CN104233409B - 一种电镀工艺 - Google Patents
一种电镀工艺 Download PDFInfo
- Publication number
- CN104233409B CN104233409B CN201410476885.2A CN201410476885A CN104233409B CN 104233409 B CN104233409 B CN 104233409B CN 201410476885 A CN201410476885 A CN 201410476885A CN 104233409 B CN104233409 B CN 104233409B
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- CN
- China
- Prior art keywords
- electroplate liquid
- electroplating
- electro
- cathode
- current density
- Prior art date
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- 238000009713 electroplating Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 241001163841 Albugo ipomoeae-panduratae Species 0.000 abstract description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002253 acid Substances 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 abstract description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 abstract description 3
- 239000000347 magnesium hydroxide Substances 0.000 abstract description 3
- KAQHZJVQFBJKCK-UHFFFAOYSA-L potassium pyrosulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OS([O-])(=O)=O KAQHZJVQFBJKCK-UHFFFAOYSA-L 0.000 abstract description 2
- 229910000365 copper sulfate Inorganic materials 0.000 abstract 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 description 1
- 238000005235 decoking Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- VFNGKCDDZUSWLR-UHFFFAOYSA-N disulfuric acid Chemical compound OS(=O)(=O)OS(O)(=O)=O VFNGKCDDZUSWLR-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
实施例 | 镀层厚度μm | 出白锈时间h | 出红锈时间h |
实施例1 | 5 | 70 | 420 |
实施例2 | 5 | 80 | 450 |
实施例3 | 5 | 60 | 500 |
实施例4 | 5 | 70 | 520 |
对比例1 | 5 | 12 | 200 |
对比例2 | 5 | 15 | 220 |
对比例3 | 5 | 20 | 250 |
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410476885.2A CN104233409B (zh) | 2014-09-17 | 2014-09-17 | 一种电镀工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410476885.2A CN104233409B (zh) | 2014-09-17 | 2014-09-17 | 一种电镀工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104233409A CN104233409A (zh) | 2014-12-24 |
CN104233409B true CN104233409B (zh) | 2016-09-14 |
Family
ID=52222280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410476885.2A Active CN104233409B (zh) | 2014-09-17 | 2014-09-17 | 一种电镀工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN104233409B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105018990A (zh) * | 2015-08-21 | 2015-11-04 | 无锡桥阳机械制造有限公司 | 一种铜锆合金电镀液及其电镀方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB838981A (en) * | 1956-08-14 | 1960-06-22 | Nippert Electric Products Comp | Improvements in copper zirconium alloy and its heat treatment |
JPS62297430A (ja) * | 1986-06-17 | 1987-12-24 | Hitachi Cable Ltd | 半導体機器のリ−ド用銅−ジルコニウム合金 |
JPH05195284A (ja) * | 1992-01-24 | 1993-08-03 | Hitachi Kyowa Kogyo Co Ltd | 銅合金めっき液 |
JPH11312655A (ja) * | 1998-04-30 | 1999-11-09 | Sony Corp | Cu合金膜の形成方法および半導体装置の製造方法 |
WO2007145164A1 (ja) * | 2006-06-12 | 2007-12-21 | Nippon Mining & Metals Co., Ltd. | 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法 |
KR20130013084A (ko) * | 2011-07-27 | 2013-02-06 | 윤종오 | 지르코늄 합금 전기도금액 조성물 및 도금체 |
CN103484906A (zh) * | 2013-09-09 | 2014-01-01 | 刘岩玉 | 一种铜合金的电镀方法 |
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2014
- 2014-09-17 CN CN201410476885.2A patent/CN104233409B/zh active Active
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Publication number | Publication date |
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CN104233409A (zh) | 2014-12-24 |
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TR01 | Transfer of patent right |
Effective date of registration: 20170407 Address after: 226100 Guangzhou road Jiangsu city Nantong Province Haimen Economic and Technological Development Zone No. 999 Patentee after: Nantong Construction Engineering Co., Ltd. Address before: Lake Town, Xishan District People's road 214000 Jiangsu city of Wuxi province and red Ju Wei Village No. 100 Patentee before: Zhu Zhongliang |
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Effective date of registration: 20190809 Address after: 226100 No. 100 Wangjiang Road, Sanchang Town, Haimen City, Nantong City, Jiangsu Province Patentee after: JIANGSU SANTONG TECHNOLOGY CO., LTD. Address before: 226100 Guangzhou road Jiangsu city Nantong Province Haimen Economic and Technological Development Zone No. 999 Patentee before: Nantong Construction Engineering Co., Ltd. |
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