CN102539318A - Assessment method of copper clad laminate mechanical properties - Google Patents
Assessment method of copper clad laminate mechanical properties Download PDFInfo
- Publication number
- CN102539318A CN102539318A CN2011104341745A CN201110434174A CN102539318A CN 102539318 A CN102539318 A CN 102539318A CN 2011104341745 A CN2011104341745 A CN 2011104341745A CN 201110434174 A CN201110434174 A CN 201110434174A CN 102539318 A CN102539318 A CN 102539318A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- metal substrate
- tack coat
- testing sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention provides an assessment method of copper clad laminate mechanical properties, which comprises the following steps: step 1, providing a copper clad laminate to be tested; step 2, manufacturing a sample to be tested, that is, etching the copper foil of the copper clad laminate to be tested, cutting the copper clad laminate with etched copper foil into a sample to be tested with a predetermined dimension; step 3, bending to obtain a predetermined angle by allowing the sample to be tested to surround a cylinder with a predetermined diameter; step 4, observing the laminating condition of the sample to be tested after bending, wherein if no lamination occurs, the sample to be tested accords with testing requirements, if lamination occurs, the sample to be tested does not accord with the testing requirements. The assessment method of copper clad laminate mechanical properties of the invention can simply and rapidly assess whether the mechanical properties to be tested of the copper clad laminate accord with the testing requirements, can rapidly and intuitively characterize the mechanical properties to be tested of the copper clad laminate, such as bonding force and toughness, and improve the assessment method of copper clad laminate mechanical properties.
Description
Technical field
The present invention relates to a kind of appraisal procedure, relate in particular to a kind of copper-clad plate mechanical property appraisal procedure.
Background technology
Along with electronics and IT products are produced in a large number; And towards compact, multi-functional designer trends; Tellite as electronics spare part main support; Also along with improving constantly technological layer, high-density wiring, thin type, fine aperture, high-cooling property to be provided, the Metal Substrate copper-clad laminate of the high heat radiation of under this background, being born.The cohesiveness of Metal Substrate copper-clad plate is a leading indicator that influences its application, and it comprises the cohesive force of cohesive force, metal substrate and the tack coat of Copper Foil and tack coat.For Copper Foil and the assessment of cohesive force; Clear and definite method has been arranged in the prior art; As the peel strength of testing Copper Foil, but the method and be not suitable for assessing the cohesive force of metal substrate and tack coat does not still have good appraisal procedure at present for the cohesive force of metal substrate and tack coat.Simultaneously, the toughness of the insulation course of copper-clad plate is an important factor in order of PCB processability, does not also have good appraisal procedure at present for the toughness of the insulation course of copper-clad plate.
Summary of the invention
The object of the present invention is to provide a kind of copper-clad plate mechanical property appraisal procedure, but whether the mechanical property to be measured of simple and fast assessment copper-clad plate meets test request.
For realizing above-mentioned purpose, the present invention provides a kind of copper-clad plate mechanical property appraisal procedure, comprises the steps:
Step 4, the layering situation of observing bending back testing sample if layering do not occur, represent that then testing sample meets test request, if layering occurs, represent that then testing sample does not meet test request.
Said copper-clad plate comprises Metal Substrate copper-clad plate and non-metal base copper-clad plate.
Said non-metal base copper-clad plate is opened bonding sheet by 1-2 and is pressed into, and the glass cloth that bonding sheet adopts is one or both in 106,1080,2116, the 7628 model glass cloth.
Said copper-clad plate is the Metal Substrate copper-clad plate; According to the layering situation between bending back testing sample metal substrate and the adhesive linkage; The metal substrate of comparative evaluation Metal Substrate copper-clad plate and the cohesive force between the tack coat; And according to the layering situation of tack coat itself, the toughness of the tack coat of comparative evaluation Metal Substrate copper-clad plate.
During said bending, bend outwardly with the tack coat of testing sample.
Said copper-clad plate is the non-metal base copper-clad plate, according to the layering situation of bending back testing sample insulation course, the toughness of the insulation course of comparative evaluation non-metal base copper-clad plate.
During the testing sample bending, adopt the bending instrument that it is bent; Said bending instrument comprises that an end has the rotating shaft of said rounded body, and this rotating shaft is around its central shaft rotation, and testing sample bends on the rounded body outer peripheral face of this rotating shaft.
Said cylindrical radius is the 2-100 millimeter; For the Metal Substrate copper-clad plate; Come toughness excellent poor of excellent difference and tack coat of bonding force of metal substrate and the tack coat of the copper-clad plate of quantification area branch Metal Substrate through the right cylinder of changing different-diameter, so that the metal substrate of Metal Substrate copper-clad plate and the bonding force of tack coat and the toughness of tack coat are carried out grade distinguishing; For the non-metal base copper-clad plate, come quantitatively to distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate through the right cylinder of changing different-diameter, carry out grade distinguishing with toughness to the insulation course of non-metal base copper-clad plate.
Said bending angle is 30-180 °; For the Metal Substrate copper-clad plate; Through changing toughness excellent poor of excellent difference and tack coat of bonding force that bending angle comes metal substrate and the tack coat of the copper-clad plate of quantification area branch Metal Substrate, so that the metal substrate of Metal Substrate copper-clad plate and the bonding force of tack coat and the toughness of tack coat are carried out grade distinguishing; For the non-metal base copper-clad plate, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate through changing bending angle, carry out grade distinguishing with toughness to the insulation course of non-metal base copper-clad plate.
Said testing sample is of a size of wide 10-25 millimeter, long 100-250 millimeter.
The invention has the beneficial effects as follows: copper-clad plate mechanical property appraisal procedure of the present invention, but whether the mechanical property to be measured of simple and fast assessment copper-clad plate meets test request; For the Metal Substrate copper-clad plate, but simple and fast its metal substrate of assessment and the bonding force of tack coat and the toughness of tack coat, for the non-metal base copper-clad plate, but the toughness of its insulation course of simple and fast assessment; Copper-clad plate mechanical property appraisal procedure of the present invention, can quicklook ground characterize mechanical property to be measured such as the bonding force and the toughness of copper-clad plate, the perfect appraisal procedure of copper-clad plate mechanical property.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through embodiment invention, will make technical scheme of the present invention and other beneficial effect obvious.
In the accompanying drawing,
Fig. 1 is a copper-clad plate mechanical property appraisal procedure process flow diagram of the present invention;
Fig. 2 is the Metal Substrate structure for covering copper plate figure of the embodiment of the invention 1;
Fig. 3 etches away the structural drawing behind the Copper Foil for Metal Substrate copper-clad plate among Fig. 2;
Fig. 4 is for etching away the Metal Substrate copper-clad plate bending structure figure on the bending instrument behind the Copper Foil among Fig. 3;
Fig. 5 is the non-metal base structure for covering copper plate figure of the embodiment of the invention 2;
Fig. 6 etches away the structural drawing behind the Copper Foil for non-metal base copper-clad plate among Fig. 5.
Embodiment
As shown in Figure 1, be copper-clad plate mechanical property appraisal procedure process flow diagram of the present invention, this disposal route comprises the steps:
Step 4, the layering situation of observing bending back testing sample if layering do not occur, represent that then testing sample meets test request, if layering occurs, represent that then testing sample does not meet test request.
Said copper-clad plate comprises Metal Substrate copper-clad plate and non-metal base copper-clad plate.
Said non-metal base copper-clad plate is opened bonding sheet by 1-2 and is pressed into, and the glass cloth that bonding sheet adopts is one or both in 106,1080,2116, the 7628 model glass cloth.
Said copper-clad plate is the Metal Substrate copper-clad plate; According to the layering situation between bending back testing sample metal substrate and the adhesive linkage; The metal substrate of comparative evaluation Metal Substrate copper-clad plate and the cohesive force between the tack coat; And according to the layering situation of tack coat itself, the toughness of the tack coat of comparative evaluation Metal Substrate copper-clad plate.
During said bending, bend outwardly with the tack coat of testing sample.
Said copper-clad plate is the non-metal base copper-clad plate, according to the layering situation of bending back testing sample insulation course, the toughness of the insulation course of comparative evaluation non-metal base copper-clad plate.
During the testing sample bending, adopt the bending instrument that it is bent; Said bending instrument comprises that an end has the rotating shaft of said rounded body, and this rotating shaft is around its central shaft rotation, and testing sample bends on the rounded body outer peripheral face of this rotating shaft.
Said cylindrical radius can be chosen as the 2-100 millimeter, and when testing sample was tested, the right cylinder through changing different-diameter can come quantification area to divide the mechanical property of testing sample to repeatedly testing with a collection of testing sample.For the Metal Substrate copper-clad plate; Come toughness excellent poor of excellent difference and tack coat of bonding force of metal substrate and the tack coat of the copper-clad plate of quantification area branch Metal Substrate through the right cylinder of changing different-diameter, so that the metal substrate of Metal Substrate copper-clad plate and the bonding force of tack coat and the toughness of tack coat are carried out grade distinguishing; For the non-metal base copper-clad plate, come quantitatively to distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate through the right cylinder of changing different-diameter, carry out grade distinguishing with toughness to the insulation course of non-metal base copper-clad plate.
During test, said bending angle is preferably 30-180 °, for a collection of testing sample, takes multiple measurements through changing bending angle, can come quantification area to divide the mechanical property of testing sample.For the Metal Substrate copper-clad plate; Through changing toughness excellent poor of excellent difference and tack coat of bonding force that bending angle comes metal substrate and the tack coat of the copper-clad plate of quantification area branch Metal Substrate, so that the metal substrate of Metal Substrate copper-clad plate and the bonding force of tack coat and the toughness of tack coat are carried out grade distinguishing; For the non-metal base copper-clad plate, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate through changing bending angle, carry out grade distinguishing with toughness to the insulation course of non-metal base copper-clad plate.
Through specific embodiment of the present invention, specify content of the present invention below.
Metal Substrate copper-clad plate to be measured is provided; With reference to shown in Figure 2; It comprises metal substrate 10, Copper Foil 30 and be located at metal substrate 10 and Copper Foil 30 between tack coat 20, the Copper Foil 30 of Metal Substrate copper-clad plate is etched away, the Metal Substrate copper-clad plate behind the etching Copper Foil 30 is cut into the testing sample of 25 millimeters of width, 250 millimeters of length; The testing sample structure is as shown in Figure 3, comprise metal substrate 10 and on tack coat 20.
As shown in Figure 4; Testing sample is carried out the bending (30-180 °) of certain angle by different-diameter with its tack coat 20 on external bending instrument 100; The layering situation between testing sample metal substrate 10 and the adhesive linkage 20 is observed in the bending back; The metal substrate 10 of comparative evaluation Metal Substrate copper-clad plate and the cohesive force between the tack coat 10, and according to the layering situation of tack coat 20 itself, the toughness of the tack coat 20 of comparative evaluation Metal Substrate copper-clad plate.
Non-metal base copper-clad plate to be measured is provided; With reference to shown in Figure 5; It comprises Copper Foil 40 and is located at the insulation course 50 of 40 of Copper Foils, and the non-metal base copper-clad plate behind the etching Copper Foil is cut into the testing sample of 25 millimeters of width, 250 millimeters of length, and the testing sample structure is as shown in Figure 6; Comprise insulation course 50, this insulation course 50 is the insulation course of non-metal base copper-clad plate.
By method shown in Figure 4, testing sample is carried out the bending (30-180 °) of certain angle by different-diameter on bending instrument 100, the layering situation that insulation course 50 is observed in the bending back is with the toughness of assessment non-metal base copper-clad plate insulation course 50.
In sum, copper-clad plate mechanical property appraisal procedure of the present invention, but whether the mechanical property to be measured of simple and fast assessment copper-clad plate meets test request; For the Metal Substrate copper-clad plate, but simple and fast its metal substrate of assessment and the bonding force of tack coat and the toughness of tack coat, for the non-metal base copper-clad plate, but the toughness of its insulation course of simple and fast assessment; Copper-clad plate mechanical property appraisal procedure of the present invention, can quicklook ground characterize mechanical property to be measured such as the bonding force and the toughness of copper-clad plate, the perfect appraisal procedure of copper-clad plate mechanical property.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of accompanying Claim of the present invention.
Claims (10)
1. a copper-clad plate mechanical property appraisal procedure is characterized in that, comprises the steps:
Step 1, copper-clad plate to be measured is provided;
Step 2, making testing sample: the Copper Foil of copper-clad plate to be measured is etched away, the copper-clad plate that etches away Copper Foil is cut into the testing sample of preliminary dimension size;
Step 3, testing sample is carried out the bending of predetermined angular around the right cylinder of predetermined diameter size;
Step 4, the layering situation of observing bending back testing sample if layering do not occur, represent that then testing sample meets test request, if layering occurs, represent that then testing sample does not meet test request.
2. copper-clad plate mechanical property appraisal procedure as claimed in claim 1 is characterized in that said copper-clad plate comprises Metal Substrate copper-clad plate and non-metal base copper-clad plate.
3. copper-clad plate mechanical property appraisal procedure as claimed in claim 2 is characterized in that, said non-metal base copper-clad plate is opened bonding sheet by 1-2 and is pressed into, and the glass cloth that bonding sheet adopts is one or both in 106,1080,2116, the 7628 model glass cloth.
4. copper-clad plate mechanical property appraisal procedure as claimed in claim 1; It is characterized in that; Said copper-clad plate is the Metal Substrate copper-clad plate, according to the layering situation between bending back testing sample metal substrate and the adhesive linkage, the metal substrate of comparative evaluation Metal Substrate copper-clad plate and the cohesive force between the tack coat; And according to the layering situation of tack coat itself, the toughness of the tack coat of comparative evaluation Metal Substrate copper-clad plate.
5. copper-clad plate mechanical property appraisal procedure as claimed in claim 4 is characterized in that, during said bending, bends outwardly with the tack coat of testing sample.
6. copper-clad plate mechanical property appraisal procedure as claimed in claim 1 is characterized in that said copper-clad plate is the non-metal base copper-clad plate, according to the layering situation of bending back testing sample insulation course, the toughness of the insulation course of comparative evaluation non-metal base copper-clad plate.
7. copper-clad plate mechanical property appraisal procedure as claimed in claim 1 is characterized in that, during the testing sample bending, adopts the bending instrument that it is bent; Said bending instrument comprises that an end has the rotating shaft of said rounded body, and this rotating shaft is around its central shaft rotation, and testing sample bends on the rounded body outer peripheral face of this rotating shaft.
8. like claim 4 or 6 described copper-clad plate mechanical property appraisal procedures; It is characterized in that; Said cylindrical radius is the 2-100 millimeter; For the Metal Substrate copper-clad plate, come toughness excellent poor of excellent difference and tack coat of bonding force of metal substrate and the tack coat of the copper-clad plate of quantification area branch Metal Substrate through the right cylinder of changing different-diameter, so that the metal substrate of Metal Substrate copper-clad plate and the bonding force of tack coat and the toughness of tack coat are carried out grade distinguishing; For the non-metal base copper-clad plate, come quantitatively to distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate through the right cylinder of changing different-diameter, carry out grade distinguishing with toughness to the insulation course of non-metal base copper-clad plate.
9. like claim 4 or 6 described copper-clad plate mechanical property appraisal procedures; It is characterized in that; Said bending angle is 30-180 °; For the Metal Substrate copper-clad plate, through changing toughness excellent poor of excellent difference and tack coat of bonding force that bending angle comes metal substrate and the tack coat of the copper-clad plate of quantification area branch Metal Substrate, so that the metal substrate of Metal Substrate copper-clad plate and the bonding force of tack coat and the toughness of tack coat are carried out grade distinguishing; For the non-metal base copper-clad plate, quantitatively distinguish toughness excellent poor of the insulation course of non-metal base copper-clad plate through changing bending angle, carry out grade distinguishing with toughness to the insulation course of non-metal base copper-clad plate.
10. copper-clad plate mechanical property appraisal procedure as claimed in claim 1 is characterized in that, said testing sample is of a size of wide 10-25 millimeter, long 100-250 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110434174.5A CN102539318B (en) | 2011-12-21 | 2011-12-21 | Assessment method of copper clad laminate mechanical properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110434174.5A CN102539318B (en) | 2011-12-21 | 2011-12-21 | Assessment method of copper clad laminate mechanical properties |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102539318A true CN102539318A (en) | 2012-07-04 |
| CN102539318B CN102539318B (en) | 2014-02-19 |
Family
ID=46346751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110434174.5A Active CN102539318B (en) | 2011-12-21 | 2011-12-21 | Assessment method of copper clad laminate mechanical properties |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102539318B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104359833A (en) * | 2014-11-07 | 2015-02-18 | 广州兴森快捷电路科技有限公司 | Test method for peel strength of copper-clad plate |
| CN104931350A (en) * | 2015-06-11 | 2015-09-23 | 中国科学院山西煤炭化学研究所 | Method for quantitatively testing flexibility of flexible graphene membrane |
| CN105445118A (en) * | 2015-12-22 | 2016-03-30 | 广东生益科技股份有限公司 | Mechanical property evaluation method of metal-based copper foil-coated laminated board |
| CN106908384A (en) * | 2017-02-27 | 2017-06-30 | 信利半导体有限公司 | A kind of method of testing of composite membrane layering |
| CN106982507A (en) * | 2016-01-15 | 2017-07-25 | Ｊｘ金属株式会社 | The manufacture method of copper foil, copper clad laminate and printing distributing board and e-machine and transmission line and antenna |
| CN107764736A (en) * | 2017-10-18 | 2018-03-06 | 广东生益科技股份有限公司 | Multiple-plate roughening effect evaluation method |
| CN108982239A (en) * | 2018-05-24 | 2018-12-11 | 中国兵器科学研究院宁波分院 | Organic coating flexility quantitative testing device |
| CN114646723A (en) * | 2020-12-21 | 2022-06-21 | 广东生益科技股份有限公司 | Laminated board internal structure and performance integrity analysis method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU953535A1 (en) * | 1981-01-14 | 1982-08-23 | Татарский Научно-Исследовательский Институт Нефтяного Машиностроения | Polymeric compound adhesion strength determination method |
| JP2000292343A (en) * | 1999-04-07 | 2000-10-20 | Yokohama Rubber Co Ltd:The | Jig, method, and device for measuring flexibility of adhesive layer |
| CN101017131A (en) * | 2007-02-14 | 2007-08-15 | 广东生益科技股份有限公司 | Method for testing interlaminar adhesive force and making apparatus |
| CN101206173A (en) * | 2006-12-22 | 2008-06-25 | 上海比亚迪有限公司 | Method for measuring coating adhesive strength on a coating body using flexible material as substrate |
| CN102147354A (en) * | 2010-02-10 | 2011-08-10 | 中国科学院金属研究所 | Device for evaluating coating binding force |
-
2011
- 2011-12-21 CN CN201110434174.5A patent/CN102539318B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU953535A1 (en) * | 1981-01-14 | 1982-08-23 | Татарский Научно-Исследовательский Институт Нефтяного Машиностроения | Polymeric compound adhesion strength determination method |
| JP2000292343A (en) * | 1999-04-07 | 2000-10-20 | Yokohama Rubber Co Ltd:The | Jig, method, and device for measuring flexibility of adhesive layer |
| CN101206173A (en) * | 2006-12-22 | 2008-06-25 | 上海比亚迪有限公司 | Method for measuring coating adhesive strength on a coating body using flexible material as substrate |
| CN101017131A (en) * | 2007-02-14 | 2007-08-15 | 广东生益科技股份有限公司 | Method for testing interlaminar adhesive force and making apparatus |
| CN102147354A (en) * | 2010-02-10 | 2011-08-10 | 中国科学院金属研究所 | Device for evaluating coating binding force |
Non-Patent Citations (1)
| Title |
|---|
| 汪传林等: "刚挠结合板用挠性材料和粘结材料性能研究", 《印制电路信息》, no. 8, 31 December 2009 (2009-12-31), pages 20 - 26 * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104359833A (en) * | 2014-11-07 | 2015-02-18 | 广州兴森快捷电路科技有限公司 | Test method for peel strength of copper-clad plate |
| CN104931350A (en) * | 2015-06-11 | 2015-09-23 | 中国科学院山西煤炭化学研究所 | Method for quantitatively testing flexibility of flexible graphene membrane |
| CN105445118A (en) * | 2015-12-22 | 2016-03-30 | 广东生益科技股份有限公司 | Mechanical property evaluation method of metal-based copper foil-coated laminated board |
| WO2017107585A1 (en) * | 2015-12-22 | 2017-06-29 | 广东生益科技股份有限公司 | Method for evaluating mechanical property of metal-based copper foil-coated laminated board |
| CN105445118B (en) * | 2015-12-22 | 2019-07-26 | 广东生益科技股份有限公司 | A kind of metal base copper-clad laminate mechanical property appraisal procedure |
| CN106982507A (en) * | 2016-01-15 | 2017-07-25 | Ｊｘ金属株式会社 | The manufacture method of copper foil, copper clad laminate and printing distributing board and e-machine and transmission line and antenna |
| CN106982507B (en) * | 2016-01-15 | 2021-06-25 | Ｊｘ金属株式会社 | Copper foil, copper-clad laminate, printed wiring board, electronic device, and method for manufacturing transmission line and antenna |
| CN106908384A (en) * | 2017-02-27 | 2017-06-30 | 信利半导体有限公司 | A kind of method of testing of composite membrane layering |
| CN107764736A (en) * | 2017-10-18 | 2018-03-06 | 广东生益科技股份有限公司 | Multiple-plate roughening effect evaluation method |
| CN108982239A (en) * | 2018-05-24 | 2018-12-11 | 中国兵器科学研究院宁波分院 | Organic coating flexility quantitative testing device |
| CN114646723A (en) * | 2020-12-21 | 2022-06-21 | 广东生益科技股份有限公司 | Laminated board internal structure and performance integrity analysis method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102539318B (en) | 2014-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102539318B (en) | Assessment method of copper clad laminate mechanical properties | |
| Sim et al. | Improving the stretchability of as-deposited Ag coatings on poly-ethylene-terephthalate substrates through use of an acrylic primer | |
| EP2290511A3 (en) | Touch panel and a method of locating a touch point of the same | |
| CN104677819B (en) | A kind of method of evaluation Cu systems metal nano multi-layer film material adhesion property | |
| CN105445118A (en) | Mechanical property evaluation method of metal-based copper foil-coated laminated board | |
| CN103096642A (en) | Manufacture method of flexible circuit board | |
| CN101998777A (en) | Method for producing conduction between layers of metal aluminum based printed wiring board | |
| CN101236189B (en) | Device and method for measuring metal film stress evolution when loading current | |
| KR101512572B1 (en) | Surface-roughened copper foil and copper-clad laminated substrate | |
| Zymelka et al. | Printed strain sensors for early damage detection in engineering structures | |
| CN209400457U (en) | A kind of monitoring device of fragile material crack initiation time | |
| CN219266410U (en) | Measuring plate for measuring grounding performance of electromagnetic shielding film | |
| CN209043174U (en) | A kind of lighium polymer cell polar ear spacing and back gauge detection device | |
| Hu et al. | Assessment of tensile damage mechanism of open‐hole GLARE laminates based on acoustic emission and digital image correlation techniques | |
| CN103364674B (en) | The decision method that conductive anodic filament lost efficacy | |
| CN204165885U (en) | A kind of pcb board tensile test assists apparatus for leveling | |
| CN111959095B (en) | Online health monitoring method for fiber reinforced metal laminated plate material | |
| CN102519872B (en) | Bending instrument | |
| Kim et al. | Non-destructive analysis of power insulators by frequency response function and three dimensional-computed tomography | |
| CN103547132A (en) | Electromagnetic interference shielding structure and flexible printed circuit board with same | |
| CN113984253A (en) | Preparation method of resistance strain gate sensor | |
| CN1203302C (en) | Method and apparatus for detecting electrical steel surface coating | |
| CN202679900U (en) | Structure for shielding electromagnetic interference and flexible printed circuit board provided with same | |
| CN201589844U (en) | Plate electrode for testing insulating property of insulating blanket | |
| CN102087325B (en) | Detection method for flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |