CN104205021B - 用于触控屏幕面板的透明体的制造方法及系统 - Google Patents

用于触控屏幕面板的透明体的制造方法及系统 Download PDF

Info

Publication number
CN104205021B
CN104205021B CN201280072160.6A CN201280072160A CN104205021B CN 104205021 B CN104205021 B CN 104205021B CN 201280072160 A CN201280072160 A CN 201280072160A CN 104205021 B CN104205021 B CN 104205021B
Authority
CN
China
Prior art keywords
transparent
layer
refractive index
dielectric film
nesa coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280072160.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN104205021A (zh
Inventor
T·W·齐尔鲍尔
J·格里尔梅耶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN104205021A publication Critical patent/CN104205021A/zh
Application granted granted Critical
Publication of CN104205021B publication Critical patent/CN104205021B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Position Input By Displaying (AREA)
  • Non-Insulated Conductors (AREA)
CN201280072160.6A 2012-03-30 2012-03-30 用于触控屏幕面板的透明体的制造方法及系统 Active CN104205021B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/055867 WO2013143614A1 (en) 2012-03-30 2012-03-30 Transparent body for use in a touch screen panel manufacturing method and system

Publications (2)

Publication Number Publication Date
CN104205021A CN104205021A (zh) 2014-12-10
CN104205021B true CN104205021B (zh) 2017-05-24

Family

ID=45922691

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280072160.6A Active CN104205021B (zh) 2012-03-30 2012-03-30 用于触控屏幕面板的透明体的制造方法及系统

Country Status (7)

Country Link
US (1) US20150083464A1 (enExample)
EP (1) EP2831707B1 (enExample)
JP (1) JP6095765B2 (enExample)
KR (1) KR101890790B1 (enExample)
CN (1) CN104205021B (enExample)
TW (1) TWI595387B (enExample)
WO (1) WO2013143614A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014007157A1 (ja) * 2012-07-02 2014-01-09 シャープ株式会社 タッチパネルおよびタッチパネル付き表示装置
US9366784B2 (en) 2013-05-07 2016-06-14 Corning Incorporated Low-color scratch-resistant articles with a multilayer optical film
US9110230B2 (en) 2013-05-07 2015-08-18 Corning Incorporated Scratch-resistant articles with retained optical properties
EP2863291A1 (en) * 2013-10-18 2015-04-22 Applied Materials, Inc. Transparent body for a touch panel manufacturing method and system for manufacturing a transparent body for a touch screen panel
EP2863290B1 (en) * 2013-10-18 2017-12-06 Applied Materials, Inc. Layer stack for a touch panel and method for forming a layer stack
WO2015135562A1 (en) * 2014-03-10 2015-09-17 Vertu Corporation Limited Touch sensitive device for mobile apparatus
US11267973B2 (en) 2014-05-12 2022-03-08 Corning Incorporated Durable anti-reflective articles
CN105224120B (zh) * 2014-07-03 2018-07-31 宸鸿科技(厦门)有限公司 基板结构
US9842862B2 (en) * 2014-07-29 2017-12-12 Hannstar Display (Nanjing) Corporation Flexible electronic device with anti-interference structures and manufacturing method thereof
US9790593B2 (en) 2014-08-01 2017-10-17 Corning Incorporated Scratch-resistant materials and articles including the same
CN104699342A (zh) * 2015-03-27 2015-06-10 深圳市深越光电技术有限公司 一种新型G1-cell电容式触摸屏模组及其制作方法
KR102392671B1 (ko) 2015-05-11 2022-04-29 삼성디스플레이 주식회사 가요성 표시 장치
JP6140775B2 (ja) 2015-07-22 2017-05-31 日東電工株式会社 透明な粘着剤層及びパターン化された透明導電層を有する偏光フィルム積層体並びに液晶パネル及び有機ｅｌパネル
JP2018530032A (ja) * 2015-08-05 2018-10-11 シェンジェン ロイオル テクノロジーズ カンパニー リミテッドＳｈｅｎｚｈｅｎ Ｒｏｙｏｌｅ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．， Ｌｔｄ． タッチフィルム、有機発光ダイオードディスプレイパネル及びタッチフィルムの製造方法
JP2018536177A (ja) 2015-09-14 2018-12-06 コーニング インコーポレイテッド 高光線透過性かつ耐擦傷性反射防止物品
CN105271821A (zh) * 2015-10-19 2016-01-27 洛阳康耀电子有限公司 一种触摸屏双面消影导电玻璃的加工方法
CN105271820A (zh) * 2015-10-19 2016-01-27 洛阳康耀电子有限公司 一种单面消影触摸屏导电玻璃的加工方法
CN105204691B (zh) * 2015-10-19 2018-08-10 洛阳康耀电子有限公司 一种触摸屏单面消影导电玻璃的加工方法
CN105204704B (zh) * 2015-10-19 2018-08-10 洛阳康耀电子有限公司 一种单面触摸屏消影导电玻璃的加工方法
CN105630263A (zh) * 2015-12-22 2016-06-01 昆山国显光电有限公司 触控面板、触摸显示屏以及触控面板的制造方法和设备
KR102625601B1 (ko) * 2016-01-26 2024-01-17 삼성디스플레이 주식회사 터치 표시 장치 및 이의 제조 방법
DE102017215670A1 (de) * 2016-09-06 2018-03-08 Ceramtec-Etec Gmbh Klebefolie für transparente Keramiken
CN106601340A (zh) * 2016-12-21 2017-04-26 张家港康得新光电材料有限公司 一种折射率匹配膜及ito导电膜
WO2019160674A1 (en) * 2018-02-19 2019-08-22 Applied Materials, Inc. Pvd titanium dioxide formation using sputter etch to halt onset of crystalinity in thick films
US20190351829A1 (en) * 2018-04-16 2019-11-21 Visteon Global Technologies, Inc. Display system for a vehicle
CN111094200B (zh) 2018-08-17 2022-01-07 康宁股份有限公司 具有薄的耐久性减反射结构的无机氧化物制品
US11257997B2 (en) * 2019-12-31 2022-02-22 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure
WO2021239211A1 (en) * 2020-05-25 2021-12-02 Applied Materials, Inc. Method for generating a layer stack and method for manufacturing a patterned layer stack
US20220009824A1 (en) 2020-07-09 2022-01-13 Corning Incorporated Anti-glare substrate for a display article including a textured region with primary surface features and secondary surface features imparting a surface roughness that increases surface scattering
CN115505884A (zh) * 2021-06-23 2022-12-23 江西华派光电科技有限公司 一种高透光蓝宝石面板及其制作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004057381A1 (ja) * 2002-12-20 2004-07-08 Teijin Limited 透明導電性積層体,タッチパネル及びタッチパネル付液晶表示装置
CN101059737A (zh) * 2006-04-20 2007-10-24 铼宝科技股份有限公司 透明触控面板结构
EP1892609A1 (en) * 2005-05-26 2008-02-27 Gunze Limited Transparent planar body and transparent touch switch
CN101504496A (zh) * 2009-03-04 2009-08-12 信利半导体有限公司 一种触摸屏和平板显示模块一体化组合模块及其制作方法
CN101581800A (zh) * 2008-05-15 2009-11-18 甘国工 复合导电膜及使用该膜的触摸屏

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8068186B2 (en) * 2003-10-15 2011-11-29 3M Innovative Properties Company Patterned conductor touch screen having improved optics
TW200745923A (en) * 2005-10-20 2007-12-16 Nitto Denko Corp Transparent conductive laminate body and touch panel equipped with above
US7538760B2 (en) * 2006-03-30 2009-05-26 Apple Inc. Force imaging input device and system
JP4721359B2 (ja) * 2006-09-12 2011-07-13 日東電工株式会社 透明導電性積層体及びそれを備えたタッチパネル
JP4314623B2 (ja) * 2006-12-07 2009-08-19 日東電工株式会社 透明導電性積層体及びタッチパネル
JP4667471B2 (ja) * 2007-01-18 2011-04-13 日東電工株式会社 透明導電性フィルム、その製造方法及びそれを備えたタッチパネル
JP5160325B2 (ja) * 2008-07-16 2013-03-13 日東電工株式会社 透明導電性フィルム及びタッチパネル
JP2010086684A (ja) * 2008-09-30 2010-04-15 Kuramoto Seisakusho Co Ltd 透明導電配線膜付き光学薄膜
JP5484891B2 (ja) * 2009-03-04 2014-05-07 株式会社ジャパンディスプレイ 表示装置
JP5545515B2 (ja) * 2009-03-30 2014-07-09 Ｄｉｃ株式会社 金属面貼付用両面粘着シート、透明導電膜積層体、タッチパネル装置
JP4958020B2 (ja) * 2009-03-31 2012-06-20 大日本印刷株式会社 タッチパネルセンサ、タッチパネルセンサを作製するための積層体、および、タッチパネルセンサの製造方法
JP3153971U (ja) * 2009-07-15 2009-09-24 洋華光電股▲ふん▼有限公司 タッチパッド
KR101082609B1 (ko) * 2009-10-16 2011-11-15 엘지이노텍 주식회사 터치패널용 면상 부재 및 이의 제조 방법
WO2011078231A1 (ja) * 2009-12-24 2011-06-30 日本写真印刷株式会社 静電容量式タッチセンサ、電子機器及び透明導電膜積層体の製造方法
JP5709311B2 (ja) * 2010-06-25 2015-04-30 グンゼ株式会社 透明面状体及び透明タッチパネル
EP2402481A1 (en) * 2010-06-29 2012-01-04 Applied Materials, Inc. Method and system for manufacturing a transparent body for use in a touch panel
JP2012058956A (ja) * 2010-09-08 2012-03-22 Sony Corp 電極フィルム及び座標検出装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004057381A1 (ja) * 2002-12-20 2004-07-08 Teijin Limited 透明導電性積層体,タッチパネル及びタッチパネル付液晶表示装置
EP1892609A1 (en) * 2005-05-26 2008-02-27 Gunze Limited Transparent planar body and transparent touch switch
CN101059737A (zh) * 2006-04-20 2007-10-24 铼宝科技股份有限公司 透明触控面板结构
CN101581800A (zh) * 2008-05-15 2009-11-18 甘国工 复合导电膜及使用该膜的触摸屏
CN101504496A (zh) * 2009-03-04 2009-08-12 信利半导体有限公司 一种触摸屏和平板显示模块一体化组合模块及其制作方法

Also Published As

Publication number Publication date
TW201351237A (zh) 2013-12-16
KR101890790B1 (ko) 2018-08-22
JP2015518596A (ja) 2015-07-02
CN104205021A (zh) 2014-12-10
WO2013143614A1 (en) 2013-10-03
EP2831707A1 (en) 2015-02-04
JP6095765B2 (ja) 2017-03-15
KR20140141707A (ko) 2014-12-10
US20150083464A1 (en) 2015-03-26
TWI595387B (zh) 2017-08-11
EP2831707B1 (en) 2018-03-14

Similar Documents

Publication Publication Date Title
CN104205021B (zh) 用于触控屏幕面板的透明体的制造方法及系统
US10281616B2 (en) Transparent body for use in a touch panel having structured transparent conductive film directly between first and second transparent layer stacks, method of making, and apparatus for making
TWI653670B (zh) 具有單一基板與抗反射和/或抗指紋塗層的透明體及其製造方法
JP6377735B2 (ja) タッチパネル用透明体の製作方法及びタッチスクリーンパネル用透明体を製作するシステム
JP2015518596A5 (enExample)
JP2015115180A (ja) 透明導電体
WO2015125558A1 (ja) 透明導電体の製造方法及び透明導電体
TW201640300A (zh) 適於使用在光電元件中的層堆疊、光電元件及適於使用在光電元件中的層堆疊的製造方法
KR101955005B1 (ko) 터치 스크린 패널에서 사용하기 위한 층 시스템, 터치 스크린 패널에서 사용하기 위한 층 시스템을 제조하기 위한 방법, 및 터치 스크린 패널
WO2015087895A1 (ja) 透明導電体
JP2016169420A (ja) 透明導電部材の製造装置、及び、透明導電部材の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant