M411666 五、新型說明： 【新型所屬之技術領域】M411666 V. New description: [New technology field]
At本創作係有關一種發光二極體封裝結構改良，尤指一種 %夠增加顏色對比’使發光二極體之亮度及顏色更加鮮明之 發光二極體封裴結構改良。 【先前技術】 近年^ ’ 由於發光二極體（Light Emitting Diode, LED) 具有耗電量低、元件壽命長、無賴料間及反應速度快等 優點’加上其體積小、耐震動、適合量產，容易配合應用需 求而製成極小或陣列式的元件，因此發光二極體已普遍使用 於資訊、通訊及消費性電子產品的指示燈與顯示裝置上，如 行動電話及個人數位助理（Personal Digital Assistant， PDA)螢幕背光源、各種戶外顯示器、交通號誌燈及車燈等。 以戶外顯示器來說，由於其環境光源種類繁多，這些環 -境光往往會對顯示器内部之發光二極體所發出的光線造成影 •響，並降低其可識度。為使發光二極體所發出的光線較為清 晰可見，一般用來作為戶外顯示器之發光光源的發光二極 體，其在封襄結構上具有別於一般常見之發光二極體封裝結 構的設計’以增加顏色對比’使發光二極體之亮度及顏色更 加鮮明。 為達上述效果’目前坊間有以下兩種做法： 1.在形成膠座的塑料中摻入黑色顏料，以形成黑色的踢 座；但此種黑色膠座會影響發光二極體封裝結構的出光效率。 3 M411666 2.以人工刷墨的方式在膠座表面上塗佈一層黑色顏 料，以作為塗佈層；然而，這種以人工在膠座表面上進行刷 墨以形成塗佈層的方式，不但不符合現今工業的自動化生產 趨勢，更容易因人為因素而導致塗佈層塗佈不均而使產品良 率下降。 故出現一種如台灣專利公開號第200952204號，專利名 稱「發光二極體封裝結構及封裝方法」，其係以射出成型的 方式來取代先前技術中必須以人工於膠座表面進行刷墨來形 成塗佈層的方式，如第一圖所示，其包括膠座11、發光二極 體晶片12、封裝膠體13以及兩支引腳14。其中，膠座11包 括第一基底111與第二基底112，且第一基底111具有凹陷 部113。第二基底112則是覆蓋住第一基底111上方表面。 發光二極體晶片12是放置於第一基底的凹陷部113内，而與 各引腳14的一端電性連接。封裝膠體13是配置於膠座11上 而覆蓋住凹陷部113以及各引腳14與發光二極體晶片12電 性連接的一端；其中，該第二基底112的顏色較第一基底111 的顏色為深。也就是說，第二基底112的組成材料亦包括可 吸收多數色光的顏料，如黑色顏料。 該種習有封裝結構雖以射出成型的方式來取代先前技術 中以人工於膠座表面進行刷墨的方式，可有效地提高發光二 極體封裝結構的產能及良率；惟，該第二基底112係僅覆蓋 於該第一基底111上方表面，該第一基底111側面仍曝露於 環境中，外部環境光線會對内部之發光二極體晶片所發出的 光線造成影響，並降低其可識度。 M411666 【新型内容】 有鑑於此，本創作之主要目的即在提供一種能夠增加顏 色對比，使發光二極體之亮度及顏色更加鮮明之發光二極體 封裝結構改良。 為達上揭目的，本創作之發光二極體封裝結構至少包括 有一座體、至少一發光二極體晶片、至少二導電部以及一封 -裝膠體，該座體設有内基部以及外基部，該内基部設有一凹 陷部，該外基部係包覆於該内基部表面，僅使該凹陷部露出， 籲用以設置發光二極體晶片，該封裝膠體則覆蓋住該凹陷部， 其中，該外基部之顏色較該内基部之顏色為深，且完全包覆 於該内基部外表面，可遮蔽阻擋環境光線而避免影響内部發 光二極體晶片所發出的光線，以增加顏色對比，使發光二極 體之亮度及顏色更加鮮明。 【實施方式】 . 本創作之特點，可參閱本案圖式及實施例之詳細說明而 籲獲得清楚地瞭解。 如第二圖係為本創作發光二極體封裝結構之侧面結構剖 視圖，以及第二圖係為本創作發光二極體封裝結構之結構示 意圖所示，本創作之發光二極體封裝結構係至少包括有：一 座體.20、至少一發光二極體晶片30、至少二導電部41、42 以及一封裝膠體50 ;其中： 該座體20設有内基部21以及外基部22,該内基部 21設有一凹陷部211，該外基部22係包覆於該内基部21表 面，僅使該凹陷部211露出，該外基部22之顏色較該内基部 5 M411666 21之顏色為深’且該凹陷部211週邊係設有朝上擴張傾斜之 反射壁212 ; 至少一發光二極體晶片30，設置於該凹陷部211内，可 利用該凹陷部週邊之反射壁212，用以增加光源表現； 至少二導電部41、42，各該導電部41、42之一端係與 該發光二極體晶片30電性連接，該發光二極體晶片3〇可以 是紅光發光二極體晶片、藍光發光二極體晶片或綠光發光二. 極體晶片’且其例如疋藉由覆晶接合（flip chip bonding) 技術而與導電部41電性連接，並透過打線接合（wire bonding)鲁 技術而與導電部42電性連接；以及 一封裝膠體50，配置於該座體20上而覆蓋住該凹陷部 211以及各該導電部40與該發光二極體晶片3〇電性連接的 一端；其中，封裝膠體50是用以保護放置在凹陷部211内的 發光二極體晶片30免受於外界溫度、濕氣與雜訊的影響，且 封裝膠體50例如是以點膠（dispensing)的方式形成。此外， 封裝膠體50中也可以摻有螢光粉（未繪示），因此當發光二極 體晶片30所發出的光線照射到螢光粉而使其激發出另一種鲁 顏色的可見光時，發光二極體晶片30所發出的光線即可與螢 光粉所激發出來的光線混合而產生混光效果。 其中，該座體20係以射出方式成型，而該内基部21以 及外基部22可利用二次射出成型’且該外基部22之顏色可 以為近黑色，可吸收多數色光，並完全包覆於該内基部21外 表面，可遮蔽阻擋環境光線而避免影響内部發光二極體晶片 30所發出的光線’以增加顏色對比，使發光二極體之亮度及 顏色更加鮮明。 6 M411666 再者，如第四圖之第二實施例所示，該内基部21設有頂 面a、側面b及底面c ’該外基部22則至少包覆於該内基部 之頂面a及侧面b，當然亦可進一步包覆於底面c，使該外基 部22得以完全包覆於該内基部21外表面，可完全阻擋環境 光線進入内基部。 綜上所述，本創作提供一較佳可行之發光二極體封裝結 -構改良’爰依法提呈新型專利之申請；本創作之技術内容及 .技術特點巳揭示如上’然而熟悉本項技術之人士仍可能基於 φ本創作之揭示而作各種不背離本案創作精神之替換及修飾。 因此’本創作之保護範圍應不限於實施例所揭示者，而應包 括各種不背離本創作之替換及修飾，並為以下之申請專利範 圍所涵蓋。 【圖式簡單說明】 第一圖係為一習用發光二極體封裝結構之側面結構剖視 -圖。 鲁 第二圖係為本創作中第一實施例發光二極體封裝結構之 側面結構剖視圖。 第三圖係為本創作中第一實施例發光二極體封裝結構之 結構示意圖。 第四圖係為本創作中第二實施例發光二極體封裝結構之 側面結構剖視圖。 【主要元件符號說明】 頂面a 7 M411666 側面b 底面c 膠座11 第一基底111 第二基底112 凹陷部113 發光二極體晶片12 封裝膠體13 引腳14 座體20 内基部21 凹陷部211 反射壁212 外基部22 發光二極體晶片30 導電部41 導電部42 封裝膠體50At this creation is related to the improvement of a light-emitting diode package structure, especially a light-emitting diode package structure in which the color contrast is increased to make the brightness and color of the light-emitting diode more vivid. [Prior Art] In recent years, 'Light Emitting Diode (LED) has the advantages of low power consumption, long component life, unreliable material and fast response speed, plus its small size, vibration resistance and suitable amount. Production, easy to meet the application needs to make very small or array of components, so LEDs have been commonly used in information, communication and consumer electronics indicators and display devices, such as mobile phones and personal digital assistants (Personal Digital Assistant, PDA) screen backlight, various outdoor displays, traffic lights and lights. In the case of outdoor displays, due to the wide variety of ambient light sources, these ambient light tends to affect the light emitted by the LEDs inside the display and reduce its visibility. In order to make the light emitted by the light-emitting diode relatively clear, the light-emitting diode generally used as the light source of the outdoor display has a design different from the common common light-emitting diode package structure in the sealing structure. In order to increase the color contrast, the brightness and color of the light-emitting diode are more vivid. In order to achieve the above effects, there are two ways to do the following: 1. Incorporating black pigment into the plastic forming the rubber seat to form a black kick seat; but such a black plastic seat will affect the light output of the LED package structure. effectiveness. 3 M411666 2. Apply a black pigment on the surface of the rubber seat as a coating layer by manual brushing; however, this method of artificially brushing the ink on the surface of the rubber seat to form a coating layer is not only It does not meet the trend of automated production in today's industry, and it is more likely to cause uneven coating of the coating layer due to human factors, resulting in a decrease in product yield. Therefore, there is a patent such as Taiwan Patent Publication No. 200952204, the patent name "Light Emitting Diode Package Structure and Packaging Method", which is formed by injection molding to replace the prior art which must be formed by artificially applying ink on the surface of the rubber seat. The manner of coating the layer, as shown in the first figure, includes a plastic seat 11, a light emitting diode wafer 12, an encapsulant 13 and two leads 14. The rubber seat 11 includes a first substrate 111 and a second substrate 112, and the first substrate 111 has a recess 113. The second substrate 112 covers the upper surface of the first substrate 111. The LED wafer 12 is placed in the recess 113 of the first substrate and electrically connected to one end of each of the leads 14. The encapsulant 13 is disposed on the plastic seat 11 to cover the recess 113 and the end of each of the leads 14 electrically connected to the LED 12; wherein the color of the second substrate 112 is greater than the color of the first substrate 111. Deep. That is, the constituent material of the second substrate 112 also includes a pigment which absorbs most of the color light, such as a black pigment. Although the packaged structure replaces the prior art method of manually brushing the surface of the rubber seat by injection molding, the productivity and yield of the LED package structure can be effectively improved; however, the second The substrate 112 covers only the upper surface of the first substrate 111. The side of the first substrate 111 is still exposed to the environment, and the external ambient light affects the light emitted by the internal LED chip and reduces its visibility. degree. M411666 [New Content] In view of this, the main purpose of this creation is to provide a light-emitting diode package structure that can increase the contrast of colors and make the brightness and color of the light-emitting diodes more vivid. In order to achieve the above, the LED package structure of the present invention comprises at least a body, at least one LED chip, at least two conductive portions and a glue-filled body, wherein the base body has an inner base and an outer base. The inner base is provided with a recessed portion, and the outer base portion is covered on the surface of the inner base portion, and the recessed portion is only exposed, and the light-emitting diode wafer is disposed, and the encapsulant covers the recessed portion. The color of the outer base is deeper than the inner base portion, and completely covers the outer surface of the inner base, which can block the ambient light and avoid affecting the light emitted by the inner light-emitting diode chip to increase the color contrast. The brightness and color of the LED are more vivid. [Embodiment] The characteristics of this creation can be clearly understood by referring to the detailed description of the drawings and the examples. For example, the second figure is a cross-sectional view of the side structure of the package structure of the light-emitting diode, and the second figure is a schematic structural view of the package structure of the light-emitting diode package. The light-emitting diode package structure of the present invention is at least The method includes: a body. 20, at least one LED chip 30, at least two conductive portions 41, 42 and an encapsulant 50. The base 20 is provided with an inner base portion 21 and an outer base portion 22, and the inner base portion 21 is provided. A recessed portion 211 is provided. The outer base portion 22 is coated on the surface of the inner base portion 21 to expose only the recessed portion 211. The color of the outer base portion 22 is deeper than the color of the inner base portion 5 M411666 21 and the recess portion 211 is provided with a reflective wall 212 that is inclined upwardly and upwardly; at least one light-emitting diode wafer 30 is disposed in the recessed portion 211, and the reflective wall 212 around the recessed portion can be used to increase the performance of the light source; The conductive portions 41 and 42 and one end of each of the conductive portions 41 and 42 are electrically connected to the LED chip 30. The LED device 3 can be a red light emitting diode chip and a blue light emitting diode. Bulk chip or green light a polar body wafer', which is electrically connected to the conductive portion 41 by, for example, flip chip bonding technology, and electrically connected to the conductive portion 42 by wire bonding technology; The encapsulant 50 is disposed on the base 20 to cover the recess 211 and one end of the conductive portion 40 electrically connected to the LED substrate 3; wherein the encapsulant 50 is used to protect the The light-emitting diode chip 30 in the depressed portion 211 is protected from external temperature, moisture, and noise, and the encapsulant 50 is formed, for example, by dispensing. In addition, the encapsulant 50 may also be doped with phosphor powder (not shown), so that when the light emitted by the LED chip 30 is irradiated to the phosphor powder to excite another Lu color of visible light, the light is emitted. The light emitted by the diode wafer 30 can be mixed with the light excited by the phosphor powder to produce a light mixing effect. Wherein, the base body 20 is formed by injection molding, and the inner base portion 21 and the outer base portion 22 can be formed by secondary injection molding and the outer base portion 22 can be nearly black in color, can absorb most color light, and is completely covered by The outer surface of the inner base portion 21 can block the ambient light and avoid affecting the light emitted by the inner light-emitting diode chip 30 to increase the color contrast, so that the brightness and color of the light-emitting diode are more vivid. 6 M411666 Further, as shown in the second embodiment of the fourth figure, the inner base portion 21 is provided with a top surface a, a side surface b and a bottom surface c'. The outer base portion 22 covers at least the top surface a of the inner base portion and The side surface b can of course be further covered on the bottom surface c so that the outer base portion 22 can completely cover the outer surface of the inner base portion 21, and can completely block ambient light from entering the inner base portion. In summary, the present invention provides a preferred and feasible LED package package-structure improvement '爰 application for new patents according to law; the technical content and technical features of the creation 巳 reveals the above 'however, familiar with the technology The person may still make a variety of substitutions and modifications based on the disclosure of φ's creation without departing from the creative spirit of the case. Therefore, the scope of protection of this work should not be limited to those disclosed in the examples, but should include various alternatives and modifications that do not depart from the present invention and are covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a cross-sectional view of a side structure of a conventional light-emitting diode package structure. The second figure is a cross-sectional view of the side structure of the light emitting diode package structure of the first embodiment in the present invention. The third figure is a schematic structural view of the light emitting diode package structure of the first embodiment in the present invention. The fourth figure is a cross-sectional view showing the side structure of the light-emitting diode package structure of the second embodiment in the present invention. [Main component symbol description] Top surface a 7 M411666 Side b bottom surface c Plastic seat 11 First substrate 111 Second substrate 112 Recessed portion 113 Light-emitting diode wafer 12 Package colloid 13 Pin 14 Seat 20 Inner base 21 Recessed portion 211 Reflecting wall 212 outer base 22 light emitting diode wafer 30 conductive portion 41 conductive portion 42 encapsulant 50