CN104327305B - 基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料 - Google Patents

基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料 Download PDF

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CN104327305B
CN104327305B CN201410564684.8A CN201410564684A CN104327305B CN 104327305 B CN104327305 B CN 104327305B CN 201410564684 A CN201410564684 A CN 201410564684A CN 104327305 B CN104327305 B CN 104327305B
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barrier composite
barrier
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resin
nano
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CN104327305A (zh
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A·伯纳希
R·马奇
R·詹南托尼奥
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032Packages or encapsulation
    • B81B7/0035Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
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    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/20Light-sensitive devices
    • H01G9/2068Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
    • H01G9/2077Sealing arrangements, e.g. to prevent the leakage of the electrolyte
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
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    • HELECTRICITY
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    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • HELECTRICITY
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    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
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    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80Constructional details
    • H10K30/88Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/331Nanoparticles used in non-emissive layers, e.g. in packaging layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/542Dye sensitized solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777Edge feature

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Organic Insulating Materials (AREA)
  • Thermistors And Varistors (AREA)
CN201410564684.8A 2008-12-12 2009-12-04 基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料 Active CN104327305B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT002206A ITMI20082206A1 (it) 2008-12-12 2008-12-12 Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica
ITMI2008A002206 2008-12-12
CN200980146836XA CN102264820A (zh) 2008-12-12 2009-12-04 基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料

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CN104327305A CN104327305A (zh) 2015-02-04
CN104327305B true CN104327305B (zh) 2016-04-06

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CN201410564684.8A Active CN104327305B (zh) 2008-12-12 2009-12-04 基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料
CN200980146836XA Pending CN102264820A (zh) 2008-12-12 2009-12-04 基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料

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US (2) US20110293895A1 (https=)
EP (1) EP2373729B1 (https=)
JP (1) JP5581332B2 (https=)
KR (2) KR101768726B1 (https=)
CN (2) CN104327305B (https=)
IT (1) ITMI20082206A1 (https=)
TW (1) TWI469827B (https=)
WO (1) WO2010066647A1 (https=)

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DK2771182T3 (da) * 2011-10-24 2019-08-19 Tera Barrier Films Pte Ltd Indkapslingsbarrierestak
DE102015106658B4 (de) * 2015-04-29 2025-12-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Bauelemente und Verfahren zu deren Herstellung
JP2020012041A (ja) * 2018-07-17 2020-01-23 パナソニックIpマネジメント株式会社 ガスバリア用塗料組成物及び発光装置
CN109456722A (zh) * 2018-10-22 2019-03-12 广州市垠瀚能源科技有限公司 一种耐锂离子电池电解液的双组份环氧胶粘剂的制备方法
JP7053911B2 (ja) * 2021-03-04 2022-04-12 旭化成株式会社 複合体

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US3704806A (en) * 1971-01-06 1972-12-05 Le T Im Lensoveta Dehumidifying composition and a method for preparing the same
US4637197A (en) * 1984-10-15 1987-01-20 Epoxy Technology, Inc. Method and compositions for removal of moisture
US5827908A (en) * 1994-01-26 1998-10-27 Shin-Etsu Chemical Co., Ltd. Naphthalene and or biphenyl skeleton containing epoxy resin composition
JPH10251488A (ja) * 1997-03-07 1998-09-22 Sony Corp 半導体装置用硬化性樹脂組成物
CN1558921A (zh) * 2001-08-03 2004-12-29 Dsm 显示器件用可固化组合物
JP2003155355A (ja) * 2001-11-21 2003-05-27 Mitsubishi Chemicals Corp 超微粒子を含有する樹脂組成物成形体
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
FR2840913B1 (fr) * 2002-06-13 2005-02-04 Inst Francais Du Petrole Composition pour reservoir a paroi monocouche
US7691514B2 (en) * 2003-11-07 2010-04-06 The Regents Of The University Of California Polymer-zeolite nanocomposite membranes for proton-exchange-membrane fuel cells
US20060284556A1 (en) * 2003-11-12 2006-12-21 Tremel James D Electronic devices and a method for encapsulating electronic devices
ITMI20051501A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti una fase attiva inserita in un materiale poroso distribuito in un mezzo disperdente a bassa permeabilita'
ITMI20052496A1 (it) * 2005-12-27 2007-06-28 Getters Spa Sistemi compositi assorbitori di gas e metodi per la loro produzione
JP4098339B2 (ja) * 2006-09-13 2008-06-11 ポジティブフォースインベストメンツコーポレーション プラスチック除湿用マスターバッチ及びプラスチック材料の除湿方法
EP2001924A1 (en) * 2006-03-30 2008-12-17 National Starch and Chemical Investment Holding Corporation Thermally curable epoxy-amine barrier sealants
DE102006029849A1 (de) * 2006-06-27 2008-01-03 Nanoscape Ag Beschichtetes Molekularsieb
EP1873202B1 (en) * 2006-06-29 2009-02-11 Clariant Finance (BVI) Limited Transparent zeolite-polymer hybrid material with tunable properties
PL2082619T3 (pl) 2006-11-06 2023-03-13 Agency For Science, Technology And Research Nanocząstkowy enkapsulujący stos barierowy

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Publication number Publication date
TWI469827B (zh) 2015-01-21
KR20160119267A (ko) 2016-10-12
JP5581332B2 (ja) 2014-08-27
ITMI20082206A1 (it) 2010-06-13
CN104327305A (zh) 2015-02-04
US20110293895A1 (en) 2011-12-01
KR101768726B1 (ko) 2017-08-16
US20170152416A1 (en) 2017-06-01
JP2012511601A (ja) 2012-05-24
WO2010066647A1 (en) 2010-06-17
EP2373729B1 (en) 2015-04-01
TW201034747A (en) 2010-10-01
KR20110104023A (ko) 2011-09-21
EP2373729A1 (en) 2011-10-12
CN102264820A (zh) 2011-11-30
US10053604B2 (en) 2018-08-21

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