CN104359833A - Test method for peel strength of copper-clad plate - Google Patents
Test method for peel strength of copper-clad plate Download PDFInfo
- Publication number
- CN104359833A CN104359833A CN201410629217.9A CN201410629217A CN104359833A CN 104359833 A CN104359833 A CN 104359833A CN 201410629217 A CN201410629217 A CN 201410629217A CN 104359833 A CN104359833 A CN 104359833A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- peel strength
- testing
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses a test method for peel strength of a copper-clad plate. The test method comprises the following steps: (1) manufacturing a test sample; (2) determining a correction value; and (3) measuring results. According to the test method disclosed by the invention, the manufacturing is simple and convenient, the steps are extremely few, the operation is easy, time can be greatly saved and the production efficiency can be greatly improved. According to the test method disclosed by the invention, a film does not need to be manufactured, processes such as exposing, developing and etching are not needed, and the production cost is greatly saved.
Description
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of method of testing of copper-clad plate peel strength.
Background technology
In printed wiring board (PCB) factory, need to carry out peel strength of copper foil test verification to copper-clad plate supplied materials, after guaranteeing that copper-clad plate makes for PCB, ensure that the reliability of PCB meets the requirements.
Peel strength test to copper-clad plate supplied materials in current PCB industry, make according to the Making programme specified in IPC TM-650, the design of its process need film, copper-clad plate pad pasting, exposure, development, etch, move back the flow processs such as film, on copper-clad plate copper face, peel strength test line pattern is formed after these flow processs, although this method is reliable, flow process is complicated, consuming time longer, cost is larger.
And at present PCB factory every day to carry out doses very large, need to carry out a large amount of test jobs, carry out testing the demand being difficult to meet plant produced according to the regulation of IPC TM-650.
Summary of the invention
Based on this, the object of this invention is to provide a kind of method of testing of simple and quick copper-clad plate peel strength.
Concrete technical scheme is as follows:
A method of testing for copper-clad plate peel strength, comprises the steps:
(1) making of test sample
Copper-clad plate to be measured carried out cutting obtaining test board, described test board is provided with test zone, and described test zone symmetria bilateralis is provided with the dark milling region of control and crimp area;
Then dark milling operation is controlled to the dark milling region of control, namely mill out test zone at test board;
(2) modified value is determined
By pressing the qualified copper-clad plate of IPC TM-650 standard testing according to step (1) production standard test sample, then measuring peel strength, obtaining canonical measure result;
Described canonical measure result=TM-650 measurement result+modified value;
Described TM-650 measurement result is the peel strength value of this copper-clad plate by IPC TM-650 standard testing gained;
(3) result measures
The peel strength of the test sample that measuring process (1) makes, obtains measurement result;
Peel strength=described measurement knot-the modified value of described copper-clad plate to be measured.
Wherein in an embodiment, the parameter of described control dark milling operation is: the table copper thickness+Δ controlling the dark milling degree of depth=described copper-clad plate to be measured, the thickness of dielectric layers of wherein copper-clad plate to be measured described in Δ <.
Wherein in an embodiment, the milling cutter used in the dark milling operation of described control is of a size of 0.8-1.6mm.
Wherein in an embodiment, described test zone is of a size of: live width 3.18mm, line length >78mm.
Wherein in an embodiment, the width of described crimp area is 4-6mm.
Beneficial effect of the present invention is as follows:,
(1) the inventive method makes simple and convenient, and step is few, and processing ease, can save time in a large number, increases substantially the testing efficiency of copper-clad plate peel strength;
(2) the inventive method does not need to carry out the making film, does not need the operations such as exposure, development, etching, has greatly saved production cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of test sample.
Embodiment
Below by way of specific embodiment, the application is further elaborated.
The method of testing of a kind of copper-clad plate peel strength of the embodiment of the present invention, comprises the steps:
(1) making (as shown in Figure 1) of test sample
Copper-clad plate to be measured is carried out cutting obtaining test board, described test board is provided with test zone (by the regulation of IPC TM-650, test zone is of a size of: live width 3.18mm, line length 78mm), described test zone symmetria bilateralis is provided with the dark milling region of control and crimp area (width of crimp area is 5mm);
Then dark milling operation is controlled to the dark milling region of control, namely mill out test zone at test board;
Described control dark milling operating parameter is: control the dark milling degree of depth=described copper-clad plate table copper thickness+0.1mm (thickness of dielectric layers of this copper-clad plate to be measured of <) to be measured; Milling cutter is new milling cutter, is of a size of 1.2mm (size of milling cutter can be arbitrary dimension, can select a size and be fixed up to determine modified value).
(2) modified value is determined
By pressing the qualified copper-clad plate of IPC TM-650 standard testing according to step (1) production standard test sample, then measuring peel strength, obtaining canonical measure result;
Described canonical measure result=TM-650 measurement result+modified value;
Described TM-650 measurement result is the peel strength value of this copper-clad plate by IPC TM-650 standard testing gained;
(3) result measures
The peel strength of the test sample that measuring process (1) makes, obtains measurement result;
Peel strength=described measurement result-the modified value of described copper-clad plate to be measured.
The numerical value specified in the value of the peel strength of the copper-clad plate to be measured then obtained by said method and IPC TM-650 standard compares, and determines that whether this copper-clad plate to be measured is qualified.
The present invention, compared with conventional art, all has greatly improved in flow process, elapsed time, consuming cost, shown in table specific as follows:
Adopt method of testing of the present invention, can be circuit board plant every year and save considerable cost, time and testing expense, specific as follows:
Note: 1) supplied materials copper-clad plate in 2013 15000 batches, current supplied materials copper-clad plate 15000 batches in 2014, predict supplied materials 18000 batches altogether, supplied materials batch calculates according to par;
2) specification of dry film is according to 17.75 " x500ft/ rolls up calculating, can cut into 12 " X12 " and dry film 500;
3) employee's hourly pay per hour is according to 20 yuan/everyone calculating;
4) film often changes one with 500 times;
5) peel strength test of copper-clad plate needs 2 copper all to test, and every face copper calculates according to a measurement circuit.
The result shown from above 2:
(1) the inventive method makes simple and convenient, and step is few, and processing ease, can save time in a large number, increases substantially the testing efficiency of copper-clad plate peel strength;
(2) the inventive method does not need to carry out the making film, does not need the operations such as exposure, development, etching, has greatly saved production cost.
(3) the present invention can save cost (cost savings 64.56%) and the time (saving 75%) of writing.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (5)
1. a method of testing for copper-clad plate peel strength, is characterized in that, comprises the steps:
(1) making of test sample
Copper-clad plate to be measured carried out cutting obtaining test board, described test board is provided with test zone, and described test zone symmetria bilateralis is provided with the dark milling region of control and crimp area;
Then dark milling operation is controlled to the dark milling region of control, namely mill out test zone at test board;
(2) modified value is determined
By pressing the qualified copper-clad plate of IPC TM-650 standard testing according to step (1) production standard test sample, then measuring peel strength, obtaining canonical measure result;
Described canonical measure result=TM-650 measurement result+modified value;
Described TM-650 measurement result is the peel strength value of this copper-clad plate by IPC TM-650 standard testing gained;
(3) result measures
The peel strength of the test sample that measuring process (1) makes, obtains measurement result;
Peel strength=described measurement result-described the modified value of described copper-clad plate to be measured.
2. the method for testing of copper-clad plate peel strength according to claim 1, it is characterized in that, the parameter of described control dark milling operation is: the table copper thickness+Δ controlling the dark milling degree of depth=described copper-clad plate to be measured, the thickness of dielectric layers of wherein copper-clad plate to be measured described in Δ <.
3. the method for testing of copper-clad plate peel strength according to claim 2, is characterized in that, the milling cutter used in the dark milling operation of described control is of a size of 0.8-1.6mm.
4. the method for testing of the copper-clad plate peel strength according to any one of claim 1-3, is characterized in that, described test zone is of a size of: live width 3.18mm, line length >78mm.
5. the method for testing of the copper-clad plate peel strength according to any one of claim 1-3, is characterized in that, the width of described crimp area is 4-6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410629217.9A CN104359833A (en) | 2014-11-07 | 2014-11-07 | Test method for peel strength of copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410629217.9A CN104359833A (en) | 2014-11-07 | 2014-11-07 | Test method for peel strength of copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104359833A true CN104359833A (en) | 2015-02-18 |
Family
ID=52527116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410629217.9A Pending CN104359833A (en) | 2014-11-07 | 2014-11-07 | Test method for peel strength of copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104359833A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115290557A (en) * | 2022-09-28 | 2022-11-04 | 惠州市金百泽电路科技有限公司 | Peeling strength PCB test board, preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017131A (en) * | 2007-02-14 | 2007-08-15 | 广东生益科技股份有限公司 | Method for testing interlaminar adhesive force and making apparatus |
| JP2008187005A (en) * | 2007-01-30 | 2008-08-14 | Hitachi Chem Co Ltd | Manufacturing method of copper clad laminate with carrier foil |
| CN102539318A (en) * | 2011-12-21 | 2012-07-04 | 广东生益科技股份有限公司 | Assessment method of copper clad laminate mechanical properties |
| WO2013108415A1 (en) * | 2012-01-18 | 2013-07-25 | Jx日鉱日石金属株式会社 | Surface-treated copper foil for copper-clad laminate and copper-clad laminate using same |
| CN203881670U (en) * | 2014-05-27 | 2014-10-15 | 铜陵浩荣华科复合基板有限公司 | Copper clad plate peeling strength testing die |
-
2014
- 2014-11-07 CN CN201410629217.9A patent/CN104359833A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008187005A (en) * | 2007-01-30 | 2008-08-14 | Hitachi Chem Co Ltd | Manufacturing method of copper clad laminate with carrier foil |
| CN101017131A (en) * | 2007-02-14 | 2007-08-15 | 广东生益科技股份有限公司 | Method for testing interlaminar adhesive force and making apparatus |
| CN102539318A (en) * | 2011-12-21 | 2012-07-04 | 广东生益科技股份有限公司 | Assessment method of copper clad laminate mechanical properties |
| WO2013108415A1 (en) * | 2012-01-18 | 2013-07-25 | Jx日鉱日石金属株式会社 | Surface-treated copper foil for copper-clad laminate and copper-clad laminate using same |
| CN203881670U (en) * | 2014-05-27 | 2014-10-15 | 铜陵浩荣华科复合基板有限公司 | Copper clad plate peeling strength testing die |
Non-Patent Citations (1)
| Title |
|---|
| 无: "《IPC-TM-650-2.4.8C peel strength of metallic clad laminates》", 31 December 1994 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115290557A (en) * | 2022-09-28 | 2022-11-04 | 惠州市金百泽电路科技有限公司 | Peeling strength PCB test board, preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103619125B (en) | A kind of PCB electro-plating method for improving electroplating evenness | |
| CN110926403B (en) | Cathode roller roughness testing method | |
| CN107708307A (en) | Gong plate method based on automatic identification parameter | |
| CN101599433A (en) | Semiconductor etching method and etching system | |
| CN101650534A (en) | Method for measuring focal plane uniformity of exposure machine | |
| CN104359833A (en) | Test method for peel strength of copper-clad plate | |
| CN102074454B (en) | Monitoring method and system of etching process | |
| CN103619126B (en) | A kind of manufacture method of the outer-layer circuit of Metal Substrate thickness copper coin | |
| CN102915818B (en) | Resistance of thick-film resistor control method | |
| CN115790412B (en) | Film thickness test and uniformity adjustment method | |
| CN104374693A (en) | Testing method for peeling strength of copper-clad plate | |
| CN104625181A (en) | PCB milling device and PCB milling method | |
| CN106851986A (en) | A kind of method that printed circuit board (PCB) and its depth milling are dragged for | |
| CN104155855B (en) | Etch-rate tests the preparation method and recycling method of control wafer | |
| CN107148170B (en) | A kind of partially undesirable method of core material riveting in reduction PCB multilayer board | |
| CN115087230A (en) | Flexible die-cutting circuit board method | |
| CN105093815B (en) | The extracting method of device design size | |
| CN104470233A (en) | Printed wiring board containing gold at different thicknesses and manufacturing method thereof | |
| CN205333015U (en) | Online thickness measurement system of waterproofing membrane | |
| CN103400674A (en) | Manufacturing method for ultrathin alloy plate sensitive resistor | |
| CN114423168A (en) | Control method for etching line width of thick copper circuit board | |
| CN103337467B (en) | The method for measurement of the bottom metal layer removal amount of contact hole | |
| CN206300604U (en) | A kind of graphic plating test cell | |
| CN110996515B (en) | Depth-controlled milling design process method for PCB | |
| CN110856358A (en) | Method for forming COF circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150218 |