1279013 • 九、發明說明： 【發明所屬之技術領域】 本發明有關一種發光模組，特別有關一種同時利用固 ， 體及流體二者封裝之高功率發光模組。 【先前技術】 # 由於發光二極體(light_emitting diode ; LED)屬於冷發 光，具有耗電量低、元件壽命長、無須暖燈時間、反應速 度快等優點，再加上其體積小、耐震動、適合量產，容易 配合應用需求製成極小或陣列式的元件，因此LED元件已 普遍使用於資訊、通訊及消費性電子產品的指示燈與顯示 裝置上，例如行動電話、PDA螢幕背光源、戶外各種顯示 器、交通號誌燈、車燈，甚至能應用於液晶顯示器產品。 關於習知之LED模組有例如第1及2圖所示之例。如 第1圖所示之習知LED模組包含有一基板1〇，複數顆 單元12設於基板10上方，以及一封裝材料層14覆蓋於這 些LED單兀12上方。如第2圖所示之習知LED模組，包 含有一基板16, 一絕緣層18以及一印刷電路板2〇依序設 於基板16上方，以及複數顆已封裝完成之LED封裝體 1279013 設於印刷電路板20上古*杂土1279013 • IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting module, and more particularly to a high-power light-emitting module that utilizes both solid, body and fluid packages. [Prior Art] # Light-emitting diode (LED) is a cold light-emitting device, which has the advantages of low power consumption, long component life, no need for warm-up time, fast response, etc., plus its small size and vibration resistance. It is suitable for mass production, and it is easy to make very small or array components with application requirements. Therefore, LED components have been widely used in indicators and display devices for information, communication and consumer electronics, such as mobile phones, PDA screen backlights, Outdoor displays, traffic lights, lights, and even LCD products. The conventional LED module has examples shown in Figs. 1 and 2, for example. The conventional LED module shown in FIG. 1 includes a substrate 1 , a plurality of cells 12 are disposed above the substrate 10 , and a layer of encapsulating material 14 covers the LED cells 12 . The conventional LED module shown in FIG. 2 includes a substrate 16, an insulating layer 18 and a printed circuit board 2, which are sequentially disposed above the substrate 16, and a plurality of packaged LED packages 1279013 are provided. Printed circuit board 20 ancient * mixed soil
u壯μ 上方並氣連接至印刷電路板20。LED Ί係先①成封I，例如利賴模或灌膠方式形成封 裝材料層24，㈣結於基板16上，形成LED模組。 先則關於LED模組封裝技術，多以導電支架或印刷電 路板(PCB)為基板，將單顆或多顆㈣晶片固著於一基板 之上，封裝材料通常已預从波長轉換材料或螢光粉或散 光材料混合完成，心壓模或轉方式崎封裝。其缺點 為’一次封裝的材料多採耐候性佳且強度高的材料，但是 封裝後易有高應力’料絲可靠度，且抗紫外線能力差， 易發生κ化現象。右以低應力材料封裝，則LED整體強度 柔軟脆弱’絲法賴晶片與接線，科_造成黃化^ 象。以上之封裝材料之散熱性亦差。 若以封裝完成之LED集結成束，形成LED模組，則 體積又過於龐大，散熱不良，而造成壽命短。對於單顆或 多顆南功率一極體晶片封裝，多以導電支竿為美板 、 晶片基座通常設計成體積大，且以導熱佳且之材料為之 或兼具導電作用，封裝仍以壓模或灌 整體體積因此較一般LED大出許多。 與低散熱等缺點。 而 膠方式進行封裝 封裝材料仍易有黃化 1279013 因此，對於良好的LED封裝結構，仍有需求。 【發明内容】 本發明之目的是提供一種發光模組，其做為光源，具 有散熱快而不易發生黃化現象以及應力低而可靠度高之優 本發明提供之發光模組包括一基板、至少一發光元件 設於基板上、一封蓋位於基板上並且覆蓋此等發光元件、 以及一流體位於封蓋與此等發光元件及基板之間所形成之 空間。 於一貫施例中，本發明提供之發光模組包括之發光元 件可為LED晶片且彼此以導線連接。於另一實施例中，此 發光元件可為一 LED封裝體且彼此以導線連接。 本發明之發光模組，由於使用具自由流動能力之液體 材料，當受熱時能因流動而能將發光元件例如二極體裸晶 或封裝體產生之熱量帶走，因此，除了與習知結構一般僅 由下方政熱之外，又額外增加上方散熱之途徑，所以，散 熱快且不易發生黃化現象。 1279013 【實施方式】 請參考第3及4圖，其為依據本發明之具體實施例之 發光模組之剖面示意圖，其中，發光元件之種類並無特別 限制，但分別以LED晶片與LED封裝體為例以說明本發 明。如第3圖所示，本發明之發光模組3〇包括一基板31、 至少一 LED晶片32做為發光元件、一封蓋34、及一流體 35。The u-μ is connected to the printed circuit board 20 at the same time. The LED Ί is first sealed with a seal I, for example, a laminate or a potting method to form a layer 24 of the sealing material, and (4) is attached to the substrate 16 to form an LED module. Firstly, regarding the LED module packaging technology, a conductive bracket or a printed circuit board (PCB) is used as a substrate, and a single or a plurality of (four) wafers are fixed on a substrate, and the package material is usually pre-selected from a wavelength conversion material or a firefly. The mixing of the light powder or astigmatism material is completed, and the heart compression mold or the transfer mode is packaged. The disadvantage is that the material of the primary package is more resistant to weathering and high strength, but it is easy to have high stress after packaging, and the reliability of the wire is poor, and the phenomenon of κ is prone to occur. When the right package is made of a low-stress material, the overall strength of the LED is soft and fragile, and the wire is used to make the yellowing. The above packaging materials are also poor in heat dissipation. If the LEDs assembled by the package are bundled to form an LED module, the volume is too large, and the heat dissipation is poor, resulting in a short life. For single or multiple South Power monolithic chip packages, the conductive support is mostly a beautiful board, and the wafer base is usually designed to be bulky, and the material with good thermal conductivity or both has a conductive effect, and the package is still The overall volume of the stamp or fill is therefore much larger than the average LED. With shortcomings such as low heat dissipation. The packaging method is still easy to yellow. 1279013 Therefore, there is still a need for a good LED package structure. SUMMARY OF THE INVENTION An object of the present invention is to provide a light-emitting module, which is used as a light source, has a fast heat dissipation, is less prone to yellowing, and has low stress and high reliability. The light-emitting module provided by the present invention includes a substrate, at least A light-emitting element is disposed on the substrate, a cover is disposed on the substrate and covers the light-emitting elements, and a fluid is located in a space formed between the cover and the light-emitting elements and the substrate. In a consistent embodiment, the illumination module of the present invention includes light emitting elements that can be LED wafers and are electrically connected to each other. In another embodiment, the light emitting elements can be an LED package and connected to each other by wires. The light-emitting module of the present invention can use the liquid material with free-flowing ability to carry away the heat generated by the light-emitting element such as the diode die or the package due to the flow when heated, and therefore, in addition to the conventional structure Generally, only the heat from the bottom is added, and the above heat dissipation is additionally added. Therefore, the heat dissipation is fast and the yellowing phenomenon is not easy to occur. 1279013 [Embodiment] Please refer to FIGS. 3 and 4, which are schematic cross-sectional views of a light emitting module according to an embodiment of the present invention, wherein the types of light emitting elements are not particularly limited, but LED chips and LED packages are respectively used. This is an example to illustrate the invention. As shown in FIG. 3, the light-emitting module 3 of the present invention includes a substrate 31, at least one LED chip 32 as a light-emitting element, a cover 34, and a fluid 35.
基板31可為具有熱傳導性或兼具導電性之散熱板。 LED晶片32可為一或多個，設置於基板3ι上，可彼此電 相連，例如以導線33連接。可使用單色光之多個led晶 片，以增加光強度，或使用不同顏色光iLED晶片，例如 使用紅光二極體晶片、綠光二極體晶片、及藍光二極體晶 片以達成混光效果。 封蓋34位於基板31上並且覆蓋LED晶片32。封蓋 34之材質可為透光或透明材料，可舉例有矽膠、玻璃、陶 瓷、環氧樹脂、聚醯亞胺、或苯環高分子化合物等之材料 f成之單一材料層或複合材料層。較佳為高透光性及高耐 光性之材料。可視需求而定。 1279013 t造本發明之發光模組時，可將—或多個發光元# 置於基板上並予以導線連接，再將預先模製好之封蓋安叹 於基板上以覆蓋發光元件，封蓋上可留有-注入孔，2 體注入後，再以封膠密封。 Μ 本發明之基板可為一平面形狀，各發光元件設置於其 表面上；或可為一凹槽形狀，各發光元件可設置於凹槽表 ►面上，因此，基板表面形狀並無特別限制，视需要而將奋 光元件及封蓋相對於基板形狀設置即可。 如上述之結構可知，本發明之發光模組由於在封蓋與 發光元件及基板之間使用流體材料，流體具有自由流動的 能力，如第3及4圖中之箭頭所示之熱量流動，因此當受 熱時能因流動而能將裸晶或發光元件產生之熱量由模組上 .方帶走，而散熱於周圍環境中，比起傳統封農結構僅由下 方基板散熱之方式，可額外增加上方散熱途徑，散熱更快 速，亦因此可減少下方基板或散熱設施之體積，縮小整體 發光模組尺寸。且由於使用流體，對接觸到之導線之推力 可降至最小，應力小，進而提高壽命與可靠度。 1279013 f知之封裝材料於靠近裸晶處，皆因裸晶發出的輻射 與熱量導致材料劣化或黃化。本發明使用流體例如石夕油取 代車父-般银氧樹醋不易黃化，也因為流體可流動，縱有 些微黃化部分，亦可因混合而稀釋，延長黃化的時間。如 果有嚴重貫化現象’可將封裝流體換新，以增加使用壽命， 特別是應用於高功率或大型LED模組封裝時，更可顯現此 • f點。本發明之發光模組以固體封蓋材料結合流體材料做 為封裝，可提昇發光裝置例如lED模組之可靠度與壽命， 並可依需求彈性變更應用於例如一般照明、Lcd背光模 、、且、車用照明、裝飾照明等不同尺寸或形狀之用途。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範 圍所做之均㈣化與修飾，皆應屬本個之涵蓋範圍。 % 【圖式簡單說明】 第1圖為習知一 LED模組的剖面示意圖。 第2圖為習知一包含有數個單顆封裝之模組的 剖面示意圖。 第3圖為依據本發明之一具體實施例之發光模組之剖面示 意圖。 11 1279013 - 第4圖為依據本發明之另一具體實施例之發光模組之剖面 示意圖。 【主要元件符號說明】 10、16、31、41 :基板 12 :發光二極體單元 14、24 :封裝材料層 • 18 :絕緣層 20:印刷電路板 22:發光二極體封裝體 30、40 :發光模組 32、 44 :發光二極體晶片 33、 45 :導線 34、 48 :封蓋 • 35、49 :流體 42 ··發光二極體封裝體 43 :基材 40 :導電層 47:封裝材料層 12The substrate 31 may be a heat dissipation plate having thermal conductivity or electrical conductivity. The LED chips 32 may be one or more, disposed on the substrate 3, and electrically connected to each other, for example, by wires 33. Multiple LED wafers of monochromatic light can be used to increase light intensity, or to use different color optical iLED wafers, such as red photodiode wafers, green photodiode wafers, and blue LED wafers to achieve a light mixing effect . A cover 34 is located on the substrate 31 and covers the LED wafer 32. The material of the cover 34 may be a light transmissive or transparent material, and may be a single material layer or a composite material layer made of a material such as silicone, glass, ceramic, epoxy resin, polyimide, or benzene ring polymer compound. . A material having high light transmittance and high light resistance is preferred. Depending on the needs. 1279013 t When the light-emitting module of the invention is fabricated, the light-emitting element # can be placed on the substrate and connected by wires, and the pre-molded cover is placed on the substrate to cover the light-emitting element, and the cover is covered. There may be a - injection hole left, and after the 2 body is injected, it is sealed with a sealant. The substrate of the present invention may have a planar shape, and each of the light-emitting elements may be disposed on the surface thereof; or may be in the shape of a groove, and each of the light-emitting elements may be disposed on the surface of the surface of the groove. Therefore, the shape of the surface of the substrate is not particularly limited. The light-emitting element and the cover may be disposed relative to the shape of the substrate as needed. As can be seen from the above structure, since the light-emitting module of the present invention uses a fluid material between the cover and the light-emitting element and the substrate, the fluid has a free flow capability, and the heat shown by the arrows in FIGS. 3 and 4 flows. When heated, the heat generated by the bare crystal or the illuminating element can be taken away from the module by the flow, and the heat is dissipated in the surrounding environment, and the heat can be additionally increased by the heat dissipation of the lower substrate. The upper heat dissipation path makes the heat dissipation faster, so the volume of the lower substrate or the heat dissipation device can be reduced, and the size of the overall light-emitting module can be reduced. And because of the use of fluid, the thrust of the contacted wire can be minimized and the stress is small, thereby improving the life and reliability. 1279013 f The package material is close to the bare metal, and the material is deteriorated or yellowed due to the radiation and heat emitted by the bare crystal. The present invention uses a fluid such as Shixia oil to replace the parent-like silver vinegar, which is not easy to yellow, and because the fluid can flow, and some slightly yellowed portions can be diluted by mixing to prolong the yellowing time. If there is a serious phenomenon, the package fluid can be renewed to increase the service life, especially when applied to high power or large LED module packages. The light-emitting module of the present invention is packaged with a solid cover material and a fluid material, which can improve the reliability and life of the light-emitting device such as the lED module, and can be flexibly changed according to requirements, for example, for general illumination, Lcd backlight mode, and , car lighting, decorative lighting and other uses of different sizes or shapes. The above description is only the preferred embodiment of the present invention, and all the modifications and modifications made by the patent application scope of the present invention should fall within the scope of the present invention. % [Simplified illustration of the drawing] Fig. 1 is a schematic cross-sectional view of a conventional LED module. Figure 2 is a schematic cross-sectional view of a conventional module including a plurality of single packages. Figure 3 is a cross-sectional view of a lighting module in accordance with an embodiment of the present invention. 11 1279013 - Figure 4 is a cross-sectional view of a lighting module in accordance with another embodiment of the present invention. [Main component symbol description] 10, 16, 31, 41: Substrate 12: Light-emitting diode unit 14, 24: Package material layer • 18: Insulation layer 20: Printed circuit board 22: Light-emitting diode package 30, 40 : Light-emitting module 32, 44: Light-emitting diode wafer 33, 45: Conductor 34, 48: Cover • 35, 49: Fluid 42 · Light-emitting diode package 43: Substrate 40: Conductive layer 47: Package Material layer 12