CN104505453A - 一种无焊线led灯丝 - Google Patents
一种无焊线led灯丝 Download PDFInfo
- Publication number
- CN104505453A CN104505453A CN201410649477.2A CN201410649477A CN104505453A CN 104505453 A CN104505453 A CN 104505453A CN 201410649477 A CN201410649477 A CN 201410649477A CN 104505453 A CN104505453 A CN 104505453A
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- bonding wire
- circuit
- lamp filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649477.2A CN104505453B (zh) | 2014-11-14 | 2014-11-14 | 一种无焊线led灯丝 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410649477.2A CN104505453B (zh) | 2014-11-14 | 2014-11-14 | 一种无焊线led灯丝 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104505453A true CN104505453A (zh) | 2015-04-08 |
CN104505453B CN104505453B (zh) | 2017-08-25 |
Family
ID=52947189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410649477.2A Active CN104505453B (zh) | 2014-11-14 | 2014-11-14 | 一种无焊线led灯丝 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104505453B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105674068A (zh) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | Led灯丝封装结构 |
CN105720048A (zh) * | 2016-02-19 | 2016-06-29 | 浙江英特来光电科技有限公司 | 一种无焊线高显指led灯丝的封装方法及无焊线高显指led灯丝 |
CN106015985A (zh) * | 2016-03-11 | 2016-10-12 | 浙江英特来光电科技有限公司 | 一种全角度发光的led球泡灯 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102522397A (zh) * | 2007-03-15 | 2012-06-27 | 夏普株式会社 | 发光装置和制造该种发光装置的方法 |
WO2014020470A1 (en) * | 2012-07-30 | 2014-02-06 | Koninklijke Philips N.V. | Strengthened led package and method therefor |
CN103943616A (zh) * | 2013-01-22 | 2014-07-23 | 浙江中宙照明科技有限公司 | 一种led发光装置 |
CN204230302U (zh) * | 2014-11-14 | 2015-03-25 | 浙江英特来光电科技有限公司 | 无焊线led灯丝 |
-
2014
- 2014-11-14 CN CN201410649477.2A patent/CN104505453B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102522397A (zh) * | 2007-03-15 | 2012-06-27 | 夏普株式会社 | 发光装置和制造该种发光装置的方法 |
WO2014020470A1 (en) * | 2012-07-30 | 2014-02-06 | Koninklijke Philips N.V. | Strengthened led package and method therefor |
CN103943616A (zh) * | 2013-01-22 | 2014-07-23 | 浙江中宙照明科技有限公司 | 一种led发光装置 |
CN204230302U (zh) * | 2014-11-14 | 2015-03-25 | 浙江英特来光电科技有限公司 | 无焊线led灯丝 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105674068A (zh) * | 2016-01-11 | 2016-06-15 | 漳州立达信光电子科技有限公司 | Led灯丝封装结构 |
CN105674068B (zh) * | 2016-01-11 | 2020-08-25 | 漳州立达信光电子科技有限公司 | Led灯丝封装结构 |
CN105720048A (zh) * | 2016-02-19 | 2016-06-29 | 浙江英特来光电科技有限公司 | 一种无焊线高显指led灯丝的封装方法及无焊线高显指led灯丝 |
CN106015985A (zh) * | 2016-03-11 | 2016-10-12 | 浙江英特来光电科技有限公司 | 一种全角度发光的led球泡灯 |
Also Published As
Publication number | Publication date |
---|---|
CN104505453B (zh) | 2017-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107170733B (zh) | Led灯丝及其led球泡灯 | |
CN102709278A (zh) | 荧光薄膜平面薄片式led阵列光源 | |
CN102074640A (zh) | 发光二极管模块及其制造方法 | |
CN201293282Y (zh) | Led支架和led发光结构 | |
CN101126863A (zh) | 具有散热结构的发光二极管光源模块 | |
CN204230302U (zh) | 无焊线led灯丝 | |
CN103199173A (zh) | 发光二极管芯片、封装基板、封装结构及其制法 | |
KR101792106B1 (ko) | 메탈 피씨비 상에 반사층이 구비된 led pcb 모듈 | |
CN104505453A (zh) | 一种无焊线led灯丝 | |
CN105805579A (zh) | 大角度发光led灯丝灯 | |
CN204227118U (zh) | 一种新型led光源结构 | |
CN204227119U (zh) | 一种led灯丝 | |
CN110966528B (zh) | 一种led柔性无光斑灯带 | |
CN202712175U (zh) | 荧光薄膜平面薄片式led阵列光源 | |
CN205065632U (zh) | 全角度led光源结构 | |
US20120113630A1 (en) | Led energy-saving lamp | |
CN205372147U (zh) | 大角度发光led灯丝灯 | |
CN201893369U (zh) | 一种发光二极管 | |
CN101783341B (zh) | 具有散热结构的发光二极管光源模块 | |
CN210950884U (zh) | 一种led柔性无光斑灯带 | |
CN203950803U (zh) | 发光器件 | |
CN204441280U (zh) | 覆晶式led灯具 | |
CN208538851U (zh) | 多面键合led灯丝 | |
CN102856476A (zh) | 一种基于均热板的led芯片封装结构及其芯片支架 | |
CN203445117U (zh) | Led封装结构及汽车车灯 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Lian Chengjie Inventor after: Lin Chengtong Inventor after: Wang Donghai Inventor after: Xu Xianmei Inventor after: Li Yuhua Inventor after: Zhu Yingken Inventor before: Lin Chengtong Inventor before: Wang Donghai Inventor before: Xu Xianmei Inventor before: Li Yuhua Inventor before: Zhu Yingken |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A solderless led filament Effective date of registration: 20220111 Granted publication date: 20170825 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230720 Granted publication date: 20170825 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |