CN104081500A - 放射线固化型切割用粘合带 - Google Patents
放射线固化型切割用粘合带 Download PDFInfo
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- CN104081500A CN104081500A CN201380007115.7A CN201380007115A CN104081500A CN 104081500 A CN104081500 A CN 104081500A CN 201380007115 A CN201380007115 A CN 201380007115A CN 104081500 A CN104081500 A CN 104081500A
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- radiation
- curing
- adhesive
- adhesive tape
- cutting
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2415/00—Presence of rubber derivatives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-214776 | 2012-09-27 | ||
| JP2012214776A JP5294365B1 (ja) | 2012-09-27 | 2012-09-27 | 放射線硬化型ダイシング用粘着テープ |
| PCT/JP2013/075561 WO2014050763A1 (ja) | 2012-09-27 | 2013-09-20 | 放射線硬化型ダイシング用粘着テープ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104081500A true CN104081500A (zh) | 2014-10-01 |
Family
ID=49396754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380007115.7A Pending CN104081500A (zh) | 2012-09-27 | 2013-09-20 | 放射线固化型切割用粘合带 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5294365B1 (ko) |
| KR (1) | KR101487148B1 (ko) |
| CN (1) | CN104081500A (ko) |
| TW (1) | TWI500735B (ko) |
| WO (1) | WO2014050763A1 (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107078037A (zh) * | 2015-03-02 | 2017-08-18 | 琳得科株式会社 | 切割片与半导体芯片的制造方法 |
| CN110582839A (zh) * | 2017-12-27 | 2019-12-17 | 古河电气工业株式会社 | 辐射固化型切割用粘合带 |
| CN111876095A (zh) * | 2017-09-28 | 2020-11-03 | 日东电工株式会社 | 增强薄膜 |
| CN112585742A (zh) * | 2018-08-08 | 2021-03-30 | 琳得科株式会社 | 端子保护用胶带及带电磁波屏蔽膜的半导体装置的制造方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6129541B2 (ja) * | 2012-12-17 | 2017-05-17 | リンテック株式会社 | ダイシングシート |
| JP6310492B2 (ja) * | 2016-03-31 | 2018-04-11 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
| MY186094A (en) * | 2016-03-31 | 2021-06-21 | Furukawa Electric Co Ltd | Removable adhesive sheet for semiconductor processing |
| JP6804860B2 (ja) * | 2016-04-05 | 2020-12-23 | パナック株式会社 | キャリアシート及びカット部材の製造方法 |
| CN112534554B (zh) * | 2018-08-08 | 2024-02-06 | 琳得科株式会社 | 端子保护用胶带及带电磁波屏蔽膜的半导体装置的制造方法 |
| JP2020125371A (ja) * | 2019-02-01 | 2020-08-20 | 日東電工株式会社 | 粘着シート |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135494A (ja) * | 2008-12-03 | 2010-06-17 | Furukawa Electric Co Ltd:The | ダイシングテープ |
| CN101903983A (zh) * | 2007-12-18 | 2010-12-01 | 古河电气工业株式会社 | 晶圆粘贴用粘合片及晶圆的加工方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4876451B2 (ja) * | 2005-06-27 | 2012-02-15 | 日立化成工業株式会社 | 接着シート |
| US7825517B2 (en) * | 2007-07-16 | 2010-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for packaging semiconductor dies having through-silicon vias |
| JP4717051B2 (ja) * | 2007-11-08 | 2011-07-06 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| JP4553400B2 (ja) * | 2008-02-18 | 2010-09-29 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
| EP2151857A2 (en) * | 2008-08-04 | 2010-02-10 | Nitto Denko Corporation | Dicing die-bonding film |
| KR20100028687A (ko) * | 2008-09-05 | 2010-03-15 | 주식회사 동진디스플레이재료 | 오프셋 인쇄 장치 |
-
2012
- 2012-09-27 JP JP2012214776A patent/JP5294365B1/ja active Active
-
2013
- 2013-09-20 CN CN201380007115.7A patent/CN104081500A/zh active Pending
- 2013-09-20 KR KR1020147021317A patent/KR101487148B1/ko active IP Right Grant
- 2013-09-20 WO PCT/JP2013/075561 patent/WO2014050763A1/ja active Application Filing
- 2013-09-27 TW TW102135066A patent/TWI500735B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101903983A (zh) * | 2007-12-18 | 2010-12-01 | 古河电气工业株式会社 | 晶圆粘贴用粘合片及晶圆的加工方法 |
| JP2010135494A (ja) * | 2008-12-03 | 2010-06-17 | Furukawa Electric Co Ltd:The | ダイシングテープ |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107078037A (zh) * | 2015-03-02 | 2017-08-18 | 琳得科株式会社 | 切割片与半导体芯片的制造方法 |
| CN107078037B (zh) * | 2015-03-02 | 2020-08-14 | 琳得科株式会社 | 切割片与半导体芯片的制造方法 |
| CN111876095A (zh) * | 2017-09-28 | 2020-11-03 | 日东电工株式会社 | 增强薄膜 |
| US11945984B2 (en) | 2017-09-28 | 2024-04-02 | Nitto Denko Corporation | Reinforcing film |
| CN110582839A (zh) * | 2017-12-27 | 2019-12-17 | 古河电气工业株式会社 | 辐射固化型切割用粘合带 |
| CN110582839B (zh) * | 2017-12-27 | 2023-06-06 | 古河电气工业株式会社 | 辐射固化型切割用粘合带 |
| CN112585742A (zh) * | 2018-08-08 | 2021-03-30 | 琳得科株式会社 | 端子保护用胶带及带电磁波屏蔽膜的半导体装置的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201420714A (zh) | 2014-06-01 |
| KR101487148B1 (ko) | 2015-01-28 |
| KR20140099337A (ko) | 2014-08-11 |
| JP5294365B1 (ja) | 2013-09-18 |
| WO2014050763A1 (ja) | 2014-04-03 |
| JP2014072221A (ja) | 2014-04-21 |
| TWI500735B (zh) | 2015-09-21 |
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