WO2014050763A1 - 放射線硬化型ダイシング用粘着テープ - Google Patents

放射線硬化型ダイシング用粘着テープ Download PDF

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Publication number
WO2014050763A1
WO2014050763A1 PCT/JP2013/075561 JP2013075561W WO2014050763A1 WO 2014050763 A1 WO2014050763 A1 WO 2014050763A1 JP 2013075561 W JP2013075561 W JP 2013075561W WO 2014050763 A1 WO2014050763 A1 WO 2014050763A1
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WIPO (PCT)
Prior art keywords
pressure
radiation
sensitive adhesive
dicing
adhesive tape
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PCT/JP2013/075561
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English (en)
French (fr)
Japanese (ja)
Inventor
郷史 大田
有理 玉川
朗 矢吹
服部　聡
Original Assignee
古河電気工業株式会社
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Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to CN201380007115.7A priority Critical patent/CN104081500A/zh
Priority to KR1020147021317A priority patent/KR101487148B1/ko
Publication of WO2014050763A1 publication Critical patent/WO2014050763A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2415/00—Presence of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Definitions

  • the present invention relates to an adhesive tape used for fixing a workpiece such as a semiconductor wafer when the semiconductor wafer or the like is cut and separated (diced) in order to make an element into small pieces.
  • the wafer with through electrodes formed is cut and separated into element pieces (semiconductor chips) (dicing process), and the process for picking up these semiconductor chips (pickup process) has a radiation-curing adhesive layer for wafer dicing processing.
  • the use of tape is being considered.
  • a wafer dicing adhesive tape having a radiation curable adhesive layer When using a wafer dicing adhesive tape having a radiation curable adhesive layer, the wafer must be sufficiently retained in the dicing process.
  • a wafer provided with a through electrode usually has a through electrode protrusion having a height of 3 to several tens of ⁇ m on one or both surfaces. For this reason, even if the conventional adhesive tape for dicing processing is bonded, it is often impossible to follow the protrusions and hold the wafer. As a result, a gap may be generated around the protrusion of the through electrode.
  • a rotary blade called a blade.
  • the chip vibrates due to impact during cutting, causing a collision between the blade and the chip, and chipping (chipping) Occurs to reduce the yield of chips.
  • the pressure-sensitive adhesive layer is cured and contracted when the pressure-sensitive adhesive force is reduced by irradiating the pressure-sensitive adhesive layer with radiation after curing. For this reason, there is a problem that the adhesive layer bites into the protrusions on the wafer surface such as the through electrodes, and the diced semiconductor chip cannot be picked up well.
  • a pressure-sensitive adhesive containing a gas generating agent that generates gas by stimulation is used.
  • gas since the pressure-sensitive adhesive becomes brittle, adhesion of pressure-sensitive adhesive waste (glue residue) to the chip occurs, which may reduce the yield.
  • an object of the present invention is to provide a radiation curable dicing adhesive tape that can be easily picked up without causing adhesive residue in a pick-up process even for a semiconductor chip or the like provided with a through electrode.
  • a radiation curable dicing adhesive tape according to the present invention is a radiation curable adhesive tape in which a radiation curable adhesive layer is provided on a base sheet, and is a Young after radiation curing.
  • the ratio of the ratio to the Young's modulus before radiation curing is 1.0 to 1.8.
  • the radiation curable dicing pressure-sensitive adhesive tape preferably has a storage elastic modulus G ′ of 1.8 ⁇ 10 4 to 4.7 ⁇ 10 4 Pa before the radiation curing of the pressure-sensitive adhesive layer.
  • the adhesive layer preferably has a loss coefficient tan ⁇ before radiation curing of 0.20 to 0.35.
  • the radiation-curable dicing adhesive tape can be suitably used when dicing a semiconductor wafer.
  • the radiation-curable dicing pressure-sensitive adhesive tape can be suitably used when the semiconductor wafer has protrusions or steps on the surface to be bonded to the pressure-sensitive adhesive layer.
  • chipping in the dicing process can be reduced, and even a semiconductor chip provided with a through electrode can be easily picked up without generating adhesive residue in the pick-up process.
  • the radiation-curing dicing pressure-sensitive adhesive tape 1 has at least one pressure-sensitive adhesive layer 3 formed on at least one side of the base material sheet 2.
  • FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of the radiation curable dicing pressure-sensitive adhesive tape 1 of the present invention.
  • the radiation curable dicing pressure-sensitive adhesive tape 1 has a base sheet 2, and the base sheet 2 An adhesive layer 3 is formed on the top.
  • the radiation curing type dicing pressure-sensitive adhesive tape 1 has a ratio of Young's modulus after radiation curing to Young's modulus before radiation curing (Young's modulus after radiation curing / Young's modulus before radiation curing) of 1. 0 to 1.8.
  • the bump or the step is the pressure-sensitive adhesive layer. 3 is preferably almost completely buried. If there is a gap between the bump or step and the radiation curable dicing adhesive tape 1, the chip vibrates greatly due to the vibration of the rotary blade (blade) in the dicing process, and contact with the blade or adjacent chip may occur. Will occur and chipping will occur.
  • the influence of vibration by the rotary blade can be reduced, but when a radiation curable pressure-sensitive adhesive composition is used as the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3. Since the pressure-sensitive adhesive layer 3 is cured in a state of being in close contact with the bump or the step, the pressure-sensitive adhesive layer 3 may be caught by the bump or the step during the pickup process, which may cause a problem that the pickup cannot be performed.
  • the radiation-curable pressure-sensitive adhesive is a pressure-sensitive adhesive composition containing at least a compound (a) having a carbon-carbon unsaturated bond at its molecular end and a compound called an initiator that generates radicals upon receiving radiation. It refers to things.
  • the initiator is activated, and by the generated radical, the terminal carbon-carbon unsaturated bond is subsequently activated, so that the compound (a) is bonded one after another, and the compound ( a) mutual forms a bridge.
  • the plurality of compounds (a) dispersed in the pressure-sensitive adhesive before cross-linking are assembled and bonded by cross-linking, so that the pressure-sensitive adhesive is harder after cross-linking than before cross-linking.
  • the cross-linking reaction occurs in close contact with the bumps or steps, the hardened adhesive is caught on the bumps or steps and inhibits smooth peeling.
  • the chip strength is extremely weak, and chip breakage is liable to occur when peeling is inhibited.
  • the bumps caused by the curing of the pressure-sensitive adhesive or the catching on the step can be suppressed by adjusting the degree of curing of the pressure-sensitive adhesive.
  • An index for checking the degree of curing of the adhesive is the tensile elastic modulus of the radiation-curing dicing adhesive tape 1.
  • the radiation-curable pressure-sensitive adhesive layer 3 undergoes a curing reaction upon irradiation with radiation, and thus the above ratio is usually larger than 1. When this ratio is 1.8 or less, there is little catching on bumps or steps, and pickup can be performed easily. If it is larger than 1.8, bumps or bumps will be caught, and the stress applied to the chip will increase when the pickup process is pushed up, so that pickup cannot be performed or the chip may be damaged. To do.
  • the tensile elastic modulus here is a value obtained according to JIS K 7127: 1999.
  • the base material sheet 2 is generally thicker and more rigid than the pressure-sensitive adhesive layer 3
  • only the pressure-sensitive adhesive layer 3 is obtained by taking the ratio of the tensile elastic modulus of the radiation-curable dicing pressure-sensitive adhesive tape 1.
  • the radiation dose is not particularly limited, but for example, in the case of ultraviolet rays, 100 to 1000 mJ / cm 2 is preferable, and 200 to 500 mJ / cm 2 is more preferable.
  • the storage elastic modulus G ′ of the pressure-sensitive adhesive layer 3 before radiation curing is preferably 1.8 ⁇ 10 4 to 4.7 ⁇ 10 4 Pa, preferably 2.0 to It is more preferable that it is 4.7 4 Pa.
  • G ′ is lower than 1.8 ⁇ 10 4 Pa, the pressure-sensitive adhesive layer 3 can sufficiently adhere to bumps or steps, but since the pressure-sensitive adhesive layer 3 is too soft, it is caused by a rotating blade in the dicing process. Vibration cannot be suppressed and chipping occurs.
  • the pressure is larger than 4.7 ⁇ 10 4 Pa, the adhesive layer 3 cannot be sufficiently adhered to the bump or the step, and a gap is formed. Therefore, chipping is caused by the vibration of the rotary blade in the dicing process. Will occur.
  • the loss coefficient tan ⁇ of the adhesive layer 3 before radiation curing is 0.20 to 0.35. More preferably, it is 0.25 to 0.35.
  • the loss coefficient tan ⁇ is represented by the ratio (G ′′ / G ′) of the storage elastic modulus G ′ and the loss elastic modulus G ′′.
  • the loss coefficient tan ⁇ of the pressure-sensitive adhesive layer 3 is smaller than 0.20, the close contact state cannot be maintained, and a gap is generated between the wafer and the pressure-sensitive adhesive tape, and chipping may be deteriorated by the above-described mechanism.
  • the loss coefficient tan ⁇ of the pressure-sensitive adhesive layer 3 is larger than 0.35, it becomes difficult to transmit the stress of the push-up jig from below when picking up after singulation, so the push-up height must be increased, The risk of chip breakage increases.
  • Base material sheet 2 About resin which comprises the base material sheet 2, it does not restrict
  • polypropylene high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene / propylene copolymer, propylene copolymer, ethylene-propylene-diene copolymer added Sulfur, polybutene, polybutadiene, polymethylpentene, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) methyl acrylate copolymer, ethylene- (meth) ethyl acrylate copolymer, ethylene- (meta ) Butyl acrylate copolymer, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polyurethane, polyamide, iono
  • the thickness of the base sheet 2 is not particularly limited, but if it is too thin, it is difficult to handle, and if it is too thick, it becomes difficult to transmit the stress of the push-up jig during the pick-up process, so 50 to 150 ⁇ m is preferable, and 70 to 100 ⁇ m is further preferable. preferable.
  • the surface of the base sheet 2 that contacts the pressure-sensitive adhesive layer 3 may be subjected to a corona treatment or a primer treatment in order to improve the adhesion.
  • Adhesive layer 3 As the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer 3, for example, those described in JP-A-7-135189 are preferably used, but the invention is not limited thereto, and a rubber-based or acrylic base polymer is used. In contrast, a compound having at least two radiation-polymerizable carbon-carbon double bonds in the molecule (hereinafter referred to as a photopolymerizable compound) and a photopolymerization initiator, or an acrylic base Those obtained by adding a compound having a carbon-carbon double bond to a polymer can be used.
  • the method for introducing a carbon-carbon double bond into an acrylic polymer is not particularly limited.
  • an acrylic polymer containing a functional group by copolymerization using a monomer having a functional group as a copolymerizable monomer After preparing the polymer, a compound having a functional group capable of reacting with a functional group in the acrylic polymer containing a functional group and a carbon-carbon double bond is converted into a carbon-carbon to the acrylic polymer containing the functional group.
  • Examples thereof include a method of preparing an acrylic polymer having a carbon-carbon double bond in the molecule by carrying out a condensation reaction or an addition reaction while maintaining the radiation curing property (radiation polymerization property) of the double bond.
  • the above rubber-based or acrylic base polymer is a rubber-based polymer such as natural rubber or various synthetic rubbers, or poly (meth) acrylic acid alkyl ester, (meth) acrylic acid alkyl ester, (meth) acrylic acid alkyl ester. And an acrylic polymer such as a copolymer of the above and other unsaturated monomer copolymerizable therewith.
  • Use of ethyl acrylate, butyl acrylate, or methoxyethyl acrylate as the monomer constituting the base polymer is preferable because the pickup property is further improved.
  • photopolymerizable compound examples include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetraethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and neopentyl glycol.
  • Esterified product of (meth) acrylic acid such as di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, glycerol di (meth) acrylate and polyhydric alcohol; ester acrylate oligomer; 2-propenyl-di-3- Cyanurate compounds having a carbon-carbon double bond-containing group such as butenyl cyanurate; tris (2-acryloxyethyl) isocyanurate, tris (2-methacryloxyethyl) isocyanurate, 2-hydroxyethylene Bis (2-acryloxyethyl) isocyanurate, bis (2-acryloxyethyl) 2-[(5-acryloxyhexyl) -oxy] ethyl isocyanurate, tris (1,3-diacryloxy-2-propyl-oxy) Carbonylamino-n-hexyl) isocyanurate, tris (1-acryloxyethyl-3-methacryloxy
  • the number of carbon-carbon double bonds in one molecule is not particularly limited, but the number of carbon-carbon double bonds in one molecule is 2-6. Is preferred.
  • the blending amount of the photopolymerizable compound is not particularly limited, but is preferably 10 to 90 parts by weight, more preferably 20 to 70 parts by weight, and more preferably 20 to 60 parts by weight based on 100 parts by weight of the base polymer. Part by mass is more preferable.
  • the radiation curable pressure-sensitive adhesive can generate a polymerization and curing reaction by radiation irradiation by mixing a photopolymerization initiator in the pressure-sensitive adhesive.
  • photopolymerization initiators include benzoin alkyl ether initiators such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone, benzoylbenzoic acid, 3,3 ′ Benzophenone initiators such as dimethyl-4-methoxybenzophenone and polyvinylbenzophenone; ⁇ -hydroxycyclohexyl phenyl ketone, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-dieth
  • the blending amount of the photopolymerization initiator is not particularly limited, but is preferably 1 to 10 parts by mass, more preferably 2 to 7 parts by mass with respect to 100 parts by mass of the base polymer of the pressure-sensitive adhesive.
  • an isocyanate curing agent can be blended in the above-mentioned pressure-sensitive adhesive as necessary.
  • Specific examples of the isocyanate curing agent include polyvalent isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane- 4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine Isocyanate is used.
  • the blending amount of the curing agent is not particularly limited, but is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the base polymer of the adhesive.
  • a tackifier for example, a tackifier, an anti-aging agent, a filler, a colorant, a flame retardant, an antistatic agent, a softening agent, an ultraviolet ray may be used as necessary.
  • Known additives such as an absorbent, an antioxidant, a plasticizer, and a surfactant may be included.
  • the pressure-sensitive adhesive layer 3 in the present invention can be formed using a known method for forming the pressure-sensitive adhesive layer 3.
  • the above-mentioned pressure-sensitive adhesive composition is applied to a predetermined surface of the base sheet 2 and formed, or the pressure-sensitive adhesive composition is separated from a separator (for example, a plastic film or sheet coated with a release agent).
  • the adhesive layer 3 can be formed on the base sheet 2 by a method in which the adhesive layer 3 is formed on the base sheet 2 by transferring the adhesive layer 3 to a predetermined surface of the base sheet 2. it can.
  • the thickness of the pressure-sensitive adhesive layer 3 is not particularly limited as long as it is higher than bumps or steps.
  • the adhesive layer 3 showed the radiation-curing-type dicing adhesive tape 1 which has a single layer form, you may have the form on which the several adhesive layer 3 was laminated
  • the adhesive layer 3 which has the surface where a wafer is bonded at the time of dicing is the radiation curing type adhesive layer 3, and the storage elastic modulus G 'before radiation curing Is 1.8 ⁇ 10 4 to 4.7 ⁇ 10 4 Pa, and the loss coefficient tan ⁇ before radiation curing is preferably 0.20 to 0.35.
  • a synthetic resin film usually used as a separator for protecting the pressure-sensitive adhesive layer 3 may be attached to the pressure-sensitive adhesive layer 3 side until it is put into practical use.
  • the constituent material of the synthetic resin film include synthetic resin films such as polyethylene, polypropylene, and polyethylene terephthalate, and paper.
  • the surface of the synthetic resin film may be subjected to release treatment such as silicone treatment, long-chain alkyl treatment, fluorine treatment, etc., as necessary, in order to enhance the peelability from the pressure-sensitive adhesive layer 3.
  • the thickness of the synthetic resin film is usually about 10 to 100 ⁇ m, preferably about 25 to 50 ⁇ m.
  • the radiation-curing dicing adhesive tape 1 of the present invention is subjected to dicing according to a conventional method after a mounting step to be attached to a semiconductor component that is to be cut, and further transferred to radiation irradiation and a pick-up step.
  • the semiconductor component include a silicon semiconductor, a compound semiconductor, a semiconductor package, glass, ceramics, and the like.
  • the radiation curable dicing adhesive tape 1 can be suitably used for dicing a semiconductor wafer having a through electrode.
  • the object to be cut and the pressure-sensitive adhesive tape 1 are usually overlapped with the object to be cut and the pressure-sensitive adhesive tape 1 while being pressed by a known pressing means such as a pressing means using a pressure-bonding roll. Paste.
  • a method of heating the workpiece can also be adopted.
  • the blade In the dicing process, the blade is rotated at a high speed to cut the object to be cut into a predetermined size. Dicing can employ a cutting method called full cut that cuts up to a part of the dicing tape.
  • the pressure-sensitive adhesive layer 3 is cured by irradiation with ultraviolet rays to reduce the adhesiveness.
  • the ultraviolet irradiation By the ultraviolet irradiation, the tackiness of the pressure-sensitive adhesive layer 3 is lowered by curing, and peeling can be facilitated.
  • the irradiation amount of ultraviolet rays is not particularly limited, but is preferably 100 to 1000 mJ / cm 2 , more preferably 200 to 500 mJ / cm 2 .
  • the pickup process can be provided with an expanding process.
  • the pickup method is not particularly limited, and various conventionally known pickup methods can be employed. For example, there is a method of pushing up individual cut pieces from a dicing tape with a jig such as a needle and picking up the cut pieces with a pickup device.
  • Adhesive composition A A polyisocyanate compound (Nippon Polyurethane Industry Co., Ltd.) is used with respect to 100 parts by mass of an acrylic copolymer (ethyl acrylate: 23 mol%, butyl acrylate: 56 mol%, methoxyethyl acrylate: 21 mol%) (weight average molecular weight 900,000).
  • Co., Ltd., trade name Coronate L 2 parts by weight, tetramethylol methane tetraacrylate 30 parts by weight as a photopolymerizable compound, and 2 parts by weight of a photopolymerization initiator (BASF, trade name Irgacure 184) are added and mixed. Then, a radiation curable pressure-sensitive adhesive composition A was prepared.
  • a pressure-sensitive adhesive composition B was prepared in the same manner as the pressure-sensitive adhesive composition A, except that the photopolymerizable compound was changed to 60 parts by mass of pentaerythritol triacrylate.
  • Adhesive Composition C was prepared in the same manner as Adhesive Composition A, except that the acrylic polymer was a copolymer (weight average molecular weight 500,000) composed of 2-ethylhexyl acrylate, methyl acrylate, and 2-hydroxyethyl acrylate. It was adjusted.
  • the pressure-sensitive adhesive composition D was prepared in the same manner as the pressure-sensitive adhesive composition C, except that the photopolymerizable compound was dipentaerythritol hexaacrylate and the blending amount was 20 parts by mass.
  • a pressure-sensitive adhesive composition E was prepared in the same manner as the pressure-sensitive adhesive composition D, except that the amount of the photopolymerizable compound was 50 parts by mass.
  • the pressure-sensitive adhesive composition F was prepared in the same manner as the pressure-sensitive adhesive composition D, except that the amount of the photopolymerizable compound was 80 parts by mass.
  • Adhesive composition G As a compound having a photopolymerizable carbon-carbon double bond and a functional group on 100 parts by mass of an acrylic copolymer composed of 2-ethylhexyl acrylate, methacrylic acid and 2-hydroxyethyl acrylate, 2-methacryloyloxyethyl isocyanate (Showa Residue having an acrylic monomer part having a radiation-curable carbon-carbon double bond-containing group with respect to a repeating unit of the main chain by reacting 0.2 part by mass with a trade name, Karenz MOI, manufactured by Denko Co., Ltd. A polymer having a group bonded thereto was obtained (weight average molecular weight 600,000).
  • a polyisocyanate compound manufactured by Nippon Polyurethane Industry Co., Ltd., trade name Coronate L
  • a photopolymerization initiator manufactured by BASF, trade name: Irgacure 184
  • Part of the mixture was added and mixed to prepare a radiation-curable pressure-sensitive adhesive composition G.
  • the pressure-sensitive adhesive composition H was prepared in the same manner as the pressure-sensitive adhesive composition G, except that the blending amount of the polyisocyanate compound was 0.5 parts by mass.
  • Adhesive composition I was prepared in the same manner as adhesive composition G, except that the amount of 2-methacryloyloxyethyl isocyanate to be reacted with the acrylic copolymer was 0.6 parts by mass.
  • Base material sheet J A film extrusion molding of ethylene-methacrylic acid- (2-methyl-propyl acrylate) -Zn ++ ionomer resin (Mitsui / DuPont Polychemical Co., Ltd., trade name Himiran AM7316) at about 200 ° C. with a twin-screw kneader, A substrate sheet J having a thickness of 100 ⁇ m was produced.
  • Substrate sheet K An ethylene-vinyl acetate copolymer (manufactured by Nippon Unicar Co., Ltd., trade name NUC-3758) was film-extruded at about 200 ° C. with a twin-screw kneader to produce a substrate sheet K having a thickness of 100 ⁇ m.
  • Base material sheet L A polyvinyl chloride sheet (thickness: 100 ⁇ m) containing 30 parts by mass of dioctyl phthalate with respect to 100 parts by mass of the polyvinyl chloride resin was prepared.
  • the adhesive compositions A to I are applied to the base sheets J to L so that the thickness after drying is 20 ⁇ m, respectively.
  • a layer was formed, and radiation-curable dicing pressure-sensitive adhesive tapes according to Examples 1, 3 to 9, and Comparative Examples 1 and 2 were produced.
  • the pressure-sensitive adhesive composition A was applied so that the thickness after drying was 25 ⁇ m to form a pressure-sensitive adhesive layer, and a radiation-curable dicing pressure-sensitive adhesive tape according to Example 2 was produced.
  • Chipability evaluation The back surface of 30 chips collected in the pickup property evaluation was observed with an optical microscope, and the size of chipping was measured. The case where the distance from the end of the chip to the deepest portion of chipping was 5 ⁇ m or less was indicated as “ ⁇ ”, the case where it was 6 to 15 ⁇ m as ⁇ , and the case where it was larger than 15 ⁇ m as “X”. The results are shown in Tables 1 and 2.
  • the radiation curable dicing adhesive tapes of Examples 1 to 9 had a ratio of Young's modulus after radiation curing to Young's modulus before radiation curing in the range of 1.0 to 1.8. Therefore, the pickup property under condition B was good.
  • the pickup is performed even under condition A where the amount of pin push-up is small and pickup is more difficult The property was good.
  • the radiation curing type dicing pressure-sensitive adhesive tapes of Examples 1 to 6 have a storage elastic modulus G ′ of 1.8 ⁇ 10 4 to 4.7 ⁇ 10 4 Pa before radiation curing of the pressure-sensitive adhesive layer. Since the loss coefficient tan ⁇ before radiation curing of the layer was 0.25 to 0.35, all of the embedding property, chipping property, and change with time after bonding were good.
  • the radiation curing type dicing pressure-sensitive adhesive tape of Example 7 has a storage elastic modulus G ′ of 4.7 ⁇ 10 4 Pa before radiation curing of the pressure-sensitive adhesive layer. Compared to the adhesive tape for mold dicing, the embedding property was inferior and the chipping property was lowered, but it was within an allowable range.
  • the radiation curable dicing pressure-sensitive adhesive tape of Example 8 has a storage elastic modulus G ′ of 1.8 ⁇ 10 4 before the radiation curing of the pressure-sensitive adhesive layer. Therefore, for radiation curable dicing of Examples 1 to 6. Although the chipping property was inferior to that of the adhesive tape, it was within an allowable range.
  • the radiation curable dicing pressure-sensitive adhesive tape of Example 9 has a loss coefficient tan ⁇ before radiation curing of the pressure-sensitive adhesive layer of 0.20, so that it is compared with the radiation curable dicing pressure-sensitive adhesive tapes of Examples 1 to 6. The wafer floated due to the change with time after bonding, and the chipping property was lowered, but it was within an allowable range.

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  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
PCT/JP2013/075561 2012-09-27 2013-09-20 放射線硬化型ダイシング用粘着テープ WO2014050763A1 (ja)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183640A (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 電子デバイスパッケージ用テープ
WO2020158351A1 (ja) * 2019-02-01 2020-08-06 日東電工株式会社 粘着シート

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6129541B2 (ja) * 2012-12-17 2017-05-17 リンテック株式会社 ダイシングシート
JP6623210B2 (ja) * 2015-03-02 2019-12-18 リンテック株式会社 ダイシングシートおよび半導体チップの製造方法
SG11201800285PA (en) * 2016-03-31 2018-02-27 Furukawa Electric Co Ltd Removable adhesive sheet for semiconductor processing
JP6804860B2 (ja) * 2016-04-05 2020-12-23 パナック株式会社 キャリアシート及びカット部材の製造方法
KR102097143B1 (ko) 2017-09-28 2020-04-03 닛토덴코 가부시키가이샤 보강 필름 및 보강 필름 부착 디바이스의 제조 방법
JP7222919B2 (ja) * 2017-12-27 2023-02-15 古河電気工業株式会社 放射線硬化型ダイシング用粘着テープ
KR102630909B1 (ko) * 2018-08-08 2024-01-30 린텍 가부시키가이샤 단자 보호용 테이프 및 전자파 쉴드막을 가지는 반도체 장치의 제조 방법
JP7301053B2 (ja) * 2018-08-08 2023-06-30 リンテック株式会社 端子保護用テープ及び電磁波シールド膜付き半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007002173A (ja) * 2005-06-27 2007-01-11 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2009135377A (ja) * 2007-11-08 2009-06-18 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2009194303A (ja) * 2008-02-18 2009-08-27 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2010062541A (ja) * 2008-08-04 2010-03-18 Nitto Denko Corp ダイシング・ダイボンドフィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825517B2 (en) * 2007-07-16 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method for packaging semiconductor dies having through-silicon vias
JP5448430B2 (ja) * 2007-12-18 2014-03-19 古河電気工業株式会社 ウエハ貼着用貼着シートおよびウエハの加工方法
KR20100028687A (ko) * 2008-09-05 2010-03-15 주식회사 동진디스플레이재료 오프셋 인쇄 장치
JP5379459B2 (ja) * 2008-12-03 2013-12-25 古河電気工業株式会社 ダイシングテープ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007002173A (ja) * 2005-06-27 2007-01-11 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2009135377A (ja) * 2007-11-08 2009-06-18 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2009194303A (ja) * 2008-02-18 2009-08-27 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2010062541A (ja) * 2008-08-04 2010-03-18 Nitto Denko Corp ダイシング・ダイボンドフィルム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183640A (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 電子デバイスパッケージ用テープ
WO2017168830A1 (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 電子デバイスパッケージ用テープ
WO2020158351A1 (ja) * 2019-02-01 2020-08-06 日東電工株式会社 粘着シート

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TW201420714A (zh) 2014-06-01
CN104081500A (zh) 2014-10-01
JP2014072221A (ja) 2014-04-21

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