FR3089090B1 - Manufacturing process of a flexible module and obtained module - Google Patents
Manufacturing process of a flexible module and obtained module Download PDFInfo
- Publication number
- FR3089090B1 FR3089090B1 FR1871703A FR1871703A FR3089090B1 FR 3089090 B1 FR3089090 B1 FR 3089090B1 FR 1871703 A FR1871703 A FR 1871703A FR 1871703 A FR1871703 A FR 1871703A FR 3089090 B1 FR3089090 B1 FR 3089090B1
- Authority
- FR
- France
- Prior art keywords
- contacts
- module
- conductive
- conductive layer
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Details Of Aerials (AREA)
- Manufacture Of Switches (AREA)
Abstract
L’invention concerne un procédé pour fabriquer un module destiné à un objet portatif ayant au moins une fonction avec contact et une fonction sans contact comportant en combinaison au moins les étapes suivantes :Disposer d’un ensemble (10) comprenant un support flexible sur lequel est disposé sur au moins une de ses faces une couche conductrice et sur au moins une face opposée une zone conductrice de contacts,Graver la couche conductrice afin de définir une forme configurée pour former une ou plusieurs pistes conductrices, Réaliser dans le support flexible un ou plusieurs orifices (6) destinés à des connexions, sans attaquer la zone conductrice portant les contacts,Déposer un circuit intégré (7) sur la face du flexible opposée à la face portant les contacts,Relier électriquement la puce à la zone conductrice portant les contacts et/ou à la couche conductrice. Figure pour l’abrégé : Fig. 5The invention relates to a method for manufacturing a module for a portable object having at least one contact function and one contactless function comprising in combination at least the following steps: Providing an assembly (10) comprising a flexible support on which is arranged on at least one of its faces a conductive layer and on at least one opposite face a conductive zone of contacts, Etch the conductive layer in order to define a shape configured to form one or more conductive tracks, Produce in the flexible support one or more several holes (6) intended for connections, without attacking the conductive zone carrying the contacts, Place an integrated circuit (7) on the side of the flexible pipe opposite the side carrying the contacts, Electrically connect the chip to the conductive zone carrying the contacts and / or to the conductive layer. Figure for the abstract: Fig. 5
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1871703A FR3089090B1 (en) | 2018-11-22 | 2018-11-22 | Manufacturing process of a flexible module and obtained module |
SG11202103718SA SG11202103718SA (en) | 2018-11-22 | 2019-11-21 | Process for producing a flexible module and module obtained |
PCT/EP2019/082042 WO2020104574A1 (en) | 2018-11-22 | 2019-11-21 | Process for producing a flexible module and module obtained |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1871703A FR3089090B1 (en) | 2018-11-22 | 2018-11-22 | Manufacturing process of a flexible module and obtained module |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3089090A1 FR3089090A1 (en) | 2020-05-29 |
FR3089090B1 true FR3089090B1 (en) | 2021-03-19 |
Family
ID=67441159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1871703A Active FR3089090B1 (en) | 2018-11-22 | 2018-11-22 | Manufacturing process of a flexible module and obtained module |
Country Status (3)
Country | Link |
---|---|
FR (1) | FR3089090B1 (en) |
SG (1) | SG11202103718SA (en) |
WO (1) | WO2020104574A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2785071B1 (en) * | 1998-10-26 | 2002-10-25 | Gemplus Card Int | METHOD FOR MANUFACTURING A CHIP CARD AND AN ELECTRONIC MODULE TO BE INSERTED IN SUCH A CARD |
JP2015513712A (en) * | 2012-01-23 | 2015-05-14 | フェイニクス アマテック テオランタ | Metallized smart card shielding cancellation and increased coupling |
FR2992761B1 (en) * | 2012-07-02 | 2015-05-29 | Inside Secure | METHOD FOR MANUFACTURING CONTACTLESS MICROCIRCUIT |
DE102016107982A1 (en) * | 2016-04-29 | 2017-11-02 | Infineon Technologies Ag | Smart card module, smart card and method for forming a smart card module |
-
2018
- 2018-11-22 FR FR1871703A patent/FR3089090B1/en active Active
-
2019
- 2019-11-21 WO PCT/EP2019/082042 patent/WO2020104574A1/en active Application Filing
- 2019-11-21 SG SG11202103718SA patent/SG11202103718SA/en unknown
Also Published As
Publication number | Publication date |
---|---|
FR3089090A1 (en) | 2020-05-29 |
WO2020104574A1 (en) | 2020-05-28 |
SG11202103718SA (en) | 2021-05-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6307612B2 (en) | Tear conductivity sensor | |
EP2741332A3 (en) | Array substrate and method of fabricating the same | |
US11367701B2 (en) | Apparatus and method for securing substrates with varying coefficients of thermal expansion | |
TW200620676A (en) | Thin film transistor and its manufacturing method | |
FR3095287B1 (en) | Biometric sensor module for smart card and method of manufacturing such a module | |
ES2192347T3 (en) | RELAY FOR MICRO ELECTRO-MECHANICAL SYSTEMS. | |
US9796584B2 (en) | Method for fabricating a micro-well of a biosensor | |
RU2017102892A (en) | CRYSTAL OF ELECTROCHEMICAL SENSITIVE ELEMENT | |
US20160074659A1 (en) | Flexible artificial retina device | |
FR3089090B1 (en) | Manufacturing process of a flexible module and obtained module | |
EP4092730A3 (en) | Production of electronic chips | |
BRPI0515713A (en) | semiconductor structure, method for forming a semiconductor device and fluid ejection device | |
JP2015163874A (en) | Fluid sensor with backside of sensor die contacting header | |
FR3079616B1 (en) | MICRO-SENSOR FOR DETECTING CHEMICAL SPECIES AND ASSOCIATED MANUFACTURING PROCESS | |
FR3088515B1 (en) | ELECTRONIC MODULE FOR CHIP CARD | |
FR2387515A1 (en) | CONTACT FORMATION PROCESS FOR AN INTEGRATED CIRCUIT | |
ATE297316T1 (en) | IMAGE PRODUCING DEVICE | |
CN109299630B (en) | Semiconductor fingerprint sensor and manufacturing method thereof | |
KR101210138B1 (en) | Wafer level pakage of mems senser and method for manufacturing the same | |
EP1699087A4 (en) | Semiconductor device and its manufacturing method | |
FR3086082B1 (en) | METHOD OF CONNECTING AN INTEGRATED CIRCUIT TO AN ELECTRICAL CIRCUIT | |
KR20180049855A (en) | Electrostatic chuck and electrostatic adsorption apparatus | |
JP2004219370A (en) | Experiment chip, and manufacturing method of experiment chip | |
PE20221212A1 (en) | SOLID-LIQUID-SOLID HYDROMETALLURGICAL PROCEDURE OPTIMIZED TO INCREASE THE SOLUBILIZATION OF METALS FROM MINERALS AND/OR CONCENTRATES IN ACID CHLORIDED MEDIUM | |
CN109299629B (en) | Semiconductor fingerprint sensor and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20200529 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |