TWI469827B - 用於保護對h2o敏感之裝置而以分散在聚合型基質中之表面官能化奈米沸石為底質的複合材料 - Google Patents
用於保護對h2o敏感之裝置而以分散在聚合型基質中之表面官能化奈米沸石為底質的複合材料 Download PDFInfo
- Publication number
- TWI469827B TWI469827B TW98142559A TW98142559A TWI469827B TW I469827 B TWI469827 B TW I469827B TW 98142559 A TW98142559 A TW 98142559A TW 98142559 A TW98142559 A TW 98142559A TW I469827 B TWI469827 B TW I469827B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- barrier layer
- barrier
- composite
- layer composite
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims description 37
- 239000011159 matrix material Substances 0.000 title description 18
- 230000004888 barrier function Effects 0.000 claims description 49
- 239000010457 zeolite Substances 0.000 claims description 41
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 31
- 229910021536 Zeolite Inorganic materials 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 125000000962 organic group Chemical group 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000007596 consolidation process Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 claims description 7
- 238000007306 functionalization reaction Methods 0.000 claims description 7
- -1 glycidoxy group Chemical group 0.000 claims description 7
- 239000007970 homogeneous dispersion Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000013626 chemical specie Substances 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000002243 precursor Substances 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 229910052744 lithium Inorganic materials 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 238000004146 energy storage Methods 0.000 claims description 2
- 125000005641 methacryl group Chemical group 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 48
- 239000000463 material Substances 0.000 description 34
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000011521 glass Substances 0.000 description 13
- 230000035515 penetration Effects 0.000 description 13
- 239000000758 substrate Substances 0.000 description 10
- 210000004027 cell Anatomy 0.000 description 9
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 9
- 239000004926 polymethyl methacrylate Substances 0.000 description 9
- 230000035699 permeability Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000010276 construction Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 101000801643 Homo sapiens Retinal-specific phospholipid-transporting ATPase ABCA4 Proteins 0.000 description 3
- 102100033617 Retinal-specific phospholipid-transporting ATPase ABCA4 Human genes 0.000 description 3
- 239000011149 active material Substances 0.000 description 3
- 239000003463 adsorbent Substances 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000012013 faujasite Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000010907 mechanical stirring Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052680 mordenite Inorganic materials 0.000 description 2
- 239000002114 nanocomposite Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000012812 sealant material Substances 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 description 1
- CWNOEVURTVLUNV-UHFFFAOYSA-N 2-(propoxymethyl)oxirane Chemical compound CCCOCC1CO1 CWNOEVURTVLUNV-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- ORGHESHFQPYLAO-UHFFFAOYSA-N vinyl radical Chemical compound C=[CH] ORGHESHFQPYLAO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
- B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
- H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Electrochemistry (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
- Thermistors And Varistors (AREA)
Description
本發明有關一種用於保護敏感裝置以免來自外部環境之H2
O滲透的複合材料,該複合材料係由分散在聚合型基質中之奈米沸石形成。
已知H2
O即使以微量形式存在亦會對於許多裝置的正確操作有害,該等裝置係在其領域中習知為MEMS(微機電系統)之微機電裝置、OLED型有機顯示器(有機發光二極體),及光伏打電池,諸如OSC(有機太陽能電池)或DSSC(對染料敏感之太陽能電池),此為部分最重要實例。下文中,以「敏感裝置」措辭指稱該等裝置,且更廣泛地指稱內部存在H2
O(即使少量(低於5000 ppm))會造成有害後果的任何密封裝置。
敏感裝置中存在H2
O可能導致該等裝置的性能漸進地惡化。有關該污染之影響的更多資訊可見科學論文:"Correlation between dark spot growth and pinhole size in organic light-emitting diodes",Shuang Fang Lim等人著,於2001年4月9日發表於Applied Physics Letters,第78卷,第15號,其主題有關OLED顯示器;以及"Organic Photovoltaics-Concepts and Realization"一書第五章,Brabec等人著,2003年由Springer-Verlag出版,其主題有關OSC型光伏打電池。
本技術中已習知使用吸附劑從對於氣態雜質之存在敏感的裝置之外殼中去除該等氣態雜質。例如,以本申請人名義申請之國際專利公告WO 2004/072604揭示使用分散在適用多孔基質中的活性成分;另一方面,在國際專利公告WO 2007/013118與WO 2007/013119(二者均以本申請人之名義申請)揭示奈米結構系統,其中該活性成分被限制在分散於聚合型基質中之多孔機構內,而分散在可滲透聚合型基質中之官能化核的使用係揭示於國際公告WO 2007/074494(以本申請人之名義申請)。
然而,使用上述解決方法可能不足以令敏感裝置的壽命延長到可與該裝置應用領域匹配的時間長度,當H2
O的滲透通量之速度高於複合吸氣劑之吸附性質所給定的吸氣量時尤甚。來自外部環境的滲透速度實際上取決於製造步驟期間該裝置的密封方式,即,取決於此種密封所使用之材料的化學物理性質。
在裝置的整體壽命期間,該密封材料必須能作為阻擋層以保護已封裝裝置免於受到來自外部環境的可能污染物污染。若通過該密封劑的污染物之滲透導致置入該裝置內的吸氣劑材料在過短(或者,總之與該裝置的預期應用不匹配)時間之後即飽和,則無法確保其對於可能惡化過程的保護作用:該阻擋層理應具有水滲透方面的適當特徵以保證可接受使用期限,且吸氣劑材料存在該敏感裝置中可與該阻擋層具有協同效果,避免該吸氣劑材料過早飽和。或者,當進入該裝置的有效滲透速度高於該吸氣劑材料的吸附速度時,無法確保該保護。若以低於滲透速度的吸附速度捕獲該污染物,則即使該吸氣劑材料並未因飽和而無活性時,亦無法避免敏感裝置的損壞。
本技術中已習知,由於不同聚合型材料對於不同類型污染的低滲透性緣故,在敏感裝置的製造過程中使用不同聚合型材料確使該等裝置之密封與保護以免受外部環境影響。例如,以3M Innovative Properties Co.名義申請之國際公告WO 2003/011939揭示環氧樹脂與包含羥基之有機化合物可作為在固結處理之後使得能獲得表面黏著性與低透濕率(通常稱為WVTR,水蒸氣穿透率)係數的化學組成物的基底。
在該等組成物的適用添加劑中,已預見使用惰性無機材料以降低在裝置之密封環境內的H2
O滲透。然而,使用惰性材料限制了對於最終聚合型基質而言很基本的阻擋性質,且該公告並未解決與製備組成物相關之獲致該等無機材料的均質分散體的技術問題。
由含有具有微米粒徑特徵之吸附物質的聚合型基質組成之阻擋層的實例的其他缺點係難以在裝置製造步驟期間獲得充分均勻沉積物,尤其是若厚度必須為約15 μm或更低時更加困難。此伴隨著確保對於該裝置或在固結步驟之後的包封結構之相關表面具有充足黏著性的額外困難度。此外,當密封材料含有具有奈米粒徑特徵(特別是奈米沸石)之吸附物質時,該等限制更常以該等吸附物質的大表面積所導致的黏聚傾向之故而難以確保其在聚合型基質內均質分散的方式表現。難以控制黏聚現象會造成難以獲得經固結材料的可重現最終性能,因此難以將其適當地用於工業製造過程。
該等複合材料的可能解決方法係揭示於以Agency For Science Technology And Research名義提出申請之國際公告WO 2008/057045,該案描述使用可吸附在以環氧樹脂為底質之組成物內部的水與氧分子之反應性奈米粒子。然而,該文件教示在多層結構中使用該組成物能獲得來自敏感裝置外部的低滲透值。事實上,在敏感裝置之包封技術領域中已為人熟知當使用一或更多層吸附層(以聚合型吸氣劑複合材料為底質或僅以吸氣劑材料為底質)且外部偶合所謂(嚴格地說)「密封層」(即,以低滲透材料為底質不含反應性物質)時,獲得較佳阻擋性質。總之,該等多層結構通常需要比使用單一層阻擋層更複雜之製造過程。
Chen等人之"Characterization and preparation of epoxy resin/zeolite nanocomposite"一文(收編於2002年,Diqiu Kexue第27卷,第403-407頁)教示使用界面活性劑或模板劑以克服獲得奈米粒子在聚合型基質中之均質分散體的困難。類似地,其他科學文章,例如Wang等人之"Preparation and Characterization of epoxy composites filled with functionalized nano-sized MCM-41 particles"(收編於2008年4月4日之Journal of Material Sciences,第43卷,第3683-3688頁)已硏究無機官能化或模板劑對於改善無機粒子與聚合型基質之間的相互作用之效果。所有該等公告均描述用於改善對無機表面與有機相之相互作用的控制之不同方法。
如公告為WO 2008/000457之國際專利申請案所述,可在上述奈米沸石表面塗布,其中該化學表面改質的特徵係藉由共價鍵與沸石表面鍵結的疏水有機基團。該公告描述含有該等奈米沸石之最終複合材料的部分可能應用(與奈米沸石在有機材料中之均勻性有關)。特別是,此參考資料著重於解決分布均勻性問題,但完全未提及官能化對沸石的吸收性質的影響以及對於密封材料之阻擋性質的影響之定量評估方面。
本發明目的係克服仍存在本技術中有關將密封材料用於對H2
O敏感之裝置的限制,其係藉由確保吸附物質之均質分散體在聚合型基質內部中,且同時藉由最大化其阻擋層性質以儘可能避免外部環境之污染物進入敏感裝置之經封裝元件。即使最新技術顯示可提高奈米複合材料之機械及/或光學性質的方式,但未提及如何根據導入所選定之離子物質、嵌段共聚物或表面官能化所給定的有益效果改善阻擋層性質,以及改善保護敏感裝置之阻擋層的較佳化學組成物。
本發明第一方面的本質係抗H2
O進入之阻擋層複合材料,該阻擋層複合材料包含表面官能化奈米沸石在可聚合化合物中或在含彼等之溶劑中的均質分散體,其特徵在於該奈米沸石含有與該可聚合化合物中之至少一種官能基屬於相同化學種類的表面改質有機基。在本發明描述中,可聚合化合物係定義為使用聚合方法藉由適當固化處理提供交聯度更高之結構的有機組成物(其為非部分聚合或僅部分聚合)。
茲使用圖1進一步描述本發明,圖1顯示本發明之複合材料與先前技術之複合材料之間的阻擋層性質的比較。
事實上,當預期使用奈米沸石作為反應性物質時,針對獲致均質分散體之前述問題的適當解決方法係以有機基官能化該等奈米沸石表面以降低其聚集傾向,以及獲得最終複合材料之阻擋層性質相較於含有非官能化或不適當官能化之奈米沸石的複合材料的意外改善。
可共價鍵結於奈米沸石表面或連接(仍藉由共價鍵連接)於可聚合材料之主鏈的有機官能基可以根據其化學種類分類:例如,在本發明下列說明中,此分類將考慮到脂族基團諸如烷基-、烯基-(例如乙烯基-)或炔基-、芳族基團(如苯基-或苯甲基-)。此外,官能基可以分成胺基-、亞胺基-、丙烯酸基-與甲基丙烯酸基-、環氧基-(epoxidic-)、異氰酸酯基-等基團。
發明人已發現,一但選用較佳密封樹脂之可聚合組成物,只能確保該等奈米沸石的某些類型之官能化,在固結步驟之後,與氣態物質之內部濃度的維持相符的H2
O穿透度低於與敏感裝置之期望壽命相當的時間之臨界值。因此,已發現特殊化學調配物包含被視為特別有利的聚合型基質之前驅物以及表面官能化之奈米沸石。
至於待用作本發明阻擋層複合材料之聚合化合物的特徵,較佳者顯示在25℃及60%相對濕度下低於10g mm m-2
天-1
之滲透性。關於本發明之分配材料的調配物,環氧樹脂特別適於作為聚合型基質的前驅物,特別是單一成分調配物、丙烯酸樹脂(以獲得例如聚甲基丙烯酸甲酯PMMA)、胺基甲酸酯(聚胺基甲酸酯PU)、烯烴(聚乙烯,PE或HDPE、聚丙烯PP、乙烯丙烯橡膠EPR),以及苯乙烯(聚苯乙烯PS)聚合物,以及以異丁烯/異戊二烯為底質之共聚物(習知為丁基橡膠BR)。在環氧樹脂當中,以雙酚A與表氯醇為底質之樹脂(習知縮寫為DGEBA(雙酚A之二縮水甘油醚)、酚醛清漆樹脂與環脂族樹脂特別有利。
關於已證實適於作為待置入至該聚合型基質中之反應性物質的奈米沸石,有表面經改質之林德(Linde)A型(LTA)沸石、林德L型(LTL)沸石、八面沸石(FAU)、絲光沸石(MOR)或水鈣沸石(GIS)。
至於其官能化的特殊類型,發明人已發現特別是使用芳族基團(諸如苯基(POD)或五氟苯基(PFOD))、或有機基(諸如乙烯基(VN)、烯丙基(ALL)、胺基(AMP)、縮水甘油氧基(GTO)、甲基丙烯酸(MCR)或其他脂族基(例如異丁基,OD))可獲得較佳結果。
存在該分配組成物內部的可能適用添加劑為陽離子光起始劑、增塑添加劑、提供可撓性之添加劑、反應性稀釋劑、固結/交聯劑,及黏著促進劑。
發明人已發現阻擋層性質係取決於該含有分配材料與奈米沸石之組成物,且在不同情況下主要可以根據奈米沸石的不同表面官能化而加以區分:
a. 未有機官能化;
b. 以與該可聚合化合物中所含有機基屬於不同化學種類的有機基官能化;
c. 以與該可聚合化合物中所含有機基屬於相同化學種類但不同的有機基官能化;或
d. 以與該可聚合化合物中所含有機基中之至少一種屬於相同化學種類且相同的有機基官能化。
此外,在情況d)中,存在該奈米沸石表面與在該可聚合化合物中的相同有機基可為可聚合基團或非可聚合基團。
可考慮不同參數(例如延遲時間或失效時間)評估介於上述所報導者之特定情況與阻擋層性質之間的關係。在A. Siegel之論文"Reactive barrier membranes: some theoretical observations regarding the time lag and breakthrough curves"(2004年發表於Journal of Membrane Science,第229卷,第33-41頁)中描述及硏究該等物理性質。因奈米沸石在聚合型基質中時比其呈粉末形式且未倂入基質中時之吸附性能降低的影響,該等性質亦可與在聚合型基質中之奈米沸石的有效吸附能力有關。
發明人已發現相較於未經表面官能化奈米沸石以及未負載聚合型材料二者,使用官能化奈米沸石可以提供更佳結果。舉例來說,圖1顯示已發現特別有利之調配物。該組成物提供以芳族基團POD官能化之奈米沸石LTA 4A在以DGEBA為底質之環氧樹脂中的均質分散體,其可經由機械性攪拌而獲得。事先熱活化奈米沸石。比較所獲得之複合材料與已載於相同聚合型材料之未官能化LTA 4A奈米沸石。
已使用玻璃接玻璃構造評估滲透前緣,該滲透前緣係表示所給定材料之阻擋層性質特徵的參數,其中在該玻璃接玻璃構造中事先沉積密封劑組成物以完全填充兩片玻璃之間的空隙。將該參數定義為對應於特定臨界H2
O濃度之沉積在玻璃接玻璃構造中的阻擋層材料的長度,其可因有興趣的最終裝置而異。因此,其可以以任何能測量聚合型材料中之H2
O局部量的分析技術加以監測。
不同複合材料之阻擋層材料的性能可以藉由比較已記錄之觀察到相同穿透前緣的不同時間--參考最佳表現材料的相對時間--來評估。事實上,針對選定之H2
O量評估該參數,但在該材料中之水的穿透率為常數(即,不會隨著該聚合物中之水濃度而改變)的假設之下,其可被視為一般性質。
表1顯示藉由比較不同複合阻擋層之具有相同穿透前緣之相對時間方面的表現而得之某些實驗數據。聚合型基質中之奈米沸石分散體(以符合黏聚分散相之徑譜的常態分布之標準差評估)並未因其特殊官能化而有意義地改變。受到官能化基之特殊性質極大影響的阻擋層性質則不在此列。因此,阻擋層性能的差異與在最終基質中之無機粒子分散體的均勻性不相關。
使用例如含有相同重量百分比之活性物質、未官能化奈米沸石(無實例)或非適當官能化(POD實例)的PMMA作為聚合型材料對於最終材料的阻擋層性質產生相同效果,然而該聚合型材料中與沸石表面上具有可交聯相同官能基者(MCR實例)獲得最佳結果。特別在該記錄實例中,可以觀察到由於PMMA-OD或PMMA-MCR之組成物相對於PMMA-POD或PMMA-無之組成物花費更長時間以具有相同穿透前緣,故PMMA-OD或PMMA-MCR之組成物不僅能保護敏感元件較長持續時間(約25至100%),亦可用作對照比較組成物具有尺寸縮小的保護塗層或密封周邊沉積物,此在製造與技術發展方面具有顯著優點。
表2中,記錄表示複合材料之阻擋層性質的特徵之其他實驗數據,考慮到活性物質之不同濃度以及不同種類之黏著樹脂,例如丙烯酸樹脂(例如由Epotek Technologies Inc.所售之Epotek og-603)、以DGBEA為底質之環氧樹脂膠(由Epotek Technologies Inc.所售之Epotek OG-142-17)或以兩種流體DGBEA為底質之環氧成分(由Struers Inc.所售之Epofix)為底質的冷固化樹脂。
本發明第二方面係於H2
O敏感裝置的包封步驟期間使用本發明組成物的方法,以便藉由在聚合型基質內部之有機基表面官能化的奈米沸石所形成之複合吸附劑保護該等裝置以免該污染物滲透。
發明人已發現特別適於本發明組成物之沉積技術係絹印(網版印刷)、微分散(例如,使用注射器)、旋轉塗布、噴霧塗布、刮刀技術、噴墨、滴下式方法(one-drop process)。該沉積步驟可經設計以形成僅沿著該敏感裝置邊緣或在該元件之至少部分但較佳係完整覆蓋層或對於該裝置中之濕氣存在特別敏感的表面形成沉積。
該固結步驟係於將欲待偶合的兩個表面適當定位之後進行。在可能步驟當中,已證實UV輻射、熱固結或其組合適用於本發明。關於同熱固結,當前驅物為含有活性物質與有機化合物的溶液時,亦可以考慮該前驅物有機化合物之雙成分混合物的室溫固化或溶劑蒸發。
本發明第三方面在於使用本發明阻擋層組成物作為對外部污染之保護的敏感裝置,該外部污染主要係指濕氣與氧。
通常,敏感裝置正常操作期間其內部之H2
O濃度不會超過臨界值時,本發明係有利的。該臨界值與敏感裝置之種類有關,且在需要極低水濃度的裝置當中,OLED通常需要10 ppm或更低之濃度,然而太陽能電池發生不可逆惡化現象之前可忍受高至5000 ppm之濃度。光伏打電池(CIS-CIGS電池、CdTe電池、a-Si電池、OSC、DSSC)、OLED顯示器、微機電裝置(MEMS或MOEMS)、發光二極體(LED)及儲能裝置(特別指鋰電池組與鋰空氣電池組)係在從本發明方法之應用受益最多的敏感裝置之列。
本發明之組成物於固結處理之後可作為敏感裝置的周邊密封劑材料、作為沿著該裝置之外部密封劑材料偶合的周邊阻擋層沉積物,或作為塗布該裝置之對於外部環境污染敏感的結構及/或功能元件之表面的阻擋層。作為限制實例,該阻擋層可用作完全填充該敏感裝置中之經包封容積的填料材料。
茲參考下列實施例進一步描述本發明。
將7.74克在真空下以240℃之熱處理事先活化的LTA 4A-POD加至31.36克之Epo-tek OG 142-17樹脂(以表氯醇和雙酚A為底質之單一成分市售環氧樹脂),黏度為300-500 cPa s,Tg為54℃。以簡單機械性攪拌預分散該組成物(DGBEA環氧樹脂-POD),然後使用所謂3滾筒粉碎混合機使之均質。在於乾燥氮氛圍下之室(通常稱為「手套工作箱」)內部進行所有前述操作。
第二組成物(DGBEA環氧樹脂-無)係使用3.66克之非有機官能化LTA-4A與14.50克之樹脂,以與上述製程相似方式製備。
在防濕氛圍下,將0.22克之分配材料沉積於(2.54 x 6.00)cm2
之表面上以獲致300 μm之厚度,然後藉由UV固化(300秒,100mW/cm2,λ=250-400 nm),製備玻璃接玻璃構造(每一種組成物製備一個此種構造)。
每一樣本在85℃及85%相對濕度之曝露條件下的H2
O動力穿透程度係列於圖1之圖表,其中含有表面經改質之沸石的組成物呈實線1之形式,而非官能化之實例呈虛線2之形式。表2已記錄經比較樣本中具有相同穿透前緣的相對時間。
將230.8克之PMMA(Aldrich,MW 120000)事先溶解於800 ml之99%無水甲苯(Aldrich)。在80℃回流加熱30分鐘且機械性攪拌,獲得澄清之具黏性PMMA/甲苯懸浮液。
將1.90克之LTA 4A(於真空下以450℃事先活化)加至30.05克之PMMA/甲苯溶液而製備之組成物PMMA-無係以簡單機械性攪拌預分散,然後使用所謂3滾筒粉碎混合機使之均質。所有操作係在手套工作箱中進行。
該玻璃接玻璃構造係在手套工作箱中進行複合物之沉積,其係沉積在2.54 x 6.00 x 0.015 cm之玻璃基材上,並溫和地加熱至50℃達10分鐘使該膜固結,然後施加覆蓋玻璃,並在真空下以80℃乾燥該玻璃接玻璃樣本6小時,直到該系統達到恆重為止。
相似地,分別使用以下各者製備含有表面經改質之奈米沸石的組成物:
a)PMMA-POD組成物:於31.32克之PMMA/甲苯溶液中之1.91克之LTA-4A POD(經由240℃之熱處理事先活化);
b)PMMA-OD組成物:於31.50克之PMMA/甲苯溶液中之1.90克之經由170℃之熱處理事先活化的LTA-4A OD;或
c)PMMA-MCR之組成物:於29.9克之PMMA/甲苯溶液中之1.79克之經由180℃之熱處理事先活化的LTA-4A MCR。
依照與PMMA-無之組成物所述相同製程獲得使用該等組成物之玻璃接玻璃構造。
在表2中,已記錄經比較樣本中具有相同穿透前緣的相對時間(測試條件為85℃及85%相對濕度)。
將1.50克在真空下以240℃之熱處理事先活化的LTA 4A-POD加至28.00克之Epo-tek OG-603樹脂(單一成分丙烯酸樹脂),黏度為300-500 cPa s,Tg為54℃。以簡單機械性攪拌預分散該丙烯酸-POD組成物,然後使用所謂3滾筒粉碎混合機使之均質。所有前述操作係在手套工作箱中進行。
第二組成物(丙烯酸-MCR)係使用1.05克之LTA-4A MCR與20.03克之樹脂,以與上述製程相似方式製備。
在防濕氛圍下,將0.49克之分配材料沉積於(2.54 x 6.00)cm2
之表面上,然後藉由UV固化(10秒,100mW/cm2,λ=250-400 nm),製備玻璃接玻璃構造(每一種組成物製備一個此種構造)。
評估在85℃及85%相對濕度之樣本曝露條件下的H2
O動力穿透程度,並在表2中記錄經比較樣本中具有相同穿透前緣的相對時間。
將0.42克在真空下以450℃之熱處理活化的LTA 4A加至1.60克之Epofix底質、0.07克之Epofix硬化劑(市售之雙成分DGEBA環氧樹脂)與0.1克之(3-縮水甘油氧基丙基)三甲氧基矽烷(ABCR)的混合料中。以簡單機械性攪拌預分散該組成物(冷固化環氧樹脂-無),然後使用所謂3滾筒粉碎混合機使之均質。所有操作係在手套工作箱中進行。
相似地,將0.42克之GTO(經由在真空下以175℃之熱處理預活化)加至1.60克之Epofix底質、0.07克之Epofix硬化劑與0.1 g之ABCR的混合料中,獲得第二組成物(冷固化樹脂-GTO)。
最後,以相同製程,將0.42克之POD(經由在真空下以240℃之熱處理預活化)加入1.60克之Epofix底質、0.07克之Epofix硬化劑與0.1克之ABCR的混合料中,獲得第三組成物(冷固化樹脂-POD)。
為了獲致每一種組成物的玻璃接玻璃構造,在手套工作箱中將該膠沉積於2.54 x 6.00 x 0.015 cm之玻璃基材上,並以另一玻璃片覆蓋。以80℃固化該等樹脂1小時。
評估在85℃及85%相對濕度之樣本曝露條件下的H2
O動力穿透程度,並在表2中記錄經比較樣本中具有相同穿透前緣的相對時間。
圖1顯示每一樣本於85℃及在85%相對濕度之曝露條件下的H2
O動力穿透程度。
Claims (25)
- 一種抗H2 O進入之阻擋層複合材料,其包含在可聚合化合物中之表面官能化奈米沸石的均質分散體,該阻擋層複合材料特徵在於該奈米沸石含有與該聚合化合物中之至少一種官能基屬於相同化學種類的表面改質有機基。
- 如申請專利範圍第1項之阻擋層複合材料,其中該奈米沸石的表面改質有機基與該可聚合化合物中之至少一種官能基相同。
- 如申請專利範圍第1或2項之阻擋層複合材料,其中該經表面改質之奈米沸石上的官能化包括芳族基。
- 如申請專利範圍第3項之阻擋層複合材料,其中該芳族基為苯基。
- 如申請專利範圍第1或2項之阻擋層複合材料,其中該表面改質有機基中之至少一者為脂族基。
- 如申請專利範圍第2項之阻擋層複合材料,其中該奈米沸石之表面改質基為可聚合基。
- 如申請專利範圍第6項之阻擋層複合材料,其中該表面改質基為縮水甘油氧基、丙烯酸基或甲基丙烯酸基。
- 如申請專利範圍第1項之阻擋層複合材料,其中該可聚合化合物為環氧樹脂或丙烯酸樹脂之有機樹脂。
- 如申請專利範圍第1項之阻擋層複合材料,其中該聚合化合物為酚醛清漆樹脂。
- 如申請專利範圍第1項之阻擋層複合材料,其中該經表面改質之奈米沸石之特徵係其為LTA、FAU、LTL或GIS沸石。
- 如申請專利範圍第8項之阻擋層複合材料,其中該環氧樹脂之特徵係其為單一成分樹脂。
- 如申請專利範圍第11項之阻擋層複合材料,其中該單一成分樹脂為以雙酚與表氯醇(DGEBA)為底質的樹脂。
- 一種用於製造如申請專利範圍第1項之阻擋層的方法,其先進行阻擋層前驅物的沉積步驟,然後進行固結步驟。
- 如申請專利範圍第13項之方法,其中該沉積係以絹印進行。
- 如申請專利範圍第13項之方法,其中該沉積係以微分散作用而獲得。
- 如申請專利範圍第15項之方法,其中該微分散作用係使用注射器而獲得。
- 如申請專利範圍第13項之方法,其中該固結步驟係選自UV照射、熱處理及其組合。
- 一種敏感裝置,其包含如申請專利範圍第1項之阻擋層複合材料。
- 如申請專利範圍第18項之敏感裝置,其中該阻擋層複合材料係存在該敏感裝置的邊緣。
- 如請求項第18項之敏感裝置,其中該阻擋層複合材料覆蓋該敏感裝置的內部零件。
- 如請求項第18項之敏感裝置,其中該裝置為光伏打電池。
- 如請求項第18項之敏感裝置,其中該裝置為OLED螢幕。
- 如請求項第18項之敏感裝置,其中該裝置為微機電裝置。
- 如請求項第18項之敏感裝置,其中該裝置為儲能裝置。
- 如請求項第24項之敏感裝置,其中該裝置為鋰電池。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002206A ITMI20082206A1 (it) | 2008-12-12 | 2008-12-12 | Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201034747A TW201034747A (en) | 2010-10-01 |
TWI469827B true TWI469827B (zh) | 2015-01-21 |
Family
ID=40668386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98142559A TWI469827B (zh) | 2008-12-12 | 2009-12-11 | 用於保護對h2o敏感之裝置而以分散在聚合型基質中之表面官能化奈米沸石為底質的複合材料 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20110293895A1 (zh) |
EP (1) | EP2373729B1 (zh) |
JP (1) | JP5581332B2 (zh) |
KR (2) | KR101768726B1 (zh) |
CN (2) | CN104327305B (zh) |
IT (1) | ITMI20082206A1 (zh) |
TW (1) | TWI469827B (zh) |
WO (1) | WO2010066647A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013062486A1 (en) * | 2011-10-24 | 2013-05-02 | Tera-Barrier Films Pte Ltd | Encapsulation barrier stack |
JP2020012041A (ja) * | 2018-07-17 | 2020-01-23 | パナソニックIpマネジメント株式会社 | ガスバリア用塗料組成物及び発光装置 |
CN109456722A (zh) * | 2018-10-22 | 2019-03-12 | 广州市垠瀚能源科技有限公司 | 一种耐锂离子电池电解液的双组份环氧胶粘剂的制备方法 |
JP7053911B2 (ja) * | 2021-03-04 | 2022-04-12 | 旭化成株式会社 | 複合体 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10251488A (ja) * | 1997-03-07 | 1998-09-22 | Sony Corp | 半導体装置用硬化性樹脂組成物 |
US20060034757A1 (en) * | 2003-11-07 | 2006-02-16 | The Regents Of The University Of California | Polymer-zeolite nanocomposite membranes for proton-exchange-membrane fuel cells |
WO2008000457A2 (de) * | 2006-06-27 | 2008-01-03 | Nanoscape Ag | Hydrophob beschichtetes molekularsieb |
US20080014451A1 (en) * | 2006-06-29 | 2008-01-17 | Clariant International Ltd., Universitat Bern and Optical Additives GmbH | Transparent zeolite-polymer hybrid material with tunable properties |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3704806A (en) * | 1971-01-06 | 1972-12-05 | Le T Im Lensoveta | Dehumidifying composition and a method for preparing the same |
US4637197A (en) * | 1984-10-15 | 1987-01-20 | Epoxy Technology, Inc. | Method and compositions for removal of moisture |
US5827908A (en) * | 1994-01-26 | 1998-10-27 | Shin-Etsu Chemical Co., Ltd. | Naphthalene and or biphenyl skeleton containing epoxy resin composition |
CN1558921A (zh) * | 2001-08-03 | 2004-12-29 | Dsm | 显示器件用可固化组合物 |
JP2003155355A (ja) * | 2001-11-21 | 2003-05-27 | Mitsubishi Chemicals Corp | 超微粒子を含有する樹脂組成物成形体 |
US6936131B2 (en) * | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
FR2840913B1 (fr) * | 2002-06-13 | 2005-02-04 | Inst Francais Du Petrole | Composition pour reservoir a paroi monocouche |
US20060284556A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Electronic devices and a method for encapsulating electronic devices |
ITMI20051501A1 (it) * | 2005-07-29 | 2007-01-30 | Getters Spa | Sistemi getter comprendenti una fase attiva inserita in un materiale poroso distribuito in un mezzo disperdente a bassa permeabilita' |
ITMI20052496A1 (it) * | 2005-12-27 | 2007-06-28 | Getters Spa | Sistemi compositi assorbitori di gas e metodi per la loro produzione |
JP4098339B2 (ja) * | 2006-09-13 | 2008-06-11 | ポジティブフォースインベストメンツコーポレーション | プラスチック除湿用マスターバッチ及びプラスチック材料の除湿方法 |
KR101286745B1 (ko) * | 2006-03-30 | 2013-07-15 | 헨켈 아게 운트 코. 카게아아 | 열경화성 에폭시-아민 배리어 밀봉제 |
JP5559542B2 (ja) | 2006-11-06 | 2014-07-23 | エージェンシー フォー サイエンス,テクノロジー アンド リサーチ | ナノ粒子カプセル封入バリアスタック |
-
2008
- 2008-12-12 IT IT002206A patent/ITMI20082206A1/it unknown
-
2009
- 2009-12-04 WO PCT/EP2009/066445 patent/WO2010066647A1/en active Application Filing
- 2009-12-04 EP EP09764831.5A patent/EP2373729B1/en active Active
- 2009-12-04 JP JP2011540032A patent/JP5581332B2/ja active Active
- 2009-12-04 KR KR1020117016025A patent/KR101768726B1/ko active IP Right Grant
- 2009-12-04 KR KR1020167027059A patent/KR20160119267A/ko not_active Application Discontinuation
- 2009-12-04 CN CN201410564684.8A patent/CN104327305B/zh active Active
- 2009-12-04 CN CN200980146836XA patent/CN102264820A/zh active Pending
- 2009-12-04 US US13/131,393 patent/US20110293895A1/en not_active Abandoned
- 2009-12-11 TW TW98142559A patent/TWI469827B/zh active
-
2016
- 2016-12-12 US US15/376,472 patent/US10053604B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10251488A (ja) * | 1997-03-07 | 1998-09-22 | Sony Corp | 半導体装置用硬化性樹脂組成物 |
US20060034757A1 (en) * | 2003-11-07 | 2006-02-16 | The Regents Of The University Of California | Polymer-zeolite nanocomposite membranes for proton-exchange-membrane fuel cells |
WO2008000457A2 (de) * | 2006-06-27 | 2008-01-03 | Nanoscape Ag | Hydrophob beschichtetes molekularsieb |
US20080014451A1 (en) * | 2006-06-29 | 2008-01-17 | Clariant International Ltd., Universitat Bern and Optical Additives GmbH | Transparent zeolite-polymer hybrid material with tunable properties |
Also Published As
Publication number | Publication date |
---|---|
EP2373729A1 (en) | 2011-10-12 |
KR20160119267A (ko) | 2016-10-12 |
CN102264820A (zh) | 2011-11-30 |
EP2373729B1 (en) | 2015-04-01 |
CN104327305B (zh) | 2016-04-06 |
US20170152416A1 (en) | 2017-06-01 |
JP2012511601A (ja) | 2012-05-24 |
CN104327305A (zh) | 2015-02-04 |
JP5581332B2 (ja) | 2014-08-27 |
US10053604B2 (en) | 2018-08-21 |
KR20110104023A (ko) | 2011-09-21 |
TW201034747A (en) | 2010-10-01 |
WO2010066647A1 (en) | 2010-06-17 |
ITMI20082206A1 (it) | 2010-06-13 |
KR101768726B1 (ko) | 2017-08-16 |
US20110293895A1 (en) | 2011-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104093805B (zh) | 粘合膜 | |
US10053604B2 (en) | Composite material for the protection of H2O sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix | |
JP5263849B2 (ja) | 酸素及び/又は水分に敏感な電子デバイスをカプセル封じするための多層膜 | |
KR100838073B1 (ko) | 유기 발광 소자 및 그 제조 방법 | |
TWI681034B (zh) | 具有可活化吸氣劑材料之黏著劑、其用途及應用方法,及保護有機電子裝置之方法 | |
TWI523685B (zh) | 用於保護對濕氣敏感的裝置之組成物 | |
AU2006350626A1 (en) | Nanoparticulate encapsulation barrier stack | |
JP2012529184A (ja) | カプセル収納プロセスおよび関連する電子デバイス構造。 | |
US11242463B2 (en) | Self-stratifying coatings | |
CN105916921B (zh) | 从平面结构体移除渗透物的方法 | |
JP2015519191A (ja) | 湿度に敏感な電子デバイス用の乾燥剤組成物 | |
CN109642125B (zh) | 用于封装电子结构体的胶带 | |
KR20160101962A (ko) | 반도체 장치의 제조 방법 및 열경화성 수지 시트 | |
US20080193751A1 (en) | Uv-Curing Adhesive, Preparation Process, Adhesively Bonded Semiconductor Component, and Method of Adhesive Bonding | |
KR20160102214A (ko) | 반도체 장치의 제조 방법 | |
O’Connell | Assessment of Interfacial Adhesives Used in Flexible Thin Film Encapsulation | |
KR20210089952A (ko) | 수분 흡착제, 이를 포함하는 봉지재 및 유기전자장치 | |
Boldrighini | Enhanced adhesives for the encapsulation of flexible organic photovoltaic modules |