TWI241693B - Light emitting device packaging structure - Google Patents

Light emitting device packaging structure Download PDF

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Publication number
TWI241693B
TWI241693B TW92121884A TW92121884A TWI241693B TW I241693 B TWI241693 B TW I241693B TW 92121884 A TW92121884 A TW 92121884A TW 92121884 A TW92121884 A TW 92121884A TW I241693 B TWI241693 B TW I241693B
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Taiwan
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light
light emitting
emitting element
emitting
scope
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TW92121884A
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Chinese (zh)
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TW200507198A (en
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Wen-Joe Sung
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Kingbright Electronics Co Ltd
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Abstract

The present invention is a packaging structure of light emitting device which includes a substrate, a plurality of light emitting devices and a transparent layer. The substrate includes a fillister and a plurality of conducted wires. Each light emitting device is set in the fillister and is conducted by a set of conducted wire correspondingly for emitting at the specific wavelength. The transparent layer fills the fillister and covers the plurality of light emitting devices. The present invention forms a convex at the opposite position of each light emitting device for converging light.

Description

1241693 五、發明說明(1) 一、發明所屬之技術領域 本發明係有關於-種發光元件之封裝結構,特別有關 於一種發光二極體(led )之封裝結構。 二、先前技術 隨著科技的進步 滿足現代人對於視覺 法,是在同一封裝結 光元件,以產生全彩 元件封裝結構1 0之示 三原色之發光元件11 腳15、17、19引入電 凹槽1 6中,以形成一 底座1 4的上緣,因此 結構。習知平頭封裝 發光亮度低。 為解決習知平頭 頭封裝的概念以增加 圖一係習知發光元件 封裝結構2 0與平頭封 層22於底座14之上緣 光元件11、1 2、1 3。 ’目前發光 上的要求。 構中同時置 光源。請參 思圖。習知 、12 、 13 置 源。接著再 透光層1 8。 >白知將此種 結構之缺點 封裝結構所 全彩光源的 球頭封裝結 波結構1 0相 外,係以凸 習知球頭封 元件必須作到 習知發光元件 入紅、綠、藍 閱圖一,圖一 發光元件封裝 入於一底座1 4 加入透光物質 透光層1 8之高 封裝結構稱之 在於光源各自 全彩化才能 全彩化的方 三原色之發 係習知發光 結構1 0係將 中,再以引 於底座14的 度係不超出 為平頭封裝 發散’因此 產生的缺點,便產生以球 發光亮度。請參閱圖二, 構2 0之示意圖。習知球頭 類似’主要差別在於透光 透面24的方式包覆三個發 裝結構20確 第5頁 1241693 五、發明說明(2) 貝^决了平頭封裝結構發光亮度不足的 面2的衫響’使得產生白光在近處可:由於凸透 色,必須將觀視距離拉遠才會有白光^ ^出三,顏 光之光醜仍然相當明顯。 生’但疋二色 因此習知技術不論是平頭封裝或球 壳度不足或混光效果不佳的問題。因 ^ *別具有 的封裝結構,以改善習知技術的缺點。’、要提出一種新 三、發明内容 本發 構,以改 本發 結構,以 本發 複數個發 數個電源 連接該等 之可見光 上,並於 會聚該等 因此 置皆設置 明之一 善習知 明之另 改善習 明係一 光元件 引腳, 電源引 。透光 每個發 發光元 本發明 凸透面 目的在於提供一種全彩 平頭封 裝結構發光亮度 一目的在於提供一種全 封裝結構 元件之封 透光層。 知球頭 種發光 以及一 複數個 腳,每 層係充 光元件 件所發 係針對 ,因此 發光元件 一個發光 混光效 裝結構 底座内 則位於 元件係 内並覆 置形成 發光元 不足的 彩發光 果不佳 件之封裝結 問題。 元件之封裝 的問題。 其包含一底座 滿該凹槽 之相對位 射之可見光。 封裝結構内每一 除可增加發光亮 具有一 該凹槽 用以散 蓋於該 複數個 凹槽以及複 内並相對應 發特定波長 等發光元件 凸透面,以 發光元件之相對位 度外,同時也1241693 V. Description of the invention (1) 1. Technical field to which the invention belongs The present invention relates to a packaging structure of a light-emitting element, and more particularly to a packaging structure of a light-emitting diode (LED). 2. The previous technology meets the modern people's vision with the advancement of technology. It is to combine light-emitting components in the same package to produce full-color component packaging structure. The three primary colors of the light-emitting components 11 are introduced into the grooves by pins 15, 17, 19 16 to form an upper edge of the base 14 and therefore a structure. The conventional flat-head package has low luminous brightness. In order to solve the concept of the conventional flat-head package, the figure 1 shows a conventional light-emitting element package structure 20 and a flat-head sealing layer 22 on the upper edge of the base 14, the light elements 11, 12, 2, and 3. ‘Currently glowing requirements. Set the light source in the structure at the same time. Consider the diagram. Know, 12, 13 Set source. Next, the light-transmitting layer 18. > Bai Zhi encapsulated the shortcomings of the full-color light source of the structure of the structure, and the structure of the ball-end package junction structure of the full-color light source was 10 out of phase. I. Figure 1. A light-emitting element packaged in a base 1 4 with a light-transmitting substance and a light-transmitting layer 18 The high packaging structure is called the light source structure of the three primary colors of the light source, which can be full-colored to achieve full color. In the middle of the system, the degree of introduction to the base 14 does not exceed the degree of divergence of the flat-head package, so the shortcomings resulting in the ball-shaped luminous brightness. Please refer to FIG. 2 for a schematic diagram of the structure 20. The conventional ball head is similar to the main one, the main difference is that the light-transmissive surface 24 covers three hair-dressing structures. 'Make white light can be produced in close range: due to the convex color, the viewing distance must be widened to have white light ^^^ 3, Yan Guangzhi's ugliness is still quite obvious. It ’s a problem that the conventional technology is either a flat-head package or an insufficient spherical shell or a poor light mixing effect. ^ * Don't have a package structure to improve the shortcomings of the conventional technology. ', To propose a new third, the invention of the present invention structure, to modify the structure of the invention, a plurality of power to this hair to connect these visible light, and in the gathering of these, all set a good knowledge Another improvement is a pin of the optical system, which leads to power. Light transmission Each luminescence element The convex surface of the present invention aims to provide a full-color flat head package structure with luminous brightness. One object is to provide a light-transmitting layer for a fully-encapsulated structure element. The ball head has a variety of luminescence and a plurality of feet. Each layer is targeted by the light-filling element. Therefore, a light-emitting mixed-light effect structure structure of the light-emitting element is located in the element system and is covered to form a color luminous element with insufficient luminescence. Problems with poor packaging results. Problems with component packaging. It contains visible light from a relative position of the base filled with the groove. Each of the encapsulation structures can increase the luminous brightness and have a groove for covering the plurality of grooves and the inside of the complex and correspondingly emitting a light emitting element with a specific wavelength and a convex surface, in addition to the relative position of the light emitting element. Meanwhile also

第6頁 1241693Page 6 1241693

以下的發明詳述及 四、實施方式 於ϊ ΐ三及圖四,圖三係本發明最佳具體實施例之 ϋ入一广圖。本發明係一種發光元件封裝結構30, =二3 一底座32、複數個發光元件33、34、35以及一透光 曰。為了說明方便,圖三中係以三個分屬於三原色 (RGB )之發光元件33、34、35加以闡述本發明之内容。 本發明所指之發光元件,可以是發光二極體(LightThe following detailed description of the invention and its implementation modes are shown in Fig. 3 and Fig. 4. Fig. 3 is a broad view of the preferred embodiment of the present invention. The present invention is a light-emitting element package structure 30 = two, three, a base 32, a plurality of light-emitting elements 33, 34, 35, and a light-transmitting light. For convenience of explanation, the content of the present invention is illustrated in FIG. 3 by using three light emitting elements 33, 34, and 35 belonging to three primary colors (RGB). The light-emitting element referred to in the present invention may be a light-emitting diode (Light

Emitting Diode,LED),雷射二極體(Laser Diode, LD)或有機發光二極體(Qrganic Light Emitting Diode,OLED )等各式發光元件。 底座32内具有一凹槽38以及相對應發光元件33、34、 3 5之二組電源引腳4 1、4 2、4 3。發光元件3 3、3 4、3 5則位 於凹槽3 8内並相對應連接電源引腳4 1、4 2、4 3,每一個發 光元件係用以激發特定波長之可見光,在本發明較佳具體 實施例中,發光元件3 3係用以發出紅光,發光元件3 4係用 以發出綠光,發光元件3 5則用以發出藍光。另外,本發明 之電源引腳係可以雙列直插方式(D IP )或表面貼裝方式 (SMT )所做成。Emitting Diode (LED), laser diode (LD) or organic light emitting diode (Qrganic Light Emitting Diode, OLED). The base 32 has a groove 38 and two sets of power pins 4 1, 4 2, 4 3 corresponding to the light-emitting elements 33, 34, and 35. The light-emitting elements 3 3, 3 4, 3 5 are located in the groove 3 8 and are correspondingly connected to the power pins 4 1, 4 2, 4 3. Each light-emitting element is used to excite visible light of a specific wavelength. In a preferred embodiment, the light-emitting element 3 3 is used to emit red light, the light-emitting element 34 is used to emit green light, and the light-emitting element 35 is used to emit blue light. In addition, the power pins of the present invention can be made by a dual in-line method (D IP) or a surface mount method (SMT).

復盍於發 對位置形 、34 、 35 之部分, 對應之凸 底座32等 此兩部分 裝結構與 為 2 7 °C, 發明製造 比較。經 平頭封裝 1241693 五、發明說明(4) 透光層3 6係充滿於凹槽3 8内並 34、35上,並於每個發光元件之相 面44、45、46,以會聚發光元件33 光。其中,透光層36與底座32等高 成。之後接著製作每一發光元件相 將凸透面44、45、46,透光層36與 者接合。除此之外,亦可一體成型 請參閱表一,表一係本發明封 結構之亮度比較表。表一係在溫度 5 5RH% ,IF =2〇mA的條件下,以本 本與習知平頭封裝之10件樣本加以 據發現’本發明封裝結構之亮度比 升了 5 8 % 。 光元件33、 成複數個凸透 所發射之可見 係可製作完 ,面,最後再 高之部分,兩 〇 習知平頭封裝 環境濕度為 完成之1 0件樣 此表之實驗數 結構之亮度提It is restored to the position of the shape, 34, 35, the corresponding convex base 32, etc. These two parts are compared with the structure of the invention at 27 ° C. Flat head package 1241693 V. Description of the invention (4) The light-transmitting layer 3 6 is filled in the grooves 3 8 and 34, 35, and is on each of the light-emitting element faces 44, 45, 46 to converge the light-emitting element 33 Light. Among them, the light-transmitting layer 36 is formed at the same height as the base 32. Then, each light-emitting element phase is made to have convex surfaces 44, 45, and 46, and the light-transmitting layer 36 is bonded to each other. In addition, it can be integrally formed. Please refer to Table 1. Table 1 is a comparison table of brightness of the seal structure of the present invention. Table 1 shows that under the conditions of a temperature of 55 RH% and IF = 20 mA, 10 samples of the book and the conventional flat-head package were added. It was found that the brightness ratio of the package structure of the present invention increased by 58%. The light element 33 is formed by a plurality of convex projections. The visible light emitted can be completed, the surface, and the last higher part. Two. Known flat-head package. The ambient humidity is 10 samples completed. The number of experiments in this table. The brightness of the structure is improved.

第8頁 1241693 五、發明說明(5) 表一 樣本編號P 本發明之亮度 (incd) ^ 習知平頭封裝之亮度 (mcd) ^ VWWVW' ' 968丄 603 ·6+) 2,- 883. ‘ 575.9,, 1000九 593.3^ 心 107U 616.U 956.U 610.4,, 6, 966.8,, 608.3<:> 848.2^ 616·心 926.7^ 60L· % 95 2^ 615.7,, 10,π 953.4,, 602^ Max^, 107L· 616·心 Miru3 848上 575·% 952.61 604.27^Page 8 1241693 V. Description of the invention (5) Table number P P. Brightness (incd) of the invention ^ Brightness (mcd) of the conventional flat-head package ^ VWWVW '' 968 丄 603 · 6+) 2,-883. ' 575.9 ,, 1000 nine 593.3 ^ heart 107U 616.U 956.U 610.4 ,, 6, 966.8 ,, 608.3 <: > 848.2 ^ 616 · heart 926.7 ^ 60L ·% 95 2 ^ 615.7 ,, 10, π 953.4, , 602 ^ Max ^, 107L · 616 · Heart Miru3 848 · 575 ·% 952.61 604.27 ^

請參閱表二,表二係本發明封裝結構與習知單球頭封 裝結構之混光效果比較表。表二係在溫度為2 7 °C,環境濕 度為55RH% ,IF=20mA的條件下,以本發明製造完成之10 件樣本與習知單球頭封裝之1 〇件樣本加以比較。經此表之 實驗數據發現,本發明封裝結構之混光效果比單球頭封裝 結構之混光效果更接近C I E色度座標圖之白光區域。Please refer to Table 2. Table 2 is a comparison table of the light mixing effect between the packaging structure of the present invention and the conventional single ball head packaging structure. Table 2 compares the 10 samples manufactured by the present invention with the 10 samples of the conventional single ball head package under the conditions of a temperature of 27 ° C, an ambient humidity of 55RH%, and IF = 20mA. According to the experimental data in this table, it is found that the light mixing effect of the package structure of the present invention is closer to the white light area of the C I E chromaticity coordinate chart than the light mixing effect of the single ball head package structure.

第9頁 1241693 五、發明說明(6) 表 樣本編號Ρ 本發明p 習知單球頭封装p CIE色度 座標义軸< CIE色度 座標 cm色度 座標X軸〇 cm色度 座標Y軸^ 1^ 0.4148,, 0.2923., 0.4783,, 0.2682,, 0.4173^ 0.2802^ 0.4614.. 0.261 心 0.3692^ 0.2998,:= 0.509& 0.290% 心 0.3615,, 0.3067,, 0.5032·) 0.2450., 5^ 0.3638^ 0.2944,, 0.523L· 0.300% 6^ 0.4036,, 0.3274^ 0.4923,, 0.2948,, 7,, 0.378L·, 0.2955,, 0.4551,) 0.2756p 心 0.3726,, 0.2933,, 0.5078,, 0.2816.P % 0.3630^ 0.2858^ 0.4862^ 0.2903^ 10^ 0.385 l+:l 0.3124^ 0.4923^- 0.2849,, Max*) 0.4173,, 0.3274,, 0.4910,, 0.2793p Min^ 0.3615*, 0.2802。 0A55U 0.2450^ Avg^ WWvVS·/· on 0.2981 0.5231 0.3009«Page 9 1241693 V. Description of the invention (6) Table sample number P The present invention p Known single ball head package p CIE chromaticity coordinate sense axis < CIE chromaticity coordinate cm chromaticity coordinate X axis 〇cm chromaticity coordinate Y axis ^ 1 ^ 0.4148, 0.2923., 0.4783 ,, 0.2682 ,, 0.4173 ^ 0.2802 ^ 0.4614 .. 0.261 heart 0.3692 ^ 0.2998 ,: = 0.509 & 0.290% heart 0.3615, 0.3067, 0.5032 ·) 0.2450., 5 ^ 0.3638 ^ 0.2944 ,, 0.523L · 0.300% 6 ^ 0.4036 ,, 0.3274 ^ 0.4923 ,, 0.2948 ,, 7, 0.378L ·, 0.2955, 0.4551,) 0.2756p heart 0.3726, 0.2933, 0.5078, 0.2816. P% 0.3630 ^ 0.2858 ^ 0.4862 ^ 0.2903 ^ 10 ^ 0.385 l +: l 0.3124 ^ 0.4923 ^-0.2849 ,, Max *) 0.4173 ,, 0.3274 ,, 0.4910 ,, 0.2793p Min ^ 0.3615 *, 0.2802. 0A55U 0.2450 ^ Avg ^ WWvVS · / · on 0.2981 0.5231 0.3009 «

綜合以上所述,本發明相較於習知技術之平頭封裝結 構,發光亮度明顯增加。再將本發明與球頭封裝結構相 較,混光效果亦明顯較佳。To sum up, compared with the flat head package structure of the conventional technology, the present invention has significantly increased luminous brightness. Compared with the ball head package structure of the present invention, the light mixing effect is also significantly better.

藉由以上較佳具體實施例之詳述,係希望能更加清楚 描述本發明之特徵與精神,而並非以上述所揭露的較佳具 體實施例來對本發明之範疇加以限制。相反地,其目的是 希望能涵蓋各種改變及具相等性的安排於本發明With the above detailed description of the preferred embodiments, it is hoped that the features and spirit of the present invention may be more clearly described, rather than limiting the scope of the present invention with the preferred specific embodiments disclosed above. On the contrary, it is intended to cover various changes and equivalent arrangements in the present invention.

第10頁 1241693 五、發明說明(7) 所欲申請之專利範圍的範疇内。Page 10 1241693 V. Description of Invention (7) Within the scope of the patent to be applied for.

1241693 圖式簡單說明 五、圖式簡單說明 圖一係習知發光元件封裝結構之示意圖。 圖二係習知發光元件球頭封裝結構之示意圖。 圖三係本發明最佳具體實施例之發光元件封裝結構之 示意圖。 圖四係圖三中發光元件封裝結構之上視圖 六、圖式標號說明 3 2 :底座 36 :透光層 43 :電源引腳 30 :發光元件封裝結構 33、34、35 :複數個發光元件 38 :凹槽 41 、 42 44、45、46 ··凸透面1241693 Brief description of drawings 5. Brief description of drawings Figure 1 is a schematic diagram of a conventional light emitting device package structure. FIG. 2 is a schematic diagram of a conventional light emitting element ball head packaging structure. FIG. 3 is a schematic diagram of a light emitting device package structure according to a preferred embodiment of the present invention. Figure 4 is a top view of the light-emitting element packaging structure in Figure 3. Six, the description of the symbol 3 2: the base 36: the light-transmitting layer 43: the power pin 30: the light-emitting element packaging structure 33, 34, 35: a plurality of light-emitting elements 38 : Grooves 41, 42, 44, 45, 46

第12頁Page 12

Claims (1)

1241693 六、申請專利範圍 Diode, LED ) 〇 7·如申請專利範圍第1項所述之發光元件封裝結構,其中 該複數個發光元件係為有機發光二極體(〇rganic Light Emitting Diode, 0LED)。 8·如申請專利範圍第1項所述之發光元件封裝結構,其中 該複數個發光元件係為雷射二極體(Laser Di〇de LD ) ° 9 ·如申凊專利範圍第1項所述之發光元件封裝結構,其中 該等電源引腳係以雙列直插方式(DIP )所做成。 1 0 ·如申明專利fe圍第1項所述之發光元件封裝結構,其中 戎等電源引腳係以表面貼裝方式(SMT )所做成。 11·如申請專利範圍第丨項所述之發光元件封裝結構,其中 该透光層與該等凸透面係一體成型。 12.如、申請專利範圍第11員所述之發光元件封裝結構,其中 該透f層係先形成與該底座上緣等高之部分後,再形 成該等凸透面,再將兩部分接合。1241693 VI. Patent application scope Diode, LED) 〇7. The light emitting device package structure described in item 1 of the patent application scope, wherein the plurality of light emitting devices are organic light emitting diodes (〇rganic Light Emitting Diode, 0LED) . 8. The light-emitting element package structure described in item 1 of the scope of patent application, wherein the plurality of light-emitting elements are laser diodes (Laser Diode LD) ° 9 · As described in item 1 of the scope of patent application The light-emitting element package structure, wherein the power pins are made by a dual in-line method (DIP). 10 · The light-emitting element package structure as described in item 1 of the stated patent, wherein the power pins such as Rong are made by surface mount (SMT). 11. The light-emitting element packaging structure according to item 丨 in the scope of application for a patent, wherein the light-transmitting layer is integrally formed with the convex surfaces. 12. The light-emitting element packaging structure as described in the 11th member of the scope of patent application, wherein the transparent layer is first formed as high as the upper edge of the base, then the convex surfaces are formed, and the two parts are joined . 第14頁Page 14
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450293B (en) * 2009-05-22 2014-08-21 Hon Hai Prec Ind Co Ltd Switch with light emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450293B (en) * 2009-05-22 2014-08-21 Hon Hai Prec Ind Co Ltd Switch with light emitting diode

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