KR101890790B1 - 터치 스크린 패널에서 이용하기 위한 투명 바디 및 그 제조 방법 및 시스템 - Google Patents

터치 스크린 패널에서 이용하기 위한 투명 바디 및 그 제조 방법 및 시스템 Download PDF

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KR101890790B1
KR101890790B1 KR1020147030609A KR20147030609A KR101890790B1 KR 101890790 B1 KR101890790 B1 KR 101890790B1 KR 1020147030609 A KR1020147030609 A KR 1020147030609A KR 20147030609 A KR20147030609 A KR 20147030609A KR 101890790 B1 KR101890790 B1 KR 101890790B1
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transparent
layer stack
refractive index
conductive film
transparent conductive
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KR20140141707A (ko
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토마스 베르너 칠바우어
유르겐 그릴마이어
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Position Input By Displaying (AREA)
  • Non-Insulated Conductors (AREA)
KR1020147030609A 2012-03-30 2012-03-30 터치 스크린 패널에서 이용하기 위한 투명 바디 및 그 제조 방법 및 시스템 Active KR101890790B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2012/055867 WO2013143614A1 (en) 2012-03-30 2012-03-30 Transparent body for use in a touch screen panel manufacturing method and system

Publications (2)

Publication Number Publication Date
KR20140141707A KR20140141707A (ko) 2014-12-10
KR101890790B1 true KR101890790B1 (ko) 2018-08-22

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Country Status (7)

Country Link
US (1) US20150083464A1 (enExample)
EP (1) EP2831707B1 (enExample)
JP (1) JP6095765B2 (enExample)
KR (1) KR101890790B1 (enExample)
CN (1) CN104205021B (enExample)
TW (1) TWI595387B (enExample)
WO (1) WO2013143614A1 (enExample)

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WO2015135562A1 (en) * 2014-03-10 2015-09-17 Vertu Corporation Limited Touch sensitive device for mobile apparatus
US11267973B2 (en) 2014-05-12 2022-03-08 Corning Incorporated Durable anti-reflective articles
CN105224120B (zh) * 2014-07-03 2018-07-31 宸鸿科技(厦门)有限公司 基板结构
US9842862B2 (en) * 2014-07-29 2017-12-12 Hannstar Display (Nanjing) Corporation Flexible electronic device with anti-interference structures and manufacturing method thereof
US9790593B2 (en) 2014-08-01 2017-10-17 Corning Incorporated Scratch-resistant materials and articles including the same
CN104699342A (zh) * 2015-03-27 2015-06-10 深圳市深越光电技术有限公司 一种新型G1-cell电容式触摸屏模组及其制作方法
KR102392671B1 (ko) 2015-05-11 2022-04-29 삼성디스플레이 주식회사 가요성 표시 장치
JP6140775B2 (ja) 2015-07-22 2017-05-31 日東電工株式会社 透明な粘着剤層及びパターン化された透明導電層を有する偏光フィルム積層体並びに液晶パネル及び有機ｅｌパネル
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CN105204691B (zh) * 2015-10-19 2018-08-10 洛阳康耀电子有限公司 一种触摸屏单面消影导电玻璃的加工方法
CN105630263A (zh) * 2015-12-22 2016-06-01 昆山国显光电有限公司 触控面板、触摸显示屏以及触控面板的制造方法和设备
KR102625601B1 (ko) * 2016-01-26 2024-01-17 삼성디스플레이 주식회사 터치 표시 장치 및 이의 제조 방법
DE102017215670A1 (de) * 2016-09-06 2018-03-08 Ceramtec-Etec Gmbh Klebefolie für transparente Keramiken
CN106601340A (zh) * 2016-12-21 2017-04-26 张家港康得新光电材料有限公司 一种折射率匹配膜及ito导电膜
CN111819303B (zh) * 2018-02-19 2023-12-08 应用材料公司 使用溅射蚀刻以中止厚膜中结晶发生的pvd二氧化钛形成
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JP2010235646A (ja) * 2009-03-30 2010-10-21 Dic Corp 金属面貼付用両面粘着シート、透明導電膜積層体、タッチパネル装置
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Also Published As

Publication number Publication date
TW201351237A (zh) 2013-12-16
US20150083464A1 (en) 2015-03-26
JP2015518596A (ja) 2015-07-02
JP6095765B2 (ja) 2017-03-15
WO2013143614A1 (en) 2013-10-03
TWI595387B (zh) 2017-08-11
EP2831707A1 (en) 2015-02-04
KR20140141707A (ko) 2014-12-10
EP2831707B1 (en) 2018-03-14
CN104205021B (zh) 2017-05-24
CN104205021A (zh) 2014-12-10

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