CN104412706B - 电子元件的封装方法以及基板接合体 - Google Patents

电子元件的封装方法以及基板接合体 Download PDF

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Publication number
CN104412706B
CN104412706B CN201380031524.0A CN201380031524A CN104412706B CN 104412706 B CN104412706 B CN 104412706B CN 201380031524 A CN201380031524 A CN 201380031524A CN 104412706 B CN104412706 B CN 104412706B
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China
Prior art keywords
substrate
inorganic material
material layer
electronic component
mentioned
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CN201380031524.0A
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Chinese (zh)
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CN104412706A (zh
Inventor
须贺唯知
松本好家
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Qinghe Jingyuan Japan Co ltd
Yorozu Yuchi
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Taiyo Yuden Co Ltd
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Publication of CN104412706A publication Critical patent/CN104412706A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/872—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN201380031524.0A 2012-06-15 2013-06-14 电子元件的封装方法以及基板接合体 Active CN104412706B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012135898 2012-06-15
JP2012-135898 2012-06-15
PCT/JP2013/066446 WO2013187500A1 (ja) 2012-06-15 2013-06-14 電子素子の封止方法及び基板接合体

Publications (2)

Publication Number Publication Date
CN104412706A CN104412706A (zh) 2015-03-11
CN104412706B true CN104412706B (zh) 2017-05-31

Family

ID=49758318

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380031524.0A Active CN104412706B (zh) 2012-06-15 2013-06-14 电子元件的封装方法以及基板接合体

Country Status (5)

Country Link
US (1) US9331305B2 (enExample)
JP (2) JP5704619B2 (enExample)
KR (1) KR102082954B1 (enExample)
CN (1) CN104412706B (enExample)
WO (1) WO2013187500A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6409287B2 (ja) * 2014-02-28 2018-10-24 株式会社リコー 有機エレクトロルミネッセンス発光装置および有機エレクトロルミネッセンス発光装置の製造方法、並びに画像形成装置
US9870922B2 (en) * 2014-04-25 2018-01-16 Tadatomo Suga Substrate bonding apparatus and substrate bonding method
CN104600222B (zh) * 2015-02-04 2016-10-19 京东方科技集团股份有限公司 封装方法、显示面板及显示装置
JP2017041412A (ja) * 2015-08-21 2017-02-23 富士フイルム株式会社 電子装置
JP6651224B2 (ja) * 2016-02-24 2020-02-19 パイオニア株式会社 発光装置の製造方法及び発光装置
JP6427712B2 (ja) * 2016-03-25 2018-11-21 日本碍子株式会社 接合方法
KR102369369B1 (ko) * 2017-08-04 2022-03-02 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP7045186B2 (ja) 2017-12-28 2022-03-31 ランテクニカルサービス株式会社 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス
CN110504160A (zh) * 2018-05-16 2019-11-26 梁剑波 半导体器件的制造方法和半导体器件
JP2020091962A (ja) * 2018-12-03 2020-06-11 ランテクニカルサービス株式会社 デバイス封止方法
JP6848008B2 (ja) * 2019-06-06 2021-03-24 マレリ株式会社 接合方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003323974A (ja) * 2002-04-30 2003-11-14 Casio Comput Co Ltd Ｅｌパネル及びその製造方法
JP2005347204A (ja) * 2004-06-07 2005-12-15 Canon Inc 有機ｅｌ素子及びその製造方法
US20070210702A1 (en) * 2006-03-08 2007-09-13 Akio Nakamura Organic electroluminescence panel and manufacturing method of the same
CN101257036A (zh) * 2007-02-28 2008-09-03 株式会社日立显示器 有机el显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
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JPH0379757A (ja) * 1989-08-23 1991-04-04 Toshiba Corp 真空蒸着による成膜方法とその装置
JP4194771B2 (ja) * 2001-06-29 2008-12-10 オリンパス株式会社 加熱治療装置
KR100442830B1 (ko) * 2001-12-04 2004-08-02 삼성전자주식회사 저온의 산화방지 허메틱 실링 방법
US20040232535A1 (en) * 2003-05-22 2004-11-25 Terry Tarn Microelectromechanical device packages with integral heaters
JP4737542B2 (ja) * 2006-06-28 2011-08-03 凸版印刷株式会社 有機ｅｌパネル
EP1986230A2 (en) * 2007-04-25 2008-10-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing SOI substrate and method of manufacturing semiconductor device
JP5442224B2 (ja) * 2007-07-23 2014-03-12 株式会社半導体エネルギー研究所 Ｓｏｉ基板の製造方法
JP2009199957A (ja) * 2008-02-22 2009-09-03 Seiko Epson Corp 有機発光装置および電子機器
JP2010140980A (ja) * 2008-12-10 2010-06-24 Sony Corp 機能性有機物素子及び機能性有機物装置
US8563113B2 (en) * 2010-04-20 2013-10-22 Corning Incorporated Multi-laminate hermetic barriers and related structures and methods of hermetic sealing
JP2012033729A (ja) * 2010-07-30 2012-02-16 Kyocera Corp 半導体層接合基板の製造方法および発光素子
JP2012089828A (ja) * 2010-09-22 2012-05-10 Toshiba Corp 半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003323974A (ja) * 2002-04-30 2003-11-14 Casio Comput Co Ltd Ｅｌパネル及びその製造方法
JP2005347204A (ja) * 2004-06-07 2005-12-15 Canon Inc 有機ｅｌ素子及びその製造方法
US20070210702A1 (en) * 2006-03-08 2007-09-13 Akio Nakamura Organic electroluminescence panel and manufacturing method of the same
CN101257036A (zh) * 2007-02-28 2008-09-03 株式会社日立显示器 有机el显示装置

Also Published As

Publication number Publication date
WO2013187500A1 (ja) 2013-12-19
JP2015111596A (ja) 2015-06-18
JP5704619B2 (ja) 2015-04-22
US9331305B2 (en) 2016-05-03
KR102082954B1 (ko) 2020-02-28
KR20150032252A (ko) 2015-03-25
CN104412706A (zh) 2015-03-11
US20150171365A1 (en) 2015-06-18
JP6196993B2 (ja) 2017-09-13
JPWO2013187500A1 (ja) 2016-02-08

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Effective date of registration: 20240805

Address after: Tokyo, Japan

Patentee after: Yorozu Yuchi

Country or region after: Japan

Patentee after: Qinghe Jingyuan (Japan) Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: Yorozu Yuchi

Country or region before: Japan

Patentee before: LAN TECHNICAL SERVICE CO.,LTD.