CN104221145A - 具有配置为模块的多级引线框的封装半导体器件 - Google Patents

具有配置为模块的多级引线框的封装半导体器件 Download PDF

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Publication number
CN104221145A
CN104221145A CN201380015939.9A CN201380015939A CN104221145A CN 104221145 A CN104221145 A CN 104221145A CN 201380015939 A CN201380015939 A CN 201380015939A CN 104221145 A CN104221145 A CN 104221145A
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CN
China
Prior art keywords
lead frame
lead
leads
leadframe
frame
Prior art date
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Pending
Application number
CN201380015939.9A
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English (en)
Chinese (zh)
Inventor
R·J·塞伊
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Texas Instruments Inc
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Texas Instruments Inc
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Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CN104221145A publication Critical patent/CN104221145A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07637—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H10W72/634—Cross-sectional shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
CN201380015939.9A 2012-03-23 2013-03-25 具有配置为模块的多级引线框的封装半导体器件 Pending CN104221145A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261615002P 2012-03-23 2012-03-23
US61/615,002 2012-03-23
US13/848,771 2013-03-22
US13/848,771 US8946880B2 (en) 2012-03-23 2013-03-22 Packaged semiconductor device having multilevel leadframes configured as modules
PCT/US2013/033728 WO2013142867A1 (en) 2012-03-23 2013-03-25 Packaged semiconductor device having multilevel leadframes configured as modules

Publications (1)

Publication Number Publication Date
CN104221145A true CN104221145A (zh) 2014-12-17

Family

ID=49211018

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380015939.9A Pending CN104221145A (zh) 2012-03-23 2013-03-25 具有配置为模块的多级引线框的封装半导体器件

Country Status (4)

Country Link
US (2) US8946880B2 (enExample)
JP (2) JP2015511073A (enExample)
CN (1) CN104221145A (enExample)
WO (1) WO2013142867A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107611119A (zh) * 2017-08-24 2018-01-19 杰群电子科技（东莞）有限公司 一种半导体封装器件及其加工方法及电子产品
CN108292609A (zh) * 2015-12-18 2018-07-17 德州仪器公司 具有含多层组装垫的引线框的半导体封装
CN109075151A (zh) * 2016-04-26 2018-12-21 凌力尔特科技有限责任公司 用于组件封装电路的机械配合、和电及热传导的引线框架
CN109564879A (zh) * 2016-07-28 2019-04-02 株式会社东海理化电机制作所 半导体装置的制造方法
CN112018063A (zh) * 2019-05-29 2020-12-01 株式会社电装 半导体封装、半导体装置及半导体封装的制造方法
US11410977B2 (en) 2018-11-13 2022-08-09 Analog Devices International Unlimited Company Electronic module for high power applications
US11749576B2 (en) 2018-03-27 2023-09-05 Analog Devices International Unlimited Company Stacked circuit package with molded base having laser drilled openings for upper package
US11844178B2 (en) 2020-06-02 2023-12-12 Analog Devices International Unlimited Company Electronic component

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TWI438792B (zh) * 2011-01-04 2014-05-21 Cyntec Co Ltd 電感器
US8426952B2 (en) * 2011-01-14 2013-04-23 International Rectifier Corporation Stacked half-bridge package with a common conductive leadframe
US10840005B2 (en) 2013-01-25 2020-11-17 Vishay Dale Electronics, Llc Low profile high current composite transformer
US9515014B2 (en) * 2014-10-08 2016-12-06 Infineon Technologies Americas Corp. Power converter package with integrated output inductor
US9496206B2 (en) * 2015-04-10 2016-11-15 Texas Instruments Incorporated Flippable leadframe for packaged electronic system having vertically stacked chips and components
CN106571354B (zh) * 2015-10-09 2018-11-16 台达电子工业股份有限公司 电源变换器及其制造方法
US10998124B2 (en) 2016-05-06 2021-05-04 Vishay Dale Electronics, Llc Nested flat wound coils forming windings for transformers and inductors
WO2018045007A1 (en) 2016-08-31 2018-03-08 Vishay Dale Electronics, Llc Inductor having high current coil with low direct current resistance
US10340210B2 (en) * 2016-09-16 2019-07-02 Texas Instruments Incorporated System in package device including inductor
US10396016B2 (en) * 2016-12-30 2019-08-27 Texas Instruments Incorporated Leadframe inductor
US9935041B1 (en) * 2017-04-06 2018-04-03 Texas Instruments Incorporated Multi-chip module clips with connector bar
DE102017109515B4 (de) 2017-05-04 2024-10-02 Schaeffler Technologies AG & Co. KG Halbleiteranordnung und Verfahren zu deren Herstellung
US10896869B2 (en) * 2018-01-12 2021-01-19 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing a semiconductor device
DE102019207012A1 (de) * 2019-05-15 2020-11-19 Zf Friedrichshafen Ag Elektronikmodul zur Leistungssteuerung
JP7286450B2 (ja) * 2019-07-10 2023-06-05 新光電気工業株式会社 電子装置及び電子装置の製造方法
US20210043466A1 (en) * 2019-08-06 2021-02-11 Texas Instruments Incorporated Universal semiconductor package molds
US11158567B2 (en) 2019-08-09 2021-10-26 Texas Instruments Incorporated Package with stacked power stage and integrated control die
US11715679B2 (en) 2019-10-09 2023-08-01 Texas Instruments Incorporated Power stage package including flexible circuit and stacked die
US11302615B2 (en) 2019-12-30 2022-04-12 Texas Instruments Incorporated Semiconductor package with isolated heat spreader
US12567533B2 (en) 2020-03-03 2026-03-03 Vishay Dale Electronics, Llc Inductor with preformed termination and method and assembly for making the same
CN111725173A (zh) * 2020-06-05 2020-09-29 杰群电子科技（东莞）有限公司 一种堆叠封装结构及堆叠封装结构的制造方法
GB2603920B (en) * 2021-02-18 2023-02-22 Zhuzhou Crrc Times Electric Uk Innovation Center Power Semiconductor package
US11495549B2 (en) * 2021-02-25 2022-11-08 Texas Instruments Incorporated Electronic device with crack arrest structure
USD1034462S1 (en) 2021-03-01 2024-07-09 Vishay Dale Electronics, Llc Inductor package
US11611170B2 (en) 2021-03-23 2023-03-21 Amkor Technology Singapore Holding Pte. Ltd Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices
US11948724B2 (en) 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device

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US20090194855A1 (en) * 2008-02-05 2009-08-06 Yong Liu Folded leadframe multiple die package
TW201117348A (en) * 2009-11-06 2011-05-16 Mediatek Inc Integrated circuits
US20120119343A1 (en) * 2009-10-16 2012-05-17 Texas Instruments Incorporated Stacked leadframe implementation for dc/dc convertor power module incorporating a stacked controller and stacked leadframe construction methodology

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US20120119343A1 (en) * 2009-10-16 2012-05-17 Texas Instruments Incorporated Stacked leadframe implementation for dc/dc convertor power module incorporating a stacked controller and stacked leadframe construction methodology
TW201117348A (en) * 2009-11-06 2011-05-16 Mediatek Inc Integrated circuits

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108292609A (zh) * 2015-12-18 2018-07-17 德州仪器公司 具有含多层组装垫的引线框的半导体封装
CN108292609B (zh) * 2015-12-18 2023-04-04 德州仪器公司 具有含多层组装垫的引线框的半导体封装
CN109075151A (zh) * 2016-04-26 2018-12-21 凌力尔特科技有限责任公司 用于组件封装电路的机械配合、和电及热传导的引线框架
US11272618B2 (en) 2016-04-26 2022-03-08 Analog Devices International Unlimited Company Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits
CN109564879A (zh) * 2016-07-28 2019-04-02 株式会社东海理化电机制作所 半导体装置的制造方法
CN107611119A (zh) * 2017-08-24 2018-01-19 杰群电子科技（东莞）有限公司 一种半导体封装器件及其加工方法及电子产品
US11749576B2 (en) 2018-03-27 2023-09-05 Analog Devices International Unlimited Company Stacked circuit package with molded base having laser drilled openings for upper package
US11410977B2 (en) 2018-11-13 2022-08-09 Analog Devices International Unlimited Company Electronic module for high power applications
CN112018063A (zh) * 2019-05-29 2020-12-01 株式会社电装 半导体封装、半导体装置及半导体封装的制造方法
CN112018063B (zh) * 2019-05-29 2025-03-07 株式会社电装 半导体封装、半导体装置及半导体封装的制造方法
US11844178B2 (en) 2020-06-02 2023-12-12 Analog Devices International Unlimited Company Electronic component

Also Published As

Publication number Publication date
US9177945B2 (en) 2015-11-03
US8946880B2 (en) 2015-02-03
JP6919134B2 (ja) 2021-08-18
US20130249051A1 (en) 2013-09-26
JP2018137466A (ja) 2018-08-30
JP2015511073A (ja) 2015-04-13
US20150099329A1 (en) 2015-04-09
WO2013142867A1 (en) 2013-09-26

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Application publication date: 20141217