic (PVC) is inserted into the processed layer insertion space 210 of the metal layer 110. At this time, the processing layer 120 may be inserted and disposed without a separate adhesive. Thereafter, the metal layer 110 opposite to the processed layer 120 may be processed to form a processed layer exposed portion 230 through which the PVC is exposed. In this case, the width L2 of the exposed layer 230 must be smaller than the width L1 of the insertion space 210. This is to prevent the processing layer 120 from falling off (separation) when the metal layer 110 is reversed later.

FIG. 5 is a view for explaining secondary processing of the processing layer 120 after laminating with other sheets 140 to 170 after the process of inserting the processing layer 120 into the metal layer 110. In one embodiment, the metal layer 110, after processing to be mounted to the processing layer 120 of PVC, the metal layer 110, the adhesive sheet 140, the insulating layer 150, the adhesive sheet 160, The inlay layer 170 may be laminated. Although not shown in the drawings, the print sheet, the magnetic strip (MS), the overlay sheet, etc. may be further laminated and laminated on the back of the inlay sheet.

The card body may be implemented as one plate through a laminating process by heat and pressure and may be represented as shown in FIG. The metal layer 110 displayed on the uppermost layer may be embodied in a form having an exposed portion 230 having a processed layer of L2 width. In this state, secondary CNC machining can be performed. As shown in (a) of FIG. 5, a process of cutting the sheet 310 to the inlay layer 170 in the width L3 may be performed. At this time, the sheets may be cut to the same width L3, and finely cut until the antenna coil of the inlay layer 170 is visible. When the antenna coil of the inlay layer 170 is visible, the antenna coil 320 is pulled up as shown in FIG. 5 (b). At this time, both side portions of the processing layer 120 are exposed to the cutting space 310, so that the antenna coil itself is only exposed to the side portions of the adhesive layers 140 and 160, the insulating layer 150, and the processing layer 120. , The metal layer 110 does not directly contact. According to this processing process, it is possible to implement so that the antenna coil is not in contact with the metal material during processing.

Next, as illustrated in FIG. 5B, the processed layer exposed portion may be cut once more (330). This is to secure a space for accommodating the COB rear portion, and to smooth the front portion of the card, and to cut the inlay layer 170 to L4 width so that the COB rear protrusion is inserted. At this time, the length of L4 is smaller than L3. Upon completion of the secondary milling for COB insertion, the inlay sheet has a receiving groove 340 for COB insertion as shown in FIG. When this processing is completed, the contact point of the antenna coil and COB pad pulled up in the upward direction can be contacted by spot welding, and the COB pad may be mounted on the metal layer 110. When the COB 350 is mounted on the metal layer 110, the protrusion of the rear surface of the COB may be accommodated by the accommodation groove 340. At this time, the COB 350 may be fixed by applying an adhesive to a region where the rear surface of the COB 350 and the processing layer 120 meet.

In one embodiment, the COB inserting process may be performed after the printing and coating process of the front surface of the card is completed. In this figure, although the receiving groove 340 has a rectangular shape, but is not limited to this, and corresponds to the shape of the rear projection of the COB, accommodated through the milling process so as to minimize the space of the margin outside the space required for the antenna connection The groove 340 may be manufactured. In an embodiment, the antenna coil 320 connected to the rear surface of the COB 350 may be spaced apart from each other at a predetermined distance so as not to directly contact the stacked processing layer 120, the insulating layer 150, and the adhesive layers 140 and 160. It can be implemented to be placed in a state.

6 is a view for explaining a COB insertion process according to another embodiment of the present invention. In the embodiment of FIG. 5, the case in which the accommodation groove 340 is manufactured to correspond to the protrusion of the rear surface of the COB has been described. However, the COB 350 may be inserted by connecting an antenna without a milling process for a separate accommodation groove 340. have. In this figure, each sheet is shown to be thicker than the actual layer to describe each sheet, but the actual sheets are very thin, and the rear protrusion of the COB 350 may be implemented to 1 mm or less. As such, when the production of the accommodation groove 340 is unnecessary, the process of manufacturing the COB accommodation groove may be omitted, and the COB 350 may be mounted after connecting the antenna coil 320 and the rear contact of the COB 350.

5 and 6 described an embodiment for generating a COB insertion region by a milling process, but is not limited thereto, and the acid resistant anticorrosive is applied to a portion except for the position where the COB 350 is to be attached, and the metal layer ( It is also possible to use a method of attaching the COB 350 to the hole after the hole 110 is immersed in the diluted acid and corroded by an etching method to drill a hole of the COB pad size. In detail, an acid resistant anticorrosive may be applied to the metal layer 110 made of SUS, but an acid resistant anticorrosive may be applied to a portion except for the position where the COB pad is inserted. Here, the acid resistant anticorrosive agent may use an "etching ground" mixed with beeswax, bitumen, rosin and the like. The metal layer 110 coated with an acid resistant anticorrosive may be immersed in a tank containing diluted acid and corroded by an etching method to form a COB-sized insertion space. At this time, when the generated space is corroded in the process of fine unevenness is characterized in that a very solid attachment can be made when the COB pad is attached to the space. Such an etching method may be applied to forming a COB pad insertion space or generating a processed layer exposed portion.

7 is a flowchart illustrating a method of manufacturing a metal card according to an embodiment of the present invention. In the embodiment described with reference to the drawings, a process of forming the processing layer 120 on the metal layer 110 and mounting the COB to the metal sheet will be described mainly in the method of manufacturing the metal card. As described above, in the present embodiment, the stacking structure of the individual cards is mainly described, but as illustrated in FIGS. 13 and 14, the metal sheet, the adhesive sheet, the insulating sheet, the inlay sheet, and the like are implemented in the form of a sheet having a large area. Can be laminated.

First, the metal layer 110 is subjected to a heat treatment process according to the characteristics of the stainless steel (SUS). When the heat treatment of the metal layer 110, the tension (tension) is improved, the strength is increased, it is efficient for card processing. In the case of using SUS as the metal layer 110, there are some irregularities on the surface of the raw material itself, and the adhesiveness is excellent. On the other hand, in the case of using a material such as aluminum, in order to improve adhesion, an aluminum plate may be polished with aluminum oxide or roughly treated by a sand blast method to form an oxide treatment layer.

In one embodiment, a process of coloring the metal layer 110 may be performed. For example, when the raw material color (silver color) of the metal layer 110 is used as it is, the color processing step can be omitted. However, when the metal layer 110 is colored, a deposition technique may be used in which particles adhere to each other using a magnetic field. That is, the particles expressing the color on the surface of the metal sheet may be treated to form a thin layered deposition layer to color the metal sheet.

In another embodiment, when the pattern is inscribed on the metal layer, the pattern may be engraved by digital printing using UV ink. After performing a printing process to inscribe a pattern with UV ink on the metal layer, the process of blowing UV rays can be treated. As such, the front color of the metal card of the present invention uses a vapor deposition technique, but a specific pattern, letters, and numbers are printed using UV ink. The reason is that when the entire area is treated with UV ink, the strength of the metal card decreases. This is because the UV ink treatment process is done individually for each card, making it unsuitable for mass production.

As another embodiment, in order to form a three-dimensional pattern on the metal layer, during UV ink printing, the transparent UV ink may be thickened to form a three-dimensional pattern. That is, by forming the transparent UV ink thick and processing to protrude with a predetermined thickness, it is possible to create a three-dimensional feeling. As another example, it may be implemented to form a three-dimensional pattern using ink of a specific color rather than transparent UV ink.

When the processing of the metal sheet itself is completed, the processing layer insertion space 210 may be formed on one surface (eg, the rear surface) of the metal layer 110 (S710). The processing layer insertion space 210 is for inserting the processing layer 120 of the PVC material, also referred to as PVC insertion space. In one embodiment, the depth of the processing layer insertion space 210 may be 1/2 of the total metal sheet thickness. That is, the depth D1 of the insertion space 210 may be 1/2 of the metal sheet thickness D. Insertion space 210 may be formed in a square of length L1, L1 is larger than the length of one side of the COB. When the formation of the insertion space 210 is completed, the processing layer 120 may be inserted into the insertion space 210.

Next, the processed layer exposed part (230 of FIG. 4) may be generated to expose the inserted PVC by cutting the other surface (eg, the front part) of the metal layer 110 (S720). In this case, the area to be cut may be cut into a square shape having a length L2 smaller than the width of the processing layer insertion space 210 (eg, a square shape having a length of one surface L1) (L2 <L1). This is to ensure that the inserted processing layer 120 is fixed without falling. As described above, after the processing layer 120 is attached to the metal layer 110, the lamination process may be performed by laminating with other sheets and applying heat and pressure. After the lamination process, the metal layer 110, the processing layer 120, the adhesive layers 140 and 160, the insulating layer 150, the inlay layer 170, and the printing layer 180 all combine to form one card body. It may be implemented in one form (see Fig. 5 (a)).

The lamination process according to the present invention can be processed at low temperature and low pressure compared to plastic, and the processing time can be shorter than that of a card made of plastic material. In one embodiment, the heat treatment conditions such as the lamination process time, temperature, pressure, etc. may be determined in consideration of the adhesive force, the thickness of the metal sheet, the degree of deformation of the processed layer. For example, when the thickness of the metal sheet is thick, the lamination temperature can be further increased. In addition, the processed layer of PVC is more likely to shrink or relax than the metal sheet, so that the laminate time and temperature can be determined in consideration of the degree of deformation (shrinkage or relaxation) of the PVC during the lamination process.

The laminated sheets may extract the antenna coil 320 of the inlay layer 170 through a first milling process (S730 and S740). As described with reference to FIG. 5A, in the other sheets laminated with the metal sheet on which the processing layer 120 is mounted, the milling process may be performed with the processing layer exposed in an upward direction. . That is, while the metal layer 110 is at the top and the PVC is exposed through the opening of the region having the L2 length, the sheets may be cut to the inlay sheet through milling. At this time, the region to be cut may be cut into a rectangular shape (or a circle) having a length L3 of less than L2 (L3 <L2). By cutting to have a length shorter than that of L2, the metal layer 110 may be spaced apart from the COB insertion region 310 by primary milling. As a predetermined distance is formed between the metal layer 110 and the COB insertion region 310, it may be implemented not to contact the metal card even after the antenna coil 320 is pulled out.

Next, as described with reference to FIG. 5, the second milling process of cutting the COB insertion region 310 once more to form the receiving groove 340 may be performed to insert the COB (S750). This embodiment describes the secondary milling process described with reference to FIG. 5, but as described with reference to FIG. 6, when COB insertion is possible without an additional milling process, step S750 may be omitted.

In one embodiment, the secondary milling process may be carried out before the primer application-printing-coating process of the card front side, and in another embodiment, may be implemented after the primer application-printing-coating process to insert COB. Here, the COB is assembled into a smart card semiconductor attached to the information transmission and short-range wireless communication package. Secondary milling creates a space for accommodating the protruding area on the rear surface of the COB, and cuts a portion of the opening of the inlay layer 170 into a space of L4 length and D4 depth (for example, a square shape having a length of L4 on one side). (See (c) 340 of FIG. 5). In this figure, an embodiment of performing secondary milling in a square shape has been described, but embodiments are not limited thereto, and secondary milling may be performed in a shape corresponding to the shape of the COB rear protrusion. That is, the second milling can be carried out to accommodate the COB rear projections and to minimize the empty space. In this case, a space for connecting the rear side of the COB and the antenna may be designed separately. There is at least one contact point (contact part) connected to the antenna at the rear side of the COB, and the antenna coil 320 pulled out through the COB insertion region 310 may be directly connected to the contact point at the rear side of the antenna.

As an example, as shown in FIGS. 5 (b) and 6 (b), two antenna coils 320 lifted in the upward direction may be connected to the contacts on the rear surface of the COB pad, respectively. May be inserted into the COB insertion region of the metal layer 110. In this case, an adhesive material or an adhesive sheet may be added to the rear surface of the COB pad, and may be implemented to be fixed to the COB insertion region of the metal layer 110.

Through this process, the antenna coil is directly connected to the COB in a state in which the antenna coil is not in direct contact with the metal sheet, thereby manufacturing a metal card having improved contactless communication function without interference or distortion while preserving the specificity of the metal material. have. That is, the COB and the antenna can be directly used while using the metal material on the front surface of the card, unlike the existing metal card, the wireless communication sensitivity is improved and the interference between the metal material and the antenna is not caused.

8 is a perspective view of a metal card according to another embodiment of the present invention. The metal card 500 according to the present embodiment adds a primer 530, a 3D printing 520, and a coating 510 process to the metal card body processed through the processing layer 120. In addition, although not shown in the drawings, the C-Cut process of trimming the edge of the card, a stamping process of attaching a sign panel (Sign Penal) and the hologram, etc. in the card rear portion may be further performed.

As described above, the metal card 500 may include one or more sheets or layers (layers). In an embodiment, the metal card 500 may include a metal layer 110, a plastic processing layer 120, an insulating layer 150, one or more adhesive layers 140 and 160, an inlay layer 170, and a printing layer 180. ) And a magnetic strip overlay layer (MS O / L (Magnetic stripe Overlay), 550). In the drawing, only the above-described components are described, but the present invention is not limited thereto, and other components such as a COB, a biometric sensor, and a display unit for implementing a metal card may be further added. In addition, the metal card 500 of the present invention can be manufactured according to the standard size and thickness according to a predefined standard, the size and thickness of each sheet is determined to the optimum thickness suitable for the operation and wireless communication sensitivity of the metal card It can be implemented to be combined.

Furthermore, the sheets constituting the metal card 100 of the present invention are not sheets for making one card, but may be composed of large sheets of a size including a plurality of cards to enable mass production, and a laminate process. After cutting, it can be produced with several cards. The cutting operation of the metal layer 110 may be a special processing material, a coolant, a cutting tool according to the characteristics of the metal material. This mass production process will be described in detail with reference to FIGS. 9 to 15.

Referring to the metal card 500 of FIG. 8, the metal layer 110 is a core sheet expressing a material and weight peculiar to the metal card according to the present invention, and may be implemented by SUS (steel use stainless, stainless steel) material. have. The metal material constituting the metal layer 110 may be selected in consideration of material and weight for expressing the properties of the metal, as well as durability, abrasion, and degree of modification to withstand the processing process. As described with reference to FIG. 7, the metal layer 110 may be heat treated to improve resilience and strength, and may perform a color deposition process, a UV ink digital printing process, and the like.

The processing layer 120 is a sheet piece made of plastic (PVC) having a predetermined thickness and size, and may be disposed in the processing layer insertion space (210 of FIG. 4) of the metal layer 110. The processing layer 120 is a device for attaching the antenna of the inlay sheet to the COB while being spaced apart from the metal layer 110 due to the characteristics of the metal card 100. By arranging and processing the processing layer 120 of the plastic material on a part of the predefined metal layer 110, direct contact between the metal layer 110 and the antenna may be avoided, and the COB and the antenna may be efficiently connected.

The insulating layer 150 blocks the interference with the metal layer 110 so that the antenna of the inlay layer 170 can be operated. In order to eliminate the vortex, a high permeability and a high resistance material must be placed between the metal and the antenna so that the magnetic field lines can be adjusted, so that a ferrite sheet can be used as the insulating layer 150. The insulating layer 150 and the metal layer 110 may be bonded using the adhesive layers 140 and 160. In one embodiment of the present invention, the adhesive layers 140 and 160 may be hot melt sheets. The hot melt is melted by heating, and a material such as a thermoplastic resin is characterized by being solidified by cooling after melting and heating. Such a material can be used as a film-type hot melt adhesive.

Inlay layer 170 is a sheet comprising a radio frequency (RF) antenna coil, the antenna coil included in inlay layer 170 is turned of the coil to exhibit optimized sensitivity through RF communication (eg, NFC) sensitivity test. The number of (Turn) is determined. In addition, the antenna coil of the present invention may be implemented to be directly connected to the chip-on-board (COB) attached to the metal layer 110 through the processing layer 120.

The print layer 180 is a sheet for printing and displaying an image such as information, a pattern, or a pattern of the card, and may be attached to the back of the card. The magnetic stripe overlay (MS O / L) sheet 550 is a sheet including a magnetic strip.

According to a predefined method, each sheet can be laminated, laminated with heat and pressure and processed into a card body. Later, a large sheet of one integrated sheet can be cut with a CNC cutting tool and separated into a single card.

Next, the cards separated into single cards may each go through a primer application process, 3D printing, and coating process. In one embodiment, the laminated integrated sheet may be separated into one card through CNC cutting and the primer may be applied to the separated card. At this time, the primer may be a material to help improve the retention of the printed information according to the metal material. For example, the primer application process may proceed for 30 minutes at a temperature of 80 degrees.

Next, on the metal sheet coated with a primer, card information, a pattern, a picture image, etc. to be engraved on the metal sheet may be engraved on the metal sheet through digital 3D printing. Then, the coating process may be performed, and the coating process 510 may be performed on the top surface, and the information engraved through 3D printing may be implemented so as not to be worn or erased. For example, the coating process may proceed for 30 minutes at a temperature of 80 degrees.

As mentioned above, the process of performing secondary milling to insert COB pads may be carried out before primer application, printing and coating, and before COB insertion after coating layer creation to prevent contamination by primer or coating material. Secondary milling may also be performed.

In the metal card according to the present embodiment, the entire surface of the card is formed of a metal material through a primer 530, 3D printing 520, and a coating 510 on the metal layer 110, thereby providing an elegant aesthetic of the metal card. While expressing, card information can be expressed. In addition, the plastic processing layer 120 is disposed to be inserted into the metal layer 110, and the antenna is directly connected to the COB without contacting the metal sheet through the plastic processing layer 120. By the manufacturing method, the entire surface of the card may be made of a metal material while improving the sensitivity of the antenna, thereby achieving a metal card capable of maintaining the luxurious aesthetics of the metal card and improving wireless communication functions.

9 is a view showing the arrangement of individual metal cards in a large area sheet for manufacturing a metal card according to the present invention. 9 shows the arrangement of cards along individual card outlines which are cut after each sheet is laminated to produce individual metal cards. The individual card outline may not be displayed on the sheet used in the actual manufacturing process, and the individual card outline cut by the CNC process may be designated by the controller of the card manufacturing apparatus. In the present invention, each sheet may have substantially the same width and height.

Sheet for manufacturing a metal card according to the present invention may have a rectangular shape consisting of the longitudinal edge (E1) and the height direction edge (E2). The longitudinal edge E1 may have a size equal to the sheet width Ws, and the height edge E2 may have a size of the sheet height Hs. In the sheet, a plurality of individual cards may be arranged while having a card unit width Wu and a card unit height Hu.

For example, the sheet width Ws may be 400 mm, the sheet height Hs may be 300 mm, the card unit width Wu may be 99 mm, and the card unit height Hu may be 67,4 mm. These widths and heights may be determined based on the size of the metal card 100 and the extra space required in the process of cutting each individual card using a cutting tool.

In the present invention, since a plurality of sheets as shown in Fig. 1 are laminated and then laminated and cut to manufacture a metal card, it is necessary to align and fix the plurality of sheets. As a result, a hole may be formed in each sheet. As the holes formed in the sheet are fixed to the pins, the plurality of sheets may be aligned and fixed.

10 is a view showing an embodiment of a hole formed in the sheet constituting the metal card.

The holes H may be formed to be adjacent to each other by a predetermined distance from at least one edge of the individual sheet, and in some embodiments, the holes H may be adjacent to each other by a predetermined distance from two or more edges of the sheet. Can be formed. In FIG. 10, four holes H are formed at vertices adjacent to the longitudinal edge E1 and the height edge E2 of the rectangular sheet. The hole H may be formed at a position spaced apart from the height direction edge E2 of each sheet by a fixed width Wf and from the lengthwise edge E1 by a fixed height Hf. In some embodiments, the fixed width Wf and the fixed height Hf may be substantially the same.

In addition, the hole H may be formed to a size of a predetermined radius (R). The predetermined radius R of the hole may be determined based on the radius of the pin PIN for fixing the hole H, the material properties of each sheet, the size of the sheet, and the like. For example, the radius R of the hole H may be 3 mm.

In another embodiment, the inner hole IH may be further formed at a position adjacent from the edge in the width direction or the length direction of the sheet so as to be spaced apart from the one edge by a predetermined distance as described above.

In addition to the hole H formed at the vertex of the sheet, when the inner hole IH is further formed and fixed along the width direction or the length direction adjacent to the edge of the sheet, it is possible to prevent the plurality of sheets from twisting in the middle. . In particular, as the number of individual cards manufactured through one sheet is increased, that is, as the sheet is enlarged, more holes can be formed. By forming the hole and fixing the sheet through the formed hole, each layer constituting the metal card can be more precisely aligned, and as a result, the thickness outer surface of the metal card formed through cutting, that is, the cutting surface is uniformly formed. Can be.

For example, as illustrated in FIG. 10, at least one inner hole IH is further added to a position adjacent to the longitudinal edge L at the center of the longitudinal edge E1 and spaced apart by a predetermined interval. Can be formed.

As described above, in manufacturing the metal card, after preparing each layer in the form of a large area sheet, the plurality of sheets are bonded to form a single sheet, and then the large area sheet is cut into individual card sizes. Manufacture a card. However, in the case of the insulating layer 150, it is not easy to prepare as the insulating sheet 150s, and even if the insulating layer 150 is bent a little, there is a problem in that all of the constituent materials are broken. Therefore, even if the insulating layer 150 including the ferrite has good magnetic control characteristics, it is difficult to apply to a large area sheet process.

The present invention proposes a metal card manufacturing method including an insulating sheet manufacturing method that is resistant to external impact and easy to form in order to apply an insulating sheet containing ferrite to a large area sheet process.

11 is a flowchart illustrating a metal card manufacturing method according to the present invention.

The metal sheet 110s made of a metal material is processed (step S411). The processing of the metal sheet 110s may include forming a space in which the processing layer 120 is to be inserted into the metal sheet 110s and inserting the processing layer 120 into the metal sheet 110s. Exposing a portion of the process. According to an embodiment, a process layer insertion space for inserting the process layer 120 into the metal sheet 110s may be formed or exposed through the computerized numerical control (CNC) process. The processing layer 120 has a thickness thinner than that of the metal sheet 110s, and thus the processing layer 120 may be inserted into the metal sheet 110s. Since the processing layer 120 is formed only in a partial region of the metal card 100, it may not be prepared in a sheet form.

In FIGS. 4A to 4C, cross-sectional views of the metal layer 110 for explaining a processing process of the metal layer 110 according to the present invention have been described. In the present invention, a plurality of metal cards 100 may be formed in one metal layer 110, and a plurality of processing layers 120 should be inserted. However, in FIG. 4, one metal card 100 is provided for convenience. It will be described with reference to the metal layer 110 is formed.

Referring to FIG. 4, a space 210 is formed in the metal layer 110 such that the processing layer 120 is inserted. The processing layer insertion space 210 may have a first processing width L1 and a first depth D1. As shown in (b) of FIG. 4, the processing layer 120 is inserted into the processing layer insertion space 210 formed by the CNC process. In some embodiments, the processing layer 120 may be inserted without an adhesive. In some embodiments, the thickness of the processed layer 120 may correspond to half the thickness of the metal layer 110.

Referring to FIG. 4C, the processing layer 120 is exposed by processing a surface facing the surface on which the processing layer 120 is exposed in the metal layer 110 into which the processing layer 120 is inserted. The exposed portion 230 may be formed. The second processing width L2 of the processing layer exposed portion 230 is smaller than the width of the processing layer insertion space 210. Accordingly, when the metal sheet 110s is later laminated with the laminated sheet, it is possible to prevent the processing layer 120 from being separated.

Referring back to FIG. 11, holes are formed in the metal sheet (110s of FIG. 13) in which the processing layer 120 is inserted (step S413). As described with reference to FIG. 10, holes may be formed in the metal sheet 110s at positions spaced apart from the at least one corner by a predetermined distance. According to an embodiment, after the hole is formed in the metal sheet 110s, the processing layer 120 may be inserted.

The insulating sheet 140s may be prepared in parallel with the machining of the metal sheet 110s and the hole formation. As described above, the insulating sheet 150s is manufactured by attaching epoxy to the ferrite instead of only ferrite in the insulating sheet. Such insulating sheets have excellent adhesion, are not easily broken and have excellent handleability.

In addition to the insulating sheet 150s, a plurality of sheets including the inlay sheet 170s may be prepared. According to the exemplary embodiment, the printing sheet 180s and the magnetic sheet 190s may be further prepared (step S415). Each sheet included in the plurality of sheets is prepared of a material suitable for the function and processing process as described above.

The inlay sheet 170s may be printed with a wireless antenna designed for the reception sensitivity required for the metal card and for the individual card size, and the information related to the card may be printed on the printing sheet 180s. In the magnetic stripe sheet 190s, a magnetic stripe in which information related to card payment is magnetically recorded may be cut and matched.

The first adhesive sheet 140s and the second adhesive sheet 160s may be interposed with the insulating sheet 150s interposed therebetween, and a hole may be formed in a state in which the plurality of sheets are stacked, or a hole may be provided for each sheet. After forming the respective layers may be laminated. In manufacturing the metal card according to the present invention, a plurality of sheets positioned under the metal sheet 110s is referred to as a laminated sheet.

Holes may be formed by performing hole drilling for each hole position of the sheet using the hole drilling equipment (step S417). As described with reference to FIG. 10, each laminated sheet may be marked with the position of the hole H or the inner hole IH, and holes may be formed by punching holes using hole drilling equipment.

12 is a view showing a cutting process of a metal card sheet in the metal card manufacturing method according to an embodiment of the present invention.

As shown in FIG. 12, the hole H formed in the laminated sheet may be inserted into the loading plate 1400 on which the pin PIN is formed. In the same order as described with reference to FIG. 1, the laminated sheet prepared in step S417 is loaded onto the stacking plate, and the metal sheet 110s prepared in step S413, specifically, the processed layer 120, is placed on top of the laminated sheet. The inserted metal sheet 110s having the processed layer exposed portion 230 may be loaded (step S420).

The metal sheets 110s and the stacked sheets aligned and stacked through the pins are laminated by heating and pressing them (step S430). Specifically, the laminating process may be performed by applying a pressure of 20 kg / cm ² to the laminated sheet and the metal sheet at a temperature of 150 ° C. for about 10 minutes and cooling the same while maintaining the same pressure. As described above, the laminating process of the metal sheet can be laminated at a low temperature and low pressure as compared to the plastic card. In addition, the laminating treatment time can be shorter than that of plastic cards. In one embodiment, the laminating process time and process conditions such as temperature, pressure, etc. may be determined in consideration of the adhesive force, the thickness of the metal sheet, the degree of PVC shrinkage, and the like. For example, when the thickness of the metal sheet is thick, the lamination temperature can be further increased. In addition, PVC is more likely to shrink or relax than metal sheets, so that the laminate time and temperature can be determined in consideration of the degree of deformation (shrinkage or relaxation) of the PVC during the lamination process.

A plurality of sheets are bonded to each other through a laminating process, and in particular, as the first adhesive sheet 140s and the second adhesive sheet 160s are melted and cooled, the plurality of sheets may be strongly bonded, and further, the insulating sheet As the epoxy is included in the 150s, the adhesion with the adjacent adhesive sheets 140s and 160s may be improved.

In the present specification, the lamination is completed and the sheet formed of one physical sheet is referred to as a metal card sheet 100s. In the present invention, individual card unit cutting is performed in a state where the hole of the metal card sheet 100s is fixed to the mounting plate 1400 pin PIN (step S440). According to an embodiment, the loading plate for laminating and the loading plate for cutting may be different. That is, after laminating, the metal card sheet 100s may be moved to another loading plate to perform a cutting process. However, the configuration of the two mounting plate may be the same in that it is fixed through the pin (PIN).

As shown in FIG. 12, the individual card may be manufactured by cutting the metal card sheet 100s with the cutting tool 1200 along the individual card outline CU. The cutting tool 1200 may include a cutting machine 1210 and an injector 1220 for spraying a coolant.

The cutting machine 1210 may be made of a special processing material according to the material characteristics of the metal card sheet 100s including the metal sheet 110s. For example, the cutting machine 1210 may include a material having greater rigidity than the metal sheet 110s. The injector 1220 may inject the cooled alcohol through the chiller 1300.

In the present invention, in the process of cutting the metal card sheet 100s, in particular the metal sheet 110s, a considerable amount of heat and sparks may be generated. These heat and sparks may affect other components or the shape of the metal sheet 110s. Can change. In consideration of this, by directly spraying the alcohol cooled through the chiller 1300 at the position cut by the cutting machine 1210, the influence due to the generation of heat or spark can be minimized.

Cutting through the cutting tool 1200 may be performed by a CNC process, and the CNC process may be controlled through the controller 1100 as shown in FIG. 5. The cutting process cuts the individual card outline CU as described with reference to FIG. 12 and exposes the antenna coil of the inlay sheet 170s across the processing layer 120 formed on the metal sheet 110s. It may be made by cutting together the chip exposed area (CE) inside the metal sheet (110s).

In addition, in the present invention, the controller 1100 may control the operation of the cutting tool 1200, and in particular, may control the CNC process of the cutting tool 1200. In another embodiment, when the cutting operation performed by the cutting tool 1200 is more than a predetermined number of times, the controller 1100 may operate to replace the cutting tool 1200. In order to replace the cutting tool 1200, the controller 1100 may record the number of cutting processes performed by the cutting tool 1200, and may replace the cutting tool 1200 when the cutting process is performed for a preset number of times or more. In particular, in the present invention, the controller 1100 may replace the cutting machine 1210 included in the cutting tool 1200. Specifically, the metal card manufacturing apparatus for performing the metal card manufacturing method according to the present invention is provided with a plurality of cutters, and the cutters may be sequentially replaced under the control of the controller 1100. By sequentially changing the cutting machine, the metal card manufacturing process may not be interrupted and production efficiency may be improved.

In another embodiment, the metal card manufacturing apparatus is provided with a monitoring unit (not shown) for monitoring the cutting operation of the metal card sheet 100s to monitor whether the cutting operation of the metal card is good. According to the monitoring result, the controller 1100 may determine the replacement of the cutting tool 1200. For example, the monitoring unit may continuously observe the cutting success rate of the metal card, the uniformity of the cutting surface, and the like.

13 and 14 are cross-sectional views of the metal card sheet along the line AA ′ of FIG. 12, FIG. 13 is a cross-sectional view of the metal card sheet before cutting after laminating is completed, and FIG. 14 is an individual card after the cutting process. Of a metal card sheet.

Referring to FIG. 13, the processed layer 120 is inserted into one surface of the metal sheet 110s, and the processed layer exposed portion 230 is formed on the other surface. In the present invention, the metal card sheet 100s is laminated so that the surface into which the processed layer 120 of the metal sheet 110s is inserted and the upper surface of the laminated sheet, that is, the insulating layer 150 (except the adhesive layer) of the laminated sheet are in contact with each other. Can be laminated.

Referring to FIG. 14, the chip exposed area CE is cut to a depth capable of exposing the inlay layer 170. The chip exposure area CE has a third processing width L3 smaller than the second processing width L2. Cutting so that the third processing width L3 is smaller than the second processing width L2 is to secure COB connection characteristics in the individual metal card process in the future. An individual metal card process will be described with reference to FIGS. 15A to 15C.

The individual card outline CU may be cut as much as the total thickness of the metal card sheet 100s. Referring to FIG. 15B, it can be seen that the inlay layer 170 is exposed as the chip exposed area CE is cut in step S430, and the metal card sheets 100s are respectively cut along the individual card outline CU. It can be seen that the metal cards 100_1, 100_2, 100_3, and 100_4 are manufactured.

When the plurality of metal cards 100_1, 100_2, 100_3, and 100_4 are formed as the metal card sheet 100s is cut, individual card processes may be performed on individual metal cards. For example, three-dimensional printing and coating are performed on individual metal cards cut in sheet units (step S450), and COB pads may be connected to individual metal cards on which three-dimensional printing and coating have been performed (step S460). .

As can be seen with reference to FIG. 14, in manufacturing the metal card, the insulating layer 150 may be cut a plurality of times. Therefore, it is important to improve the handleability of the insulating layer 150 above all. According to the method of manufacturing a metal card according to the present invention, by using the insulating sheet 150s in which ferrite containing epoxy is formed in a sheet form, the magnetic field between the antenna of the metal layer 110 and the inlay layer 170 can be effectively controlled. In addition to being able to be stable in the manufacturing process, metal cards can be produced in large quantities.

15A to 15C are cross-sectional views illustrating step S460 of FIG. 11 for connecting COB and antenna coils of an inlay layer in an individual metal card process.

FIG. 15A illustrates a form in which the inlay layer is exposed through the CNC process for the chip exposed area CE described with reference to FIG. 14.

When the inlay layer 170 is exposed, the antenna coil 320 printed on the inlay layer 170 may be pulled up through the first milling process as shown in FIG. 15B. For example, as illustrated in FIG. 15, the milling process may be performed in a state in which the processed layer exposed part 230 faces upward with respect to the metal card 100 on which the processed layer 120 is mounted.

Since the third processing width L3 is smaller than the second processing width L2, the antenna coil 320 does not come into contact with the metal layer 110 even when the antenna coil 320 moves upward.

As the antenna coil 320 is pulled up, the milling process (secondary milling) may be performed once more on the exposed inlay layer 170 to secure a space in which the COB is mounted and smooth the front surface of the card. When the secondary milling process is completed, it is formed by inserting the COB 350 in the receiving groove as shown in Figure 15c. The width of the receiving groove 340 may be smaller than the third processing width L3, and the depth of the receiving groove 340 may have a depth of D2 corresponding to the thickness of the COB rear surface (or the thickness of the COB rear projection). . After connecting the contact point of the antenna coil 320 and the COB pad pulled up by the Spot Welding method, the COB 350 may be seated in the receiving groove 340. In this case, an adhesive (for example, hot melt) may be applied to the rear surface of the COB 350 to attach the adhesive. As described above, although the metal layer 110 is provided in the individual card process, the COB and the antenna coil may be efficiently connected while blocking the electrical contact.

Subsequently, as described with reference to FIG. 8, a primer layer may be formed by applying a primer to the metal card 100 that is finished until COB connection. The primer may be formed by adopting a material capable of improving the preservation power of the printed information according to the material of the metal layer. On the metal layer 110 to which the primer is applied, card information, a pattern, a picture image, etc. to be engraved on the metal layer 110 may be engraved through 3D printing. Later, by forming a coating layer to protect the top surface, the metal card can be completed so that the information engraved through the three-dimensional printing is not worn or erased.

In the card manufacturing method according to the present invention, a plurality of metal cards can be manufactured at one time through a single sheet process by stacking sheets of a large area capable of producing a plurality of cards and cutting them into individual card units. In addition, the card manufacturing method according to the present invention can stably cut the outline by spraying a cooling gas at the same time in the process of cutting the individual card outline along the surface of the laminated sheet laminated a large area sheet including a metal sheet. have.

According to the card manufacturing method according to the present invention, in order to prevent the distortion of the sheets generated in the process of cutting the large area sheet by creating a hole in the sheet to fix the individual card while maintaining the alignment of the large area sheet Can be cut

According to the method of manufacturing a card according to the present invention, an insulating layer capable of efficiently controlling magnetic interference generated between a metal layer constituting a metal card and an antenna coil for generating contactless communication can be implemented in a stable sheet form. . Accordingly, according to the manufacturing method according to the present invention, it is possible to manufacture a large amount of metal cards with improved operation performance.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is represented by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

100, 200, 300, 500: metal card
110s: metal sheet 140s, 160s: adhesive sheet
150s: insulation sheet 170s: inlay sheet
180s: printing sheet 190s: magnetic sheet
110: metal layer 120: processing layer
130: ferrite powder layer 140, 160: adhesive layer
150: insulating layer 170: inlay layer
180: printing layer 510: coating layer
520: 3D printed layer 530: primer
550: magnetic strip overlay layer

Claims (12)

A metal layer of SUS material heat-treated to improve strength and resilience;
A processing layer of a PVC plastic material inserted into a processing layer insertion space formed through processing on a lower surface of the metal layer;
An insulating layer including a ferromagnetic insulator attached to a lower surface of the metal layer; And
An inlay layer including an antenna coil attached to a lower surface of the insulating layer,
The plurality of sheets including the metal layer, the processing layer, the insulating layer, and the inlay layer are laminated and laminated to each other,
The metal layer may include a processed layer exposed part formed on an upper surface of the metal layer to expose a part of the processed layer,
The processing layer and the insulating layer are cut to expose the antenna coil of the inlay layer through a milling process with respect to a predefined area in the exposed portion of the processing layer to form a COB insertion region,
The COB insertion region accommodates the COB pad mounted on the metal layer after connecting the antenna coil and the rear surface of the COB pad, and the periphery of the COB pad is mounted on a processing layer exposed around the COB insertion region. The side of the COB pad inserted in the COB insertion region is in direct contact with the metal layer,
And the insulating layer is formed by crushing the ferromagnetic insulator into one or more non-uniform pieces. The method of claim 1,
The ferromagnetic insulator is a ferrite (Ferrite) metal card, characterized in that. The method of claim 1,
The COB insertion region is formed so that the margin space other than the antenna connection space is minimized. The method of claim 1,
At least one adhesive layer for attaching the insulating layer,
The adhesive layer is composed of a hot melt sheet (Hot Melt), the metal card, characterized in that the melted during the high temperature process to enter between the one or more pieces to be bonded. The method of claim 1,
The ferromagnetic insulator is a metal card, characterized in that contained in the form of powder (powder). The method according to any one of claims 1 to 5,
A primer layer on which a primer is applied onto the metal layer to which the COB is attached;
A print layer for printing card information on the primer layer; And
The metal card further comprises a coating layer for coating the metal sheet on which the card information is printed. A metal card manufacturing method comprising a metal layer, a processing layer, an insulating layer, and an inlay layer,
Inserting a processing layer of a plastic material into a lower surface of the metal layer to form a processed metal layer;
Forming a processed layer exposed portion to expose a portion of the processed layer on an upper surface of the metal layer;
Attaching an insulating layer including a ferromagnetic insulator to a bottom surface of the metal layer; And
Attaching an inlay layer comprising an antenna coil to a bottom surface of the insulating layer,
Attaching the metal layer, the insulating layer, and the inlay layer using at least one adhesive layer,
The processing layer and the insulating layer are cut to expose the antenna coil of the inlay layer through a milling process with respect to a predefined area in the exposed portion of the processing layer to form a COB insertion region,
The COB insertion region accommodates the COB pad mounted on the metal layer after connecting the antenna coil and the rear surface of the COB pad, and the periphery of the COB pad is mounted on a processing layer exposed around the COB insertion region. The side of the COB pad inserted in the COB insertion region is in direct contact with the metal layer,
The insulating layer is a method of manufacturing a metal card, characterized in that the ferromagnetic insulator is finely divided into a non-uniform one or more pieces. The method of claim 7, wherein
The ferromagnetic insulator is a ferrite (Ferrite) characterized in that the metal card manufacturing method. The method of claim 7, wherein
At least one adhesive layer for attaching the insulating layer,
The adhesive layer is composed of a hot melt (Hot Melt) sheet, the metal card manufacturing method, characterized in that the melted during the high temperature process to enter between the one or more pieces. The method of claim 7, wherein
Laminating step of laminating by laminating a plurality of sheets including the insulating layer and the inlay layer on the opposite side of the side into which the processing layer is inserted. The method of claim 10,
The COB insertion region is formed so that the margin space other than the antenna connection space is minimized. The method of claim 7, wherein
The ferromagnetic insulator is pulverized finely, characterized in that it is included in the form of powder (powder).

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