CN104038680A - 摄像机组件 - Google Patents
摄像机组件 Download PDFInfo
- Publication number
- CN104038680A CN104038680A CN201310726117.3A CN201310726117A CN104038680A CN 104038680 A CN104038680 A CN 104038680A CN 201310726117 A CN201310726117 A CN 201310726117A CN 104038680 A CN104038680 A CN 104038680A
- Authority
- CN
- China
- Prior art keywords
- substrate
- recess
- imaging apparatus
- parts built
- camera assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Wire Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本发明提供一种能够满足薄型化要求的摄像机组件。该摄像机组件在部件内置基板(10)的表面(上表面)设置有具有大于摄像元件(15)的厚度的深度的凹部(CP),摄像元件(15)以其表面(上表面)与部件内置基板(10)的表面(上表面)之间存在间隙(GA)的方式安装于凹部(CP)的底面(CPa),并且摄像元件(15)的连接焊盘(15b)通过在空隙(GA)中经过的键合丝(BW)与设置于部件内置基板(10)的表面(上表面)的导体焊盘(12d)连接。
Description
技术领域
本发明涉及使用部件内置基板的摄像机组件。
背景技术
作为手机、智能手机等移动设备中使用的摄像机组件,下述专利文献1的图16中公开了利用部件内置基板(埋设有电子部件的多层基板)代替配线基板的摄像机组件。
然而,这种摄像机组件必须在摄像元件的受光部与透镜之间确保与最小焦距相应的间隔。因此,如下述专利文献1的图16所示,在部件内置基板的表面(上表面)安装有摄像元件的结构中,摄像机组件的高度设得较低是困难的,即实现薄型化是困难的。
伴随着手机和智能手机等移动设备的薄型化,这种摄像机组件也强烈要求进行薄型化,考虑这种现状,必须要研发满足这种要求的摄像机组件。
现有技术文献
专利文献
专利文献1:日本特开2011-035458号公报
发明内容
发明想要解决的技术问题
本发明的目的在于提供一种能够满足薄型化的要求的摄像机组件。
用于解决问题的技术方案
为了实现上述目的,本发明提供一种摄像机组件,包括:埋设有电子部件的部件内置基板;安装于上述部件内置基板的摄像元件;和设置成位于上述摄像元件上方的透镜,在该摄像机组件中,在上述部件内置基板的表面设置有凹部,该凹部具有比上述摄像元件的厚度大的深度,上述摄像元件以使该摄像元件的表面与上述部件内置基板的表面之间存在间隙的方式被安装于上述凹部的底面,并且该摄像元件的连接焊盘通过在上述空隙中经过的键合丝与设置于上述部件内置基板的表面的导体焊盘连接。
发明效果
根据本发明,能够提供一种能够满足薄型化要求的摄像机组件。
本发明的上述目的和其他目的以及与各目的对应的特征和效果由以下说明和附图显而易见。
附图说明
图1(A)是应用本发明的摄像机组件的纵截面图,图1(B)是图1(A)的主要部分放大图。
图2(A)~图2(C)是表示图1(A)所示的凹部的变形例的部件内置基板的纵截面图。
具体实施方式
首先,对图1(A)所示的摄像机组件的结构进行说明。该摄像机组件具备用于发挥摄像机功能的各种器件和电路,该摄像机组件包括部件内置基板10和安装于此的光学封装体20,整体形成大致长方体形状。作为参考,对图1(A)所示的摄像机组件的尺寸例进行描述,其长度和宽度(图1(A)的左右方向尺寸)大致为8.5mm,高度(图1(A)的上下方向尺寸)大致为5mm。
部件内置基板10包括:由导电性材料构成并兼用作接地配线的芯层11、设置在芯层11的厚度方向一面(上表面)的第一绝缘层12、和设置在芯层11的厚度方向另一面(下表面)的第二绝缘层13。
在芯层11,设置有部件收纳用的贯通孔11a、构成后述凹部CP的一部分的贯通孔11b和导体通孔配置用的贯通孔11c。在部件收纳用的贯通孔11a,适当地收纳有例如电容器、电感器、寄存器、滤波芯片、IC芯片等的电子部件14,在所收纳的电子部件14与贯通孔11a之间的间隙,填充有绝缘材料11b。亦即,各电子部件14埋设于芯层11、即埋设于部件内置基板10中。
在第一绝缘层12的内部,设置有二维图案化的信号配线12a和接地配线12b。另外,在第二绝缘层13的内部,设置有二维图案化的信号配线13a和接地配线13b,并且设置有截面呈T字状的导体通孔13c。另外,在第一绝缘层12和第二绝缘层13的内部,设置有从第一绝缘层12通过芯层11的贯通孔11c到达第二绝缘层13的筒状的导体通孔12c。另外,在第一绝缘层12的表面(上表面)和第二绝缘层13的表面(下表面),分别设置有截面呈T字状的导体焊盘12d和导体焊盘13d。
参照图1(A)做补充说明,则左起第一个和第二个导体焊盘13d分别经由导体通孔13c与左侧的电子部件14的端子连接,右起第一个和第二个导体焊盘13d分别经由导体通孔13c与右侧的电子部件14的端子连接。另外,左起第三个导体焊盘13d经由导体通孔12c与左侧的导体焊盘12d连接。另外,左起第四个导体焊盘13d与信号配线13a连接,右起第三个导体焊盘13d与接地配线13b连接,接地配线13b的通孔部分(无附图标记)与芯层11a连接。另外,右侧的导体焊盘12d与信号配线12a连接,接地配线12b的通孔部分(无附图标记)与芯层11a连接。
另外,在第一绝缘层12,与芯层11的贯通孔11b的正上方对应的位置,设置有构成后述凹部CP的另一部分的贯通孔12e。该贯通孔12e的横截面积大于芯层11的贯通孔11b的横截面积,贯通孔12e的中心线与贯通孔11b的中心线大致一致。亦即,在部件内置基板10的表面(上表面),设置有由第一绝缘层12的贯通孔12e和芯层11的贯通孔11b构成的凹部CP。该凹部CP的深度大于后述摄像元件15的厚度,开口CPb(指部件内置基板10的表面的开口)的面积大于凹部CP的底面CPa的面积,凹部CP的内壁(无附图标记)呈台阶状的截面形状。
在上述凹部CP的底面CPa,利用粘接剂安装有CMOS图像传感器、CCD图像传感器等摄像元件15。该摄像元件15在表面(上表面)的中央具有受光部15a,在其周围具有多个连接焊盘15b。如前文所述,凹部CP的深度大于摄像元件15的厚度,因此安装于凹部CP的底面CPa的摄像元件的表面(上表面)与部件内置基板10的表面(上表面)之间存在空隙GA。另外,摄像元件15的连接焊盘15b通过经由位于摄像元件15的表面(上表面)与部件内置基板10的表面(上表面)之间的空隙GA的键合丝BW,与设置于部件内置基板10的表面(上表面)的导体焊盘12d连接。
参照图1(A)做补充说明,当摄像元件15的轮廓为大致矩形时,凹部CP的底面CPa的轮廓(贯通孔11b的横截面形状)和开口CPa的轮廓(贯通孔12e的横截面形状)呈与摄像元件15的轮廓相似的大致矩形。另外,当与摄像元件15的轮廓相比,凹部CP的底面CPa的轮廓(贯通孔11b的横截面形状)形成为过大时,摄像机组件的长度和宽度(图1(A)的左右方向尺寸)无益地增加,因此底面CPa的轮廓(贯通孔11b的横截面形状)采用容许摄像元件15的插入的最小轮廓。
另外,参照图1(B)做补充说明,优选键合丝BW配设为,当从凹部CP的底面CPa的外周缘CPa1起描绘与该底面CPa呈直角的线L1时,该键合丝BW在比该线L1与凹部CP的开口CPb的交点IP更靠下侧通过。根据这种配设方式,在开口CPb的面积大于底面CPa的面积的凹部CP中,使在上述空隙GA经过的键合丝BW的线长尽可能短,在此基础上还能将摄像元件15的连接焊盘15b与部件内置基板10的导体焊盘12d连接。
此外,部件内置基板10的芯层11由铜或铜合金等导电性材料构成,其厚度例如在100~400μm范围内。另外,绝缘材料11b、第一绝缘层12和第二绝缘层13,由环氧树脂、聚酰亚胺、双马来酰亚胺三嗪树脂、或其中加入由二氧化硅等构成的增强填料的树脂等的合成树脂(不仅能使用热固化性树脂,还能使用热可塑性树脂)构成,第一绝缘层12和第二绝缘层13的厚度例如在30~90μm的范围内。另外,信号配线12a和13a、接地配线12b和13b、导体通孔12c和13c以及导体焊盘12d和13d由铜或铜合金等导电性材料构成,信号配线12a和13a以及接地配线12b和13b的厚度例如在5~25μm的范围内。
另一方面,光学封装体20具备:透镜单元21、配置在透镜单元21周围的自动聚焦用促动器22、配置在透镜单元21的下侧的滤光单元23、和包含透镜单元21、促动器22和滤光单元23的外壳24。
透镜单元21具有多个(图中为2个)透镜21a和包围透镜21a的周围的筒状保持器21b。自动聚焦用促动器22例如包括可动线圈和固定永磁铁,其基于输入到可动线圈的驱动信号,使透镜单元21在上下方向上移动进行对焦。滤光单元23包括IR截止滤光片(IR cut filter)等光学滤光片23a和包围光学滤光片23a的周围的环状保持器23b。外壳24的外观呈大致长方体形状,覆盖配置在其内侧的透镜单元21、促动器22和滤光单元23。该外壳24通过嵌合、粘接等结合方法被安装于部件内置基板10,使得透镜21a和光学滤光片23a位于部件内置基板10的摄像元件15的正上方,该外壳24经由省略图示的端子与构建于部件内置基板10的电路电连接。
接着,对由图1(A)所示的摄像机组件得到的效果进行说明。该摄像机组件具有如下结构:在部件内置基板10的表面(上表面)设置有具有大于摄像元件15的厚度的深度的凹部CP,摄像元件15以其表面(上表面)与部件内置基板10的表面(上表面)之间存在间隙GA的方式安装于凹部CP的底面CPa,并且摄像元件15的连接焊盘15b通过在空隙GA经过的键合丝BW与设置于部件内置基板10的表面(上表面)的导体焊盘12d连接。
即,因为摄像元件15安装在凹部CP的底面CPa,因此即使在摄像元件15的受光部15a与透镜21a之间必须要确保与最小焦距相应的间隔CL(参照图1)的情况下,也能够使透镜21a接近部件内置基板10的表面(上表面)而配置,由此能够减少摄像机组件的高度而满足薄型化的要求。而且,键合丝BW的绝大部分收纳于上述空隙GA中,从而能够尽量减少从部件内置基板10的表面(上表面)向上方伸出的部分的高度,因此能够消除例如因该上方伸出部分的高度的影响而不能使透镜21a接近部件内置基板10的表面(上表面)配置之类的不良状况,通过减少摄像机组件的高度(薄型化)能够进一步做出贡献。
另外,上述凹部CP中,开口CPb的面积大于安装有摄像元件15的底面CPa的面积,因此,能够尽可能缩短摄像元件15的连接焊盘15b与部件内置基板10的导体焊盘12d的连接所需的键合丝BW的线长,并且通过缩短线长,也能对减少成本做出贡献。
另外,上述凹部CP由设置于部件内置基板10的芯层11的贯通孔11b和设置于第一绝缘层12的贯通孔12e构成,因此能够通过在芯层11的制作阶段形成贯通孔11b,在第一绝缘层12的制作阶段形成贯通孔12e,由此能够容易地使开口CPb的面积大于底面CPa的面积的凹部CP在部件内置基板10形成。
接着,对图1(A)所示的凹部CP的变形例进行说明。图2(A)表示第一变形例,该图所示的凹部CP-1与图1(A)所示的凹部CP不同之处在于,在芯层11的贯通孔11b的上部形成有与第一绝缘层12的贯通孔12e的横截面形状相同的部分,从而增加具有与贯通孔12e相同的横截面积的部分的深度。凹部CP-1的内壁与凹部CP同样,呈台阶状的截面形状。在用该凹部CP-1替代图1(A)所示的凹部CP的情况下也能够发挥上述同样的效果。
图2(B)表示第二变形例,该图所示的凹部CP-2与图1(A)所示的凹部CP不同之处在于,通过将第一绝缘层12的贯通孔12e形成为横截面积随着朝向芯层11去逐渐减小的形状,由此将凹部CP-2的内壁形成为在其开口CPb侧具有与部件内置基板10的表面(上表面)呈锐角的倾斜状的部分的截面形状。在用该凹部CP-2替代图1(A)所示的凹部CP的情况下也能够发挥上述同样的效果。
图2(C)表示第三变形例,该图所示的凹部CP-3与图1(A)所示的凹部CP不同之处在于,通过将第一绝缘层12的贯通孔12e形成为横截面积随着朝向芯层11去而逐渐减小的形状,并且将芯层11的贯通孔11b形成为横截面积随着朝向第二绝缘层13去而逐渐减小的形状,由此将凹部CP-3的内壁形成为在其整体具有与部件内置基板10的表面(上表面)呈锐角的倾斜状的部分的截面形状。在用该凹部CP-3替代图1(A)所示的凹部CP的情况下也能够发挥上述同样的效果。
另外,图1(A)和图2(A)~图2(C)中表示了部件内置基板10的芯层11由导电性材料构成的结构,但是芯层11例如为由合成树脂、陶瓷等非导电性材料构成的部件内置基板,也能够发挥上述同样的效果。当然,即使是芯层11和绝缘材料11b由单一的层状绝缘材料构成的部件内置基板,更具体而言电子部件埋设在单一的层状绝缘材料中的部件内置基板,也能够发挥上述同样的效果。
另外,图1(A)和图2(A)~图2(C)表示了凹部CP、CP-1、CP-2和CP-3由芯层11的贯通孔11b和第一绝缘层12的贯通孔12e构成的结构,但是,将芯层11的贯通孔11b更换为有底孔(非贯通孔),也能够发挥上述同样的效果。当然,层11和绝缘材料11b由单一的层状绝缘材料构成的上述部件内置基板中,即使在单一的层状绝缘材料设置有底孔(非贯通孔),也能够发挥上述同样的效果。
附图标记
10······部件内置基板、11······芯层、11a、11b、11c······贯通孔、12······第一绝缘层、12a······信号配线、12b······接地配线、12c······导体通孔、12d······导体焊盘、12e······贯通孔、13······第二绝缘层、13a······信号配线、13b······接地配线、13c······导体通孔、13d······导体焊盘、14······电子部件、CP、CP-1、CP-2、CP3······凹部、CPa······底面、CPb······开口、15······摄像元件、GA······空隙、BW······键合丝、20······光学封装体、21······透镜单元、21a······透镜、22······自动聚焦用促动器、23······滤光单元、24······外壳。
Claims (7)
1.一种摄像机组件,包括:埋设有电子部件的部件内置基板;安装于所述部件内置基板的摄像元件;和设置成位于所述摄像元件上方的透镜,所述摄像机组件的特征在于:
在所述部件内置基板的表面设置有凹部,该凹部具有比所述摄像元件的厚度大的深度,
所述摄像元件,以使该摄像元件的表面与所述部件内置基板的表面之间存在间隙的方式被安装于所述凹部的底面,并且该摄像元件的连接焊盘通过在所述空隙中经过的键合丝与设置于所述部件内置基板的表面的导体焊盘连接。
2.如权利要求1所述的摄像机组件,其特征在于:
所述凹部,其位于所述部件内置基板的表面的开口的面积大于安装有所述摄像元件的底面的面积。
3.如权利要求2所述的摄像机组件,其特征在于:
所述凹部的内壁呈台阶状的截面形状。
4.如权利要求2所述的摄像机组件,其特征在于:
所述凹部的内壁呈至少在开口侧具有与所述部件内置基板的表面形成锐角的倾斜状部分的截面形状。
5.如权利要求1~4中的任一项所述的摄像机组件,其特征在于:
所述部件内置基板包括:芯层;设置于所述芯层的厚度方向上的一个面并且在内部具有配线的第一绝缘层;和设置于所述芯层的厚度方向上的另一个面并且在内部具有配线的第二绝缘层,
所述凹部由设置于所述第一绝缘层的贯通孔和设置于所述芯层的贯通孔构成。
6.如权利要求5所述的摄像机组件,其特征在于:
所述芯层由导电性材料构成。
7.如权利要求5所述的摄像机组件,其特征在于:
所述芯层由非导电性材料构成。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013043082A JP2014170893A (ja) | 2013-03-05 | 2013-03-05 | カメラモジュール |
JP2013-043082 | 2013-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104038680A true CN104038680A (zh) | 2014-09-10 |
CN104038680B CN104038680B (zh) | 2018-04-27 |
Family
ID=51469255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310726117.3A Expired - Fee Related CN104038680B (zh) | 2013-03-05 | 2013-12-25 | 摄像机组件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9253386B2 (zh) |
JP (1) | JP2014170893A (zh) |
KR (1) | KR20140109235A (zh) |
CN (1) | CN104038680B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107068625A (zh) * | 2015-11-04 | 2017-08-18 | 台湾积体电路制造股份有限公司 | 具有空腔的聚合物系半导体结构 |
CN108878413A (zh) * | 2017-05-12 | 2018-11-23 | 海华科技股份有限公司 | 可携式电子装置及其影像获取模块与承载组件 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101952853B1 (ko) * | 2013-07-12 | 2019-02-27 | 삼성전기주식회사 | 카메라 모듈 |
JP6373219B2 (ja) | 2015-03-31 | 2018-08-15 | 太陽誘電株式会社 | 部品内蔵基板および半導体モジュール |
WO2016200126A1 (ko) * | 2015-06-08 | 2016-12-15 | 엘지이노텍(주) | 카메라 모듈 |
CN106356351B (zh) * | 2015-07-15 | 2019-02-01 | 凤凰先驱股份有限公司 | 基板结构及其制作方法 |
CN105611135B (zh) * | 2015-11-13 | 2019-03-19 | 宁波舜宇光电信息有限公司 | 系统级摄像模组及其电气支架和制造方法 |
EP3376751B1 (en) * | 2015-11-13 | 2021-04-21 | Ningbo Sunny Opotech Co., Ltd. | Camera module, electrical support thereof, and assembling method therefor |
CN105744127B (zh) * | 2015-11-13 | 2020-04-28 | 宁波舜宇光电信息有限公司 | 摄像模组及其电气支架和组装方法 |
WO2017092694A1 (zh) * | 2015-12-01 | 2017-06-08 | 宁波舜宇光电信息有限公司 | 摄像模组及其电气支架 |
US20180376041A1 (en) * | 2015-12-24 | 2018-12-27 | Kyocera Corporation | Image sensor mounting board and imaging device |
CN107295746B (zh) * | 2016-03-31 | 2021-06-15 | 奥特斯(中国)有限公司 | 器件载体及其制造方法 |
CN108240829B (zh) | 2016-12-23 | 2022-01-21 | 奥特斯奥地利科技与系统技术有限公司 | 传感器系统 |
EP3606038B1 (en) | 2017-03-31 | 2021-12-08 | Panasonic Intellectual Property Management Co., Ltd. | Imaging system and correction method |
JP7122694B2 (ja) | 2017-03-31 | 2022-08-22 | パナソニックIpマネジメント株式会社 | 撮像システムおよび校正方法 |
US11502710B2 (en) * | 2020-02-05 | 2022-11-15 | Samsung Electro-Mechanics Co., Ltd. | Front-end module |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040119862A1 (en) * | 2002-12-16 | 2004-06-24 | Jackson Hsieh | Image sensor capable of radiating heat rapidly |
US20060228103A1 (en) * | 2005-04-07 | 2006-10-12 | Samsung Electro-Mechanics Co., Ltd. | Nonadjustable focusing type camera module |
CN101297404A (zh) * | 2005-12-24 | 2008-10-29 | 崔显圭 | 半导体封装,制造半导体封装的方法,以及用于图像传感器的半导体封装模块 |
US20080283952A1 (en) * | 2005-12-24 | 2008-11-20 | Choi Hyun-Kyu | Semiconductor Package, Method of Fabricating the Same and Semiconductor Package Module For Image Sensor |
JP2013021031A (ja) * | 2011-07-07 | 2013-01-31 | Sony Corp | 固体撮像装置、電子機器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002093936A (ja) * | 2000-09-14 | 2002-03-29 | Ibiden Co Ltd | 電子部品搭載用基板 |
JP4975523B2 (ja) * | 2007-05-28 | 2012-07-11 | 新光電気工業株式会社 | 部品内蔵基板 |
JP4743296B2 (ja) * | 2008-11-17 | 2011-08-10 | ソニー株式会社 | 固体撮像装置、および、その製造方法、カメラ |
JP5277105B2 (ja) | 2009-07-29 | 2013-08-28 | 富士フイルム株式会社 | カメラモジュール |
JP2012238687A (ja) * | 2011-05-11 | 2012-12-06 | Sony Corp | 半導体パッケージ、半導体装置の製造方法、および固体撮像装置 |
JP5354045B2 (ja) * | 2012-03-15 | 2013-11-27 | オムロン株式会社 | マイクロフォン |
JP5539453B2 (ja) * | 2012-07-17 | 2014-07-02 | 新光電気工業株式会社 | 電子部品搭載多層配線基板及びその製造方法 |
-
2013
- 2013-03-05 JP JP2013043082A patent/JP2014170893A/ja active Pending
- 2013-11-20 KR KR1020130141151A patent/KR20140109235A/ko not_active Application Discontinuation
- 2013-12-25 CN CN201310726117.3A patent/CN104038680B/zh not_active Expired - Fee Related
-
2014
- 2014-01-14 US US14/155,311 patent/US9253386B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040119862A1 (en) * | 2002-12-16 | 2004-06-24 | Jackson Hsieh | Image sensor capable of radiating heat rapidly |
US20060228103A1 (en) * | 2005-04-07 | 2006-10-12 | Samsung Electro-Mechanics Co., Ltd. | Nonadjustable focusing type camera module |
CN101297404A (zh) * | 2005-12-24 | 2008-10-29 | 崔显圭 | 半导体封装,制造半导体封装的方法,以及用于图像传感器的半导体封装模块 |
US20080283952A1 (en) * | 2005-12-24 | 2008-11-20 | Choi Hyun-Kyu | Semiconductor Package, Method of Fabricating the Same and Semiconductor Package Module For Image Sensor |
JP2013021031A (ja) * | 2011-07-07 | 2013-01-31 | Sony Corp | 固体撮像装置、電子機器 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107068625A (zh) * | 2015-11-04 | 2017-08-18 | 台湾积体电路制造股份有限公司 | 具有空腔的聚合物系半导体结构 |
US10504810B2 (en) | 2015-11-04 | 2019-12-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polymer-based-semiconductor structure with cavity |
CN107068625B (zh) * | 2015-11-04 | 2019-12-10 | 台湾积体电路制造股份有限公司 | 具有空腔的聚合物系半导体结构 |
US11133236B2 (en) | 2015-11-04 | 2021-09-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polymer-based-semiconductor structure with cavity |
CN108878413A (zh) * | 2017-05-12 | 2018-11-23 | 海华科技股份有限公司 | 可携式电子装置及其影像获取模块与承载组件 |
CN108878413B (zh) * | 2017-05-12 | 2022-08-09 | 海华科技股份有限公司 | 可携式电子装置及其影像获取模块与承载组件 |
Also Published As
Publication number | Publication date |
---|---|
US20140253794A1 (en) | 2014-09-11 |
CN104038680B (zh) | 2018-04-27 |
US9253386B2 (en) | 2016-02-02 |
JP2014170893A (ja) | 2014-09-18 |
KR20140109235A (ko) | 2014-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104038680A (zh) | 摄像机组件 | |
US7521790B2 (en) | Semiconductor device module and manufacturing method of semiconductor device module | |
US20140312503A1 (en) | Semiconductor packages and methods of fabricating the same | |
US10388685B2 (en) | Portable electronic device and image-capturing module thereof, and image-sensing assembly thereof | |
CN104038681A (zh) | 摄像机组件 | |
US20140061841A1 (en) | Semiconductor package | |
EP2757812A1 (en) | Semiconductor device and microphone | |
CN109429431B (zh) | 电路基板 | |
US20140021608A1 (en) | Semiconductor package and method of fabricating the same | |
US20150325611A1 (en) | Semiconductor packages including electrical insulation features | |
US20170179182A1 (en) | Semiconductor package and method of fabricating the same | |
JP6102770B2 (ja) | 高周波モジュール | |
CN105489619A (zh) | 具有柔性互连层的图像传感器装置及相关方法 | |
KR102185063B1 (ko) | 센싱 패키지 및 이의 제조방법 | |
US7700956B2 (en) | Sensor component and panel used for the production thereof | |
US9711459B2 (en) | Multi-layer substrate with an embedded die | |
US10025969B2 (en) | Fingerprint identification module and manufacturing method thereof | |
TWI746082B (zh) | 可攜式電子裝置及其影像擷取模組 | |
JP2021185621A (ja) | 電子デバイス | |
CN110781804B (zh) | 光学式影像辨识装置的制作方法 | |
JP6256575B2 (ja) | 高周波モジュール | |
KR20160086586A (ko) | 지문인식 센서 패키지 및 그 제조 방법 | |
TWM607350U (zh) | 可攜式電子裝置及其影像擷取模組 | |
JP2007194441A (ja) | イメージセンサ用半導体装置およびその製造方法 | |
FR3093228B1 (fr) | Module a double interface a contact et sans contact comportant une ou plusieurs interfaces additionnelles |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180427 Termination date: 20211225 |
|
CF01 | Termination of patent right due to non-payment of annual fee |