CN104231192A - 聚(环己基乙烯)-聚丙烯酸酯嵌段共聚物,其制造方法及包括其的制品 - Google Patents
聚(环己基乙烯)-聚丙烯酸酯嵌段共聚物,其制造方法及包括其的制品 Download PDFInfo
- Publication number
- CN104231192A CN104231192A CN201410235367.1A CN201410235367A CN104231192A CN 104231192 A CN104231192 A CN 104231192A CN 201410235367 A CN201410235367 A CN 201410235367A CN 104231192 A CN104231192 A CN 104231192A
- Authority
- CN
- China
- Prior art keywords
- block
- block copolymer
- copolymer
- pche
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
- C08F293/005—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/12—Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2438/00—Living radical polymerisation
- C08F2438/01—Atom Transfer Radical Polymerization [ATRP] or reverse ATRP
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/912,797 US10202479B2 (en) | 2013-06-07 | 2013-06-07 | Poly(cyclohexylethylene)-polyacrylate block copolymers, methods of manufacture thereof and articles comprising the same |
| US13/912,797 | 2013-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104231192A true CN104231192A (zh) | 2014-12-24 |
Family
ID=52004587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410235367.1A Pending CN104231192A (zh) | 2013-06-07 | 2014-05-29 | 聚(环己基乙烯)-聚丙烯酸酯嵌段共聚物,其制造方法及包括其的制品 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10202479B2 (https=) |
| JP (1) | JP6574083B2 (https=) |
| KR (1) | KR101631561B1 (https=) |
| CN (1) | CN104231192A (https=) |
| TW (1) | TWI525117B (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112203750A (zh) * | 2018-06-01 | 2021-01-08 | 3M创新有限公司 | 包含三嵌段共聚物的多孔膜 |
| CN116284517A (zh) * | 2022-09-08 | 2023-06-23 | 上海八亿时空先进材料有限公司 | 一种分子量窄分布且高透光性phs树脂及其合成方法与应用 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6446195B2 (ja) * | 2013-07-31 | 2018-12-26 | 東京応化工業株式会社 | 相分離構造体の製造方法、パターン形成方法及び微細パターン形成方法 |
| KR20160060223A (ko) * | 2014-11-19 | 2016-05-30 | 삼성디스플레이 주식회사 | 미세 패턴 형성 방법 |
| US10780685B2 (en) | 2015-03-18 | 2020-09-22 | Riken Technos Corporation | Hard coat laminated film |
| CN107428143B (zh) * | 2015-03-18 | 2019-09-20 | 理研科技株式会社 | 硬涂层层叠膜 |
| EP3272513B1 (en) | 2015-03-18 | 2022-06-01 | Riken Technos Corporation | Molded body |
| US11352473B2 (en) | 2015-03-18 | 2022-06-07 | Riken Technos Corporation | Hard coat laminated film and method for producing same |
| US11433651B2 (en) | 2015-03-18 | 2022-09-06 | Riken Technos Corporation | Hard coat laminated film |
| PH12017501474B1 (en) | 2015-03-18 | 2024-05-15 | Riken Technos Corp | Anti-glare hard coat laminated film |
| WO2016147716A1 (ja) | 2015-03-18 | 2016-09-22 | リケンテクノス株式会社 | 粘着フィルム |
| CN107849201B (zh) * | 2015-08-21 | 2021-05-14 | 株式会社日本触媒 | 嵌段共聚物 |
| KR102402958B1 (ko) | 2015-11-11 | 2022-05-27 | 삼성전자주식회사 | 반도체 장치의 패턴 형성 방법 및 반도체 장치의 제조 방법 |
| JP6599789B2 (ja) * | 2015-11-25 | 2019-10-30 | リケンテクノス株式会社 | ハードコート積層フィルム |
| US11774166B2 (en) | 2015-11-25 | 2023-10-03 | Riken Technos Corporation | Door body |
| TWI745316B (zh) | 2015-11-25 | 2021-11-11 | 日商理研科技股份有限公司 | 門體 |
| JP6644534B2 (ja) | 2015-12-08 | 2020-02-12 | リケンテクノス株式会社 | ハードコート積層フィルム |
| US10414953B2 (en) | 2016-02-19 | 2019-09-17 | Avery Dennison Corporation | Two stage methods for processing adhesives and related compositions |
| EP3808800B1 (en) | 2016-09-14 | 2022-01-05 | Riken Technos Corporation | Hard coat laminated film |
| CN110099939B (zh) | 2016-10-25 | 2022-09-06 | 艾利丹尼森公司 | 在主链中具有光引发剂基团的嵌段聚合物及其用于粘合剂组合物中的用途 |
| JP7064313B2 (ja) | 2016-11-25 | 2022-05-10 | リケンテクノス株式会社 | ハードコート積層フィルム |
| CN110291124B (zh) | 2017-02-17 | 2021-06-25 | 3M创新有限公司 | 三嵌段共聚物 |
| JP2018154760A (ja) * | 2017-03-17 | 2018-10-04 | 東芝メモリ株式会社 | パターン形成材料及びパターン形成方法 |
| AU2018392478B2 (en) | 2017-12-19 | 2023-03-16 | Avery Dennison Corporation | Post-polymerization functionalization of pendant functional groups |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012036121A1 (ja) * | 2010-09-14 | 2012-03-22 | 東京応化工業株式会社 | 下地剤及びブロックコポリマーを含む層のパターン形成方法 |
Family Cites Families (19)
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| US4098980A (en) | 1976-06-24 | 1978-07-04 | The Goodyear Tire & Rubber Company | Non-aqueous dispersion polymerization of conjugated diolefins |
| JPH05310867A (ja) | 1992-05-07 | 1993-11-22 | Terumo Corp | 血液適合性ブロック共重合体 |
| WO1997049387A1 (en) | 1996-06-27 | 1997-12-31 | G.D. Searle And Co. | Particles comprising amphiphilic copolymers, having a cross-linked shell domain and an interior core domain, useful for pharmaceutical and other applications |
| JP4189889B2 (ja) | 1996-07-29 | 2008-12-03 | 株式会社ヴァーユ | ポリ(2―ヒドロキシエチル(メタ)アクリレート)セグメントを分子中に含有する改質ポリマー |
| JPH10130348A (ja) | 1996-10-25 | 1998-05-19 | Asahi Glass Co Ltd | ポリフルオロアルキル基を有するブロック共重合体およびその製造法 |
| DE19921943A1 (de) * | 1999-05-12 | 2000-11-16 | Bayer Ag | Substrate für optische Speichermedien |
| JP2001115082A (ja) | 1999-10-13 | 2001-04-24 | Nof Corp | ラテックス型塗料組成物 |
| JP2001348404A (ja) | 2000-06-05 | 2001-12-18 | Nof Corp | ブロック共重合体ラテックスの製造方法 |
| US7204997B2 (en) * | 2002-01-29 | 2007-04-17 | Supratek Pharma Inc. | Responsive microgel and methods related thereto |
| US20050118370A1 (en) * | 2003-08-18 | 2005-06-02 | Medtronic Vascular, Inc. | Hyper-elastic, high strength dilatation balloon made from multi-block copolymers |
| US20060249784A1 (en) | 2005-05-06 | 2006-11-09 | International Business Machines Corporation | Field effect transistor device including an array of channel elements and methods for forming |
| KR101007166B1 (ko) * | 2006-05-16 | 2011-01-12 | 닛뽕소다 가부시키가이샤 | 블록 코폴리머 |
| US20100311849A1 (en) | 2006-08-23 | 2010-12-09 | Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv | Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers |
| KR101628792B1 (ko) | 2008-10-03 | 2016-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 에틸렌/α-올레핀 혼성중합체를 갖는 중합체 블렌드 |
| EP2189846B1 (en) * | 2008-11-19 | 2015-04-22 | Rohm and Haas Electronic Materials LLC | Process for photolithography applying a photoresist composition comprising a block copolymer |
| JP2010230891A (ja) | 2009-03-26 | 2010-10-14 | Jsr Corp | 感放射線性樹脂組成物、レジストパターン形成方法、及びブロック共重合体 |
| WO2011036778A1 (ja) * | 2009-09-25 | 2011-03-31 | 株式会社 東芝 | パターン形成方法 |
| JP5979660B2 (ja) * | 2012-02-09 | 2016-08-24 | 東京応化工業株式会社 | コンタクトホールパターンの形成方法 |
| US9127113B2 (en) | 2012-05-16 | 2015-09-08 | Rohm And Haas Electronic Materials Llc | Polystyrene-polyacrylate block copolymers, methods of manufacture thereof and articles comprising the same |
-
2013
- 2013-06-07 US US13/912,797 patent/US10202479B2/en not_active Expired - Fee Related
-
2014
- 2014-05-29 CN CN201410235367.1A patent/CN104231192A/zh active Pending
- 2014-05-30 JP JP2014112042A patent/JP6574083B2/ja not_active Expired - Fee Related
- 2014-06-03 KR KR1020140067715A patent/KR101631561B1/ko not_active Expired - Fee Related
- 2014-06-06 TW TW103119677A patent/TWI525117B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012036121A1 (ja) * | 2010-09-14 | 2012-03-22 | 東京応化工業株式会社 | 下地剤及びブロックコポリマーを含む層のパターン形成方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112203750A (zh) * | 2018-06-01 | 2021-01-08 | 3M创新有限公司 | 包含三嵌段共聚物的多孔膜 |
| CN116284517A (zh) * | 2022-09-08 | 2023-06-23 | 上海八亿时空先进材料有限公司 | 一种分子量窄分布且高透光性phs树脂及其合成方法与应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201509970A (zh) | 2015-03-16 |
| JP2014237817A (ja) | 2014-12-18 |
| KR101631561B1 (ko) | 2016-06-20 |
| US20140360975A1 (en) | 2014-12-11 |
| TWI525117B (zh) | 2016-03-11 |
| JP6574083B2 (ja) | 2019-09-11 |
| US10202479B2 (en) | 2019-02-12 |
| KR20140143715A (ko) | 2014-12-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141224 |