CN104253208B - 基于半导体的霍尔传感器 - Google Patents
基于半导体的霍尔传感器 Download PDFInfo
- Publication number
- CN104253208B CN104253208B CN201310629910.1A CN201310629910A CN104253208B CN 104253208 B CN104253208 B CN 104253208B CN 201310629910 A CN201310629910 A CN 201310629910A CN 104253208 B CN104253208 B CN 104253208B
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- electrode
- sensing area
- hall
- hall sensor
- hall element
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000007514 turning Methods 0.000 claims abstract description 17
- 230000005611 electricity Effects 0.000 claims description 5
- 230000005355 Hall effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/82—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of the magnetic field applied to the device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/80—Constructional details
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0075971 | 2013-06-28 | ||
KR1020130075971A KR102019514B1 (ko) | 2013-06-28 | 2013-06-28 | 반도체 기반의 홀 센서 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104253208A CN104253208A (zh) | 2014-12-31 |
CN104253208B true CN104253208B (zh) | 2019-03-15 |
Family
ID=52114971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310629910.1A Active CN104253208B (zh) | 2013-06-28 | 2013-11-29 | 基于半导体的霍尔传感器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10809318B2 (zh) |
KR (1) | KR102019514B1 (zh) |
CN (1) | CN104253208B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2539681A (en) * | 2015-06-23 | 2016-12-28 | Melexis Tech Sa | Stress and temperature compensated hall sensor, and method |
ITUB20152562A1 (it) * | 2015-07-28 | 2017-01-28 | St Microelectronics Srl | Procedimento di funzionamento di sensori di hall e dispositivo corrispondente |
CN105674777B (zh) * | 2016-01-25 | 2017-08-04 | 云南科威液态金属谷研发有限公司 | 一种基于液态金属的智能器件 |
US20170288131A1 (en) * | 2016-03-29 | 2017-10-05 | Globalfoundries Singapore Pte. Ltd. | Integrated hall effect sensors with voltage controllable sensitivity |
DE102016114174B4 (de) * | 2016-08-01 | 2019-10-10 | Infineon Technologies Ag | Hall-sensor-bauelemente und verfahren zum betreiben derselben |
JP6929675B2 (ja) * | 2016-11-18 | 2021-09-01 | 旭化成エレクトロニクス株式会社 | ホール素子 |
US10760981B2 (en) * | 2016-11-18 | 2020-09-01 | Asahi Kasei Microdevices Corporation | Hall sensor |
CN108075036B (zh) * | 2016-11-18 | 2021-08-13 | 旭化成微电子株式会社 | 霍尔元件以及霍尔元件的制造方法 |
JP7011896B2 (ja) * | 2016-11-18 | 2022-01-27 | 旭化成エレクトロニクス株式会社 | ホール素子 |
CN106449969A (zh) * | 2016-12-01 | 2017-02-22 | 上海南麟电子股份有限公司 | 一种霍尔传感器及其制备方法 |
JP2018148166A (ja) * | 2017-03-09 | 2018-09-20 | エイブリック株式会社 | 半導体装置 |
KR101976771B1 (ko) * | 2017-10-13 | 2019-05-09 | (주)동운아나텍 | 작은 오프셋 전압을 갖는 홀센서 |
CN107765197B (zh) * | 2017-11-21 | 2020-07-07 | 上海南麟电子股份有限公司 | 一种霍尔传感器 |
IT201800007246A1 (it) | 2018-07-17 | 2020-01-17 | Sensore di hall, dispositivi e procedimento corrispondenti | |
CN109755381B (zh) * | 2018-12-24 | 2023-08-29 | 合肥中感微电子有限公司 | 霍尔传感器及其制造方法 |
CN110095056B (zh) * | 2019-06-19 | 2024-01-16 | 福州大学 | 一种片上集成的环形霍尔角度传感器及其传感扫描方法 |
CN112670404A (zh) * | 2020-12-22 | 2021-04-16 | 中国电子科技集团公司第四十九研究所 | 霍尔元件及霍尔元件的制备方法 |
KR102535002B1 (ko) * | 2021-04-23 | 2023-05-26 | 주식회사 키파운드리 | Cmos 공정 기반의 홀 센서를 포함하는 반도체 소자 및 그 제조 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87102998A (zh) * | 1986-04-29 | 1987-11-11 | 兰迪斯和吉尔楚格股份公司 | 可集成的霍尔元件 |
CN1343889A (zh) * | 2000-08-21 | 2002-04-10 | 桑特隆股份公司 | 检测磁场方向用的传感器 |
US6639290B1 (en) * | 1999-02-26 | 2003-10-28 | Fraunhofer-Gesellschaft Zur Foerderung, Der Angewandten Forschung E.V. | Hall sensor with a reduced offset signal |
CN102509767A (zh) * | 2011-11-04 | 2012-06-20 | 湖南追日光电科技有限公司 | 一种正八边形霍尔盘结构的cmos传感器及其制作方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4660065A (en) * | 1983-06-10 | 1987-04-21 | Texas Instruments Incorporated | Hall effect device with surface potential shielding layer |
CH662905A5 (de) * | 1983-12-19 | 1987-10-30 | Landis & Gyr Ag | Integrierbares hallelement. |
EP0590222A1 (en) * | 1992-09-30 | 1994-04-06 | STMicroelectronics S.r.l. | Magnetic position sensor |
US5548151A (en) * | 1994-03-09 | 1996-08-20 | Kabushiki Kaisha Toshiba | Hall element for detecting a magnetic field perpendicular to a substrate |
JP3602611B2 (ja) * | 1995-03-30 | 2004-12-15 | 株式会社東芝 | 横型ホール素子 |
US6492697B1 (en) * | 2000-04-04 | 2002-12-10 | Honeywell International Inc. | Hall-effect element with integrated offset control and method for operating hall-effect element to reduce null offset |
JP4490687B2 (ja) * | 2001-07-26 | 2010-06-30 | 旭化成エレクトロニクス株式会社 | 半導体ホールセンサ |
JP2005333103A (ja) * | 2004-03-30 | 2005-12-02 | Denso Corp | 縦型ホール素子およびその製造方法 |
KR101093776B1 (ko) * | 2010-01-21 | 2011-12-19 | 충남대학교산학협력단 | 자기 센서 |
JP2012204616A (ja) * | 2011-03-25 | 2012-10-22 | Asahi Kasei Electronics Co Ltd | ホール素子及びその製造方法、半導体装置 |
JP2013179251A (ja) * | 2012-02-09 | 2013-09-09 | Renesas Electronics Corp | 半導体装置 |
US9252354B2 (en) * | 2013-01-29 | 2016-02-02 | Infineon Technologies Ag | Vertical hall device with highly conductive opposite face node for electrically connecting first and second hall effect regions |
-
2013
- 2013-06-28 KR KR1020130075971A patent/KR102019514B1/ko active IP Right Grant
- 2013-11-01 US US14/069,430 patent/US10809318B2/en active Active
- 2013-11-29 CN CN201310629910.1A patent/CN104253208B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87102998A (zh) * | 1986-04-29 | 1987-11-11 | 兰迪斯和吉尔楚格股份公司 | 可集成的霍尔元件 |
US6639290B1 (en) * | 1999-02-26 | 2003-10-28 | Fraunhofer-Gesellschaft Zur Foerderung, Der Angewandten Forschung E.V. | Hall sensor with a reduced offset signal |
CN1343889A (zh) * | 2000-08-21 | 2002-04-10 | 桑特隆股份公司 | 检测磁场方向用的传感器 |
CN102509767A (zh) * | 2011-11-04 | 2012-06-20 | 湖南追日光电科技有限公司 | 一种正八边形霍尔盘结构的cmos传感器及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20150002140A1 (en) | 2015-01-01 |
KR20150003044A (ko) | 2015-01-08 |
US10809318B2 (en) | 2020-10-20 |
KR102019514B1 (ko) | 2019-11-15 |
CN104253208A (zh) | 2014-12-31 |
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TR01 | Transfer of patent right |
Effective date of registration: 20201020 Address after: Han Guozhongqingbeidao Patentee after: Key Foundry Co.,Ltd. Address before: Han Guozhongqingbeidao Patentee before: Magnachip Semiconductor, Ltd. |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Republic of Korea Patentee after: Aisi Kaifang Semiconductor Co.,Ltd. Country or region after: Republic of Korea Address before: Han Guozhongqingbeidao Patentee before: Key Foundry Co.,Ltd. Country or region before: Republic of Korea |