CN104164234B - 磷光体及包括磷光体的发光器件封装件 - Google Patents

磷光体及包括磷光体的发光器件封装件 Download PDF

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Publication number
CN104164234B
CN104164234B CN201410203308.6A CN201410203308A CN104164234B CN 104164234 B CN104164234 B CN 104164234B CN 201410203308 A CN201410203308 A CN 201410203308A CN 104164234 B CN104164234 B CN 104164234B
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Prior art keywords
phosphor
light
light emitting
emitting device
wavelength
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Chinese (zh)
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CN104164234A (zh
Inventor
金泰勋
李智娜
韩美正
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Suzhou Liyu Semiconductor Co ltd
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LG Innotek Co Ltd
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Priority claimed from KR1020130056027A external-priority patent/KR20140135556A/ko
Priority claimed from KR1020130117219A external-priority patent/KR102131309B1/ko
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Publication of CN104164234A publication Critical patent/CN104164234A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN201410203308.6A 2013-05-16 2014-05-14 磷光体及包括磷光体的发光器件封装件 Active CN104164234B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020130056027A KR20140135556A (ko) 2013-05-16 2013-05-16 형광체 및 이를 포함하는 발광소자 패키지
KR10-2013-0056027 2013-05-16
KR1020130117219A KR102131309B1 (ko) 2013-10-01 2013-10-01 형광체 및 이를 포함하는 발광소자 패키지
KR10-2013-0117219 2013-10-01

Publications (2)

Publication Number Publication Date
CN104164234A CN104164234A (zh) 2014-11-26
CN104164234B true CN104164234B (zh) 2018-11-13

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Country Link
US (1) US9252340B2 (https=)
EP (1) EP2803715B1 (https=)
JP (1) JP6542509B2 (https=)
CN (1) CN104164234B (https=)
TW (1) TWI615998B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104716246B (zh) * 2013-12-17 2017-09-26 展晶科技(深圳)有限公司 光电元件封装结构及其制造方法
DE102014202424A1 (de) * 2014-02-11 2015-08-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer reflektierenden Schichtenfolge und Verfahren zum Erzeugen einer reflektierenden Schichtenfolge
KR20160025782A (ko) * 2014-08-28 2016-03-09 엘지이노텍 주식회사 발광 소자 패키지
CN111509111A (zh) 2014-11-18 2020-08-07 首尔半导体株式会社 发光装置及包括该发光装置的车灯
JP2016225423A (ja) * 2015-05-29 2016-12-28 久豊技研株式会社 Ｌｅｄ用蛍光膜、ｌｅｄ用蛍光膜の製造方法、ｌｅｄ面発光装置、及び画像形成装置
CN108473868B (zh) * 2015-12-23 2021-07-09 Lg伊诺特有限公司 荧光体组合物、包括该荧光体组合物的发光器件封装和照明装置
TWI650884B (zh) * 2016-06-01 2019-02-11 光寶光電（常州）有限公司 發光二極體封裝結構
CN107452849B (zh) * 2016-06-01 2019-08-27 光宝光电(常州)有限公司 发光二极管封装结构
EP3309446A1 (en) 2016-10-17 2018-04-18 Lumileds Holding B.V. Light converting device with clamped light converter
JP7553776B2 (ja) * 2020-07-22 2024-09-19 日亜化学工業株式会社 波長変換部材及び発光装置
CN112490303A (zh) * 2020-10-28 2021-03-12 南昌大学 n面出光为特定几何图形的AlGaInP薄膜LED芯片结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7084436B2 (en) * 1999-11-19 2006-08-01 Cree, Inc. Multi element, multi color solid state LED/laser
TW200830580A (en) * 2007-01-05 2008-07-16 Solidlite Corp High color saturation three wavelength white-light LED
CN102185076A (zh) * 2009-12-29 2011-09-14 三星电子株式会社 发光装置和具有该发光装置的显示设备

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8829546B2 (en) * 1999-11-19 2014-09-09 Cree, Inc. Rare earth doped layer or substrate for light conversion
JP3837588B2 (ja) * 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置
US7824573B2 (en) * 2005-04-01 2010-11-02 Mitsubishi Chemical Corporation Alloy powder for material of inorganic functional material precursor and phosphor
TW200717866A (en) * 2005-07-29 2007-05-01 Toshiba Kk Semiconductor light emitting device
KR101264580B1 (ko) * 2005-09-27 2013-05-14 미쓰비시 가가꾸 가부시키가이샤 형광체 및 그 제조방법, 및 상기 형광체를 사용한 발광장치
CN101448914B (zh) * 2006-05-19 2012-10-03 三菱化学株式会社 含氮合金以及使用该含氮合金的荧光体制造方法
JP4228012B2 (ja) * 2006-12-20 2009-02-25 Ｎｅｃライティング株式会社 赤色発光窒化物蛍光体およびそれを用いた白色発光素子
JP4466757B2 (ja) * 2007-04-18 2010-05-26 三菱化学株式会社 蛍光体、蛍光体含有組成物、発光装置、照明装置、画像表示装置、及び窒素含有化合物
KR100986359B1 (ko) * 2008-03-14 2010-10-08 엘지이노텍 주식회사 발광 장치 및 이를 구비한 표시 장치
EP2312658B1 (en) * 2008-07-03 2018-06-27 Samsung Electronics Co., Ltd. A wavelength-converting light emitting diode (led) chip and method for fabrication of an led device equipped with this chip
US8008683B2 (en) * 2008-10-22 2011-08-30 Samsung Led Co., Ltd. Semiconductor light emitting device
WO2010114061A1 (ja) * 2009-03-31 2010-10-07 三菱化学株式会社 蛍光体、蛍光体の製造方法、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
US8648372B2 (en) * 2009-04-14 2014-02-11 Panasonic Corporation Light-emitting device, method for adjusting optical properties, and method for manufacturing light-emitting devices
JP2011014890A (ja) * 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
US20120267999A1 (en) * 2010-02-26 2012-10-25 Mitsubishi Chemical Corporation Halophosphate phosphor and white light-emitting device
WO2011145794A1 (ko) * 2010-05-18 2011-11-24 서울반도체 주식회사 파장변환층을 갖는 발광 다이오드 칩과 그 제조 방법, 및 그것을 포함하는 패키지 및 그 제조 방법
JP2012060097A (ja) * 2010-06-25 2012-03-22 Mitsubishi Chemicals Corp 白色半導体発光装置
JP5437177B2 (ja) * 2010-06-25 2014-03-12 パナソニック株式会社 発光装置
US8974695B2 (en) * 2010-11-11 2015-03-10 Auterra, Inc. Phosphors of rare earth and transition metal doped Ca1+xSr1-xGayIn2-ySzSe3-zF2; manufacturing and applications
WO2012120433A1 (en) * 2011-03-10 2012-09-13 Koninklijke Philips Electronics N.V. Phosphor composition for leds
KR101781437B1 (ko) * 2011-04-29 2017-09-25 삼성전자주식회사 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치
US8921875B2 (en) * 2011-05-10 2014-12-30 Cree, Inc. Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods
KR101806551B1 (ko) * 2011-06-16 2017-12-07 엘지이노텍 주식회사 형광체 및 이를 포함하는 발광소자 패키지
KR20130010283A (ko) * 2011-07-18 2013-01-28 삼성전자주식회사 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치
KR101395432B1 (ko) * 2011-07-28 2014-05-14 주식회사 막스 백색 ｌｅｄ 장치
US8558252B2 (en) * 2011-08-26 2013-10-15 Cree, Inc. White LEDs with emission wavelength correction
CN102391861B (zh) * 2011-09-29 2014-08-27 北京宇极科技发展有限公司 一种氮化合物发光材料及其制法以及由其制成的照明光源
CN104025321B (zh) * 2011-10-24 2018-06-19 株式会社东芝 白光源和包括所述白光源的白光源系统
JP2015026418A (ja) * 2011-11-18 2015-02-05 シャープ株式会社 有機エレクトロルミネッセンス表示装置およびそれを用いた電子機器、並びに、有機エレクトロルミネッセンス表示装置の製造方法
WO2014017613A1 (ja) * 2012-07-25 2014-01-30 独立行政法人物質・材料研究機構 蛍光体およびその製造方法、蛍光体を用いた発光装置、画像表示装置、顔料および紫外線吸収剤
KR101957701B1 (ko) * 2012-11-14 2019-03-14 삼성전자주식회사 발광소자 패키지 및 그 제조방법
US8847261B1 (en) * 2013-03-14 2014-09-30 Cooledge Lighting Inc. Light-emitting devices having engineered phosphor elements
KR102075989B1 (ko) * 2013-06-20 2020-02-11 삼성전자주식회사 적색 형광체, 백색 발광장치, 디스플레이 장치 및 조명장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7084436B2 (en) * 1999-11-19 2006-08-01 Cree, Inc. Multi element, multi color solid state LED/laser
TW200830580A (en) * 2007-01-05 2008-07-16 Solidlite Corp High color saturation three wavelength white-light LED
CN102185076A (zh) * 2009-12-29 2011-09-14 三星电子株式会社 发光装置和具有该发光装置的显示设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"A New Yellow Phosphor La3Si6N11:Ce3+ for White LEDs";T. Seto et al.，;《ECS Transactions》;20091231;第25卷(第9期);第247-252页 *

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US9252340B2 (en) 2016-02-02
TWI615998B (zh) 2018-02-21
JP6542509B2 (ja) 2019-07-10
EP2803715B1 (en) 2020-02-26
US20140339584A1 (en) 2014-11-20
TW201445774A (zh) 2014-12-01
CN104164234A (zh) 2014-11-26
EP2803715A1 (en) 2014-11-19
JP2014224247A (ja) 2014-12-04

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