CN103943616B - 一种led发光装置 - Google Patents
一种led发光装置 Download PDFInfo
- Publication number
- CN103943616B CN103943616B CN201310024997.XA CN201310024997A CN103943616B CN 103943616 B CN103943616 B CN 103943616B CN 201310024997 A CN201310024997 A CN 201310024997A CN 103943616 B CN103943616 B CN 103943616B
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- Prior art keywords
- carrier
- led
- led wafer
- light emission
- emission device
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H01L2224/83805—Soldering or alloying involving forming a eutectic alloy at the bonding interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510365882.6A CN104966773B (zh) | 2013-01-22 | 2013-01-22 | 一种led发光装置 |
| CN201310024997.XA CN103943616B (zh) | 2013-01-22 | 2013-01-22 | 一种led发光装置 |
| PCT/CN2014/071154 WO2014114242A1 (zh) | 2013-01-22 | 2014-01-22 | 一种led发光装置 |
| EP14743894.9A EP2950343B1 (en) | 2013-01-22 | 2014-01-22 | Led light-emitting device |
| JP2015554036A JP6183470B2 (ja) | 2013-01-22 | 2014-01-22 | Ｌｅｄ発光素子 |
| US14/762,602 US9679879B2 (en) | 2013-01-22 | 2014-01-22 | LED light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310024997.XA CN103943616B (zh) | 2013-01-22 | 2013-01-22 | 一种led发光装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510365882.6A Division CN104966773B (zh) | 2013-01-22 | 2013-01-22 | 一种led发光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103943616A CN103943616A (zh) | 2014-07-23 |
| CN103943616B true CN103943616B (zh) | 2017-04-12 |
Family
ID=51191211
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510365882.6A Active CN104966773B (zh) | 2013-01-22 | 2013-01-22 | 一种led发光装置 |
| CN201310024997.XA Active CN103943616B (zh) | 2013-01-22 | 2013-01-22 | 一种led发光装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510365882.6A Active CN104966773B (zh) | 2013-01-22 | 2013-01-22 | 一种led发光装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9679879B2 (ja) |
| EP (1) | EP2950343B1 (ja) |
| JP (1) | JP6183470B2 (ja) |
| CN (2) | CN104966773B (ja) |
| WO (1) | WO2014114242A1 (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505452A (zh) * | 2014-11-14 | 2015-04-08 | 浙江英特来光电科技有限公司 | 一种回流焊式led灯丝 |
| CN104505453B (zh) * | 2014-11-14 | 2017-08-25 | 浙江英特来光电科技有限公司 | 一种无焊线led灯丝 |
| TWI651491B (zh) * | 2015-07-23 | 2019-02-21 | 晶元光電股份有限公司 | 發光裝置 |
| DE102016105211A1 (de) | 2016-03-21 | 2017-09-21 | Osram Opto Semiconductors Gmbh | Filament und dessen Herstellung sowie Leuchtmittel mit Filamenten |
| DE102017102044A1 (de) * | 2017-02-02 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Filament |
| DE102018118822A1 (de) | 2018-08-02 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Leuchtfadenvorrichtung und verfahren zur herstellung einer leuchtfadenvorrichtung |
| CN109300797A (zh) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | 一种深腔无引线芯片共晶焊接装置及方法 |
| DE102019106931A1 (de) * | 2019-03-19 | 2020-09-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement, optoelektronische Halbleitervorrichtung und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| US11777065B2 (en) * | 2020-05-29 | 2023-10-03 | X Display Company Technology Limited | White-light-emitting LED structures |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101621105A (zh) * | 2009-07-30 | 2010-01-06 | 宁波晶科光电有限公司 | Led倒装芯片集成封装方法及采用该方法封装的led |
| CN202281062U (zh) * | 2011-08-29 | 2012-06-20 | 浙江锐迪生光电有限公司 | 一种LED芯片4π出光的高显色指数LED灯泡 |
| CN203134856U (zh) * | 2013-01-22 | 2013-08-14 | 浙江中宙照明科技有限公司 | 一种led发光装置 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5445608A (en) * | 1993-08-16 | 1995-08-29 | James C. Chen | Method and apparatus for providing light-activated therapy |
| US7009199B2 (en) * | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
| US7221044B2 (en) * | 2005-01-21 | 2007-05-22 | Ac Led Lighting, L.L.C. | Heterogeneous integrated high voltage DC/AC light emitter |
| JP2007081234A (ja) * | 2005-09-15 | 2007-03-29 | Toyoda Gosei Co Ltd | 照明装置 |
| TW200828632A (en) * | 2006-12-28 | 2008-07-01 | Yu-Nung Shen | Package body of luminous source |
| JP4986735B2 (ja) * | 2007-06-25 | 2012-07-25 | 京セラ株式会社 | 照明用光源 |
| JP2009263531A (ja) * | 2008-04-25 | 2009-11-12 | Sekisui Chem Co Ltd | 光半導体用熱硬化性組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及び光半導体素子 |
| JP5322801B2 (ja) * | 2009-06-19 | 2013-10-23 | スタンレー電気株式会社 | 半導体発光装置及びその製造方法 |
| JP5102815B2 (ja) * | 2009-08-31 | 2012-12-19 | 日立電線株式会社 | 光電気複合配線モジュールおよびその製造方法 |
| US20120043886A1 (en) * | 2010-08-18 | 2012-02-23 | Hua Ji | Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module |
| US8198109B2 (en) * | 2010-08-27 | 2012-06-12 | Quarkstar Llc | Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination |
| DK2535640T4 (da) | 2010-09-08 | 2020-09-28 | Zhejiang Ledison Optoelectronics Co Ltd | LED-pære og LED-belysningsliste til udsendelse af lys over 4 PI |
| CN202281057U (zh) * | 2011-05-11 | 2012-06-20 | 浙江锐迪生光电有限公司 | 一种LED芯片4π出光的高效率LED发光管 |
| US8575639B2 (en) * | 2011-02-16 | 2013-11-05 | Cree, Inc. | Light emitting devices for light emitting diodes (LEDs) |
| JP2012146738A (ja) * | 2011-01-07 | 2012-08-02 | Stanley Electric Co Ltd | Ｌｅｄモジュール及びｌｅｄランプ |
| JP5074639B1 (ja) * | 2011-07-22 | 2012-11-14 | パナソニック株式会社 | ランプ及び照明装置 |
| CN202259395U (zh) | 2011-09-07 | 2012-05-30 | 王元成 | 一种led光源 |
| CN202493931U (zh) | 2012-02-15 | 2012-10-17 | 李彬斌 | 一种低阻散热型led灯泡 |
| CN102664229B (zh) * | 2012-06-05 | 2015-04-08 | 泉州万明光电有限公司 | 一种发光二极体光源结构 |
-
2013
- 2013-01-22 CN CN201510365882.6A patent/CN104966773B/zh active Active
- 2013-01-22 CN CN201310024997.XA patent/CN103943616B/zh active Active
-
2014
- 2014-01-22 WO PCT/CN2014/071154 patent/WO2014114242A1/zh active Application Filing
- 2014-01-22 US US14/762,602 patent/US9679879B2/en active Active
- 2014-01-22 JP JP2015554036A patent/JP6183470B2/ja not_active Expired - Fee Related
- 2014-01-22 EP EP14743894.9A patent/EP2950343B1/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101621105A (zh) * | 2009-07-30 | 2010-01-06 | 宁波晶科光电有限公司 | Led倒装芯片集成封装方法及采用该方法封装的led |
| CN202281062U (zh) * | 2011-08-29 | 2012-06-20 | 浙江锐迪生光电有限公司 | 一种LED芯片4π出光的高显色指数LED灯泡 |
| CN203134856U (zh) * | 2013-01-22 | 2013-08-14 | 浙江中宙照明科技有限公司 | 一种led发光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014114242A1 (zh) | 2014-07-31 |
| EP2950343A4 (en) | 2016-08-24 |
| EP2950343B1 (en) | 2020-07-01 |
| US20150364452A1 (en) | 2015-12-17 |
| CN104966773B (zh) | 2018-03-09 |
| CN103943616A (zh) | 2014-07-23 |
| CN104966773A (zh) | 2015-10-07 |
| EP2950343A1 (en) | 2015-12-02 |
| JP6183470B2 (ja) | 2017-08-23 |
| JP2016509752A (ja) | 2016-03-31 |
| US9679879B2 (en) | 2017-06-13 |
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