CN104231192A - 聚(环己基乙烯)-聚丙烯酸酯嵌段共聚物,其制造方法及包括其的制品 - Google Patents

聚(环己基乙烯)-聚丙烯酸酯嵌段共聚物,其制造方法及包括其的制品 Download PDF

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Publication number
CN104231192A
CN104231192A CN201410235367.1A CN201410235367A CN104231192A CN 104231192 A CN104231192 A CN 104231192A CN 201410235367 A CN201410235367 A CN 201410235367A CN 104231192 A CN104231192 A CN 104231192A
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CN
China
Prior art keywords
block
block copolymer
copolymer
pche
monomer
Prior art date
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Pending
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CN201410235367.1A
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English (en)
Chinese (zh)
Inventor
P·D·胡斯塔德
F·S·贝茨
M·A·希尔姆耶
J·G·肯纳姆
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University of Minnesota Twin Cities
Dow Global Technologies LLC
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University of Minnesota Twin Cities
Dow Global Technologies LLC
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Publication of CN104231192A publication Critical patent/CN104231192A/zh
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F293/00Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
    • C08F293/005Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule using free radical "living" or "controlled" polymerisation, e.g. using a complexing agent
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02Monomers containing only one unsaturated aliphatic radical
    • C08F212/04Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06Hydrocarbons
    • C08F212/12Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/22Esters containing halogen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/011Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2438/00Living radical polymerisation
    • C08F2438/01Atom Transfer Radical Polymerization [ATRP] or reverse ATRP

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Graft Or Block Polymers (AREA)
CN201410235367.1A 2013-06-07 2014-05-29 聚(环己基乙烯)-聚丙烯酸酯嵌段共聚物,其制造方法及包括其的制品 Pending CN104231192A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/912,797 US10202479B2 (en) 2013-06-07 2013-06-07 Poly(cyclohexylethylene)-polyacrylate block copolymers, methods of manufacture thereof and articles comprising the same
US13/912,797 2013-06-07

Publications (1)

Publication Number Publication Date
CN104231192A true CN104231192A (zh) 2014-12-24

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CN201410235367.1A Pending CN104231192A (zh) 2013-06-07 2014-05-29 聚(环己基乙烯)-聚丙烯酸酯嵌段共聚物,其制造方法及包括其的制品

Country Status (5)

Country Link
US (1) US10202479B2 (https=)
JP (1) JP6574083B2 (https=)
KR (1) KR101631561B1 (https=)
CN (1) CN104231192A (https=)
TW (1) TWI525117B (https=)

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CN112203750A (zh) * 2018-06-01 2021-01-08 3M创新有限公司 包含三嵌段共聚物的多孔膜
CN116284517A (zh) * 2022-09-08 2023-06-23 上海八亿时空先进材料有限公司 一种分子量窄分布且高透光性phs树脂及其合成方法与应用

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JP6446195B2 (ja) * 2013-07-31 2018-12-26 東京応化工業株式会社 相分離構造体の製造方法、パターン形成方法及び微細パターン形成方法
KR20160060223A (ko) * 2014-11-19 2016-05-30 삼성디스플레이 주식회사 미세 패턴 형성 방법
US10780685B2 (en) 2015-03-18 2020-09-22 Riken Technos Corporation Hard coat laminated film
CN107428143B (zh) * 2015-03-18 2019-09-20 理研科技株式会社 硬涂层层叠膜
EP3272513B1 (en) 2015-03-18 2022-06-01 Riken Technos Corporation Molded body
US11352473B2 (en) 2015-03-18 2022-06-07 Riken Technos Corporation Hard coat laminated film and method for producing same
US11433651B2 (en) 2015-03-18 2022-09-06 Riken Technos Corporation Hard coat laminated film
PH12017501474B1 (en) 2015-03-18 2024-05-15 Riken Technos Corp Anti-glare hard coat laminated film
WO2016147716A1 (ja) 2015-03-18 2016-09-22 リケンテクノス株式会社 粘着フィルム
CN107849201B (zh) * 2015-08-21 2021-05-14 株式会社日本触媒 嵌段共聚物
KR102402958B1 (ko) 2015-11-11 2022-05-27 삼성전자주식회사 반도체 장치의 패턴 형성 방법 및 반도체 장치의 제조 방법
JP6599789B2 (ja) * 2015-11-25 2019-10-30 リケンテクノス株式会社 ハードコート積層フィルム
US11774166B2 (en) 2015-11-25 2023-10-03 Riken Technos Corporation Door body
TWI745316B (zh) 2015-11-25 2021-11-11 日商理研科技股份有限公司 門體
JP6644534B2 (ja) 2015-12-08 2020-02-12 リケンテクノス株式会社 ハードコート積層フィルム
US10414953B2 (en) 2016-02-19 2019-09-17 Avery Dennison Corporation Two stage methods for processing adhesives and related compositions
EP3808800B1 (en) 2016-09-14 2022-01-05 Riken Technos Corporation Hard coat laminated film
CN110099939B (zh) 2016-10-25 2022-09-06 艾利丹尼森公司 在主链中具有光引发剂基团的嵌段聚合物及其用于粘合剂组合物中的用途
JP7064313B2 (ja) 2016-11-25 2022-05-10 リケンテクノス株式会社 ハードコート積層フィルム
CN110291124B (zh) 2017-02-17 2021-06-25 3M创新有限公司 三嵌段共聚物
JP2018154760A (ja) * 2017-03-17 2018-10-04 東芝メモリ株式会社 パターン形成材料及びパターン形成方法
AU2018392478B2 (en) 2017-12-19 2023-03-16 Avery Dennison Corporation Post-polymerization functionalization of pendant functional groups

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CN116284517A (zh) * 2022-09-08 2023-06-23 上海八亿时空先进材料有限公司 一种分子量窄分布且高透光性phs树脂及其合成方法与应用

Also Published As

Publication number Publication date
TW201509970A (zh) 2015-03-16
JP2014237817A (ja) 2014-12-18
KR101631561B1 (ko) 2016-06-20
US20140360975A1 (en) 2014-12-11
TWI525117B (zh) 2016-03-11
JP6574083B2 (ja) 2019-09-11
US10202479B2 (en) 2019-02-12
KR20140143715A (ko) 2014-12-17

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Application publication date: 20141224