ITMI20082206A1 - Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica - Google Patents

Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica Download PDF

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Publication number
ITMI20082206A1
ITMI20082206A1 IT002206A ITMI20082206A ITMI20082206A1 IT MI20082206 A1 ITMI20082206 A1 IT MI20082206A1 IT 002206 A IT002206 A IT 002206A IT MI20082206 A ITMI20082206 A IT MI20082206A IT MI20082206 A1 ITMI20082206 A1 IT MI20082206A1
Authority
IT
Italy
Prior art keywords
composite material
nanozeolites
protection
polymer matrix
disposed
Prior art date
Application number
IT002206A
Other languages
English (en)
Italian (it)
Inventor
Antonio Bonucci
Roberto Giannantonio
Roberto Macchi
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Priority to IT002206A priority Critical patent/ITMI20082206A1/it
Priority to EP09764831.5A priority patent/EP2373729B1/en
Priority to KR1020117016025A priority patent/KR101768726B1/ko
Priority to PCT/EP2009/066445 priority patent/WO2010066647A1/en
Priority to CN200980146836XA priority patent/CN102264820A/zh
Priority to KR1020167027059A priority patent/KR20160119267A/ko
Priority to CN201410564684.8A priority patent/CN104327305B/zh
Priority to JP2011540032A priority patent/JP5581332B2/ja
Priority to US13/131,393 priority patent/US20110293895A1/en
Priority to TW98142559A priority patent/TWI469827B/zh
Publication of ITMI20082206A1 publication Critical patent/ITMI20082206A1/it
Priority to US15/376,472 priority patent/US10053604B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/20—Light-sensitive devices
    • H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
    • H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/542—Dye sensitized solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Organic Insulating Materials (AREA)
  • Thermistors And Varistors (AREA)
IT002206A 2008-12-12 2008-12-12 Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica ITMI20082206A1 (it)

Priority Applications (11)

Application Number Priority Date Filing Date Title
IT002206A ITMI20082206A1 (it) 2008-12-12 2008-12-12 Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica
KR1020167027059A KR20160119267A (ko) 2008-12-12 2009-12-04 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료
KR1020117016025A KR101768726B1 (ko) 2008-12-12 2009-12-04 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료
PCT/EP2009/066445 WO2010066647A1 (en) 2008-12-12 2009-12-04 Composite material for the protection of h2o sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix
CN200980146836XA CN102264820A (zh) 2008-12-12 2009-12-04 基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料
EP09764831.5A EP2373729B1 (en) 2008-12-12 2009-12-04 Composite material for the protection of h2o sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix
CN201410564684.8A CN104327305B (zh) 2008-12-12 2009-12-04 基于在聚合物基体内分散的表面官能化的纳米沸石的用于h2o敏感性器件保护的复合材料
JP2011540032A JP5581332B2 (ja) 2008-12-12 2009-12-04 ポリマーのマトリクス中に分散された、表面を官能基化したナノゼオライトに基づく、ｈ２ｏに敏感な装置の保護のための複合材料
US13/131,393 US20110293895A1 (en) 2008-12-12 2009-12-04 Composite material for the protection of h2o sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix
TW98142559A TWI469827B (zh) 2008-12-12 2009-12-11 用於保護對ｈ2ｏ敏感之裝置而以分散在聚合型基質中之表面官能化奈米沸石為底質的複合材料
US15/376,472 US10053604B2 (en) 2008-12-12 2016-12-12 Composite material for the protection of H2O sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT002206A ITMI20082206A1 (it) 2008-12-12 2008-12-12 Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica

Publications (1)

Publication Number Publication Date
ITMI20082206A1 true ITMI20082206A1 (it) 2010-06-13

Family

ID=40668386

Family Applications (1)

Application Number Title Priority Date Filing Date
IT002206A ITMI20082206A1 (it) 2008-12-12 2008-12-12 Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica

Country Status (8)

Country Link
US (2) US20110293895A1 (https=)
EP (1) EP2373729B1 (https=)
JP (1) JP5581332B2 (https=)
KR (2) KR20160119267A (https=)
CN (2) CN102264820A (https=)
IT (1) ITMI20082206A1 (https=)
TW (1) TWI469827B (https=)
WO (1) WO2010066647A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201401022SA (en) * 2011-10-24 2014-04-28 Tera Barrier Films Pte Ltd Encapsulation barrier stack
DE102015106658B4 (de) * 2015-04-29 2025-12-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Bauelemente und Verfahren zu deren Herstellung
JP2020012041A (ja) * 2018-07-17 2020-01-23 パナソニックＩｐマネジメント株式会社 ガスバリア用塗料組成物及び発光装置
CN109456722A (zh) * 2018-10-22 2019-03-12 广州市垠瀚能源科技有限公司 一种耐锂离子电池电解液的双组份环氧胶粘剂的制备方法
JP7053911B2 (ja) * 2021-03-04 2022-04-12 旭化成株式会社 複合体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704806A (en) * 1971-01-06 1972-12-05 Le T Im Lensoveta Dehumidifying composition and a method for preparing the same
WO2007114822A1 (en) * 2006-03-30 2007-10-11 National Starch And Chemical Investment Holding Corporation Thermally curable epoxy-amine barrier sealants
EP1873202A1 (en) * 2006-06-29 2008-01-02 Clariant International Ltd. Transparent zeolite-polymer hybrid material with tunable properties

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US4637197A (en) * 1984-10-15 1987-01-20 Epoxy Technology, Inc. Method and compositions for removal of moisture
US5827908A (en) * 1994-01-26 1998-10-27 Shin-Etsu Chemical Co., Ltd. Naphthalene and or biphenyl skeleton containing epoxy resin composition
JPH10251488A (ja) * 1997-03-07 1998-09-22 Sony Corp 半導体装置用硬化性樹脂組成物
EP1412409A1 (en) * 2001-08-03 2004-04-28 Dsm N.V. Curable compositions for display devices
JP2003155355A (ja) * 2001-11-21 2003-05-27 Mitsubishi Chemicals Corp 超微粒子を含有する樹脂組成物成形体
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
FR2840913B1 (fr) * 2002-06-13 2005-02-04 Inst Francais Du Petrole Composition pour reservoir a paroi monocouche
US7691514B2 (en) * 2003-11-07 2010-04-06 The Regents Of The University Of California Polymer-zeolite nanocomposite membranes for proton-exchange-membrane fuel cells
US20060284556A1 (en) * 2003-11-12 2006-12-21 Tremel James D Electronic devices and a method for encapsulating electronic devices
ITMI20051501A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti una fase attiva inserita in un materiale poroso distribuito in un mezzo disperdente a bassa permeabilita'
ITMI20052496A1 (it) * 2005-12-27 2007-06-28 Getters Spa Sistemi compositi assorbitori di gas e metodi per la loro produzione
JP4098339B2 (ja) * 2006-09-13 2008-06-11 ポジティブフォースインベストメンツコーポレーション プラスチック除湿用マスターバッチ及びプラスチック材料の除湿方法
DE102006029849A1 (de) * 2006-06-27 2008-01-03 Nanoscape Ag Beschichtetes Molekularsieb
EP2082619B1 (en) * 2006-11-06 2022-10-12 Agency for Science, Technology And Research Nanoparticulate encapsulation barrier stack

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704806A (en) * 1971-01-06 1972-12-05 Le T Im Lensoveta Dehumidifying composition and a method for preparing the same
WO2007114822A1 (en) * 2006-03-30 2007-10-11 National Starch And Chemical Investment Holding Corporation Thermally curable epoxy-amine barrier sealants
EP1873202A1 (en) * 2006-06-29 2008-01-02 Clariant International Ltd. Transparent zeolite-polymer hybrid material with tunable properties

Non-Patent Citations (3)

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Title
DATABASE CHEMABS [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; 2002, CHEN, YAN-LING, E.A.: "Characterization and preparation of epoxy resin/zeolite nanocomposite", XP002531815, retrieved from STN Database accession no. 137:356800 *
DIQIU KEXUE, vol. 27, no. 4, 2002, pages 403 - 407 *
NA WANG, E.A.: "Preparation and characterization of epoxy composites filled with functionalized nano-sized MCM-41 particles", JOURNAL OF MATERIALS SCIENCE, vol. 43, 4 April 2008 (2008-04-04), pages 3683 - 3688, XP002531814 *

Also Published As

Publication number Publication date
US20110293895A1 (en) 2011-12-01
KR20160119267A (ko) 2016-10-12
KR20110104023A (ko) 2011-09-21
CN104327305A (zh) 2015-02-04
EP2373729A1 (en) 2011-10-12
TW201034747A (en) 2010-10-01
JP5581332B2 (ja) 2014-08-27
CN102264820A (zh) 2011-11-30
CN104327305B (zh) 2016-04-06
KR101768726B1 (ko) 2017-08-16
JP2012511601A (ja) 2012-05-24
US20170152416A1 (en) 2017-06-01
TWI469827B (zh) 2015-01-21
WO2010066647A1 (en) 2010-06-17
US10053604B2 (en) 2018-08-21
EP2373729B1 (en) 2015-04-01

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