CN104103585B - 带扩张装置 - Google Patents
带扩张装置 Download PDFInfo
- Publication number
- CN104103585B CN104103585B CN201410144272.9A CN201410144272A CN104103585B CN 104103585 B CN104103585 B CN 104103585B CN 201410144272 A CN201410144272 A CN 201410144272A CN 104103585 B CN104103585 B CN 104103585B
- Authority
- CN
- China
- Prior art keywords
- clamping
- clamping components
- components
- downside
- clamping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003825 pressing Methods 0.000 claims description 21
- 230000008093 supporting effect Effects 0.000 description 33
- 238000000034 method Methods 0.000 description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-084783 | 2013-04-15 | ||
| JP2013084783A JP6087707B2 (ja) | 2013-04-15 | 2013-04-15 | テープ拡張装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104103585A CN104103585A (zh) | 2014-10-15 |
| CN104103585B true CN104103585B (zh) | 2018-01-23 |
Family
ID=51671607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410144272.9A Active CN104103585B (zh) | 2013-04-15 | 2014-04-11 | 带扩张装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6087707B2 (ja) |
| CN (1) | CN104103585B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6408366B2 (ja) * | 2014-12-05 | 2018-10-17 | リンテック株式会社 | 離間装置および離間方法 |
| JP6363947B2 (ja) * | 2014-12-26 | 2018-07-25 | リンテック株式会社 | 離間装置および離間方法 |
| JP6941022B2 (ja) * | 2017-10-06 | 2021-09-29 | 株式会社ディスコ | 拡張方法及び拡張装置 |
| JP7224214B2 (ja) * | 2019-03-13 | 2023-02-17 | 株式会社ディスコ | 拡張装置 |
| JP7312666B2 (ja) | 2019-10-18 | 2023-07-21 | 株式会社ディスコ | シート拡張装置 |
| JP7316729B2 (ja) | 2019-10-18 | 2023-07-28 | 株式会社ディスコ | シート拡張装置 |
| JP7377671B2 (ja) | 2019-10-18 | 2023-11-10 | 株式会社ディスコ | シートの拡張方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1681082A (zh) * | 2004-03-31 | 2005-10-12 | 株式会社迪斯科 | 带扩展设备 |
| CN102054681A (zh) * | 2009-10-02 | 2011-05-11 | 株式会社迪思科 | 带扩张装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5984438A (ja) * | 1982-11-04 | 1984-05-16 | Nec Corp | シ−ト拡張装置 |
| JPH0212944A (ja) * | 1988-06-30 | 1990-01-17 | Nec Corp | 半導体装置製造用シート拡大装置 |
| SG74007A1 (en) * | 1994-07-20 | 2000-07-18 | Loomis Ind Inc | Apparatus and method for dicing semiconductor wafers |
| JP2006173269A (ja) * | 2004-12-14 | 2006-06-29 | Hamamatsu Photonics Kk | 基板加工方法及びフィルム伸張装置 |
| JP2006229021A (ja) * | 2005-02-18 | 2006-08-31 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
| JP5496692B2 (ja) * | 2010-01-22 | 2014-05-21 | 三洋電機株式会社 | 半導体モジュールの製造方法 |
| JP6009885B2 (ja) * | 2012-09-24 | 2016-10-19 | 株式会社ディスコ | テープ拡張装置 |
-
2013
- 2013-04-15 JP JP2013084783A patent/JP6087707B2/ja active Active
-
2014
- 2014-04-11 CN CN201410144272.9A patent/CN104103585B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1681082A (zh) * | 2004-03-31 | 2005-10-12 | 株式会社迪斯科 | 带扩展设备 |
| CN102054681A (zh) * | 2009-10-02 | 2011-05-11 | 株式会社迪思科 | 带扩张装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014207358A (ja) | 2014-10-30 |
| JP6087707B2 (ja) | 2017-03-01 |
| CN104103585A (zh) | 2014-10-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |