CN104505453B - 一种无焊线led灯丝 - Google Patents
一种无焊线led灯丝 Download PDFInfo
- Publication number
- CN104505453B CN104505453B CN201410649477.2A CN201410649477A CN104505453B CN 104505453 B CN104505453 B CN 104505453B CN 201410649477 A CN201410649477 A CN 201410649477A CN 104505453 B CN104505453 B CN 104505453B
- Authority
- CN
- China
- Prior art keywords
- substrate
- filament
- circuit
- led
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649477.2A CN104505453B (zh) | 2014-11-14 | 2014-11-14 | 一种无焊线led灯丝 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649477.2A CN104505453B (zh) | 2014-11-14 | 2014-11-14 | 一种无焊线led灯丝 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104505453A CN104505453A (zh) | 2015-04-08 |
CN104505453B true CN104505453B (zh) | 2017-08-25 |
Family
ID=52947189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410649477.2A Active CN104505453B (zh) | 2014-11-14 | 2014-11-14 | 一种无焊线led灯丝 |
Country Status (1)
Country | Link |
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CN (1) | CN104505453B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105674068B (zh) * | 2016-01-11 | 2020-08-25 | 漳州立达信光电子科技有限公司 | Led灯丝封装结构 |
CN105720048A (zh) * | 2016-02-19 | 2016-06-29 | 浙江英特来光电科技有限公司 | 一种无焊线高显指led灯丝的封装方法及无焊线高显指led灯丝 |
CN106015985A (zh) * | 2016-03-11 | 2016-10-12 | 浙江英特来光电科技有限公司 | 一种全角度发光的led球泡灯 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102522397A (zh) * | 2007-03-15 | 2012-06-27 | 夏普株式会社 | 发光装置和制造该种发光装置的方法 |
CN103943616A (zh) * | 2013-01-22 | 2014-07-23 | 浙江中宙照明科技有限公司 | 一种led发光装置 |
CN204230302U (zh) * | 2014-11-14 | 2015-03-25 | 浙江英特来光电科技有限公司 | 无焊线led灯丝 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014020470A1 (en) * | 2012-07-30 | 2014-02-06 | Koninklijke Philips N.V. | Strengthened led package and method therefor |
-
2014
- 2014-11-14 CN CN201410649477.2A patent/CN104505453B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102522397A (zh) * | 2007-03-15 | 2012-06-27 | 夏普株式会社 | 发光装置和制造该种发光装置的方法 |
CN103943616A (zh) * | 2013-01-22 | 2014-07-23 | 浙江中宙照明科技有限公司 | 一种led发光装置 |
CN204230302U (zh) * | 2014-11-14 | 2015-03-25 | 浙江英特来光电科技有限公司 | 无焊线led灯丝 |
Also Published As
Publication number | Publication date |
---|---|
CN104505453A (zh) | 2015-04-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Lian Chengjie Inventor after: Lin Chengtong Inventor after: Wang Donghai Inventor after: Xu Xianmei Inventor after: Li Yuhua Inventor after: Zhu Yingken Inventor before: Lin Chengtong Inventor before: Wang Donghai Inventor before: Xu Xianmei Inventor before: Li Yuhua Inventor before: Zhu Yingken |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A solderless led filament Effective date of registration: 20220111 Granted publication date: 20170825 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230720 Granted publication date: 20170825 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |