CN104053825A - Surface-treated Copper Foil For Copper-clad Laminate And Copper-clad Laminate Using Same - Google Patents

Surface-treated Copper Foil For Copper-clad Laminate And Copper-clad Laminate Using Same Download PDF

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Publication number
CN104053825A
CN104053825A CN201280067564.6A CN201280067564A CN104053825A CN 104053825 A CN104053825 A CN 104053825A CN 201280067564 A CN201280067564 A CN 201280067564A CN 104053825 A CN104053825 A CN 104053825A
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Prior art keywords
particle
alligatoring
copper foil
copper
particle diameter
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CN201280067564.6A
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CN104053825B (en
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新井英太
三木敦史
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JX Nippon Mining and Metals Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper film is removed by etching. The surface-treated copper foil for copper-clad laminate is such that roughening particles are formed on the surface of the copper foil by a roughening treatment. Roughening particles are formed on the roughening treatment surface in the following manner: roughening particles with particle diameters of less than 0.10 micrometer<2> are formed at a density of 0-42 per micrometer<2>; roughening particles with particle diameters of at least 0.10 micrometer and less than 0.30 micrometer are formed at a density of 0-25 per [micrometer<2>; roughening particles with particle diameters of at least 0.30 micrometer and less than 1.0 micrometer are formed at a density of 0-10 per micrometer<2>; and roughening particles with particle diameters of at least 1.0 [mu]m are formed at a density of 0-0.1 per micrometer<2>.

Description

Copper-clad plate is with surface treatment copper foil and used its copper-clad plate
Technical field
The present invention relates to copper-clad plate (Copper Zhang Plot Layer plate) with surface treatment copper foil and used its copper-clad plate, be particularly applicable to copper-clad plate to the resin of the remainder obtaining after Copper Foil etching being required to transparent field with surface treatment copper foil and used its copper-clad plate.
Background technology
Because flexible print circuit board is wiring and lightweight easily, so adopt flexible print circuit board (hereinafter referred to as FPC) in smart mobile phone and the such miniaturized electronics of dull and stereotyped PC.In recent years, the performance raising due to these electronicss, so carry out the high speed of signal transmission speed, is matched to as important factor at FPC middle impedance.Strategy as the impedance matching increasing for signal volume, is increasing the bed thickness that becomes the resin insulating barrier of FPC substrate (for example polyimide).On the other hand, will to FPC carry out with liquid crystal base material engage and carry the processing such as IC chip, location is now undertaken by positioning image, see through resin insulating barrier residual after the Copper Foil etching of copper-clad plate is recognized described positioning image, so the visibility (Visual Recognize of resin insulating barrier) become important.
In addition, can manufacture copper-clad plate with the rolled copper foil that effects on surface has been implemented alligatoring plating.Described rolled copper foil is used red copper (oxygen level 100～500 ppm by weight) or oxygen free copper (oxygen level 10 ppm by weight are following) conventionally as starting material, their ingot casting is carried out after hot rolling, until become the thickness of regulation, repeatedly carry out cold rolling and annealing, manufacture thus.Patent documentation 1 has proposed the scheme that the high low roughness electrolysis paper tinsel of surface gloss is used as conductor layer.
On the other hand, a kind of scheme of rolled copper foil has been proposed in patent documentation 2, described rolled copper foil, as the Copper Foil of bendability excellence, is to form by the cold rolling process under the conditions such as oil film control, and lip-deep oil hole (オ イ Le ピ ッ ト) degree of depth is below 2.0 μ m.
Prior art document
Patent documentation
Patent documentation 1: No. 2004-98659, Japanese Patent Publication communique JP
Patent documentation 2: No. 2001-58203, Japanese Patent Publication communique JP
Summary of the invention
The technical problem to be solved in the present invention
In patent documentation 1, Darkening process or plating have been carried out cementability by organic agent after processing and have been improved and process the low roughness Copper Foil obtaining and copper-clad plate is being required in the purposes of bending property, sometimes because of tired, break, and resin see-through is poor sometimes.In addition,, even if use the rolled copper foil of the oil hole state with the degree that patent documentation 2 records, can not obtain enough transparencys of resin.Like this, in technology in the past, the see-through of removing the resin after rolled copper foil by etching is low, can not carry out smoothly the location of chip.
The invention provides a kind of can with resin well bonding and by etching, Copper Foil is removed after the copper-clad plate Copper Foil of transparency excellence of resin.
The technical scheme of technical solution problem
The inventor has carried out intently research repeatedly, and it found that, individual number density of every kind of particle diameter of Copper Foil and the alligatoring particle bonding side of resin substrate, on having impact by etching the transparency of the resin after Copper Foil removal.
The one aspect of the present invention having completed using above understanding as basis provides a kind of copper-clad plate surface treatment copper foil, and it is formed with alligatoring particle by roughening treatment at copper foil surface, and the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 0～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～10/μ m 2and alligatoring particles more than particle diameter 1.0 μ m is 0～0.1/μ m 2mode, on roughening treatment surface, be formed with alligatoring particle.
In copper-clad plate of the present invention, with in an embodiment of surface treatment copper foil, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 10～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～10/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～5/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
In the copper-clad plate of the present invention embodiment other with surface treatment copper foil, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 15～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～2/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～2/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
In copper-clad plate of the present invention, with in other embodiment of surface treatment copper foil, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 0～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 10～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～2/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
In copper-clad plate of the present invention, with in other embodiments of surface treatment copper foil, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 0～30/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 3～7/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
In copper-clad plate of the present invention, with in other embodiments of surface treatment copper foil, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 15～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～3/μ m 2, there is no the mode that particle diameter 0.30 μ m is above and be less than the alligatoring particle of 1.0 μ m and there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
In copper-clad plate of the present invention, with in other embodiments of surface treatment copper foil, the surface-area A of described alligatoring particle and the ratio A/B of the area B obtaining when described copper foil surface side is overlooked described alligatoring particle are 2.00～2.45.
In copper-clad plate of the present invention, with in other embodiments of surface treatment copper foil, described A/B is 2.00～2.30.
In copper-clad plate of the present invention, with in other embodiments of surface treatment copper foil, described A/B is 2.00～2.15.
Described Copper Foil, after roughening treatment face side is fitted in the two sides of resin substrate that thickness is 50 μ m, when having removed described Copper Foil with etching, the light transmission rate of described resin substrate is more than 30%.
Other aspect of the present invention provides a kind of copper-clad plate, and it is by described surface treatment copper foil with resin substrate is stacked forms.
Invention effect
According to the present invention, can provide a kind of can with resin well bonding and by etching, Copper Foil is removed after the copper-clad plate surface treatment copper foil of transparency excellence of resin.
Accompanying drawing explanation
Fig. 1 is that the printed matter of the visibility of embodiment while evaluating observed photo, and (a) of Fig. 1 is comparative example 1, and (b) of Fig. 1 is embodiment 1, and (c) of Fig. 1 is embodiment 2, and (d) of Fig. 1 is embodiment 3, and (e) of Fig. 1 is embodiment 4.
Fig. 2 is that the SEM of the individual number density of the alligatoring particle of embodiment while evaluating observes photo, (a) of Fig. 2 is comparative example 1, and (b) of Fig. 2 is embodiment 1, and (c) of Fig. 2 is embodiment 2, (d) of Fig. 2 is embodiment 10, and (e) of Fig. 2 is embodiment 4.
Embodiment
[form of surface treatment copper foil and manufacture method]
The Copper Foil using in the present invention can be electrolytic copper foil or rolled copper foil.Conventionally, the stripping strength that improves the Copper Foil after stacked of take is object, for Copper Foil implement roughening treatment with bonding face that is the alligatoring face of resin base material, the copper foil surface of described roughening treatment after to degreasing carries out the galvanic deposit of pimple shape.Electrolytic copper foil has concavo-convex during fabrication, by roughening treatment, the protuberance of electrolytic copper foil is increased, and further increases concavo-convex.In the present invention, can carry out described roughening treatment by the plating of copper-cobalt-nickel alloy.As the pre-treatment before alligatoring, carry out common copper facing etc., as the final processing after alligatoring, in order to prevent coming off of electrodeposit, also carry out common copper facing etc.In rolled copper foil and electrolytic copper foil, also make some difference of content of processing.In the present invention, also comprise described pre-treatment and final processing, comprise as required the known processing relevant to roughening of copper foil, they are referred to as to roughening treatment.
As copper-cobalt-nickel alloy plating of roughening treatment of the present invention, can implement by plating, making to form adhesion amount is 15～40mg/dm 2copper-100～3000 μ g/dm 2cobalt-100～900 μ g/dm 2the ternary alloy layer of nickel.Adhesion amount at Co is less than 100 μ g/dm 2situation under, thermotolerance worsens sometimes, etching worsens.If the adhesion amount of Co surpasses 3000 μ g/dm 2, in the situation that must considering effect of magnetic influence, be undesirable, sometimes produce etching spot, in addition, sometimes make acid resistance and resistance to chemical reagents worsen.If the adhesion amount of Ni is less than 100 μ g/dm 2, thermotolerance worsens sometimes.On the other hand, if the adhesion amount of Ni surpasses 900 μ g/dm 2, etching residue becomes many.Preferably, the adhesion amount of Co is 1000～2000 μ g/dm 2, nickel adhesion amount be 200～400 μ g/dm 2.At this, so-called etching spot refers to be used in the etched situation of cupric chloride, and Co does not dissolve and left behind, and so-called etching residue refers to that Ni does not dissolve and left behind in the situation that having carried out alkali etching with ammonium chloride.
The common body lotion of the ternary copper described in being used to form-cobalt-nickel alloy plating and an example of plating condition are as follows:
Plating solution forms: Cu10～20g/L, Co1～10g/L, Ni1～10g/L
pH：1～4
Temperature: 40～50 ℃
Current density D k: 20～30A/dm 2
Plating time: 1～5 second
After roughening treatment, can on alligatoring face, form adhesion amount is 200～3000 μ g/dm 2cobalt-100～700 μ g/dm 2the cobalt-nickel alloy coating of nickel.This processing can be considered as a kind of antirust processing in a broad sense.Under the degree that described cobalt-nickel alloy coating need to not make the bonding strength of Copper Foil and substrate reduce actually, carry out.Adhesion amount at cobalt is less than 200 μ g/dm 2situation under, heat-resisting stripping strength reduces sometimes, oxidation-resistance and resistance to chemical reagents worsen.In addition Another reason is if cobalt amount is few, because treat surface reddens, so be undesirable.If the adhesion amount of cobalt surpasses 3000 μ g/dm 2, in the situation that must considering effect of magnetic influence, be undesirable, and can produce etching spot, in addition, also to consider that acid resistance and resistance to chemical reagents worsen.Preferably, the adhesion amount of cobalt is 500～3000 μ g/dm 2.On the other hand, the adhesion amount at nickel is less than 100 μ g/dm 2situation under, heat-resisting stripping strength reduces, oxidation-resistance and resistance to chemical reagents worsen.If nickel surpasses 700 μ g/dm 2, alkali etching worsens.Preferably, the adhesion amount of nickel is 200～600 μ g/dm 2.
In addition, an example of cobalt-nickel alloy plating condition is as follows:
Plating solution forms: Co1～20g/L, Ni1～20g/L
pH：1.5～3.5
Temperature: 30～80 ℃
Current density D k: 1.0～20.0A/dm 2
Plating time: 0.5～4 second
According to the present invention, at cobalt-nickel alloy, plating further formation adhesion amount is 10～80 μ g/dm 2zinc coating.Adhesion amount at zinc is less than 10 μ g/dm 2situation under, sometimes do not have heat-resisting deteriorated rate to improve effect.On the other hand, if the adhesion amount of zinc surpasses 80 μ g/dm 2, the deteriorated rate of salt tolerant acid extremely worsens sometimes.Zinc adhesion amount is 20～60 μ g/dm preferably 2, 30～50 μ g/dm more preferably 2.
An example of described zinc-plated condition is as follows:
Plating solution forms: Zn100～300g/L
pH：3～4
Temperature: 50～60 ℃
Current density D k: 0.1～0.5A/dm 2
Plating time: 1～3 second
In addition, instead of zinc coating, also can form the zn alloy coatings such as zinc-nickel alloy plating, also can, by most surface being carried out to chromic salt processing or silane-coating coupling agent etc., form thus rustproof layer in addition.
In addition, surface treatment copper foil of the present invention, also can be on the surface of Copper Foil, after forming the primary particle layer of copper as roughening treatment in advance, on primary particle layer, form the second particle layer consisting of ternary alloy, described ternary alloy consists of copper, cobalt and nickel.In this case, an example of the plating condition of the primary particle of copper is as follows:
Plating solution forms: Cu10～25g/L, sulfuric acid 50～100g/L
Temperature: 25～50 ℃
Current density D k: 10～70A/dm 2
Plating time: 5～25 seconds
Coulomb amount: 50～500As/dm 2
An example of the plating condition of second particle is as follows:
Plating solution forms: Cu10～20g/L, nickel 5～15g/L, cobalt 5～15g/L
pH：2～3
Temperature: 30～50 ℃
Current density D k: 20～60A/dm 2
Plating time: 1～5 second
Coulomb amount: 30～70As/dm 2
[the individual number density of alligatoring particle]
Copper Foil and resin substrate stacked after, the alligatoring particle of copper foil surface is embedded in resin.Then,, when copper foil layer is removed by etching, the form of copper foil surface alligatoring particle remains on resin as replica.Described resin replica is less, and the alligatoring particle of copper foil surface is more small, and scattering during light transmission is also less, so visibility is excellent.According to such viewpoint, surface treatment copper foil of the present invention is by copper foil surface is carried out to the surface treatment copper foil that roughening treatment is formed with alligatoring particle, and to take the alligatoring particle that particle diameter is less than 0.10 μ m be 0～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～10/μ m 2and alligatoring particles more than particle diameter 1.0 μ m is 0～0.1/μ m 2mode on roughening treatment surface, be formed with alligatoring particle.Surface treatment copper foil of the present invention, by having described structure, can make stripping strength uprise, can be bonding well with resin, and it is good by etching, to remove the light transmission of the resin after Copper Foil.Its result, the location during IC chip carrying being undertaken by the location pattern through this resin identification etc. becomes easy.
About the individual number density of described alligatoring particle, preferably, the alligatoring particle that particle diameter is less than 0.10 μ m is 10～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～10/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～5/μ m 2and there is no alligatoring particles more than particle diameter 1.0 μ m.In addition more preferably, to be less than the alligatoring particle of 0.10 μ m be 15～42/μ m to particle diameter 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～2/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～2/μ m 2and there is no alligatoring particles more than particle diameter 1.0 μ m.
In addition, also can take the alligatoring particle that particle diameter is less than 0.10 μ m is 0～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 10～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～2/μ m 2and do not have the mode of alligatoring particles more than particle diameter 1.0 μ m to form alligatoring particle on roughening treatment surface.In addition, also can take the alligatoring particle that particle diameter is less than 0.10 μ m is 0～30/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 3～7/μ m 2and do not have the mode of alligatoring particles more than particle diameter 1.0 μ m to form alligatoring particle on roughening treatment surface.In addition, also can take the alligatoring particle that particle diameter is less than 0.10 μ m is 15～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～3/μ m 2, do not have particle diameter 0.30 μ m above and be less than the alligatoring particle of 1.0 μ m and do not have the mode of alligatoring particles more than particle diameter 1.0 μ m to form alligatoring particle on roughening treatment surface.
[light transmission rate]
Surface treatment copper foil of the present invention is owing to having controlled as described the mean roughness Rz on roughening treatment surface, so after being fitted on resin substrate, the light transmission rate of having removed Copper Foil resin substrate is partly good.Specifically, surface treatment copper foil of the present invention is fitted in the two sides of resin substrate that thickness is 50 μ m from roughening treatment face side after, when having removed this Copper Foil by etching, the light transmission rate of resin substrate is more than 30%, preferably more than 50%.
[surface-area of particle]
The ratio A/B of the surface-area A of alligatoring particle and the area B obtaining when copper foil surface side is overlooked alligatoring particle, has a significant impact the light transmission rate of described resin.That is, the described less Copper Foil of ratio A/B, the light transmission rate of described resin is better.Therefore, this of surface treatment copper foil of the present invention be than A/B preferably 2.00～2.45, and more preferably 2.00～2.30, further preferably 2.00～2.15.
Current density and plating time while forming by controlling particle, can determine the form of particle and form density, and control the individual number density of particle and the Area Ratio A/B of particle of described each particle diameter.
By surface treatment copper foil of the present invention is fitted in resin substrate from roughening treatment face side, can manufacture copper-clad laminate.Resin substrate is so long as have the resin substrate of the characteristic that can be applicable to printed-wiring board (PWB) etc., just there is no particular limitation, such as the resin substrate of using for rigidity PWB, can use paper base material phenol resins, paper base material epoxy resin, synthon cloth base material epoxy resin, woven fiber glass and the non-woven fabric compounded base material epoxy resin of paper composite base material epoxy resin, woven fiber glass and glass and woven fiber glass base material epoxy resin etc., the resin substrate of using for FPC can be used polyester film, polyimide film etc.
In the situation that rigidity PWB uses, the method of laminating is carried out as follows: prepare resin impregnated in the base materials such as woven fiber glass and make resin solidification arrive the prepreg of semi-cured state, Copper Foil is overlapped prepreg from the face of tectum opposition side, heat and pressurize.
Copper-clad laminate of the present invention can be for various printed-wiring board (PWB)s (PWB), have no particular limits, for example, from the viewpoint of the conductive pattern number of plies, go for one side PWB, two sides PWB, multilayer PWB (more than 3 layers), from the viewpoint of insulated substrate material category, go for rigidity PWB, flexible PWB (FPC), the compound PWB of soft or hard.
Embodiment
As embodiment 1～13 and comparative example 1～5, prepare Copper Foil, as roughening treatment, the condition of being recorded with table 1～4 on a surface has been carried out plating processing.At this, the Copper Foil of embodiment 1～8, comparative example 2,3,5 has been used the rolled copper foil of the red copper (JISH3100 C1100R) of JX Nippon Mining & Metals Co., Ltd.'s manufacture.In addition, as the Copper Foil of embodiment 9～13 and comparative example 1,4, the electrolytic copper foil HLPLC that has used JX Nippon Mining & Metals Co., Ltd. to manufacture.
Table 2
? Current density (A/dm 2) Plating time (second) Coulomb amount (As/dm 2)
Embodiment 2 45 1 45
Embodiment 3 50 1 50
Embodiment 4 34 3 102
Embodiment 6 34 3 102
Embodiment 10 39 3 117
Composition and the temperature of ※ plating solution (Cu-Co-Ni solution):
Cu：10g/L；Co：10g/L；Ni：10g/L；pH：3；40℃
Table 3
Composition and the temperature of ※ plating solution (copper-bath):
The 1st time: Cu:20g/L; H 2sO 4: 50g/L; 20 ℃
The 2nd time: Cu:30g/L; H 2sO 4: 100g/L; 55 ℃
Table 4
? Current density (A/dm 2) Plating time (second) Coulomb amount (As/dm 2)
Comparative example 4 52 10 520
Composition and the temperature of ※ plating solution (processing of Cu-Ni-P Alloy Plating):
Cu：20g/L；Ni：5g/L；P：1g/L；H 2SO 4：2g/L；pH：2.0；30℃
For each sample of the embodiment producing as described above and comparative example, various evaluations as described below have been carried out.
(1) mensuration of the individual number density of alligatoring particle
From 30,000 times of electron scanning micrographs (area 4.3 μ m * 3.1 μ m) of the alligatoring face of Copper Foil, every kind of grain size has been added up to particle number.In addition, in the situation that draw straight line on the particle of electron scanning micrograph, the straight length that the crosses particle particle length of long part, as the particle diameter of this particle.
(2) Area Ratio of particle (A/B)
The surface-area of alligatoring particle has been used laser microscope method of masurement.The laser microscope VK8500 that uses the キ of Co., Ltd. mono-ェ Application ス to manufacture, by measuring the area that is equivalent to 100 * 100 μ m of roughening treatment face, (real data is 9924.4 μ m 2) three-dimensional table area A and the method for establishing three-dimensional table area A ÷ bivariate table area B=Area Ratio (A/B) set.
(3) light transmission rate
Copper Foil is fitted on the two sides with the stacked polyimide film (thickness 50 μ m) with Thermocurable caking agent, with etching (ferric chloride in aqueous solution), removes Copper Foil and made sample film.The spectrophotometer V-660 that uses Japan Spectroscopy Corporation to manufacture, setting slit is that 10mm, wavelength are 620nm, has measured light transmission rate thus for the resin layer obtaining.
(4) visibility (resin transparent)
Copper Foil is fitted on the two sides with the stacked polyimide film (thickness 50 μ m) with Thermocurable caking agent, with etching (ferric chloride in aqueous solution), removes Copper Foil and made sample film.Printed matter is attached on a face of the resin layer obtaining, from contrary one side, crosses resin layer, judged the visibility of printed matter.Clear-cut being judged to be " zero " (qualified) of printed matter, profile is unclear is judged to be " * " (defective), evaluates thus.
(5) stripping strength (bonding strength)
Based on PC-TM-650, with tensile testing machine autoplotter 100, measured the stripping strength of normality and in the baking box of 150 ℃, placed the stripping strength of the normality after a week, the stripping strength of described normality is more than 0.7N/mm, can be for the purposes of copper-clad plate.
Condition and the evaluation of described each test are shown in table 5.
(evaluation result)
The light transmission rate of embodiment 1～13, visibility and stripping strength are all good.
Because alligatoring particles more than the particle diameter 1.0 μ m of comparative example 1,2 surpasses 0.1/μ m 2so the light transmission rate of comparative example 1,2 is bad.
Because the alligatoring particle that the particle diameter 0.30 μ m of comparative example 3 is above and be less than 1.0 μ m has surpassed 10/μ m 2so the light transmission rate of comparative example 3 is bad.
Because the alligatoring particle that the particle diameter 0.10 μ m of comparative example 4 is above and be less than 0.30 μ m has surpassed 25/μ m 2so the light transmission rate of comparative example 4 is bad.
The alligatoring particle that is less than 0.10 μ m due to the particle diameter of comparative example 5 has surpassed 42/μ m 2so the light transmission rate of comparative example 5 is bad.
Fig. 1 has represented respectively the observation photo of the printed matter when described visibility is evaluated, (a) of Fig. 1 is the photo of comparative example 1, (b) of Fig. 1 is the photo of embodiment 1, (c) of Fig. 1 is the photo of embodiment 2, (d) of Fig. 1 is the photo of embodiment 3, and (e) of Fig. 1 is the photo of embodiment 4.
Fig. 2 has represented that respectively the SEM when the individual number density of described alligatoring particle is evaluated observes photo, (a) of Fig. 2 is that the SEM of comparative example 1 observes photo, (b) of Fig. 2 is that the SEM of embodiment 1 observes photo, (c) of Fig. 2 is that the SEM of embodiment 2 observes photo, (d) of Fig. 2 is that the SEM of embodiment 10 observes photo, and (e) of Fig. 2 is that the SEM of embodiment 4 observes photo.

Claims (11)

1. a copper-clad plate surface treatment copper foil, it is formed with alligatoring particle by roughening treatment at copper foil surface, and described copper-clad plate is characterised in that with surface treatment copper foil,
The alligatoring particle that the particle diameter of take is less than 0.10 μ m is 0～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～10/μ m 2and alligatoring particles more than particle diameter 1.0 μ m is 0～0.1/μ m 2mode, on roughening treatment surface, be formed with alligatoring particle.
2. copper-clad plate surface treatment copper foil according to claim 1, is characterized in that, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 10～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～10/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～5/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
3. copper-clad plate surface treatment copper foil according to claim 2, is characterized in that, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 15～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～2/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～2/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
4. copper-clad plate surface treatment copper foil according to claim 1, is characterized in that, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 0～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 10～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 0～2/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
5. copper-clad plate surface treatment copper foil according to claim 1, is characterized in that, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 0～30/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～25/μ m 2, particle diameter 0.30 μ m is above and the alligatoring particle that is less than 1.0 μ m is 3～7/μ m 2and the mode that there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
6. copper-clad plate surface treatment copper foil according to claim 1, is characterized in that, the alligatoring particle that the particle diameter of take is less than 0.10 μ m is 15～42/μ m 2, particle diameter 0.10 μ m is above and the alligatoring particle that is less than 0.30 μ m is 0～3/μ m 2, there is no the mode that particle diameter 0.30 μ m is above and be less than the alligatoring particle of 1.0 μ m and there is no alligatoring particles more than particle diameter 1.0 μ m, on described roughening treatment surface, be formed with alligatoring particle.
7. according to the copper-clad plate surface treatment copper foil described in any one in claim 1～3, it is characterized in that, the surface-area A of described alligatoring particle and the ratio A/B of the area B obtaining when described copper foil surface side is overlooked described alligatoring particle are 2.00～2.45.
8. copper-clad plate surface treatment copper foil according to claim 4, is characterized in that, described A/B is 2.00～2.30.
9. copper-clad plate surface treatment copper foil according to claim 5, is characterized in that, described A/B is 2.00～2.15.
10. according to the copper-clad plate surface treatment copper foil described in any one in claim 1～6, it is characterized in that, described Copper Foil after roughening treatment face side is fitted in the two sides of resin substrate that thickness is 50 μ m, when having removed described Copper Foil with etching, the light transmission rate of described resin substrate is more than 30%.
11. 1 kinds of copper-clad plates, is characterized in that, described copper-clad plate is by the surface treatment copper foil described in any one in claim 1～7 with resin substrate is stacked forms.
CN201280067564.6A 2012-01-18 2012-03-05 Surface treatment copper foil and employ its copper-clad plate Active CN104053825B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867239A (en) * 2021-01-12 2021-05-28 深圳市鑫诺诚科技有限公司 Ultra-thick and low-resistance copper foil material

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI577256B (en) 2013-07-24 2017-04-01 Jx Nippon Mining & Metals Corp Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method
JP6273106B2 (en) * 2013-07-24 2018-01-31 Ｊｘ金属株式会社 Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board
JP5706026B1 (en) * 2013-07-30 2015-04-22 古河電気工業株式会社 Copper foil for wiring board and wiring board
JP6343204B2 (en) * 2013-08-20 2018-06-13 Ｊｘ金属株式会社 Surface-treated copper foil and copper foil with carrier using the same, laminated board, printed wiring board, electronic device, and method for producing printed wiring board
JP6343205B2 (en) * 2013-08-21 2018-06-13 Ｊｘ金属株式会社 Copper foil with carrier and laminate manufacturing method using the same, printed wiring board, electronic device, printed wiring board manufacturing method, and electronic device manufacturing method
JP6261037B2 (en) * 2014-02-06 2018-01-17 古河電気工業株式会社 Copper foil for high frequency circuit, copper clad laminate and printed wiring board
CN104359833A (en) * 2014-11-07 2015-02-18 广州兴森快捷电路科技有限公司 Test method for peel strength of copper-clad plate
KR20160093555A (en) * 2015-01-29 2016-08-08 제이엑스금속주식회사 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, laminate, printed circuit board, electronic device and method of manufacturing printed circuit board
JP6522974B2 (en) * 2015-02-07 2019-05-29 Ｊｘ金属株式会社 Copper foil with carrier, laminate, method of producing laminate, and method of producing printed wiring board
KR102504286B1 (en) * 2015-06-26 2023-02-24 에스케이넥실리스 주식회사 Surface treated copper foil and Method for producing the same
JP6550196B2 (en) * 2017-07-24 2019-07-24 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate and printed wiring board using the same
KR102647658B1 (en) * 2018-03-27 2024-03-15 미쓰이금속광업주식회사 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102224281A (en) * 2008-11-25 2011-10-19 吉坤日矿日石金属株式会社 Copper foil for printed circuit

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650794B2 (en) * 1989-05-02 1994-06-29 日鉱グールド・フォイル株式会社 Method of treating copper foil for printed circuits
JP2849059B2 (en) * 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 Processing method of copper foil for printed circuit
JP3295308B2 (en) * 1996-06-28 2002-06-24 株式会社日鉱マテリアルズ Electrolytic copper foil
CN1301046C (en) * 2002-05-13 2007-02-14 三井金属鉱业株式会社 Flexible printed wiring board for chip-on-film
JP2007051267A (en) * 2005-07-20 2007-03-01 Hitachi Chem Co Ltd Resin composition, prepreg using the same, flame-retardant laminate and printed wiring board
JP4712759B2 (en) * 2006-06-07 2011-06-29 古河電気工業株式会社 Surface-treated electrolytic copper foil, method for producing the same, and circuit board
JP5215631B2 (en) * 2007-10-24 2013-06-19 三井金属鉱業株式会社 Surface treated copper foil
JP5654581B2 (en) * 2010-05-07 2015-01-14 Jx日鉱日石金属株式会社 Copper foil for printed circuit, copper-clad laminate, printed circuit board, printed circuit and electronic equipment
CN102212250A (en) * 2011-04-15 2011-10-12 广东生益科技股份有限公司 Filler compound and copper clad laminate made of same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102224281A (en) * 2008-11-25 2011-10-19 吉坤日矿日石金属株式会社 Copper foil for printed circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867239A (en) * 2021-01-12 2021-05-28 深圳市鑫诺诚科技有限公司 Ultra-thick and low-resistance copper foil material

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