CN104409604A - 一种新型led支架制作方法及封装的应用 - Google Patents

一种新型led支架制作方法及封装的应用 Download PDF

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CN104409604A
CN104409604A CN201410708590.3A CN201410708590A CN104409604A CN 104409604 A CN104409604 A CN 104409604A CN 201410708590 A CN201410708590 A CN 201410708590A CN 104409604 A CN104409604 A CN 104409604A
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rubber material
plastic rubber
encapsulation
manufacture method
application
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CN104409604B (zh
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龚文
邵鹏睿
周姣敏
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Suzhou Kinglight Optoelectronics Co ltd
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SHENZHEN JINGTAI CO Ltd
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Priority to TW104103393A priority patent/TWI642210B/zh
Publication of CN104409604A publication Critical patent/CN104409604A/zh
Priority to PCT/CN2015/078770 priority patent/WO2016086604A1/zh
Priority to KR1020167025690A priority patent/KR20180015051A/ko
Priority to US15/532,139 priority patent/US20170271560A1/en
Priority to JP2016557944A priority patent/JP2018501632A/ja
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Abstract

本发明公开了一种新型LED支架制作方法及封装的应用，包括：金属支架端子；固定在所述金属支架端子上的LED芯片；用于连接所述金属支架端子表面与所述LED芯片的键合线；保护所述LED芯片的封装胶；还包括：覆盖在所述金属支架端子表面的塑胶料；包裹所述金属支架端子的塑胶料反射杯；所述金属支架端子包括镶嵌在所述塑胶料反射杯内的金属引脚和设置在所述塑胶料反射杯外部的金属管脚，其中所述金属引脚设置有功能区和非功能区。本发明通过增大塑胶料与封装胶水的结合面积，提升了LED结构的气密性；同时塑胶料覆盖与金属引脚功能区相结合处的缝隙，提高了LED产品的防潮性能和可靠性能，并延长了使用寿命。

Description

一种新型LED支架制作方法及封装的应用
技术领域
本发明涉及LED支架技术领域，更具体的说是涉及一种新型LED支架制作方法及封装的应用。
背景技术
随着户内外LED显示应用技术及照明技术的快速发展，目前使用的是显示屏用表面贴装型LED器件，但是性能尤其在可靠性方面不能满足市场上的使用要求。
显示屏及照明用表面贴装型LED器件，特别是户外用的LED器件对环境的适应性要求很高，需要具有优秀的防潮性能、耐高低温性能。但是，目前LED显示屏仍然维持较高的失效率，造成原因之一为封装胶体与反射杯内物料剥离。而照明产品也存在硫化及失效现象，支架端子与塑胶料结合处的管脚气密性是造成硫化及失效原因之一，由于LED器件由多种原物料封装成型，每种物料经过高温环境下的热膨胀系数不一样，导致封装胶体和反射杯内金属片结合处更容易造成剥离，从而使连接LED芯片的支架引线框的键合线断裂或者由于潮气的进入器件内部引起失效等。在通常情况下，反射杯底的金属区域面积往往占大部分面积，从材料特性分析金属和胶水的结合性不强，所以在吸潮和热胀冷缩时，胶水和金属往往会发生剥离，使得键合线断裂或者芯片拔起从而导致失效。而支架端子与塑胶结合气密性不好导致外界硫元素及氧气从支架管脚处进入杯体与端子表面银层发生反应而变黑
因此，如何解决LED产品的防潮性能差、密封性能不好以及提升LED产品的可靠性能是本领域技术人员亟需解决的问题。
发明内容
有鉴于此，本发明提供了一种新型LED支架制作方法及封装的应用，不仅通过增大塑胶料与封装胶水的结合面积，提升了LED结构的气密性，而且利用塑胶料覆盖与金属引脚功能区相结合处的缝隙，提高了LED产品的防潮性能和可靠性能，并延长了使用寿命。
为了实现上述目的，本发明提供如下技术方案：
一种新型LED支架制作方法及封装的应用，包括：金属支架端子；固定在所述金属支架端子上的LED芯片；用于连接所述金属支架端子表面与所述LED芯片的键合线；保护所述LED芯片的封装胶；还包括：覆盖在所述金属支架端子表面的塑胶料；包裹所述金属支架端子的塑胶料反射杯；所述金属支架端子包括镶嵌在所述塑胶料反射杯内的金属引脚和设置在所述塑胶料反射杯外部的金属管脚，其中所述金属引脚设置有功能区和非功能区。
优选的，在上述一种新型LED支架制作方法及封装的应用中，所述金属支架端子的材质可以为铜材、铁材或铝材，并且在所述金属支架端子表面镀上金、银、锡、镍其中的一种或者几种混合。
优选的，在上述一种新型LED支架制作方法及封装的应用中，其特征在于，通过注塑机与模具配合在所述金属引脚的非功能区表面注塑一层塑胶料增大所述塑胶料反射杯内塑胶料的面积，塑胶料覆盖与所述金属引脚功能区相结合处的缝隙，同时塑胶料的形状是根据所述LED芯片大小和所述键合线连接方式决定的，可以是圆形、方形、菱形及不规则形状，且塑胶料的材质可为PPA、PCT、EMC、SMC其中的一种或几种混合。
优选的，在上述一种新型LED支架制作方法及封装的应用中，所述金属引脚非功能区的塑胶料在不影响所述LED芯片邦定和所述键合线连接的条件下，与保护所述LED芯片的所述封装胶相结合。
优选的，在上述一种新型LED支架结构及封装的应用中，其特征在于，所述金属引脚非功能区的塑胶料填充高度在0.03-1.0mm之间，且高于所述金属引脚功能区，同时填充各个非功能区塑胶高度为不规则平面，与功能区接触部分的倾斜角度在30-90度之间。
优选的，在上述一种新型LED支架结构及封装的应用中，所述金属支架端子和所述塑胶料反射杯结合形成基座的形状可以为正方体、长方体、圆柱体或其它不规则的形状。
优选的，在上述一种新型LED支架结构及封装的应用中，所述塑胶料反射杯整体外型可以为不规则形状，杯口可以为圆形、方形、或者方形四角进行圆角处理，内壁可以为规则或不规则形状，同时所述塑胶料反射杯的材质可为PPA、PCT、EMC、SMC其中的一种或几种混合。
优选的，在上述一种新型LED支架结构及封装的应用中，所述键合线为金线、铜线、银线、铝线、金包银线、合金线其中的一种或几种混合。
优选的，在上述一种新型LED支架制作方法及封装的应用中，所述LED芯片可以为单颗、双颗、多颗组成，发光颜色可以为单色、双色、多色其中的一种或几种组合。
优选的，在上述一种新型LED支架制作方法及封装的应用中，所述封装胶可以为环氧树脂、硅树脂、硅胶，且封装胶体里面也可加入成份为二氧化硅类的扩散粉或者荧光粉，荧光粉的成份可为氮化物、硅酸盐、钾化铬、镥化铬。
经由上述的技术方案可知，与现有技术相比，本发明公开提供了在不影响LED器件在通电情况下的散热问题，使得塑胶料反射杯底部杯体中塑胶料与封装胶结合面积最大化，提高了LED产品的密封性能；同时改变了传统LED支架的功能区平面结构的设计，通过增大塑胶料与封装胶水的结合面积，提高封装胶水与塑胶料反射杯区域的结合性；另外金属引脚非功能区的塑胶料将与功能区相结合处的缝隙给遮盖掉，降低水汽从金属引脚与塑胶结合处渗入的速度，从结构上真正的提高了LED产品的防潮性能和密性性能，实现了LED的高可靠性能，以及延长了使用寿命。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1附图为传统LED支架结构示意图。
图2附图为本发明的结构示意图。
图3附图为本发明管脚结构示意图。
在图1中：
1’为金属支架端子、2’LED芯片、3’为键合线、4’为封装胶、5’塑胶料、6’为塑胶料反射杯、11’金属引脚。
在图2中：
2为LED芯片、3为键合线、4为封装胶、5为塑胶料、6为塑胶料反射杯、11为金属引脚。
在图3中：
1为金属支架端子、5为塑胶料、12为金属管脚。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例公开了一种新型LED支架制作方法及封装的应用，不仅通过增大塑胶料与封装胶水的结合面积，提升了LED结构的气密性，而且利用塑胶料覆盖与金属引脚功能区相结合处的缝隙，提高了LED产品的防潮性能和可靠性能，并延长了使用寿命。
下面将结合说明书附图中的图1、图2和图3进行说明，本发明为一种新型LED支架结构及封装的应用，具体包括：金属支架端子1；固定在金属支架端子1上的LED芯片2；用于连接金属支架端子1表面与LED芯片2的键合线3；保护LED芯片2的封装胶4；还包括：覆盖在金属支架端子1表面的塑胶料5；包裹金属支架端子1的塑胶料反射杯6；金属支架端子1包括镶嵌在塑胶料反射杯6内的金属引脚11和设置在塑胶料反射杯6外部的金属管脚12，其中金属引脚11设置有功能区和非功能区。
为了进一步优化上述技术方案，金属支架端子1的材质可以为铜材、铁材或铝材等等，并且在金属支架端子1表面镀上金、银、锡、镍等其中的一种或者几种混合。
为了进一步优化上述技术方案，通过注塑机与模具配合在金属引脚11的非功能区表面注塑一层塑胶料增大塑胶料反射杯6内塑胶料的面积，且塑胶料覆盖与金属引脚11功能区相结合处的缝隙，可以降低水汽从金属管脚12与塑胶料结合处渗入速度，提高了产品的防潮性能，同时塑胶料的形状是根据LED芯片2大小和键合线3连接方式决定的，因而塑胶料的形状可以是圆形、方形、菱形及不规则形状，且塑胶料的材质可为PPA、PCT、EMC、SMC其中的一种或几种混合。
为了进一步优化上述技术方案，金属引脚11非功能区的塑胶料在不影响LED芯片2邦定和键合线3连接的条件下，与保护LED芯片2的封装胶4相结合，做到了塑胶料反射杯6内的塑胶料与封装胶4结合的面积最大化，同时保证不减少塑胶料反射杯内金属片实际面积，提高了封装胶4与塑胶料反射杯6区域的结合性，提高了产品的气密性。
为了进一步优化上述技术方案，所述金属引脚11非功能区的塑胶料填充高度在0.03-1.0mm之间，高于功能区金属引脚，且填充的各个非功能区塑胶料高度为不规则，如表面平整面、高低不平面、与功能区接触部分倾斜角度在30-90度之间。
为了进一步优化上述技术方案，所述支架端子1和所述塑胶料反射杯6结合成的基座形状可以为正方体、长方体、圆柱体或其它不规则的形状等。
为了进一步优化上述技术方案，所述塑胶料反射杯6整体外型可以为不规则形状，杯口可以为圆形、方形、或者方形四角进行圆角处理，内壁也可为规则或不规则形状的。
为了进一步优化上述技术方案，塑胶料反射杯6的材质为PPA、PCT、EMC、SMC等其中的一种或几种混合。
为了进一步优化上述技术方案，键合线3为金线、铜线、银线、铝线、金包银线、合金线等其中的一种或几种混合。
为了进一步优化上述技术方案，所述LED芯片2可以为单颗、双颗、多颗组成，发光颜色可以为单色、双色、多色等其中的一种或几种组合。
为了进一步优化上述技术方案，所述封装胶4可以为环氧树脂、硅树脂、硅胶等，且封装胶体里面也可加入成份为二氧化硅或硅石等扩散粉或者荧光粉，荧光粉的成份可为氮化物、硅酸盐、钾化铬、镥化铬等。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。对于实施例公开的装置而言，由于其与实施例公开的方法相对应，所以描述的比较简单，相关之处参见方法部分说明即可。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (10)

1.一种新型LED支架制作方法及封装的应用，包括：金属支架端子(1)；固定在所述金属支架端子(1)上的LED芯片(2)；用于连接所述金属支架端子(1)表面与所述LED芯片(2)的键合线(3)；保护所述LED芯片(2)的封装胶(4)；其特征在于，还包括：覆盖在所述金属支架端子(1)表面的塑胶料(5)；包裹所述金属支架端子(1)的塑胶料反射杯(6)；所述金属支架端子(1)包括镶嵌在所述塑胶料反射杯(6)内的金属引脚(11)和设置在所述塑胶料反射杯(6)外部的金属管脚(12)，其中所述金属引脚(11)设置有功能区和非功能区。
2.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述金属支架端子(1)的材质可以为铜材、铁材或铝材，并且在所述金属支架端子(1)表面镀上金、银、锡、镍其中的一种或者几种混合。
3.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，通过注塑机与模具配合在所述金属引脚(11)的非功能区表面注塑一层塑胶料增大所述塑胶料反射杯(6)内塑胶料的面积，塑胶料覆盖与所述金属引脚(11)功能区相结合处的缝隙，同时塑胶料的形状是根据所述LED芯片(2)大小和所述键合线(3)连接方式决定的，可以是圆形、方形、菱形及不规则形状，且塑胶料的材质可为PPA、PCT、EMC、SMC其中的一种或几种混合。
4.根据权利要求1或3所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述金属引脚(11)非功能区的塑胶料在不影响所述LED芯片(2)邦定和所述键合线(3)连接的条件下，与保护所述LED芯片(2)的所述封装胶(4)相结合。
5.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述金属引脚(11)非功能区的塑胶料填充高度在0.03-1.0mm之间，且高于所述金属引脚(11)功能区，同时填充各个非功能区塑胶高度为不规则平面，与功能区接触部分的倾斜角度在30-90度之间。
6.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述金属支架端子(1)和所述塑胶料反射杯(6)结合形成基座的形状可以为正方体、长方体、圆柱体或其它不规则的形状。
7.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述塑胶料反射杯(6)整体外型可以为不规则形状，杯口可以为圆形、方形、或者方形四角进行圆角处理，内壁可以为规则或不规则形状，同时所述塑胶料反射杯(6)的材质可为PPA、PCT、EMC、SMC其中的一种或几种混合。
8.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述键合线(3)可为金线、铜线、银线、铝线、金包银线、合金线其中的一种或几种混合。
9.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述LED芯片(2)可以为单颗、双颗、多颗组成，发光颜色可以为单色、双色、多色其中的一种或几种组合。
10.根据权利要求1所述的一种新型LED支架制作方法及封装的应用，其特征在于，所述封装胶(4)可以为环氧树脂、硅树脂、硅胶，且封装胶体里面也可加入成份为二氧化硅、硅石的扩散粉或者荧光粉，荧光粉的成份可为氮化物、硅酸盐、钾化铬、镥化铬。
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