CN1043002C - 波峰焊装置中用的焊料波形面检测装置 - Google Patents

波峰焊装置中用的焊料波形面检测装置 Download PDF

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Publication number
CN1043002C
CN1043002C CN92110001A CN92110001A CN1043002C CN 1043002 C CN1043002 C CN 1043002C CN 92110001 A CN92110001 A CN 92110001A CN 92110001 A CN92110001 A CN 92110001A CN 1043002 C CN1043002 C CN 1043002C
Authority
CN
China
Prior art keywords
solder
wave
wave surface
surface detection
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN92110001A
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English (en)
Chinese (zh)
Other versions
CN1070306A (zh
Inventor
森田恭弘
木山和行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1070306A publication Critical patent/CN1070306A/zh
Application granted granted Critical
Publication of CN1043002C publication Critical patent/CN1043002C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CN92110001A 1991-08-23 1992-08-21 波峰焊装置中用的焊料波形面检测装置 Expired - Fee Related CN1043002C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP212014/91 1991-08-23
JP3212014A JPH0775775B2 (ja) 1991-08-23 1991-08-23 噴流半田装置の波形面管理装置及びこれを用いた半田付け装置

Publications (2)

Publication Number Publication Date
CN1070306A CN1070306A (zh) 1993-03-24
CN1043002C true CN1043002C (zh) 1999-04-14

Family

ID=16615456

Family Applications (1)

Application Number Title Priority Date Filing Date
CN92110001A Expired - Fee Related CN1043002C (zh) 1991-08-23 1992-08-21 波峰焊装置中用的焊料波形面检测装置

Country Status (5)

Country Link
JP (1) JPH0775775B2 (enrdf_load_stackoverflow)
KR (1) KR960013706B1 (enrdf_load_stackoverflow)
CN (1) CN1043002C (enrdf_load_stackoverflow)
MY (1) MY109790A (enrdf_load_stackoverflow)
TW (1) TW221974B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744485A (zh) * 2012-07-23 2012-10-24 宝电电子(张家港)有限公司 变压器的焊锡装置

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4554748B2 (ja) * 1999-12-07 2010-09-29 株式会社タムラ製作所 ろう付け方法およびその装置
JP2003025063A (ja) * 2001-07-09 2003-01-28 Nihon Dennetsu Keiki Co Ltd 半田付け方法及び半田付け装置
CN102421560B (zh) * 2009-05-14 2015-04-22 千住金属工业株式会社 喷流焊料槽及锡焊装置
CN101628353B (zh) * 2009-08-07 2011-09-07 台达电子（东莞）有限公司 锡炉参数检测方法
CH706925A1 (de) * 2012-09-10 2014-03-14 Kirsten Soldering Ag Lötanlage mit einer Lotpumpe.
CN104148770B (zh) * 2014-09-02 2017-01-18 安徽省和翰光电科技有限公司 一种用于自动浸锡机的装夹装置
CN104296791B (zh) * 2014-10-08 2017-01-18 深圳市双赢伟业科技股份有限公司 印刷电路板测试探头夹持装置
CN104613844B (zh) * 2015-02-05 2019-03-12 合肥鑫晟光电科技有限公司 靶材厚度测量装置
JP6820948B2 (ja) * 2017-01-12 2021-01-27 三菱電機株式会社 はんだ噴流検査装置及びはんだ噴流検査方法
CN107335888B (zh) * 2017-05-19 2020-08-28 深圳市阿拉玎光电自动化有限公司 波峰焊波峰高度校正装置及校正方法
CN111201104B (zh) * 2017-10-18 2022-05-06 三菱电机株式会社 焊接装置、焊接方法及带元件的配线基板的制造方法
CN108465901B (zh) * 2018-05-19 2024-03-12 东莞市合易自动化科技有限公司 一种检测锡波形态的装置和检测方法
EP3831524A4 (en) * 2018-07-31 2022-05-18 OMRON Corporation INFORMATION PROCESSING DEVICE, MANAGEMENT SYSTEM, CONTROL PROGRAM AND METHOD FOR CONTROLLING AN INFORMATION PROCESSING DEVICE
CN113091683A (zh) * 2019-12-23 2021-07-09 昆山华复精密金属有限公司 一种产品表面弧度的检测装置
CN111473726B (zh) * 2020-05-11 2021-11-16 绍兴上虞通风机有限公司 一种利用标准风叶检测风机风叶的检测装置及其检测方法
DE102022118883B4 (de) * 2022-07-27 2025-05-22 Ersa Gmbh Verfahren zur Bestimmung der Wellenhöhe einer Lötwelle, Einrichtung zur Bestimmung der Wellenhöhe einer Lötwelle und Wellenlötanlage

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465219A (en) * 1981-06-02 1984-08-14 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01104446A (ja) * 1987-10-14 1989-04-21 Ishikawajima Harima Heavy Ind Co Ltd 双ロール式連鋳機の始動方法
JPH026163U (enrdf_load_stackoverflow) * 1988-06-24 1990-01-16
JPH0276663U (enrdf_load_stackoverflow) * 1988-11-25 1990-06-12
JP3070853U (ja) * 2000-02-08 2000-08-15 株式会社渡辺製作所 Ｉｓｄｎ回線用接続装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465219A (en) * 1981-06-02 1984-08-14 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744485A (zh) * 2012-07-23 2012-10-24 宝电电子(张家港)有限公司 变压器的焊锡装置

Also Published As

Publication number Publication date
JPH0775775B2 (ja) 1995-08-16
JPH0569121A (ja) 1993-03-23
KR930004013A (ko) 1993-03-22
MY109790A (en) 1997-06-30
KR960013706B1 (ko) 1996-10-10
CN1070306A (zh) 1993-03-24
TW221974B (enrdf_load_stackoverflow) 1994-04-01

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GR01 Patent grant
C15 Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993)
OR01 Other related matters
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee