JP2015513712A - Metallized smart card shielding cancellation and increased coupling - Google Patents

Abstract

A booster antenna (BA) with a coupler coil (CC) in a card body (CB) and a metallized face plate (202, 320) having window openings (220, 320) for an antenna module (AM). 302). The performance consists of making a window opening substantially larger than the antenna module, providing perforations through the face plate, and placing ferrite material between the face plate and the booster antenna. It can be improved by one or more. In addition, the contact pad (CP) of the antenna module (AM) is deformed, the compensation loop (CL) is arranged under the booster antenna (BA), and the antenna module is connected to the coupler coil. Offsetting, placing the booster antenna as a pseudo-dipole, providing a capacitive stub on the module antenna (MA), and in the antenna module, a ferrite element (FE) between the module antenna and the contact pad Can be improved by one or more of the following.

Description

  The present invention (in one aspect) includes an RFID (Radio Frequency Identification) chip or chip module (CM) that includes a dual interface (DI or DIF) card that can also operate in contact mode (ISO 7816-2). And more particularly to “secure documents” such as electronic passports, electronic ID cards, and smart cards (data storage media) that operate in contactless mode (ISO 14443), and more particularly RFID chips (CM Between the module antenna (MA) connected to the module antenna and the booster antenna (BA) of the card body (CB) of the smart card inductively coupled to the module antenna (MA). Improving coupling between elements, and external RFI On improvement resulting from the RFID chip (CM) which interacts with the reader.

  The present invention (in one aspect) relates to a passive RFID smart card having a conductive metal or metallization layer that shields electromagnetic fields generated by a reader. In particular, it relates to a dual interface card that operates on the principle of reactive coupling.

  For purposes of this description, an RFID transponder typically includes a substrate, an RFID chip (or chip module) disposed on or in the substrate, and an antenna disposed on or in the substrate. The transponder can form the basis of a secure document such as an electronic passport, smart card, or national ID card.

  The chip module can simply operate in a contactless mode (such as ISO 14443), or even a dual interface (DIF) module that can operate in a contact mode (such as ISO 7816-2) and contactless mode. can do. A chip module can take energy from an RF signal supplied by an external RFID reader device with which it communicates.

  Substrates sometimes referred to as “inlay substrates” (for electronic passports) or “card bodies” (for smart cards) are polyvinyl chloride (PVC), polycarbonate (PC), polyethylene (PE), PET It may include one or more layers of materials such as (dope PE), PET-G (a derivative of PE), Teslin ™, paper, or cotton / noyl. Where “inlay substrate” is referred to herein, it should be construed to include “card body” and vice versa, unless specifically indicated otherwise.

  The chip module can be a leadframe type chip module or an epoxy glass type chip module. Epoxy glass modules can be metallized on one side (contact side) or on both sides by through-hole plating to facilitate interconnection with the antenna. Where “chip module” is referred to herein, it should be construed as including “chip” and vice versa, unless specifically indicated otherwise.

  The antenna can be a self-bonding (or self-adhesive) wire. Traditional methods of attaching antenna wires to a substrate use a sonotrode tool that vibrates and feeds the wire from a capillary tube and embeds it within the surface of the substrate or affixes it onto the surface of the substrate It is a method to do. A typical pattern for an antenna is generally a rectangle in the form of a flat (planar) coil (spiral) with several turns. The two ends of the antenna wire can be connected to the terminal (or terminal area or contact pad) of the chip module, such as by thermocompression bonding (TC) bonding. See, eg, US Pat. No. 6,698,089 and US Pat. No. 6,233,818, which are incorporated herein by reference.

  The problem with the configuration of incorporating an antenna into a chip module (antenna module) is formed by embedding a wire of several turns (such as 4 or 5 turns) around the periphery of the inlay substrate or card body of a security document In that case, the total antenna area is quite small (such as about 15 mm × 15 mm), in contrast to larger conventional antennas where the total antenna area can be approximately 80 mm × 50 mm (approximately 20 times larger). That is. When the antenna is incorporated into a chip module, the resulting entity may be referred to as an “antenna module”.

Some Prior Art US Pat. No. 8,261,997 (NXP) discloses that a carrier assembly for receiving an RFID transponder chip is attached to a consumer device, and the RFID transponder chip is in operational use And an operating side for receiving an RF signal.
-A conductive shielding layer is provided on the mounting side. The effect of this layer is that it effectively shields the transponder from the surface material that will be provided with the transponder. The shielding layer has some detuning effect on the resonant frequency, but after this detuning effect is considered in the antenna design, there is little further detuning effect due to the surface on which the RFID transponder is provided, i.e. the present invention An RFID transponder including a carrier assembly is suitable for virtually any surface.
The magnetic layer comprises a ferrite foil or a ferrite plate;
The conductive shielding layer comprises a material selected from the group comprising copper, aluminum, silver, gold, platinum, conductor paste, and silver ink.

  EP 1854222 A2 (NXP) is a mobile communication device (1, 10) in which a first area (A) and a second area (inside and / or outside the communication device (1, 10)) ( B, B1, B2) include a shielding component that provides electromagnetic shielding or attenuation. In the first area (A), an antenna (4) and at least one ferrite (6) are arranged, the ferrite (6) interacts with the antenna (4) and the first area (A) ) And the second zone (B, B1, B2).

  US Patent Application Publication No. 20120055013 (Finn, 2012: “S32”) describes microstructures such as connection areas, contact pads, antennas, coils, capacitor plates, etc., nanostructures such as nanoparticles, nanowires, and nanotubes. It is disclosed that it can be formed using a structure. A laser can be used to assist the process of microstructure formation, and the laser can also be used to form other features in the substrate, such as recesses or channels for receiving the microstructure. A smart mobile phone sticker (MPS) is attached to a mobile phone using a self-adhesive shielding element that includes a core layer with ferrite particles.

  European Patent Application Publication No. 02063489A1 (Tyco) discloses an antenna element and a method for manufacturing it. An antenna device is provided that is more easily manufactured for use with the tags that make up an RFID (Radio Frequency Identification) system. The antenna device (10) has (A) a layered magnetic element formed from a magnetic composition containing a magnetic material and a polymer material, and (B) an antenna wiring provided on one of the surfaces of the layered magnetic element. .

Foil Composite Card US Patent Publication No. 2009/016976 (2009, Herslow) discloses a composite card that includes a security layer that includes a hologram or diffraction grating formed in or in the center of the card, ie, the core layer. Yes. The hologram can be formed by embossing a diffraction pattern in a designated area of the core layer and depositing a thin layer of metal on the embossed layer. Additional layers can be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser can be used to remove selected portions of the metal formed on the embossed layer at selected stages of forming the card and impart a selected pattern or information to the holographic region. Cards can be “lasered” when the card being processed is attached to a large sheet of material and part of it, thereby “lasing” all the cards on the sheet. At the same time, it can be performed at a relatively low cost. Alternatively, after the sheet is punched into cards, each card can be individually “lased” to produce the desired alphanumeric information, barcode information, or graphic image.

Metal Card US Patent Application Publication No. 2011/0189620 (2011, Herslow) anneals a selected metal region so that the selected region softens and becomes ductile while the remainder of the metal layer remains stiff. A method and apparatus for treating selected areas of a metal layer used to form a metal card is disclosed. Selected metal regions that have been softened and made ductile can be embossed with reduced power and with reduced wear and tear on the embossing device. Alternatively, the annealed metal layer can be subjected to additional processing steps to form an assembly and then the assembly can be embossed. The method can include the use of a fixture to hold the metal layer, the fixture having a window region, the window region providing heat to soften the region of the metal layer within the window region. Make it possible. The fixture includes a device for cooling the portion of the metal layer outside the window area and for preventing the temperature of the metal layer outside the window area from rising above a predetermined limit.

Ferrite U.S. Pat. No. 8,158,018 (2012, TDK) shows that when the ferrite sintered body of the present invention is converted into an oxide, 52 to 54 mol% Fe2O3, 35 to 42 mol% MnO, And a main component composed of 6 to 11 mol% ZnO and an additive containing a predetermined amount of Co, Ti, Si, and Ca, and the power loss is a minimum value in a magnetic field having an excitation magnetic flux density of 200 mT and a frequency of 100 kHz. The temperature (bottom temperature) is higher than 120 ° C., and the power loss at the bottom temperature is 350 kW / m 3 or less.

  US Pat. No. 7,948,057 (2011, TDK) discloses a ferrite substrate, a winding-embedded ferrite resin layer, and an IC-embedded ferrite resin layer laminated, and the ferrite substrate protrudes from the surface into the ferrite resin layer. The winding inside the ferrite resin layer is arranged around the first protrusion, and the IC overlaps with the first protrusion of the resin layer. According to this configuration, high integration is achieved, and the first protrusion of ferrite that hardly varies in height as a result of thermal expansion and the thickness of the first protrusion are thinned, and as a result of thermal expansion. As a result, the IC is disposed in a region where the ferrite resin layer that hardly changes is overlapped, and the fluctuation of the gap between the winding and the IC as a result of thermal expansion is minimized, thereby achieving greater stability of the electrical characteristics. It is disclosed.

  US Pat. No. 6,817,085 (2004, TDK) includes an element body constructed by laminating ferrite layers and conductor layers such that their laminated surfaces are perpendicular to the element mounting surface. A method of manufacturing a multilayer ferrite chip inductor array is disclosed. The method further includes providing a plurality of coil-shaped inner conductors in the element body, wherein the winding direction of the coil-shaped inner conductor is parallel to the element mounting surface, and a ferrite sheet having a through hole is formed, The coil-shaped inner conductor and the conductor pattern are printed on the ferrite sheet with a conductive material.

  US Pat. No. 6,329,958 (2001, TDK) discloses that an antenna structure can be formed by placing a current limiting structure on a conductive surface. The current limiting structure can be formed from a ferrite material and can be configured to include a belt, tile, or patterned deposition layer. The conductive surface can be associated with a vehicle or structure. The current limiting structure changes the path taken by the current above or below the conductive surface when voltage is applied between portions of the surface.

US Pat. No. 6,698,089 US Pat. No. 6,233,818 U.S. Pat. No. 8,261,997 European Patent Application Publication No. 1854222A2 US Patent Application Publication No. 20120055013 European Patent Application Publication No. 02063489A1 US Patent Publication No. 2009/016977 US Patent Publication No. 2011/0189620 U.S. Pat. No. 8,158,018 US Pat. No. 7,948,057 US Pat. No. 6,817,085 US Pat. No. 6,329,958 US Pat. No. 6,295,720 US Pat. No. 7,980,477 US Patent Application Publication No. 2012/0074233 US Patent Application No. 13 / 600,140 U.S. Patent Application No. 13 / 730,811 US Patent Application Publication No. 20120038445 US Patent Application No. 61 / 697,825 US Patent Application No. 61 / 737,746 US Patent Application No. 61 / 693,262 US Patent Application No. 61 / 589,434 US Patent Application No. 61 / 619,951 US Patent Application Publication No. 2010/0176205 U.S. Pat. No. 8,100,337 US Pat. No. 6,778,384 US Patent Application No. 13 / 205,600 U.S. Patent Application No. 13 / 310,718

  The object of the present invention is to improve the coupling between RFID readers and smart card chip modules with metal or metallization layers. In general, with the aim of improving the coupling between the smart card and the external RFID (electromagnetic) reader, various changes and in order to offset the shielding effect by the metal or metallized card body substrate during the electromagnetic coupling Additions can be added to the structure of such smart cards. Dual interface (DI) smart cards have contact pads (CP) that extend through openings in the metal layer to interface with external contact (electrical) readers.

In general, a dual interface smart card includes a booster antenna (BA) having a coupler coil (CC) and an antenna module (AM) having a module antenna (MA) in the card body (CB). And metallized face plates (202, 302) having window openings (220, 320). The attenuation caused by the metallized face plate is
Making a window opening substantially larger than the antenna module (AM);
Providing perforations through the face plate,
Arranging ferrite material between the face plate and booster antenna,
Deforming the contact pad (CP) on the antenna module (AM);
Disposing a compensation loop (CL) under the booster antenna (BA);
Offsetting the antenna module (AM) relative to the coupler coil (CC);
Placing the booster antenna as a pseudo-dipole,
Providing a module antenna (MA) having a capacitive stub, and disposing a ferrite element (FE) between the module antenna (MA) and the contact pad (CP) in the antenna module (AM). Can be reduced by one or more of these (overall performance can be improved).

  According to one embodiment of the present invention, a smart card having a metallized face plate with a window opening for receiving an antenna module and a card body with a booster antenna including a coupler coil (wherein The window opening has a baseline size approximately equal to the size of the antenna module), the window opening may be characterized by being substantially larger than the antenna module. The window opening can be at least 10% larger than the antenna module to provide a gap between the inner edge of the window opening and the antenna module. A ferrite layer can be disposed between the face plate and the booster antenna. A plurality of perforations may be formed in the face plate extending around at least one of the window opening and the periphery of the face plate. At least some of these perforations can reduce the amount of face plate material in the area surrounding the window opening or the amount of face plate material around the periphery of the face plate by 25-50%. . A compensation loop can be placed behind the booster antenna. The compensation loop can have a gap and two free ends, can include a conductive material such as copper, and can include ferrite.

The following features: Booster antenna can be configured as a pseudo dipole with or without coupler coil,
The booster antenna can have an extension,
The booster antenna can include two overlapping booster antennas,
The booster antenna can be provided mainly in the upper part of the smart card,
One or more of the fact that the module antenna can be offset from the coupler coil can be included in the smart card.

The smart card has the following features: a ferrite element can be arranged between the module antenna and the contact pad of the antenna module,
Capacitive stubs can be added to the module antenna,
The module antenna can include two separate coils;
The module antenna can include two windings connected in a pseudo-dipole configuration;
At least one of the antenna module contact pad perforations may further be included.

According to one embodiment of the present invention, a method for minimizing coupling attenuation by a face plate of a metallized smart card having a booster antenna with a coupler coil in the card body comprises:
Making a window opening in the face plate larger than the antenna module;
Providing a perforation through the face plate;
Providing a ferrite material between the face plate and the booster antenna;
One or more of the steps of disposing a compensation loop under the booster antenna may be included.

  The antenna module can be offset with respect to the coupler coil. The booster antenna can be arranged as a pseudodipole, the module antenna can be provided with a capacitive stub, and a ferrite can be provided between the module antenna and the contact pad in the antenna module. The contact pad can be trimmed or perforated.

  Reference will now be made in detail to embodiments of the present disclosure, non-limiting examples of which are illustrated in the accompanying drawing (FIG). The figure is generally in the form of a diagram. Certain elements in the figures may be exaggerated and other elements may be omitted for clarity of explanation. Some figures are in the form of diagrams. Although the present invention is generally described in the context of various exemplary embodiments, it is not intended that the invention be limited to these specific embodiments, but individual features of the various embodiments. It should be understood that can be combined with each other. Any text appearing in the drawings (legends, notes, reference numbers, etc.) is incorporated herein by reference.

1 is a cross-sectional view of a dual interface (DI) smart card and reader. It is a schematic top view of a booster antenna (BA) having a coupler coil (CC). 1 is a schematic cross-sectional view of a smart card with metallization. 1 is a partial schematic perspective view of a smart card with metallization. FIG. , , 1 is a schematic top view of an embodiment of a face plate (ML) for a smart card. FIG. FIG. 3 is a diagram of a layer having a compensation loop with a gap. FIG. 3 is a diagram of a layer with a compensation loop without gaps. FIG. 3 is a plan view of an exemplary configuration of a contact pad (CP) of a module tape (MT). FIG. 3 illustrates an exemplary contact pad layout and assignment. It is a top view which shows extension of the outer edge part of a contact pad (CP). It is a top view which shows trimming of the outer edge part of a contact pad (CP). It is a top view which shows the increase in the clearance gap between contact pads (CP). It is a top view which shows the change of the clearance gap between contact pads (CP). It is a top view which shows perforation of a contact pad (CP). It is sectional drawing which shows thinning of a contact pad (CP). It is a top view which shows the lower surface of a module tape (MT). It is a top view which shows perforation of a contact pad (CP). It is a top view which shows perforation of a contact pad (CP). It is a top view which shows perforation of a contact pad (CP). FIG. 6 is a plan view of the lower surface of a module tape (MT) for an antenna module (AM), showing an antenna structure (AS) having two antenna segments (MA1, MA2). It is the schematic of an antenna structure (AS).

  Various embodiments are described to illustrate the teachings of the present invention and should be construed as illustrative rather than limiting. Any dimensions and materials or processes described herein are to be considered approximate and exemplary unless otherwise indicated.

  In general, below, a transponder in the form of a secure document, which can be a smart card or a national ID card, is described as an example of the various features and embodiments of the present invention disclosed herein. The As will be apparent, many features and embodiments may be applicable (and can be easily incorporated) to other forms of secure documents, such as electronic passports. As used herein, any of the terms “transponder”, “smart card”, “data storage medium” and the like are similar to those operating under ISO 14443 or similar RFID standards. It can be construed to refer to any other device.

  A typical data storage medium described herein includes (i) an antenna module (AM) having an RFID chip or chip module (CM) and a module antenna (MA), and (ii) a card body (CB). ) And (iii) a booster antenna (BA) disposed on the card body (CB) to enhance the coupling between the module antenna (MA) and the antenna of the external RFID “reader” be able to. Where “chip module” is referred to herein, it should be construed as including “chip” and vice versa, unless specifically indicated otherwise. The module antenna (MA) can include a coil of conductive traces of wire etched or printed on the module tape (MT) substrate of the antenna module (AM) or can be incorporated directly into the chip itself. .

  The booster antenna (BA) can be formed by embedding a wire in the inlay substrate or the card body (CB). However, the antenna is a process other than embedding a wire in a substrate, such as an additive process or subtractive process such as a printed antenna structure, coil winding technique (see US Pat. No. 6,295,720). An antenna structure formed on a separate antenna substrate and transferred to an inlay substrate (or layer thereof), an antenna structure etched from a conductive layer on the substrate (including laser etching), as disclosed It should be understood that the substrate can be formed using a conductive material deposited on a substrate or in a channel formed in the substrate, or the like. When “inlay board” is referred to herein, unless specifically indicated otherwise, it includes “card body” and vice versa, as well as any other board for security documents. Should be interpreted.

  The following description is most often related to a dual interface (DI, DIF) smart card and most often relates to its contactless operation. Many of the teachings described herein may be applicable to electronic passports and the like that have only a contactless mode of operation. In general, any dimensions described herein are approximations and the materials described herein are intended to be exemplary.

  In general, the coupling between the module antenna (MA) and the antenna of the external RFID reader can be enhanced by incorporating a booster antenna (BA) into the card body (CB). In some respects, a booster antenna (BA) is similar to a card antenna (CA). However, in contrast to a card antenna (CA) (such as in US Pat. No. 7,980,477) that is electrically connected directly to an RFID chip or chip module, a booster antenna (BA) is Inductively coupled to a module antenna (MA) of an antenna module (AM) that can be connected to an RFID chip (CM). Such inductive (electromagnetic) coupling can be more difficult to achieve than direct electrical connection. The booster antenna (BA) is sometimes called a card antenna (CA). The booster antenna (BA) can have a coupler coil (CC) associated with it, and the coupler coil (CC) is in close proximity to the module antenna (MA) and is connected to the module antenna (MA). Arranged to be tightly coupled.

  As used herein, the term “coupled” (and variations thereof) depends on the generation of an electromagnetic field by a given element and the reaction to the electromagnetic field by another element (interaction with the electromagnetic field). Reference is made to inductive, magnetic, capacitive, or reactive coupling between two elements (including combinations thereof, any of which may be referred to as “inductive coupling”). In contrast, the term “connection” (and variations thereof) refers to two elements that are electrically connected to each other, and the interaction between the two elements is the flow of electrons between the two elements. Arise from. In general, two elements that are inductively coupled to each other are not electrically connected to each other. Elements that are coiled wires, such as module antenna MA and coupler coil CC, disposed in close proximity to each other are generally inductively coupled to each other without any electrical connection between the two elements. In contrast, the module antenna MA is typically electrically connected to an RFID chip (CM) element. The windings and coils of the booster antenna BA, such as the outer winding OW, the inner winding IW, and the coupler coil CC element, are generally electrically connected to each other, but may also exhibit inductive coupling with each other. The module antenna MA and the coupler coil CC are not electrically connected to each other but are inductively coupled (or “transformer coupled”) to each other.

  The booster antenna BA (and other mechanisms) disclosed herein increases the effective working (“read”) distance between the antenna module AM and an external contactless reader by capacitive and inductive coupling. be able to. For a reading distance of generally only a few centimeters, an increase of 1 cm can mean a considerable improvement.

  Various embodiments are described to illustrate the teachings of the present invention and should be construed as illustrative rather than limiting. In general, below, a transponder in the form of a secure document, which can be a smart card or a national ID card, is described as an example of the various features and embodiments of the present invention disclosed herein. The As will be apparent, many features and embodiments may be applicable (and can be easily incorporated) to other forms of secure documents, such as electronic passports. As used herein, any of the terms “transponder”, “smart card”, “data storage medium” and the like are similar to those operating under ISO 14443 or similar RFID standards. It can be construed to refer to any other device.

  A typical data storage medium described herein includes (i) an antenna module (AM) having an RFID chip or chip module (CM) and a module antenna (MA), and (ii) a card body (CB). ) And (iii) a booster antenna (BA) disposed on the card body (CB) to enhance the coupling between the module antenna (MA) and the antenna of the external RFID “reader” be able to. Where “chip module” is referred to herein, it should be construed as including “chip” and vice versa, unless specifically indicated otherwise. The module antenna (MA) can include a coil of conductive traces of wire etched or printed on the module tape (MT) substrate of the antenna module (AM) or can be incorporated directly into the chip itself. .

  The booster antenna (BA) can be formed by embedding a wire in the inlay substrate or the card body (CB). However, antennas are manufactured by processes other than by embedding wires in a substrate, such as additive or subtractive processes such as printed antenna structures, coil winding techniques (see US Pat. No. 6,295,720). An antenna structure formed on a separate antenna substrate and transferred to an inlay substrate (or layer thereof), an antenna structure etched from a conductive layer on the substrate (including laser etching). It should be understood that the substrate can be formed using a conductive material deposited on a substrate or in a channel formed in the substrate, or the like. When “inlay board” is referred to herein, unless specifically indicated otherwise, it includes “card body” and vice versa, as well as any other board for security documents. Should be interpreted.

  The following description is most often related to a dual interface (DI, DIF) smart card and most often relates to its contactless operation. Many of the teachings described herein may be applicable to electronic passports and the like that have only a contactless mode of operation. In general, any dimensions described herein are approximations and the materials described herein are intended to be exemplary.

  In general, the coupling between the module antenna (MA) and the antenna of the external RFID reader can be enhanced by incorporating a booster antenna (BA) into the card body (CB). In some respects, a booster antenna (BA) is similar to a card antenna (CA). However, in contrast to a card antenna (CA) (such as in US Pat. No. 7,980,477) that is electrically connected directly to an RFID chip or chip module, a booster antenna (BA) is Inductively coupled to a module antenna (MA) that can be connected to an RFID chip (CM). Such inductive coupling can be more difficult to achieve than direct electrical connections.

  As used herein, the term “coupled” (and variations thereof) depends on the generation of an electromagnetic field by a given element and the reaction to the electromagnetic field by another element (interaction with the electromagnetic field). Reference is made to inductive, magnetic, capacitive, or reactive coupling between two elements (including combinations thereof, any of which may be referred to as “inductive coupling”). In contrast, the term “connection” (and variations thereof) refers to two elements that are electrically connected to each other, and the interaction between the two elements is the flow of electrons between the two elements. Arise from. In general, two elements that are inductively coupled to each other are not electrically connected to each other. Elements that are coiled wires, such as module antenna MA and coupler coil CC, placed close to each other are generally inductively coupled to each other without any electrical connection between the two elements. In contrast, the module antenna MA is typically electrically connected to an RFID chip (CM) element. The windings and coils of the booster antenna BA, such as the outer winding OW, the inner winding IW, and the coupler coil CC element, are generally electrically connected to each other, but may also exhibit inductive coupling with each other. The module antenna MA and the coupler coil CC are not electrically connected to each other but are inductively coupled (or “transformer coupled”) to each other.

  The booster antenna BA (and other mechanisms) disclosed herein increases the effective working (“read”) distance between the antenna module AM and an external contactless reader by capacitive and inductive coupling. be able to. For a reading distance of generally only a few centimeters, an increase of 1 cm can mean a considerable improvement.

  FIG. 1 is a cross-sectional view of a portion of an exemplary smart card having an antenna module AM disposed in a recess in a card body CB. The antenna module AM has a chip module CM. The antenna module AM has a contact pad CP for a contact interface with an external contact reader (ISO 7816). The antenna module AM has a module antenna MA for a contactless interface with an external contactless reader (ISO 14443). The booster antenna BA is disposed around the periphery of the card body CB and includes a coupler coil CC disposed around the recess of the card body CB. With the antenna module AM disposed in the recess, the module antenna MA is tightly coupled to the coupler coil CC of the booster antenna BA. The coupler coil CC can be arranged to surround the module antenna MA instead of surrounding it.

  US 2012/0074233, for example, as shown in FIGS. 3A and 4A therein, a booster antenna BA (or card antenna CA) is an outer winding connected in antiphase with each other as a pseudodipole. OW (or D) and inner winding IW (or E) can be included. The coupler coil (CC) is not shown.

  As shown in US patent application Ser. No. 13 / 600,140, eg, FIGS. 3 and 4 therein, the pseudo-dipole booster antenna BA may additionally include an inner coupler coil CC. The coupler coil CC is shown without details and is represented by several broken lines. (Some details of the coupler coil CC structure and how the coupler coil CC can be arranged in various orientations (clockwise, counterclockwise) and connected to the outer winding OW and the inner winding IW. (Described in FIGS. 3A-3D.)

FIG. 1A is a schematic top view of a smart card body CB having a booster antenna BA and an antenna module AM. The booster antenna BA has a coupler coil CC incorporated therein. The following abbreviations may appear in the figure.
CB-Card body or inlay board BA-Booster antenna or card antenna (CA)
OW-outer winding of BA-about 2-3 turns IW-inner winding of BA-about 2-3 turns CC-coupler coil-about 10 turns IE-OW, IW, Or CC inner edge OE-OW, IW, or CC outer edge

The following can be pointed out.
The inner end (IE, a) of the outer winding (OW) is a “free end”.
The outer end (OE, f) of the inner winding (IW) is a “free end”.
The outer end (OE, b) of OW is connected to one end of CC.
The inner end (IE, e) of the IW is connected to another end of the CC.
The outer winding OW can be set clockwise (CW) from IE (a) to OE (b).
The inner winding IW can be set clockwise (CW) from IE (e) to OE (f).

  The booster antenna BA includes an outer winding OW and an inner winding IW, both extending substantially around the periphery of the card body CB. Each of the inner and outer windings has an inner end IE and an outer end OE. The outer end OE (b) of the outer winding OW is connected to the inner end IE (e) of the inner winding IW via the coupler coil CC. The inner end IE (a) of the outer winding OW and the outer end OE (f) of the inner winding IW can be left unconnected as “free ends”. The entire booster antenna BA, including the outer winding OW, the coupler coil CC, and the inner winding IE, is open circuit and may be referred to as a “pseudo dipole” (the outer winding OW is one of the poles of the dipole. The inner winding IW constitutes the other pole of the dipole) and the center is fed by the coupler coil CC.

The booster antenna BA is disposed (inside) around the periphery (periphery) of the card body CB (or an inlay substrate or a data storage medium substrate such as one formed from a thermoplastic material). Can be formed using isolated copper wires (insulated together). The booster antenna BA includes an outer winding OW (or coil, D) and an inner winding IW (or coil, E), and further includes a coupler coil CC, all of which are included in these various coil elements. Can be formed from a single continuous length of wire (such as an 80 μm self-bonding wire) that can be placed on or embedded in the card body CB. More specifically,
The outer winding OW has several turns (such as 2-3) and is formed as a helix with an inner end IE of point “a” and an outer end OE of point “b” be able to. The outer winding OW exists near (substantially) the periphery (periphery) of the card body CB. The inner end IE (“a”) of the outer winding OW is a free end.
The coupler coil CC can have several turns (such as about 10) and can be formed as a helix with two ends “c” and “d”. The end “c” can be the outer end OE or the inner end IE, and the end “d” can be the inner end IE or the outer end OE.
The inner winding IE has several turns (such as 2-3) and can be formed as a helix with an inner end IE “e” and an outer end OE “f”. The inner winding IW is present inside the outer winding OW near (substantially) the periphery of the card body CB. The outer end OE (“f”) of the inner winding IW is a “free end”. In FIG. 3, the inner winding IW is shown by a broken line for easy understanding.
The inner end IE of the outer winding OW is a “free end” because it remains unconnected. Similarly, the outer end OE of the inner winding (IW) is a “free end” that remains unconnected.

  The outer winding OW, the coupler coil CC, and the inner winding IW can be formed as a single continuous structure using conventional wire embedding techniques. Reference to the coupler coil CC connected to the ends of the outer winding (OW) and the inner winding (IW) is taken to mean that the coupler coil CC is a separate entity having ends. Please understand that it should not. Rather, in the context of forming one continuous structure of outer winding OW, coupler coil CC, and inner winding IW, the “end” is what would normally be the actual end. It can be construed to mean the corresponding position, and the term “connected to” is interpreted in this context as “continuous with”.

  The size of the card body CB can be about 54 mm × 86 mm. The outer dimension of the outer winding OW of the booster antenna BA can be about 80 × 50 mm. The wire for forming the booster antenna BA can have a diameter (d) of about 100 μm (including but not limited to 80 μm, 112 μm, 125 μm).

  The inner winding IW can be disposed on a given surface of the card body CB (or a layer of the multi-layer inlay substrate) and inside the outer winding OW as shown. Alternatively, these two windings of the booster antenna BA can be arranged on the opposite surface of the card body CB, substantially aligned with each other (in this case two windings). Will be "top" and "bottom" windings instead of "outside" and "inside" windings). The two windings of the booster antenna BA can be coupled in close proximity so that the voltages induced in the two windings can have opposite phases to each other. The coupler coil CC can be present on the same surface of the card body CB as the outer and inner windings.

  The turns of the outer winding OW and the inner winding IW of the booster antenna BA can be 0.2 mm (200 μm) in pitch, and approximately 1 between adjacent turns of the outer winding OW or the inner winding IW. A space of two wire diameters is provided. The winding pitch of the coupler coil CC is substantially the same as or smaller than the pitch of at least one of the outer winding OW and the inner winding IW (in other words, less than that). Can be, for example, 0.15 mm (150 μm), resulting in a space less than one wire diameter between adjacent turns of the coupler coil (CC). Self-bonded copper wire can be used for the booster antenna BA. The pitch of both the outer / inner winding OW / IW and the coupler coil CC are both about twice the diameter of the wire (or the width of the conductive trace or track) (2 ×) (twice). Can provide a spacing between adjacent turns of the helix, on the order of one wire diameter (or trace width). The pitch of the outer winding OW and the inner winding IW can be substantially the same as each other or can be different from each other.

  For example, two “track” wires are stacked (with an insulating film between them if necessary) in a laser-removed trench that defines an area for the winding of the coupler coil CC. Allows more turns of the coupler coil CC to be accommodated in a given area.

  The substrate or card body CB on which the booster antenna BA is formed is prepared by a first manufacturer and is an intermediate product (may be referred to as “data storage medium component” in the absence of the antenna module AM). Can be configured. Subsequently, the second manufacturer mills (or otherwise forms) a recess in the card body CB inside the coupler coil CC (see FIG. 1), and the antenna module AM (module. With an antenna MA). (Of course, the data storage media component may be supplied by the first manufacturer with the recess already formed.)

In addition, reference may be made to several drawings and descriptions of the following applications related to DIF (Dual Interface-Contact and Contactless) smart cards, which are incorporated herein by reference. For example,
US Patent Application No. 13 / 730,811 filed December 28, 2012, or US Patent Application Publication No. 2012/0074233 FIG. 1A Card Antenna CA, Contact and Non-Contact Reader in Card Body CB 1B Card antenna CA in card body CB, ferrite in card body CB FIG. 1D Ferrite element FE in AM between module antenna MA and contact pad CP
3A, 4A Pseudo-dipole booster antenna BA without coupler coil CC
Fig. 4I, ferrite in J card body CB Fig. 6A Mobile phone sticker MPS with ferrite
Fig. 6B Ferrite shielding element 670, adhesive on both sides Fig. 8 (U.S. Patent Application No. 13 / 730,811) Card antenna CA mainly in the upper half of the card body CB
US patent application Ser. No. 13 / 600,140 filed Aug. 30, 2012 FIG. 2A Booster antenna BA without coupler coil CC FIG. 3 Booster antenna BA with coupler coil CC
3A to 3D Various configurations of coupler coil CC FIG. 4 Antenna module AM with BA having CC and module antenna MA
Fig. 5H Booster antenna with extension Fig. 5I-K Two booster antennas Fig. 6A-C BA arranged in upper half of card body CB

Metallized Card Structure Some smart cards, including dual interface (DI) smart cards, have a metal (or metallized) top layer, or “face plate”, substantially the size of the card body. The presence of the metal layer is technically poor because the metal layer can significantly reduce the bond between the card and the external contactless reader. Nevertheless, this mechanism can be important for a variety of purposes.

FIG. 2 is a highly generalized and simplified schematic cross-sectional view illustrating several exemplary layers of an exemplary “metal” (or metallized) smart card. The layers are numbered for reference purposes only, not to indicate a specific order. The layers can be rearranged. Some layers can be omitted. Some layers may be applicable to either non-metallic smart cards or metallized smart cards. Some of the layers can include more than one layer. Some layers can be combined with other layers.
Layer 1 Printed sheet, overlay scratch protection, etc. Layer 2 Separate metal layer or metallized foil Layer 3 Booster antenna BA with coupler coil CC
Layer 4 Card body CB
Layer 5 Metallized or non-metallized compensation frame (back of card body)
Layer 6 Printed sheet, underlay scratch prevention, magnetic stripe, etc.

  The chip module (CM) extends into the smart card, that is, from the front (top when viewed) surface of the smart card, through the metallized foil (layer 2) and into the card body (layer 4). It is shown disposed in the window “W” (opening). The chip module (CM) has a contact pad (CP) on the front for interfacing with an external contact reader. The chip module is a dual interface (DI) antenna module with a module antenna (MA) for interfacing with an external contactless reader via a booster antenna (BA) with a coupler coil (CC) (AM). The antenna module (AM) can fit within the inner area of the coupler coil (CC). Contrast with FIG.

FIG. 2A shows an exemplary stackup (sequence of layers) of a metallized smart card 200 having the following layers, structures, and components. Exemplary dimensions are presented. All dimensions are approximate. Thickness represents the vertical dimension in the figure.
The top layer 202 may be a metal (or metallized) layer 202, such as 250 μm thick stainless steel, sometimes referred to as a “face plate”. Contrast with “Layer 1”. This top layer 202 can be as large as an entire smart card, such as about 50 mm × 80 mm.
-Layer of adhesive 203, such as polyurethane, 40 μm thick
A layer 204 of ferrite material such as a 60 μm thick sheet of soft (flexible) ferrite
A layer 205 of adhesive, such as polyurethane, 40 μm thick
A layer 208 of plastic material, such as 50-100 μm thick PVC, which can function as a spacer (separate the lower layers and components from the upper layers and components)
A layer 210 of plastic material, such as 150-200 μm thick PVC, which can function as a card body (CB). Contrast with “Layer 4”.
A wire 212, such as a 112 μm diameter wire, forming a booster antenna (BA) with a coupler coil (CC). Contrast with FIG. For ease of explanation, only one wire cross section is shown.
A layer 214 of plastic material, such as 150 μm thick PVC, which can include prints, magnetic stripes, etc
A layer 216 of plastic material, such as 50 μm thick PVC, which can serve as an overlay
-The overall thickness of the smart card 200 (layers 202, 203, 204, 208, 210, 214, 216) may be about 810 μm (0.81 mm).

  A window opening 220 (“W”) can extend into the smart card, ie, from the face plate 202 through the intervening layer and into the card body layer 210. A dual interface (DI) antenna module (AM) with a module antenna (MA) can be disposed in the window opening 220. Contrast with FIG. The window opening 220 can extend completely through the layer 210, in which case the antenna module (AM) will be supported by the lower layer 214.

  The coupler coil (CC) of the booster antenna (BA) can surround the window opening 220 so as to be tightly coupled with the module antenna (MA) of the antenna module (AM). Contrast with FIG. Alternatively, the coupler coil (CC) can be arranged in the card body (CB) so that it is directly under the module antenna (MA) of the antenna module (AM).

  The antenna module (AM) may be sized approximately 12 × 13 mm (and approximately 0.6 mm thick). The window opening 220 (“W”) of the face plate 202 can be approximately the same size as the antenna module (AM), ie, about 12 × 13 mm. In this “baseline” configuration, the chip activation distance can be about 15 mm. (Chip activation distance is similar to reading distance, indicating the maximum distance (for reading) that the chip module is activated by an external reader.) As a general plan, larger is better, but 15mm is less No, 20mm or 25mm would be better. The chip activation distance of the metallized smart card is adversely affected by the electromagnetic field attenuation associated with the booster antenna due to the metal face plate 202 (layer 1).

In accordance with features of the present invention, the window opening 220 in the face plate 202 is made significantly larger than the antenna module (AM) to offset shielding and enhance coupling, thereby increasing the starting distance. . For example, assuming that the antenna module (AM) is about 12 × 13 mm,
The window opening 220 can be expanded by about 1 mm in all directions, so that there is a 1 mm gap (GAP) all around the antenna module (AM). This represents a window opening that is 14 × 15 mm and has a 30% larger area (which is the area of the gap). The gap (1 mm) is about 10% of the transverse dimension of the unexpanded (12 × 13 mm) window opening. The resulting chip activation distance can be approximately 20 mm (33% increase over baseline 15 mm).
The window opening 220 can be expanded about 2 mm in all directions, so that there is a 1 mm gap (GAP) all around the antenna module (AM). This represents 16 × 17 mm, resulting in a window opening with an area 75% larger (which is the area of the gap). The gap (2 mm) is about 20% of the transverse dimension of the unexpanded (12 × 13 mm) window opening. The resulting chip activation distance can be about 22 mm (50% increase over baseline 15 mm).

  The results of providing a gap and enlarging the window opening are summarized in the following table (all numerical values are approximate).

  More generally, the window opening 220 increases the size by at least 10% (compared to a nominal dimension approximately equal to the antenna module AM), including the values of about 30% and 75% in the above example. Can be increased to at least 100%.

  The gap (GAP) between the antenna module (AM) and the inner edge of the window opening 220 is the coupler coil (CC) of the booster antenna (BA) and the module antenna (MA) of the antenna module (AM). ) Can be significantly better. A start-up distance improvement of up to 50% is shown. While gap sizes of 1 mm and 2 mm have been described, they indicate that the window opening has been enlarged by 10% and 20%, respectively. More generally, the gap can be at least 0.5 mm and can include up to at least 3 mm.

  The ferrite layer 204 can further improve the coupling by reducing the attenuation of the coupling by the face plate 202, which is an electromagnetic field between the booster antenna BA and the module antenna MA of the antenna module AM. Helps to focus. The ferrite layer 204 is preferably as close as possible to the lower surface of the face plate 202. Rather than having a separate ferrite layer 204 (and adhesive layer 203), ferrite particles or powder are mixed with the adhesive and sprayed or coated onto the lower surface of the face plate 202, thereby removing the intervening adhesive layer 203. can do. Alternatively, rather than in the form of a separate layer 204, the ferrite material may be a ferrite particle embedded in an underlying layer such as the spacer layer 208 or the card body layer 210 (the spacer layer 208 may be omitted in some configurations). (Including nanoparticles).

  The spacer layer 208 simply attenuates the coupling by the face plate 202 by keeping the face plate 202 as far away as practical from the booster antenna 212 (within the shape factor of the smart card). Reduction can also improve the coupling.

  In addition to the features of the enlarged window opening 220 of the face plate 202, the ferrite 204 between the face plate and the underlying layer / component, and the spacer layer 208, various additional features to improve coupling. Can be incorporated into smart card layers and / or antenna modules, for example, but not limited to:

For metal cards
-Drilling into the face plate as described in more detail with respect to Figs. 3A, B, C;
-Install a compensation frame under the booster antenna (BA). Contrast with layer 5 (FIG. 2, above) and FIGS. 4A, 4B (below).

For the card body layer,
-Arranging ferrites at key locations on the card body (CB), such as those disclosed in FIGS. 1B, 4I, J of US 20120074233, etc.
An antenna module in which a booster antenna (BA) or a card antenna (CA) is configured as a pseudo-dipole without a coupler coil (CC), and the module antenna MA overlaps only with the inner winding IW of the booster antenna. Positioning the AM is disclosed, for example, in FIG. 2C of US Patent Publication No. 20120038445, FIGS. 3A and 4A of US Patent Publication No. 20120074233, and FIG. 2A of US Patent Application No. 13 / 600,140. Things, etc.
-Constructing a booster antenna (BA) as a pseudo-dipole with a coupler coil (CC), such as disclosed in FIGS. 3, 3A-D of US patent application Ser. No. 13 / 600,140, etc. Contrast with FIGS. 1, 1A (above).
-Providing an "extension" to the booster antenna (BA), such as that disclosed in Figure 5H of US patent application Ser. No. 13 / 600,140-providing an overlapping booster antenna (BA) Such as those disclosed in FIGS. 5I, J, and K of US patent application Ser. No. 13 / 600,140, etc.-a booster antenna (BA) is provided primarily in the upper portion of the smart card and the lower "embossing" Leaving the “processed” portion empty, eg, FIG. 6A, B, C of US patent application 13 / 600,140, FIG. 8 of US patent application 13 / 730,811, and US patent application Ser. 61 / 697,825, as disclosed in FIG. 6D, etc.-the module antenna (MA) and the coupler coil (CC) are not concentric Offsetting the antenna (MA) from the coupler coil (CC), for example, disclosed in FIGS. 7A, B, C of US Patent Application No. 61 / 737,746, filed Dec. 15, 2012. -Forming and connecting booster antenna (BA) and coupler coil (CC) windings in ways other than those shown in FIG. 1A (above), eg, filed on Dec. 15, 2012 US Patent Application No. 61 / 737,746 issued to FIGS. 8A-C, etc.

For the antenna module (AM)
-Placing a ferrite element between the module antenna (MA) of the antenna module (AM) and the contact pad (CP), eg in FIGS. 1D and 7C, D, E of US 20120074233; What is disclosed, such as adding capacitive stubs to a modular antenna (MA), such as those disclosed in FIGS. 2A and B of US 20120038445 and US 20120074233. Trimming and / or drilling the contact pads (CP) of the antenna module (AM), such as those disclosed in FIGS. 2-5 of US patent application 61 / 693,262, etc. Forming the antenna (MA) as two separate coils, eg, US Such as that disclosed in FIG. 6A of patent application 61 / 693,262-connecting two windings of a module antenna (MA) in a pseudo-dipole configuration, eg US patent application 61 / 693,262 Disclosed in Fig. 6B

  Using various combinations of these features, the baseline activation distance of 15 mm is increased to about 28 mm or more, with an improvement of about 100%, between the chip module (CM) and the external contactless reader. Corresponding improvements to communication reliability can be made. It is within the scope of the present invention that these features listed above can be incorporated into a non-metallized (no metal face plate) smart card to significantly improve start-up and read distance.

Manufacturing The intermediate product can include a ferrite 204 adhered to an underlying spacer layer 208 using an adhesive 205 and a card body layer 210 with a booster antenna 212 fitted therein. This intermediate product is sometimes referred to as a pre-laminated stack or “pre-laminate” and can have a thickness of about 450 μm.

  The pre-laminate can be handed over to a second manufacturer who will apply the face plate 202, the bottom PVC sheet 214, and the bottom overlay 216. Face plate 202 can be pre-drilled (otherwise machined) with openings 220. The resulting stack-up has a pre-laminated thickness of about 940 μm (0.94 mm) and can have a final thickness of about 890 μm (0.89 mm) after lamination (heating and pressing). .

  In the lamination process, the underlying material (ferrite 204, spacer PVC 208, card body PVC 210, etc.) expands upward into window opening 220 (causing the resulting jagged surface on the bottom surface of the smart card). To prevent, a plug of material is first inserted into the window opening 220. The material of the plug can be PVC, or a metal “slag” removed from the face plate to create an opening, or the like.

  Generally, after lamination, the plug (in the case of metal) is removed. If the plug was PVC, it can be left in place. The antenna module recess can then be machined into a smart card layer (ferrite 204, spacer PVC 208, card body PVC 210), taking care not to damage the coupler coil (CC). .

Perforation of the face plate (202) The face plate (202), sometimes referred to as a "metallized layer"("ML"), can be perforated to improve bonding, which is usually for lamination Before the face plate is added to the stack, for example, in connection with the formation of the window (220). In other words, to counteract the shielding caused by the smart card metallization layer, the metallization layer is perforated, around the window (220) approximately directly above the coupling coil (CC), and / or the booster antenna BA. The material in places such as around the periphery of the metallization layer ML that is almost directly above the outer winding OW and the inner winding IW can be removed. When slots and holes are drilled in the metallized layer ML at these locations, the electromagnetic field will operate better, for example, by facilitating the emission of magnetic flux lines. The perforation design can add the beauty of a smart card and can provide optical (visible) security features.

  FIG. 3A shows that a pattern of perforations (or openings) in the form of elongated slits 322 can be formed around the periphery of the face plate 302 (to be contrasted with 202), such as by laser etching. The slit 322 should be aligned above (or below) the booster antenna BA (FIG. 1) to enhance the coupling between the booster antenna BA and the antenna of the external contactless reader (FIG. 1). Can do.

  FIG. 3A shows a pattern of perforations (or openings) in the form of holes 324 around the perimeter of the opening 320 (contrast with 220) of the face plate 302 (202, further contrast with “Layer 2”). It can be formed by laser etching or the like. These perforations are located above (or below) the coupler coil CC (FIG. 1) to enhance the coupling between the coupler coil CC (212) and the module antenna MA of the antenna module AM. Can be combined.

  FIG. 3B shows an alternative pattern of perforations (or openings) 322 and 324 in the metallization layer (face plate) 302. Here, the perforations 322 around the periphery of the face plate A are in the form of holes and the perforations 324 around the window opening 320 are in the form of slits.

  FIG. 3C shows an alternative pattern of perforations (or openings) 324 in the metallization layer (face plate) 302. Here, the openings 324 are a number of arc segments of increasing radius (centered around the window openings 320) distributed around the window openings 320.

  Regardless of whether the perforations (or openings) 322 and 324 are slits or holes, or other shapes, the holes can be arranged in an aesthetically pleasing pattern and can also serve as a security (anti-counterfeit) measure. The perforations (or openings) 322 and 324 of the face plate 302 can be filled with a preferred non-metallic, visually contrasting material, such as pearl's artificial (plastic) mother.

The size of the card body CB is (about 50mm x 80mm)
Width 85.47mm-85.72mm
Height 53.92mm-54.03mm
Thickness 0.76mm + 0.08mm
It can be.

  The face plate 302 (or metallization layer ML) can be approximately 86 mm × 54 mm in size. The opening 320 (or “W”) of the face plate 302 can be approximately 8 mm × 10 mm in size. (In the description of FIG. 2A, other exemplary dimensions of the antenna module AM and the window opening 220 of the face plate 202 are shown and tabulated.) The peripheral area of the card body CB (or metallization layer ML) is , Extending into / from the edge of the card body CB (or metallization layer) 5-10 mm, in other words, it can extend to the periphery of the entire card body, but not entirely.

  As shown in FIGS. 3A and 3B, there may be a plurality of apertures 322 (such as 20-60 or more) disposed around the peripheral area of the face plate 302. The opening 322 can reduce the amount of metallic material in the surrounding area by about 25% to 50%, thereby allowing better coupling between the booster antenna BA and the external contactless reader.

  Similarly, there may be a plurality (such as 10-30 or more) of openings 324 disposed around the window openings 320 of the face plate 302. The aperture B can reduce the amount of metallic material in this area by about 25% to 50%, thereby providing a better coupling between the coupler coil CC and the module antenna MA of the antenna module AM. to enable.

Card Body Layer Additions and Alternative Changes Compensation Loop FIG. 4A shows that a conductive “compensation loop” CL is placed behind booster antenna BA (layer 3) (such as layer 5 in FIG. 2) It shows that it can extend around the periphery of the body CB. Compensation loop CL may be an open loop having two free ends and a gap (“gap”) between them. The compensation loop CL can be made of copper clad, printed on a support layer, etc.

  FIG. 4B shows that the compensation loop CL can include a ferrite material, in which case the ferrite is not an electrical conductor (as opposed to copper) so that the loop can be closed and there is no gap and free end. .

  The compensation loop is sometimes referred to as a “frame”. The compensation frame on the back side of the booster antenna BA (FIG. 1) can help stabilize the resonant frequency.

  The compensation loop CL can be used in addition to the booster antenna BA. The booster antenna BA can be embedded on one side of the inlay substrate, while the compensation frame can be inkjet printed or adhesively attached to the opposite side of the inlay substrate. The compensation loop CL can be mounted using a subtractive (material etch away) process or an additive (material deposition) process.

Ferrite The ferrite layers can be laminated together and can stabilize the resonant frequency of the booster antenna BA in conjunction with the copper compensation loop CL on the back side of the booster antenna BA. The track can be cut (with a gap) at a certain position.

  Lamination and high heat can be used to sinter the ferrite particles together into a continuous path. By laminating ferrite particles under high heat and ultra high pressure, a thin card material film such as PC, PVC, PETG produces a ferrite inlay with an antenna. The inlay can consist of several layers of ferrite. Due to the applied temperature and pressure, the particles are sintered to form an insulating layer of ferrite.

  By depositing ferrite nanoparticles or powder on the inlay substrate, the effect of shielding is caused by bending the magnetic flux lines and metallization of the printed layer of the smart card body or the metal layer close to the RFID antenna of the card body And a transponder with one or several underlayers of ferrite laminated together with RFID components to form a pre-laminated inlay with a booster antenna or a composite inlay layer.

  Ferrite nanoparticles or powder can be applied to the substrate layer by wet or dry spraying. In the case of wet spraying, the ferrite is suspended in a liquid phase dispersion prepared by sonicating the particles in a solvent or water soluble / surfactant liquid. The particles can further have a steric wrap to maintain suspension of the particles in the liquid. The average crystal grain size of the ferrite spheres can be determined by filtering and by the degree of sonication over a period of time. (Sonication is the action of stirring particles in a sample by applying sound, usually ultrasonic energy.)

  Sintering of nano-sized ferrite particles occurs during hot lamination of the synthetic layer that forms the inlay. The lamination process includes heating and cooling under high pressure. Several layers of ferrite-coated substrates or foils can be used to enhance the ferromagnetic properties. Unlike bulk ferrite granules, nanoparticles have a very low sintering temperature consistent with the glass transition temperature of the synthetic substrate. Additional heat treatment after lamination may be required.

Additional mechanisms built into the card body As mentioned above, various additional mechanisms can be built into the smart card body (regardless of metal or non-metal (typical) type) in various combinations, The electromagnetic coupling of the module antenna with the external contactless reader via the antenna can be enhanced, thereby increasing the starting and reading distance to an “acceptable” level. These enhancements are mainly generated by other components of the smart card, such as the metal face plates (202, 302) described in detail above, or the metal contact pads (CP) of the antenna module (AM). Other components of the smart card or metal contact pads (CP) can also be modified to enhance the coupling as will be described in some detail below. Some of the card-related mechanisms are
-Placing ferrites at key locations on the card body (CB), such as those disclosed in Figures 1B, 4I, J of U.S. Patent Application Publication No. 20120074233; and-several variants have been described above Various configurations of booster antennas (BA) can be included.

Laser etching and change to antenna module Using laser etching instead of chemical etching to remove material such as metal from the layer, such as to form module antenna MA of antenna module AM Is mentioned very briefly. A more complete description of this process can be found in US Patent Application No. 61 / 589,434, filed January 23, 2012, and US Patent Application No. 61 / 619,951, filed April 4, 2012. , And U.S. Patent Application No. 61 / 693,262, filed August 25, 2012.

  Chemical etching of antennas having 10 to 12 turns within the limit dimensions of an ISO standard chip card module is described in US 2010/0176205. Such an antenna module with contact and contactless interfaces is plugged into the card body for inductive coupling with a booster antenna that communicates with the reader in contactless mode.

  Due to limitations on the size of the smart card module (eg 13mm x 11.8mm), the number of turns forming the antenna is limited to the space surrounding the center position of the silicon die attached and bonded to the module substrate. The This substrate is typically made of epoxy glass with a contact metallization layer on the face-up side of the module and a bonding metallization layer on the face-down side. The antenna to be chemically etched is usually formed on the face-down side.

  Another limitation in producing induction antennas by chemical etching is the minimum pitch (or spacing) between tracks that can be achieved economically using a lithographic process. The optimum pitch (or spacing) between the tracks (adjacent) of the etched antenna on super 35 mm tape is about 100 μm. (As used herein, the term “pitch” refers to the spacing between adjacent conductive tracks, rather than the traditional meaning of the center-to-center dimension between track centerlines or the number of tracks per unit length. is there.)

  An antenna structure, such as a module antenna, can be formed by laser etching a copper clad laminate, thereby forming an integral part of the RFID smart card chip module. The use of laser etching solves the pitch factor limitations that can be achieved using conventional chemical etching, resulting in a significant increase in the number of turns forming the antenna and the resulting performance benefits. Can accompany. The use of lasers for chemical etching can significantly reduce the footprint of laser etched antennas that have substantially the same electrical characteristics as chemical etched antennas that require larger areas. Using the adhesive tape, the antenna chip module can be easily arranged and bonded to the recess provided in the card body.

  The material to be laser etched can include a standard prepreg laminate (110 μm) made from epoxy glass and hardened halogen-free epoxy resin coated on both sides with copper foil (17 μm + 17 μm), non-contact And dual interface smart card modules can be used to produce on a super 35 mm chip carrier tape in rows and columns. The carrier tape can be equipped with sprockets and positioning holes for transfer, and punching holes for vertical interconnects that electrically connect the top and bottom metallization layers should be performed before laser processing Can do.

  The antenna structure for each module site is laser etched (separated) into a copper clad “seed” layer (face-down side of the prepreg) having a thickness of 17 μm using a UV or green nanosecond or picosecond laser. Technique), the distance between the tracks is dimensionally equal to about 25 μm of the width of the laser beam. On the face-up side, the contact area can be further laser etched in preparation for copper electroless plating and nickel and gold electroplating. After laser etching of the copper seed layer, the tape with the antenna site on the face down side is further processed. Sand blasting to remove residual laser-removed particles and prepare for plating adhesion, carbon deposition to assist vertical interconnect through-hole plating, dry film application and photo masking process, tape Electroless deposition of copper (Cu≈6 μm) to increase track thickness on both sides, nickel and nickel phosphorus (Ni / NiP≈9 μm) or nickel (Ni≈9 μm) and palladium to prevent oxidation / Electroplating of gold or gold (Pd / Au or Au-0.1 μm / 0.03 μm or 0.2 μm).

  Laser etch the contact pads on the face-up side and the antenna structure on the face-down side by using a standard pre-impregnated laminate with copper seed layers on both sides, then electrolessly plating the tape with copper And can be electroplated with nickel and gold. The main advantage of this technique is a reduction in the mechanism pitch size (spacing) between tracks, and the inevitable increase in the number of turns allowed in the restricted area of a standard smart card chip module.

Contact Pad (CP) Modification US Patent Application No. 61 / 693,262, filed on August 25, 2012, described above, cancels electromagnetic coupling attenuation that may be caused by a metal contact pad (CP). Various ways of changing the contact pad (CP) of a dual interface (DI) antenna module (AM) for the purpose (see FIGS. 2A-D, 3A-B, 4A-B, 5A-B of that application) Is disclosed. In one example shown in that application (FIG. 3A), at least some of the contact pads (CP) have “coverage” of the coupling coil CC to achieve a good effect (increase) on the read distance. Holes or slots can be drilled to reduce what is called. The perforation of the contact pad (CP) serves the same purpose as the opening 324 in the face plate 302. Both mechanisms (perforated contact pads, perforated face plates) can be implemented.

  As used herein, the term “coverage area” (or “coverage”) refers to how much the contact pad (CP) is on the opposite side of the module tape from the module antenna (MA). To see if they overlap. The coverage area is 0% (no overlap, such as when the MA is completely outside the perimeter of the CP) and almost 100% (substantially entirely overlapping, the module MA is completely contact pad ( CP), but the gap between the pads may be between 100% and 100%). Correspondingly, the term “coil exposure” refers to how much of the module antenna (A) located within the area of the contact pad (CP) is exposed, such as through a gap between the contact pads. . The coil exposure can be between almost 0% (the only exposure is due to the gap between the pads) to 100% (such as when the module antenna MA is located completely outside the perimeter of the contact pads).

  FIG. 5 (corresponding to FIG. 1A of US Patent Application No. 61 / 693,262) shows a typical layout of contact pads (CP) on the face-up side of a module tape (MT). A contact pad (CP) is a layer of conductive material such as copper (generally with other conductive layers for protection) that has been chemically or laser (ablated) etched to show the desired pattern of pads. Can be included. The overall dimensions of the antenna module (AM) can be about 15 mm × 15 mm. The overall size of the card body (CB) can be about 50 mm × 80 mm. The overall dimensions and pattern of the contact pad (CP) can be specified in ISO7816. For example, the pattern contact pad (CP) can occupy an area measuring about 10 mm × 13 mm on the face-up side of the module tape (MT) and can have a thickness of about 30 μm. FIG. 5 shows seven contact pads (CP) exposed through the openings in the module tape MT.

  In FIG. 5, the module antenna (MA) disposed on the opposite side of the module tape MT when viewed from the contact pad (CP) is indicated by a broken line. In this example, the coverage area is substantially 100% (the module antenna MA is completely covered by the contact pads (CP) except for a small gap between adjacent pads) and the coil exposure is substantially 0% (there is only minimal coil exposure in a small gap between adjacent pads). Therefore, the contact pad CP shields (attenuates) the signal between the booster antenna BA (or card antenna CA) and the module antenna (MA) of the antenna module (AM).

  U.S. Pat. No. 8,100,337 (2012, SPS) discloses an electronic module (11) with a double communication interface, in particular for a chip card, said module being first of the reader Including a substrate (27) with an electrical contact terminal block (17) that allows it to function by contact with a contact portion, and secondly, including an antenna including at least one turn (13); The terminals are connected to the terminals of the microelectronic chip located on one side of the module (11). In this module (11), the antenna winding (13) is located substantially outside the area covered by the electrical contact (17) so that the electrical contact of the terminal block is a signal for the antenna. The electromagnetic shielding is not configured. This applies in particular to the manufacture of chip cards with a double communication interface with and without contacts.

Claim 1
An electronic module with a double communication interface for a chip card,
A substrate including an electrical contact terminal block that allows it to function by contact with a reader contact;
Including at least one turn on the surface of the electronic module, the terminal of which is connected to a terminal of a microelectronic chip located on one side of the module;
The at least one turn of the antenna is located on a first area of the surface of the electronic module substantially outside of a second area covered by the electrical contact; An electronic module having a plurality of protrusions located outside the area of the electrical contact portion of the terminal block on the surface of the substrate opposite to the surface supporting the antenna winding.

  As described in U.S. Pat. No. 8,100,337 and using a language more consistent with applicants' present application and co-pending application, the antenna module (AM) is externally read in a contactless mode. When in communication, the contact pad (CP) may cause “shielding” (or attenuation) of the signal, thereby limiting the read distance. Although limiting reading distances such as just a few centimeters may be desirable for security reasons, such shielding may limit reading distances uncomfortably small, such as 3 cm. More advantageously, sufficient security and improved communication between the external reader and the antenna module (AM), including using a smart card (SC) incorporating the antenna module (AM). A 5 cm reading distance provided may be desirable.

US Pat. No. 6,778,384 (2002, Toppan) shows an example of an antenna module having a module antenna (8) and a contact pad (7);
-The coverage area is substantially 100%;
-Coil exposure is substantially 0%.

US Pat. No. 8,100,337 (2012, SPS) shows an example of an antenna module having a module antenna (13) and a contact pad (17);
-Coverage area is essentially 0%,
-Coil exposure is substantially 100%.

U.S. Pat. No. 8,100,337 discloses that problems may arise when the antenna is completely outside the area of the contact area, and proposes a solution as follows. ing.
Since the antenna turn 13 is located outside the area of the contact 17, there is no direct pressurization in the area located above the antenna turn 13, so that the responsibility for joining and the card There is a potential risk of bending of the substrate 27 that would impair the life, or at least the deterioration of the high quality bond between the winding 13 and the adhesive 31. In order to remedy this risk, the present invention provides, in a more advantageous variant, a plurality of protrusions 33 located in the area overlying the antenna winding 13 on the same side as the electrical contact 17. (5 columns, 7-18 rows)

Addressing the shielding problem The techniques disclosed in each of the following embodiments (examples) can be combined with each other as appropriate to arrive at an effective solution. The overall goal is to increase the read distance, which can (or cannot) result from a decrease in “coverage area” and an increase in “coil exposure”.

  FIG. 6A (corresponding to FIG. 2A of US Patent Application No. 61 / 693,262) shows a set of contact pads CP, at least some of the outer edges of the contact pads CP having their original perimeter (dashed line) The outer edge). The coil coverage in this example can be characterized as increasing from an initial 100% to over 100%, such as 110%. The coil exposure remains substantially 0% in this example. It is considered that extending the edge may have an adverse effect (reduction) on the reading distance.

  Extending the edges to increase the area of individual pads can be useful when using pads as interconnects to elements such as module antenna MA, capacitive elements, etc. on the underside of module tape MT. sell.

  For example, consider the following contact pad layout / assignment shown in FIG. 5A. Note that the contacts C4 and C8 can be connected to two ends (LA, LB) of the module antenna MA.

  FIG. 6B (corresponding to FIG. 2B of US Patent Application No. 61 / 693,262) shows a set of contact pads CP, at least some of the outer edges of the contact pads CP having their original perimeter Trimmed to be inside (outer edge shown by dashed line). The coil coverage in this example is reduced from, for example, an initial 100% to 90%. The coil exposure in this example is increased, for example, from an initial substantial 0% to 5%. The trimming of the edge is considered to have a slight good effect (increase) in the reading distance.

FIG. 6C (corresponding to FIG. 2C of US Patent Application No. 61 / 693,262) shows a set of contact pads CP where the inner edge of at least some adjacent ones of the contact pads CP is contact pads. Is trimmed to have the effect of increasing the gap between the selected ones. The coil coverage in this example is reduced from, for example, an initial 100% to 90%. The coil exposure in this example is increased, for example, from an initial substantial 0% to 5%. It is considered that the increase in the gap has a slight good effect (increase) in the reading distance.
* Original gap = about 150μm
* Changed gap = about 300μm

  FIG. 6D (corresponding to FIG. 2D of US Patent Application No. 61 / 693,262) shows an alternative to FIG. 6C, which does not increase the overall gap between adjacent contact pads, but has a lack of inner edges. Changed in a regular way. The coil coverage in this example is reduced from, for example, an initial 100% to 95%. The coil exposure in this example is increased, for example, from an initial substantial 0% to 3%. It is considered that the increase in the gap has a slight good effect (increase) in the reading distance.

  In the previous example described in FIGS. 6A, B, C, D above, some outer or inner edges belonging to some of the contact pads are shifted from the “original” position. Contrast with FIG. 5, which is an example of “original position”.

  In the following example, the edge of the contact pad generally remains completely in place, thereby substantially maintaining the most important design.

  FIG. 7A (corresponding to FIG. 3A of US Patent Application No. 61 / 693,262) shows an example of drilling holes or slots or the like in at least some of the contact pads. The coil coverage in this example is reduced from, for example, an initial 100% to 90%. The coil exposure in this example is increased, for example, from an initial substantial 0% to 5%. It is thought that the perforation of the contact pad has a good effect (increase) on the reading distance.

  In FIG. 7A, a regular array of a plurality of circular perforations (or holes) arranged in a row and column array is shown on one of the contact pads. The perforations can be arranged irregularly, staggered, alternately, pseudo-randomly, etc. The circular perforations have an exemplary diameter of 35 μm and can be arranged at 70 μm or 140 μm, or 40 μm exemplary pitch (offset 35 μm hole rows). Some of the perforations can be slots or elongated holes, as shown with another of the contact pads. Holes having other shapes such as rectangular, irregular, elongated, etc. can be formed in some of the contact pads.

  FIG. 7B (corresponding to FIG. 3B of US Patent Application No. 61 / 693,262) shows an example of thinning at least some selected areas of the contact pads. The coil coverage in this example is “effectively” reduced, for example, from an initial 100% to 95%. The coil exposure in this example is “effectively” increased, for example, from an initial substantial 0% to 2%. It is considered that the thinning of the contact pad has a good effect (increase) in the reading distance.

  In FIG. 7B, the module antenna MA is etched rather than the coil wire module antenna MA shown in FIG. 1, and is shown as having conductive lines (tracks).

  FIG. 8A (corresponding to FIG. 4A of US Patent Application No. 61 / 693,262) shows a module antenna MA and a chip CM disposed on the lower surface of the module tape MT. In this example, the module antenna MA is a wound coil of wire having two ends a and b that are joined to the respective joining pads BP.

  FIG. 8B (corresponding to FIG. 4B of US Patent Application No. 61 / 693,262) shows the face-up side of the module tape MT shown in FIG. 8A. Here, a pattern of holes or perforations is formed in the contact pad CP (contrast with FIG. 3A). The perforation pattern is arranged in concentric circles. This pattern will be visible to the user (of the smart card SC). The coil coverage in this example is “effectively” reduced, for example, from an initial 100% to 95%. The coil exposure in this example is “effectively” increased, for example, from an initial substantial 0% to 2%. It is considered that the perforation of the contact pad of this method has a good effect (increase) in the reading distance.

  FIG. 9A (corresponding to FIG. 5A of US Patent Application No. 61 / 693,262) shows another example of perforating the contact pad CP. In this example, the perforations are visible and arranged in a logo pattern, such as the Chase Bank logo.

  FIG. 9B (corresponding to FIG. 5B of US Patent Application No. 61 / 693,262) shows another example of perforating the contact pad CP. In this example, the perforations are visible and placed in a logo pattern, such as the Deutsche Bank logo.

  The contact pad perforation pattern is visible to the user and mimics or complements the perforation 324 (eg, a smaller version thereof, or a continuation thereof) surrounding the window opening 320 of the face plate 302 in the metallized card. Can be formed.

  In the example described above, the contact pad CP of the antenna module AM was changed for the purpose of increasing the reading distance (between the module antenna MA and the booster antenna BA, which may be caused by the contact pad CP). By reducing the decay of the coupling). In some cases, coil coverage (or effective coil coverage) is reduced and coil exposure (or effective coil exposure) is increased. In some examples, a contact pad that includes an inner edge and an outer edge maintains its original position. In some examples, the most important design of the contact pad is maintained. Larger gaps between the contact pads that result in more coil exposure and perforation of the contact pads CP can improve the read distance.

Some other aspects of the antenna module AM FIG. 10A (corresponding to FIG. 6A of US patent application 61 / 693,262) shows the underside of the module tape MT for the antenna module AM. The antenna structure AS of the module antenna MA is shown and includes two module antenna segments MA1 and MA2. Two module antenna segments MA1 and MA2 are shown. These two module antenna segments MA1, MA2 can be arranged concentrically with each other as an inner antenna structure and an outer antenna structure. Both module antenna segments MA1, MA2 can be wound coils or patterned tracks, or one can be a wound coil and the other a track pattern. The two module antenna segments MA1, MA2 can be interconnected with each other in any suitable manner to achieve effective results. For example, the two module antenna segments MA1, MA2 can be connected to each other in any suitable manner.

FIG. 10B (corresponding to FIG. 5A of US Patent Application No. 61 / 693,262) can be used in the antenna module AM and is two segments interconnected with each other (contrast MA1, MA2). Shows an exemplary antenna structure AS having the antenna structure:
An outer segment OS having an outer end 7 and an inner end 8;
-An inner segment IS having an outer end 9 and an inner end 10;
The outer end 7 of the outer segment OS is connected to the inner end 10 of the inner segment IS;
The inner end 8 of the outer segment OS and the outer end 9 of the inner segment IS remain unconnected,
This forms what is sometimes referred to as a “pseudodipole” antenna structure AS.
Contrast with FIG. 1A.
○ Such a configuration is based on US patent application Ser. No. 13 / 205,600 filed on Aug. 8, 2011 (US patent application) for use as a booster antenna BA in a card body CB of a smart card SC. Publication 2012/0038445, Feb. 16, 2012).
○ Such a configuration is based on US patent application Ser. No. 13 / 310,718 filed on Dec. 3, 2011 (US patent application) for use as a booster antenna BA in a card body CB of a smart card SC. Publication 2012/0074233, March 29, 2012).

  The contact pad CP and antenna structure AS described herein uses laser etching (separation technique) of the copper clad “seed” layer of the module tape MT using a UV nanosecond or picosecond laser. Can be formed. The seed layer can have a thickness of about 17 μm. With respect to the antenna structure AS, the space between the tracks can be dimensionally equal to the width of the laser beam, ie about 30 μm. The track itself can have a width of 30-50 μm. Perforations such as those described above can be formed by laser shock drilling.

After laser etching the copper seed layer to pattern and / or drill the contact pad CP or antenna structure AS, the module tape MT can be further processed as follows.
-Sand blasting to remove residual laser removal particles and prepare for plating adhesion,
-Deposition of carbon to support vertical interconnect through-hole plating,
-Dry film application and photo masking process,
-Electrodeposition of copper (Cu≈6 μm) to increase the thickness of the patterned seed layer (for CP or AS) on both sides of the tape,
-Nickel and nickel phosphorus (Ni / NiP≈9 μm) or nickel (Ni≈9 μm) and palladium / gold or gold (Pd / Au or Au—0.1 μm / 0.03 μm or 0. 0 to prevent oxidation. 2 μm) electroless plating.

Although the invention has been described with respect to a limited number of embodiments, they should not be construed as limiting the scope of the invention, but rather as examples of some of the embodiments. It is. Those skilled in the art can envision other possible variations, modifications, and implementations that are still within the scope of the present invention based on the present disclosure as described herein.

Claims (15)

  Card body with a metallized face plate (202, 302) having window openings (220, 320) for receiving an antenna module (AM) and a booster antenna (BA) including a coupler coil (CC) CB), wherein the window opening has a baseline size approximately equal to the size of the antenna module, and the window opening is substantially larger than the antenna module. Smart card featuring.   The smart card of claim 1, wherein the window opening is at least 10% larger than the antenna module. A gap (GAP) between the inner edge of the window opening and the antenna module
The smart card of claim 1, further comprising: Ferrite layer (204) disposed between the face plate and the booster antenna
The smart card of claim 1, further comprising: A plurality of perforations (322, 324) in the face plate (320) extending around at least one of the window opening (320) and the periphery of the face plate
The smart card of claim 1, further comprising:   At least some of the perforations reduce the amount of face plate material in the area surrounding the window opening or the amount of face plate material around the periphery of the face plate by 25-50%; The smart card according to claim 5. Compensation loop (CL) disposed behind the booster antenna (BA)
The smart card of claim 1, further comprising: The compensation loop (CL) has the following characteristics: the compensation loop (CL) has a gap and two free ends;
The compensation loop (CL) comprises a conductive material such as copper;
The compensation loop (CL) comprises at least one of including ferrite;
The smart card according to claim 7. The following features, that is, ferrite disposed at a pivotal location in the card body (CB),
The booster antenna (BA) is configured as a pseudo dipole without a coupler coil (CC);
The booster antenna (BA) is configured as a pseudo dipole with a coupler coil (CC);
The booster antenna (BA) includes an extension;
The booster antenna (BA) includes two overlapping booster antennas;
The booster antenna (BA) is mainly provided in the upper part of the smart card;
The smart card of claim 1, further comprising at least one of the module antenna (MA) being offset from the coupler coil. The following features: a ferrite element (FE) disposed between the module antenna (MA) and the contact pad (CP) of the antenna module (AM);
A capacitive stub added to the module antenna (MA);
The module antenna (MA) includes two separate coils;
The smart card of claim 1, further comprising at least one of: said module antenna (MA) comprising two windings connected in a pseudo-dipole configuration. The smart card according to claim 1, further comprising perforations of the contact pad (CP) of the antenna module (AM). A method of minimizing coupling attenuation by a face plate (202, 302) of a metallized smart card having a booster antenna (BA) with a coupler coil (CC) in the card body (CB),
Making a window opening (220) in the face plate larger than the antenna module (AM);
Providing a perforation through the face plate;
One or more of: providing a ferrite material between the face plate and the booster antenna (BA); and disposing a compensation loop (CL) under the booster antenna (BA). Including a method. The method of claim 12, further comprising offsetting the antenna module (AM) with respect to the coupler coil (CC). Arranging the booster antenna (BA) as a pseudo-dipole;
A step of providing a capacitive stub in the module antenna (MA), and a step of providing a ferrite between the module antenna (MA) and the contact pad (CP) in the antenna module (AM). The method of claim 12, further comprising one or more. The method of claim 12, further comprising: trimming or punching the contact pad (CP) of the antenna module (AM).

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