CN104203490B - 焊料预成型件与焊料合金装配方法 - Google Patents

焊料预成型件与焊料合金装配方法 Download PDF

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Publication number
CN104203490B
CN104203490B CN201380015592.8A CN201380015592A CN104203490B CN 104203490 B CN104203490 B CN 104203490B CN 201380015592 A CN201380015592 A CN 201380015592A CN 104203490 B CN104203490 B CN 104203490B
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CN
China
Prior art keywords
solder
temperature
solder paste
tin
weight
Prior art date
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Active
Application number
CN201380015592.8A
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English (en)
Chinese (zh)
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CN104203490A (zh
Inventor
P·J·凯普
E·S·托米
G·森多内
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Alpha Assembly Solutions Inc
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Alpha Assembly Solutions Inc
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Publication of CN104203490A publication Critical patent/CN104203490A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201380015592.8A 2012-03-20 2013-03-15 焊料预成型件与焊料合金装配方法 Active CN104203490B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261613233P 2012-03-20 2012-03-20
US61/613,233 2012-03-20
PCT/US2013/032137 WO2013142335A1 (en) 2012-03-20 2013-03-15 Solder preforms and solder alloy assembly methods

Publications (2)

Publication Number Publication Date
CN104203490A CN104203490A (zh) 2014-12-10
CN104203490B true CN104203490B (zh) 2018-04-24

Family

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CN201380015592.8A Active CN104203490B (zh) 2012-03-20 2013-03-15 焊料预成型件与焊料合金装配方法

Country Status (7)

Country Link
US (2) US9801285B2 (enExample)
EP (1) EP2834037A4 (enExample)
JP (1) JP6251235B2 (enExample)
KR (1) KR102087004B1 (enExample)
CN (1) CN104203490B (enExample)
IN (1) IN2014DN07833A (enExample)
WO (1) WO2013142335A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10431564B2 (en) 2014-01-27 2019-10-01 Mediatek Inc. Structure and formation method of chip package structure
CN104625463A (zh) * 2014-12-23 2015-05-20 苏州龙腾万里化工科技有限公司 一种抗氧化锡棒的生产方法
CN104889594B (zh) * 2015-06-08 2017-07-11 哈尔滨工业大学 低温超声SnBi基钎料及其制备方法，及其超声钎焊陶瓷和/或陶瓷基复合材料的方法
CN109661289A (zh) * 2016-02-11 2019-04-19 塞拉斯提卡国际有限合伙公司 用于焊点预调节或修复的热处理
GB2569466B (en) 2016-10-24 2021-06-30 Jaguar Land Rover Ltd Apparatus and method relating to electrochemical migration
DE102018116410A1 (de) 2018-07-06 2020-01-09 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer hochtemperaturfesten bleifreien Lotverbindung und hochtemperaturfeste bleifreie Lotverbindung
TWI860363B (zh) * 2019-05-23 2024-11-01 美商阿爾發金屬化工公司 包含互連光伏（ｐｖ）電池的太陽能模組及其製造方法
US11278977B2 (en) 2019-10-22 2022-03-22 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
US11310950B2 (en) 2019-10-22 2022-04-19 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
DE102019129971A1 (de) * 2019-11-06 2021-05-06 Endress+Hauser SE+Co. KG Verfahren zum Auflöten eines Bauelements auf eine Leiterplatte, Elektronikeinheit und Feldgerät der Automatisierungstechnik
DE102020129831A1 (de) 2020-11-12 2022-05-12 Endress+Hauser SE+Co. KG Verfahren zum Auflöten eines Bauelements auf eine Oberfläche einer ersten Leiterplatte
JPWO2022153631A1 (enExample) * 2021-01-14 2022-07-21
DE102021103360A1 (de) 2021-02-05 2022-08-11 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Verfahren zur Herstellung einer Vorverzinnungsanordnung und derartige Vorverzinnungsanordnung
CN117712035B (zh) * 2024-02-06 2024-04-30 苏州锐杰微科技集团有限公司 一种用于解决基板翘曲问题的复合焊点低温互连方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569433A (en) * 1994-11-08 1996-10-29 Lucent Technologies Inc. Lead-free low melting solder with improved mechanical properties
CN1937887A (zh) * 2005-09-22 2007-03-28 富士通株式会社 用于减小基板翘曲的结构及方法

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US711629A (en) * 1902-03-06 1902-10-21 Storm Miller W Insulator.
US4878611A (en) * 1986-05-30 1989-11-07 American Telephone And Telegraph Company, At&T Bell Laboratories Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
US5147084A (en) * 1990-07-18 1992-09-15 International Business Machines Corporation Interconnection structure and test method
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5118027A (en) * 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
US5389160A (en) * 1993-06-01 1995-02-14 Motorola, Inc. Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5427865A (en) 1994-05-02 1995-06-27 Motorola, Inc. Multiple alloy solder preform
US5551627A (en) * 1994-09-29 1996-09-03 Motorola, Inc. Alloy solder connect assembly and method of connection
US5655703A (en) * 1995-05-25 1997-08-12 International Business Machines Corporation Solder hierarchy for chip attachment to substrates
US5803340A (en) * 1995-09-29 1998-09-08 Delco Electronics Corporation Composite solder paste for flip chip bumping
WO1997047426A1 (en) 1996-06-12 1997-12-18 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and indium
US20010002982A1 (en) 1996-06-12 2001-06-07 Sarkhel Amit Kumar Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
US6117759A (en) * 1997-01-03 2000-09-12 Motorola Inc. Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
US6002172A (en) * 1997-03-12 1999-12-14 International Business Machines Corporation Substrate structure and method for improving attachment reliability of semiconductor chips and modules
US6330967B1 (en) * 1997-03-13 2001-12-18 International Business Machines Corporation Process to produce a high temperature interconnection
US5953623A (en) * 1997-04-10 1999-09-14 International Business Machines Corporation Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection
US5872400A (en) * 1997-06-25 1999-02-16 International Business Machines Corporation High melting point solder ball coated with a low melting point solder
US6050481A (en) * 1997-06-25 2000-04-18 International Business Machines Corporation Method of making a high melting point solder ball coated with a low melting point solder
US6059172A (en) * 1997-06-25 2000-05-09 International Business Machines Corporation Method for establishing electrical communication between a first object having a solder ball and a second object
US6025649A (en) * 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
JP2985840B2 (ja) * 1997-07-31 1999-12-06 日本電気株式会社 半田バンプ電極の製造方法
US6235996B1 (en) * 1998-01-28 2001-05-22 International Business Machines Corporation Interconnection structure and process module assembly and rework
GB9903552D0 (en) * 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
US6583354B2 (en) * 1999-04-27 2003-06-24 International Business Machines Corporation Method of reforming reformable members of an electronic package and the resultant electronic package
JP3514670B2 (ja) * 1999-07-29 2004-03-31 松下電器産業株式会社 半田付け方法
KR100398716B1 (ko) * 2000-06-12 2003-09-19 가부시키가이샤 히타치세이사쿠쇼 반도체 모듈 및 반도체 장치를 접속한 회로 기판
JP2002043466A (ja) * 2000-07-26 2002-02-08 Denso Corp ボールグリッドアレイパッケージ
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
US6350669B1 (en) * 2000-10-30 2002-02-26 Siliconware Precision Industries Co., Ltd. Method of bonding ball grid array package to circuit board without causing package collapse
JP4051893B2 (ja) * 2001-04-18 2008-02-27 株式会社日立製作所 電子機器
JP3556922B2 (ja) * 2001-05-07 2004-08-25 富士通株式会社 バンプ形成方法
US6974659B2 (en) * 2002-01-16 2005-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming a solder ball using a thermally stable resinous protective layer
US6805974B2 (en) * 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US6782897B2 (en) * 2002-05-23 2004-08-31 Taiwan Semiconductor Manufacturing Co., Ltd. Method of protecting a passivation layer during solder bump formation
US6897761B2 (en) * 2002-12-04 2005-05-24 Cts Corporation Ball grid array resistor network
TW200414858A (en) * 2003-01-15 2004-08-01 Senju Metal Industry Co Apparatus and method for aligning and attaching solder columns to a substrate
US6842341B1 (en) * 2003-10-02 2005-01-11 Motorola, Inc. Electrical circuit apparatus and method for assembling same
US8574959B2 (en) * 2003-11-10 2013-11-05 Stats Chippac, Ltd. Semiconductor device and method of forming bump-on-lead interconnection
JP4502690B2 (ja) * 2004-04-13 2010-07-14 富士通株式会社 実装基板
JP2006032619A (ja) * 2004-07-15 2006-02-02 Hitachi Ltd 低耐熱性表面実装部品及びこれをバンプ接続した実装基板
JP2006041401A (ja) * 2004-07-29 2006-02-09 Sharp Corp 半導体装置及びその製造方法
US20060054657A1 (en) * 2004-09-16 2006-03-16 Francis Thamarayoor R Method and apparatus for de-soldering integrated circuit devices
US7331503B2 (en) * 2004-10-29 2008-02-19 Intel Corporation Solder printing process to reduce void formation in a microvia
US7413110B2 (en) * 2005-02-16 2008-08-19 Motorola, Inc. Method for reducing stress between substrates of differing materials
US7195145B2 (en) * 2005-07-13 2007-03-27 Motorola, Inc. Electrical circuit apparatus and method for assembling same
JP2007103462A (ja) * 2005-09-30 2007-04-19 Oki Electric Ind Co Ltd 端子パッドと半田の接合構造、当該接合構造を有する半導体装置、およびその半導体装置の製造方法
KR100790978B1 (ko) * 2006-01-24 2008-01-02 삼성전자주식회사 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법
CN101500744B (zh) * 2006-07-05 2011-11-30 富士电机株式会社 膏状钎焊料和电子部件的软钎焊方法
US20100059244A1 (en) * 2007-03-05 2010-03-11 Kyocera Corporation Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus
US20080308612A1 (en) * 2007-06-15 2008-12-18 Best Inc. Manual method for reballing using a solder preform
US20090136824A1 (en) * 2007-11-26 2009-05-28 Daido Tokushuko Kabushiki Kaisha Metallic bipolar plate for fuel cells and method for manufacturing the same
US7560373B1 (en) * 2008-03-31 2009-07-14 Fay Hua Low temperature solder metallurgy and process for packaging applications and structures formed thereby
JP2009277777A (ja) * 2008-05-13 2009-11-26 Tamura Seisakusho Co Ltd はんだボール搭載方法及び電子部品実装用部材
JP2011198777A (ja) * 2008-06-12 2011-10-06 Nihon Superior Co Ltd はんだ接合方法及びはんだ継手
JP2010109032A (ja) * 2008-10-29 2010-05-13 Fujitsu Microelectronics Ltd 半導体装置の製造方法
JP5533665B2 (ja) * 2008-11-28 2014-06-25 富士通株式会社 電子装置の製造方法、電子部品搭載用基板及びその製造方法
US8339161B2 (en) * 2009-07-07 2012-12-25 Analog Devices, Inc. High performance voltage buffers with distortion cancellation
KR101660787B1 (ko) * 2009-09-23 2016-10-11 삼성전자주식회사 솔더 볼 접합 방법 및 메모리 모듈 리페어 방법
US10625378B2 (en) * 2010-04-23 2020-04-21 Iowa State University Research Foundation, Inc. Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
JP2012023667A (ja) * 2010-07-16 2012-02-02 Panasonic Corp 固体撮像装置
US8580607B2 (en) * 2010-07-27 2013-11-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
TW201210733A (en) * 2010-08-26 2012-03-16 Dynajoin Corp Variable melting point solders
US20120069528A1 (en) * 2010-09-17 2012-03-22 Irvine Sensors Corporation Method for Control of Solder Collapse in Stacked Microelectronic Structure
US8558374B2 (en) * 2011-02-08 2013-10-15 Endicott Interconnect Technologies, Inc. Electronic package with thermal interposer and method of making same
WO2012111711A1 (ja) * 2011-02-15 2012-08-23 株式会社村田製作所 多層配線基板およびその製造方法
JP5658088B2 (ja) * 2011-05-23 2015-01-21 パナソニックＩｐマネジメント株式会社 半導体パッケージ部品の実装構造体および製造方法
JP2013080844A (ja) * 2011-10-04 2013-05-02 Fujitsu Ltd 基板モジュールの製造方法、基板モジュール及び基板モジュール組立体
US9198302B2 (en) * 2012-07-18 2015-11-24 Koninklijke Philips N.V. Method of soldering an electronic component with a high lateral accuracy
US9005330B2 (en) * 2012-08-09 2015-04-14 Ormet Circuits, Inc. Electrically conductive compositions comprising non-eutectic solder alloys
WO2014053066A1 (en) * 2012-10-04 2014-04-10 Celestica International Inc. Solder alloy for low-temperature processing
US20140151096A1 (en) * 2012-12-04 2014-06-05 Hongjin Jiang Low temperature/high temperature solder hybrid solder interconnects
EP3047937A4 (en) * 2013-09-20 2017-05-17 Sumitomo Metal Mining Co., Ltd. Bi GROUP SOLDER ALLOY, METHOD FOR BONDING ELECTRONIC PART USING SAME, AND ELECTRONIC PART MOUNTING SUBSTRATE
US10253395B2 (en) * 2015-10-27 2019-04-09 Tdk Corporation Electronic circuit module component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569433A (en) * 1994-11-08 1996-10-29 Lucent Technologies Inc. Lead-free low melting solder with improved mechanical properties
CN1937887A (zh) * 2005-09-22 2007-03-28 富士通株式会社 用于减小基板翘曲的结构及方法

Also Published As

Publication number Publication date
JP2015514316A (ja) 2015-05-18
US20180020554A1 (en) 2018-01-18
JP6251235B2 (ja) 2017-12-20
US9801285B2 (en) 2017-10-24
IN2014DN07833A (enExample) 2015-04-24
KR102087004B1 (ko) 2020-03-10
CN104203490A (zh) 2014-12-10
US20150078810A1 (en) 2015-03-19
WO2013142335A1 (en) 2013-09-26
EP2834037A1 (en) 2015-02-11
KR20140138755A (ko) 2014-12-04
EP2834037A4 (en) 2016-03-16

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