Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/844—Encapsulations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
  • B81B7/0032—Packages or encapsulation
  • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
  • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K9/00—Use of pretreated ingredients
  • C08K9/04—Ingredients treated with organic substances
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
  • C09J11/02—Non-macromolecular additives
  • C09J11/04—Non-macromolecular additives inorganic
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/20—Light-sensitive devices
  • H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
  • H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
  • H01M10/00—Secondary cells; Manufacture thereof
  • H01M10/05—Accumulators with non-aqueous electrolyte
  • H01M10/052—Li-accumulators
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
  • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/852—Encapsulations
  • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
  • H10K30/80—Constructional details
  • H10K30/88—Passivation; Containers; Encapsulations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
  • H10K85/10—Organic polymers or oligomers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/011—Nanostructured additives
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
  • H10K2102/301—Details of OLEDs
  • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/842—Containers
  • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/542—Dye sensitized solar cells
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/549—Organic PV cells
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
  • Y02E60/10—Energy storage using batteries
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24777—Edge feature

Definitions

• the present invention relates to a composite material for the protection of sensitive devices to the permeation of H 2 O from the external environment, the composite material being formed of nanozeolites dispersed in a polymeric matrix.
• H 2 O Even in the form of traces, is harmful for the correct operation of several devices, among which there are micro-electromechanical devices known in the field as MEMS (Micro-Electro-Mechanical Systems), OLED type organic displays (Organic Light Emitting Diode) and photovoltaic cells such as OSC (Organic Solar Cells) or DSSC (Dye-Sensitized Solar Cells), to mention some of the most interesting ones.
• MEMS Micro-Electro-Mechanical Systems
• OLED type organic displays Organic Light Emitting Diode
• OSC Organic Solar Cells
• DSSC Dynamic Switche-Sensitized Solar Cells
• the use of the above-described solutions may be not sufficient to extend the life of the sensitive device up to a length of time compatible with its application field, especially when the permeation flux Of H 2 O is at a higher speed than the gettering flux specified by the sorbing properties of the composite getter.
• the permeation speed from the external environment in fact depends on how the device is sealed during the manufacturing step, i.e. on the chemical -physical characteristics of the material used for such a sealing.
• the sealing material must be able to act as a barrier in order to protect the packaged device from possible contaminants coming from the outside environment. If the permeation of these contaminants through the sealant is such to lead to the saturation of the getter material inserted in the device after a time that is too short or, anyway, not compatible with the intended application of the device, its protection from possible deterioration processes is not ensured: the barrier shall possess suitable characteristics in term of water permeation in order to guarantee an acceptable lifetime and the presence of the getter material in the sensitive device may have a synergistic effect with the barrier, avoiding its premature saturation. Alternatively, the protection can not be ensured when the effective permeation speed into the device is higher than the sorbing speed of the getter material. Even when the getter material is not inactive due to the saturation if the contaminant is captured with a sorption speed lower than the permeation speed, the damage of the sensitive device element can not be avoided.
• the above mentioned nanozeolites can be coated on their surface, where the chemical surface modification is characterized by hydrophobic organic groups bonded by covalent bonds to the zeolite surface.
• This publication describes some possible applications (related to the uniformity of the nanozeolites in the organic material) for the final composite material that contains them. In particular such reference addresses the problem of the uniformity of the distribution but is completely silent on the effect of the functionalization on the absorption properties of the zeolites and on the quantitative evaluation of its effect on the barrier properties of the sealing material.
• the invention is inherent to a barrier composite material against the ingress of H 2 O comprising a homogeneous dispersion of superficially functionalized nanozeolites in polymerizable compounds or in a solvent containing them, characterized in that said nanozeolites contain a surface modifying organic group belonging to the same chemical class of at least one functional group of the polymerizable compound.
• a polymerizable compound is defined as an organic composition (that is non or only partially polymeried) where a polymerization process is employed to give a more cross-linked structure by a suitable curing treatment.
• Figure 1 showing a comparison of the barrier properties between a composite material according to the present invention and a composite material of the prior art.
• a suitable solution to the above-described problem of achieving a homogeneous dispersion is to functionalize their surface with organic groups in order to reduce their tendency to aggregate and to obtain an unexpected improvement of the barrier properties of the final composite material with respect to a composite material containing non-functionalized or not-suitably functionalized nanozeolites.
• Organic functional groups that can be covalently bonded on the surface of the nanozeolites or connected (still by a covalent bond) to the main chain of a polymerizable material can be classified basing on its chemical class: for example, in the following description of the invention, this classification will considered aliphatic groups such as alkyl-, alkenyl- (e.g. vinyl-) or alkynyl-, aromatic groups as phenyl- or benzyl-.
• functional groups can be classified as amino-, imino-, acrylic- and methacryl-, epoxidic-, isocianate- etc. groups.
• the inventors have found out that, once the polymerizable composition of the preferred sealing resin has been chosen, only some types of functionalization of the nanozeolites can ensure, subsequent to the consolidation step, levels Of H 2 O penetration that are compatible with the maintenance of inner concentrations of the gaseous species lower than the critical value for time comparable to the desired life of the sensitive device.
• special chemical formulations have been found, which comprise precursors of polymeric matrices and also nanometric zeolites superficially functionalized that are to be considered particularly advantageous.
• epoxy resins are particularly suitable as precursors of the polymeric matrix, with particular reference to single component formulations, acrylic (to obtain, for example, polymethylmethacrylate PMMA), urethane (polyurethane PU), olefins (polyethylene PE or HDPE, polypropylene PP, Ethylene propylene rubber EPR) and styrene (polystyrene PS) polymers, as well as isobutylene/isoprene based copolymers (known as butyl rubbers BR).
• acrylic to obtain, for example, polymethylmethacrylate PMMA
• urethane PU polyurethane
• olefins polyethylene PE or HDPE
• polypropylene PP polypropylene PP
• EPR Ethylene propylene rubber
• styrene PS polystyrene PS
• DGEBA Diglycidyl Ether of Bisphenol A
• novolak resins and cycloaliphatic resins are particularly advantageous.
• aromatic groups such as phenyl groups (POD) or pentafluorphenyl groups (PFOD), or organic groups such as vinyl groups (VN), allyl groups (ALL), amino groups (AMP), glycidoxy groups (GTO) methacrilic groups (MCR) or other aliphatic groups (as for example iso-butyl groups OD).
• POD phenyl groups
• PFOD pentafluorphenyl groups
• organic groups such as vinyl groups (VN), allyl groups (ALL), amino groups (AMP), glycidoxy groups (GTO) methacrilic groups (MCR) or other aliphatic groups (as for example iso-butyl groups OD).
• POD phenyl groups
• PFOD pentafluorphenyl groups
• organic groups such as vinyl groups (VN), allyl groups (ALL), amino groups (AMP), glycidoxy groups (GTO) methacrilic groups (MCR) or other aliphatic
• barrier properties depend on the composition containing a dispensable material and nanozeolites and mainly can be distinguished in different cases according to different surface funtionalization of the nanozeolites: a. not organically functionalized; b. functionalized by organic groups belonging to different chemical classes with respect to those which are contained in the polymerizable compound; c. functionalized by organic groups belonging to the same chemical class but not identical to those which are contained in the polymerizable compound; or d. functionalized by organic groups belonging to the same chemical class and identical to at least one of those which are contained in the polymerizable compound.
• the identical organic groups present on the surface of the nanozeolites and in the polymerizable compound may be polymerizable groups or not.
• Figure 1 shows a formulation that has been found particularly advantageous.
• This composition provides for the homogeneous dispersion of nanometric zeolites LTA 4A functionalized with aromatic groups POD within a DGEBA based epoxy resin that can be obtained through mechanical stirring. Nanozeolites were previously thermally activated. The obtained composite material has been compared to the case in which not-funzionalized LTA 4A nanozeolites have been loaded in the same polymeric material.
• the permeation front a parameter which characterized the barrier properties of a given material, has been evaluated using a glass-to-glass configuration where the sealant composition was previously deposited to completely fill the space between the two glasses.
• This parameter is defined as the length of the barrier material deposit in glass- to-glass configuration corresponding to a specific critical H 2 O concentration, that can be different in relation to the final device of interest. Therefore it can be monitored with any analytical techniques able to measure the local amount of H 2 O in the polymeric material.
• the performance as barrier material for different composite materials can be evaluated by comparing the different times after which the same penetration front has been observed: the relative time, referred to best performing material, have been reported.
• This parameter in fact, is evaluated for a chosen H 2 O amount but it can be considered as a general property by the assumption that the penetration rate of water is constant in the material (i.e. does not change in function of the water concentration in the polymer).
• Table 1 shows some experimental data obtained by comparing the behavior of different composite barriers in terms of the relative time to have the same penetration front.
• the nanozeolite dispersion in a polymeric matrix (evaluable as the standard deviation in the normal distribution that fits the size spectrum of the agglomerated dispersed phase) does not change meaningfully with their specific functionalization. This is not the case for the barrier properties, that are strongly affected by the specific nature of the functionalization group. Therefore the difference in the barrier performance is not related to the uniformity of the inorganic particle dispersion in the final matrix.
• not-functionalized nanozeolites (none case) or not- suitably functionalized (POD case) give the same effect on the barrier property of the final material whereas best results have been obtained with crosslinkable identical functional groups in the polymeric material and on the zeolite surface (MCR case).
• PMMA-OD or PMMA-MCR compositions because of the longer time to have the same penetration front with respect to the PMMA-POD or PMMA-none, can not only protect a sensitive element for longer lasting time (from about 25 to 100%), but also can be used as protective coating or sealing perimetral deposits with reduced dimensions with respect to the comparative compositions, with obvious advantage in manufacturing and technological development.
• the invention resides in a method for the use of the compositions of the invention during the encapsulating process of H 2 O sensitive devices, in order to protect them from the permeation of this contaminant by means of composite sorbers formed of nanozeolites superficially functionalized with organic groups inside a polymeric matrix.
• deposition techniques particularly suitable for the compositions of the present invention are serigraphy (screen-printing), micro- dispensing (e.g. using a syringe), spin-coating, spray-coating, doctor blade technique, ink-jet, one-drop process.
• the deposition process may be so configured to result in a deposit along the edge only of the sensitive device or in an at least partial but preferably complete covering of the element or surface particularly sensible to the presence of moisture in the device.
• the consolidation process is carried out after having suitably positioned the two surfaces desired to be coupled.
• UV radiation, thermal consolidation or a combination thereof have proved to be suitable for the present invention.
• thermal consolidation it can be also considered the room temperature curing of a bi-component mixture of precursor organic compounds or the solvent evaporation whenever the precursor is a solution containing the active species and the organic compounds.
• the invention consists in a sensitive device wherein the barrier composition of the invention is used for its protection from external contamination, with main reference to moisture and oxygen.
• the present invention is advantageous when it is necessary that the concentration of H 2 O inside the sensitive device does not exceed a critical value during the normal operation of the device. This critical value is related to the type of sensitive device, and among the devices requiring a very small water concentration there are the OLEDs, which typically require concentrations of 10 ppm or lower, whereas solar cells may withstand up to 5000 ppm before irreversible deterioration phenomena are generated.
• Photovoltaic cells CIS-CIGS cells, CdTe cells, a-Si cells, OSC, DSSC), OLED displays, micro-electromechanical devices (MEMS or MOEMS), Light Emission Diodes (LED) and energy storage devices (with particular reference to lithium batteries and lithium air batteries) are among the sensitive devices that mostly benefit from the application of the method of the invention.
• the composition of the invention after its consolidation treatment, can act as the perimetric sealant material of the sensitive device, as perimetral barrier deposit coupled along an outer sealant material of the device or as a barrier layer coating the surface of the structural and/or functional elements of the device that are sensitive to the external environment contaminations.
• the barrier layer can be used as a filler material that completely fills the encapsulated volume in the sensitive device.
• a second composition (DGBEAepoxy - none) has been prepared similarly to the procedure above described, using 3.66 grams of non-organically functionalized LTA- 4 A and 14.50 grams of resin.
• composition PMMA-none prepared adding 1.90 grams of LTA 4 A
• the glass to glass configurations were performed in glove box depositing the composite over a glass substrate 2.54 x 6.00 x 0.015 cm, and gently heated to 50 0 C for
• surface modified nanozeolite containing compositions have been prepared using respectively: a) PMMA-POD composition: 1.91 grams of LTA-4A POD (previously activated through a thermal process at 240 0 C) in 31.32 grams of PMMA/Toluene solution; b) PMMA-OD composition: 1.90 grams of LTA-4A OD previously activated through a thermal process at 170 0 C in 31.50 grams of PMMA/Toluene solution; or c) PMMA-MCR composition: 1.79 grams of LTA-4A MCR previously activated through a thermal process at 180 0 C in 29.9 grams of PMMA/Toluene solution.
• a second composition (cold setting resin - GTO) has been obtained by adding 0.42 grams of GTO (pre-activated through a thermal process at 175°C under vacuum) to a mix of 1.60 grams of Epofix base, 0.07 grams of Epofix hardener and O.lg of ABCR.
• a third composition (cold setting resin - POD) has been obtained, with the same procedure, adding, 0.42 grams of (POD pre-activated through a thermal process at 240 0 C under vacuum) to a mix of 1.60 grams of Epof ⁇ x base, 0.07 grams of Epof ⁇ x hardener and 0.1 grams of ABCR.

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• Chemical Kinetics & Catalysis (AREA)
• Microelectronics & Electronic Packaging (AREA)
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• Computer Hardware Design (AREA)
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• Compositions Of Macromolecular Compounds (AREA)
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• Electroluminescent Light Sources (AREA)
• Organic Insulating Materials (AREA)
• Thermistors And Varistors (AREA)

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