CN104659028A - 一种led模组的构造及其制造工艺 - Google Patents

一种led模组的构造及其制造工艺 Download PDF

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CN104659028A
CN104659028A CN201310598109.5A CN201310598109A CN104659028A CN 104659028 A CN104659028 A CN 104659028A CN 201310598109 A CN201310598109 A CN 201310598109A CN 104659028 A CN104659028 A CN 104659028A
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led
substrate
parallel
electrode
led chip
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CN104659028B (zh
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吴鼎鼎
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MCOB OPTOELECTRONICS TECHNOLOGY CO., LTD.
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FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
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Abstract

本发明公开了一种LED模组的制造工艺和构造，其特征在于，将LED芯片通过一绝缘胶层固定于一基板的上表面；LED芯片两个一组构成一LED对，电极面向上；再将基板电极通过一绝缘胶层固定于基板的上表面；进而将邦定线打线于基板电极与所述LED芯片的电极；每两个相邻的所述LED对之间设置一个并联部，邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；所有的并联单元通过该并联部相串联构成一LED串；最后涂覆荧光粉层覆盖所述LED芯片、邦定线和绝缘胶层；本方案基板本身省略了所有的绝缘层和焊接点，热阻小，也避免了焊接工艺/构造带来的导热不均，其LED芯片的固定工艺简单，结构简单，加工速度快。

Description

一种LED模组的构造及其制造工艺
技术领域
本发明涉及一种LED模组的构造及其制造工艺。 
背景技术
LED在照明领域活动越来越多的普及，因而其产品需求也不断加大，从聚光型灯具逐渐扩展到包括各种泛光照明的通用照明领域，多种LED模组也应运而生，其目的在于替代传统光源例如白炽灯、荧光灯已经大量使用的灯具结构，以获得现有甚至更优质的照明性能。 
考虑到LED光源的特点，当需要实现较大面积的发光体时，必然会将数量庞大的LED芯片颗粒贴装于各种形态的基板上，例如长条型的灯带，使之具有均匀的发光表面，一方面可获得较好的散热效果，另一方面要具有合适的几何结构以匹配替代灯具。 
现有的灯带，通常一类方案都采用已经封装好的LED光源，利用焊接的方式固定在带状基板上实现阵列，这类方式得到的LED模组其发光效果和散热效果都直接受制于已经封装好的LED光源以及具有PCB布局的基板，而且其焊接过程中会因为焊锡熔融应力的原因导致电接触、散热不良；另一类方案采用芯片直接焊接于基板上，同样地，其基板必然采用PCB布局的基板，热阻大，同样具有散热和焊接的问题。 
发明内容
针对现有LED模组结构和生产工艺中PCB基板散热不佳、LED芯片焊接带来 的接触、热阻的问题，以及针对现有LED模组难以实现高光效的缺点，本发明提出一种LED模组的构造及其制造工艺，其技术方案如下： 
一种LED模组的构造，它包括： 
基板； 
LED芯片，通过一绝缘胶层配合固定于所述基板的上表面；该LED芯片两个一组构成一LED对，且沿该基板长度方向排列；该LED芯片的电极面向上， 
基板电极，通过一绝缘胶层配合固定于所述基板的上表面； 
邦定线，连接于所述基板电极与所述LED芯片的电极；其中该LED对两端具有并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；该并联部与所述基板之间具有绝缘物； 
荧光粉层，配合于所述基板的上表面，覆盖所述LED芯片、邦定线、绝缘物和绝缘胶层； 
其中，所有的所述并联单元通过该并联部相串联构成一LED串；所述基板电极、并联单元构成完整的电气回路。 
作为实现该结构的工艺，其技术方案如下： 
一种LED模组的制造工艺，它包括以下步骤： 
1）提供一具有良导热性能的基板； 
2）将LED芯片通过一绝缘胶层配合固定于所述基板的上表面；且LED芯片每两个一组构成一LED对，该LED对沿该基板的长度方向排列，且该LED芯片的电极面向上；再将导体材料的基板电极通过一绝缘胶层配合固定于所述基板的上表面； 
3）采用打线设备将邦定线打线于基板电极与所述LED芯片的电极；每两个相 邻的所述LED对之间设置一个并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；所有的所述并联单元通过该并联部相串联构成一LED串；同时使所述基板电极、并联单元构成完整的电气回路； 
4）在所述基板的上表面涂覆荧光粉层，该荧光粉层覆盖所述LED芯片、邦定线和绝缘胶层； 
其中，所述步骤1）或者步骤2）在该基板表面设置绝缘物，介于该上表面与所述并联部之间。 
作为上述方案的改进者，可以在以下方面体现： 
在较佳实施例中，所述并联部包括一过渡芯片，所述绝缘物为固定配合于该过渡芯片与基板之间的绝缘胶。 
在较佳实施例中，所述并联部形态为所述邦定线相互交叉电接触构成的交叉点；该交叉点悬空于所述基板表面；所述绝缘物为配合于该基板表面的绝缘胶；所述交叉点涂覆导电胶。 
在较佳实施例中，所述上表面为高反射率的表面。 
在较佳实施例中，所述基板为良导体，所述基板电极和该基板分别串联于该LED串的两端。 
在较佳实施例中，在所述步骤2）之后在该基板上表面用绝缘胶作为所述绝缘物，再将一过渡芯片通过该绝缘物粘贴配合于该上表面。 
在较佳实施例中，所述步骤1）之后即用绝缘胶喷涂于在该基板上表面作为所述绝缘物；所述邦定线在所述LED对之间交叉并电接触构成所述并联部；该并联部成型后涂覆导电胶；并且该并联部采用悬空的状态位于该上表面和绝缘物上方。 
在较佳实施例中，所述基板为良导体；步骤3）中将所述基板电极和该基板分别用该邦定线串联于该LED串的两端。 
在较佳实施例中，每个所述LED对中的两个所述LED芯片其连线与所述基板的长度方向夹角为锐角，且每个所述LED对的所述连线倾斜方向一致。 
本方案的有益效果有： 
1.高反射率的基板保证了光源光效高。本身省略了所有的绝缘层和焊接点，避免了热阻过大和成本过高，也避免了PCB式基板焊接工艺/构造带来的导热不均、高温损坏LED芯片的隐患，其LED芯片的固定工艺简单，结构简单，加工速度快； 
2.邦定线作为LED芯片拓扑连接的导体，充分利用了打线工艺的速度优势，同时也节省了这些连接带来的金属材料损耗； 
3.所构造的并联单元使整个LED串具有良好的抗失效性能，即使任何一个并联单元中的LED芯片损坏，整个LED串仍然保持发亮，而且在荧光粉层的覆盖下明暗均匀； 
4.并联部形态为邦定线相互交叉电接触构成的交叉点；该交叉点悬空于基板上表面；交叉点涂覆导电胶。使得并联部的成型非常快速，省略了过渡芯片的结构，使LED芯片的拓扑连接具有快速成型的特点。 
5.实现近180°广角反射出光，芯片所发出的光不再受SMD杯状结构遮挡，极大提升出光效率。 
附图说明
以下结合附图实施例对本发明作进一步说明： 
图1是本发明实施例一的俯视图； 
图2是图1中AA部分的剖面示意图； 
图3是图1中BB部分的剖面示意图； 
图4是本发明实施例二的俯视图； 
图5是图4中CC部分的剖面示意图； 
图6是图4中DD部分的剖面示意图。 
图7是邦定线和导电胶连接的结构示意图。 
具体实施方式
实施例一： 
图1至图3展示了本发明一个实施例的构造图。 
它有一个镜面的基板10，该基板10用金属或者陶瓷材料，本身具有较小的热阻。多颗LED芯片，包括21、22通过一绝缘胶层60配合固定于基板10的上表面；LED芯片两个一组构成一LED对20，如本图所示的LED芯片21和22，就构成了一LED对，LED对为单元，沿该基板10长度方向，即图1中自左至右的方向排列分布，且该LED芯片21和22的电极面向上。在基板10的上表面还用绝缘胶层60固定了基板电极51。 
邦定线30作为构造LED芯片电气拓扑结构的主要连线，连接于基板电极51与LED芯片包括21、22的电极；其中该LED对20两端具有并联部40，使该LED对成为一个电气并联的并联单元，例如LED芯片21和22相互并联，该并联部40与基板10之间具有绝缘物70。 
在基板10的上表面配合有荧光粉层50，荧光粉层覆盖了LED芯片、邦定线30、绝缘物70和绝缘胶层60；所有的并联单元通过该并联部40相串联构成一LED串；基板电极51、并联单元构成完整的电气回路，也即，该基板10上所有 的LED芯片，都是两两并联后再串联起来的拓扑结构。 
本方案的实施步骤如下： 
1）先提供一镜面的、具有良导热性能的基板10； 
2）将LED芯片通过一绝缘胶层60配合固定于基板10的上表面；且LED芯片每两个一组构成一LED对，例如LED芯片21和22组成一LED对20；该LED对20沿该基板10的长度方向排列，且LED芯片的电极面向上；再将导体材料的基板电极51通过一绝缘胶层60配合固定于基板10的上表面； 
3）采用打线设备将邦定线30打线于基板电极51与LED芯片的电极；每两个相邻的LED对之间设置一个并联部40，邦定线30自该LED对中各个LED芯片的电极引出后连接于该并联部40，使该LED对成为一个电气并联的并联单元；所有的并联单元通过该并联部40相串联构成一LED串；同时使基板电极51、并联单元构成完整的电气回路。 
4）在所述基板的上表面涂覆荧光粉层50，该荧光粉层50覆盖LED芯片、邦定线30和绝缘胶层60； 
其中，步骤2）在该基板表面设置绝缘物70，此绝缘物70介于该上表面与并联部40之间。 
本方案具有许多优点，首先，基板10在本构造和工艺下省略了多层结构和焊接点，例如传统PCB铝基板，避免了铝基板PCB形态的多层形态带来的热阻过大和成本过高，也避免了PCB式基板焊接工艺/构造带来的导热不均、高温损坏LED芯片的隐患，其LED芯片的固定工艺简单，结构简单，加工速度快。 
采用邦定线作为LED芯片拓扑连接的导体，一方面充分利用了打线工艺的速度优势，同时也节省了这些连接带来的金属材料损耗，另一方面，所构造的并联单元，使整个LED串具有良好的抗失效性能，即使任何一个并联单元中的LED 芯片损坏，整个LED串仍然保持发亮，而且在荧光粉层的覆盖下明暗均匀。 
本实施例还具有其他一些特点： 
并联部40包括一过渡芯片的形态，绝缘物70为绝缘胶，将过渡芯片固定配合于基板10之间，使二者紧密配合。该形态的并联部40比较牢固、使邦定线30的打线速度具有较快的保障。 
实施例二： 
如图4至图7所示，本发明实施例二的示意图。 
本方案有一个导热的基板10，该基板10用上表面高抛光的铝材料，具有高反射率、高导热的特点。多颗LED芯片，包括21、22通过一绝缘胶层60配合固定于基板10的上表面；LED芯片两个一组构成一LED对，如本图所示的LED芯片21和22，就构成了一LED对20，LED对20为单元，沿该基板10长度方向，即图1中自左至右的方向排列分布，且该LED芯片21和22的电极面向上。在基板10的上表面还用绝缘胶层60固定了基板电极51。 
邦定线30作为构造LED芯片电气拓扑结构的主要连线，连接于基板电极51与LED芯片包括21、22的电极；其中该LED对20两端具有并联部40，邦定线30自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元，例如LED芯片21和22相互并联，该并联部40与基板10之间具有绝缘物70。 
在基板10的上表面配合有荧光粉层50，荧光粉层覆盖了LED芯片、邦定线30、绝缘物70和绝缘胶层60；所有的联单元通过该并联部40相串联构成一LED串；基板电极51、并联单元构成完整的电气回路，也即，该基板10上所有的LED芯片，都是两两并联后再串联起来的拓扑结构。 
不同于实施例一的是，本方案并联部40形态为邦定线30相互交叉电接触构成的交叉点；该交叉点悬空于基板10上表面；绝缘物70为配合于该基板表面的绝缘胶；交叉点涂覆导电胶31。该方案使得并联部40的成型非常快速，省略了过渡芯片的结构，使LED芯片的拓扑连接具有快速成型的特点，同时也同实施例一使LED芯片具有先并联后串联的高可靠性结构。 
每个LED对中的两个LED芯片其连线与基板的长度方向夹角α为锐角，且每个LED对的倾斜方向一致，这一点在图4中可看出，该结构一方面使得邦定线30在交叉点的夹角更趋向于直角，其交叉接触较稳固；另一方面使LED芯片的几何排列结构易于利用摆动式贴装机快速贴装，工艺速度快。考虑到邦定线30在交叉点的电接触，需要在并联部40处涂覆导电胶，例如银胶等优质导电胶体。 
本方案的基板10为良导体，基板电极51和该基板10分别串联于该LED串的两端。使得基板10被充分利用为整个LED拓扑的一端电极，简化了电极引线。 
该实施例的步骤如下： 
1）先提供一具有良导热性能的铝质基板10； 
2）将LED芯片通过一绝缘胶层60配合固定于基板10的上表面；且LED芯片每两个一组构成一LED对，例如LED芯片21和22组成一LED对20；该LED对20沿该基板10的长度方向排列，且LED芯片的电极面向上；再将导体材料的基板电极51通过一绝缘胶层60配合固定于基板10的上表面； 
3）采用打线设备将邦定线30打线于基板电极51与LED芯片的电极；每两个相邻的LED对之间设置一个并联部40，邦定线30自该LED对中各个LED芯片的电极引出后连接于该并联部40，使该LED对成为一个电气并联的并联单元；所有的并联单元通过该并联部40相串联构成一LED串；同时使基板电极51、并联单元构成完整的电气回路。 
4）在所述基板的上表面涂覆荧光粉层50，该荧光粉层50覆盖LED芯片、邦定线30和绝缘胶层60； 
其中，步骤1）之后即用绝缘胶喷涂于在该基板10上表面作为绝缘物70；邦定线30在LED对之间交叉并电接触构成并联部40；该并联部成型后涂覆导电胶31；并且该并联部40采用悬空的状态位于该上表面和绝缘物70上方。 
特别地，为实现并联部40的电接触强度，邦定线30从上往下下压的一支其弧度小于下方者，因此必然会压迫下方者使其形变，从而具有可靠电接触，配合导电胶31，得到了并联部的快速成型。 
以上所述，仅为本发明较佳实施例而已，故不能依此限定本发明实施的范围，即依本发明专利范围及说明书内容所作的等效变化与修饰，皆应仍属本发明涵盖的范围内。 

Claims (10)

1.一种LED模组的构造，其特征在于：它包括：
基板；
LED芯片，通过一绝缘胶层配合固定于所述基板的上表面；该LED芯片两个一组构成一LED对，且沿该基板长度方向排列；该LED芯片的电极面向上，
基板电极，通过一绝缘胶层配合固定于所述基板的上表面；
邦定线，连接于所述基板电极与所述LED芯片的电极；其中该LED对两端具有并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；该并联部与所述基板之间具有绝缘物；
荧光粉层，配合于所述基板的上表面，覆盖所述LED芯片、邦定线、绝缘物和绝缘胶层；
其中，所有的所述并联单元通过该并联部相串联构成一LED串；所述基板电极、并联单元构成完整的电气回路。
2.根据权利要求1所述一种LED模组的构造，其特征在于：所述并联部包括一过渡芯片，所述绝缘物为固定配合于该过渡芯片与基板之间的绝缘胶。
3.根据权利要求1所述一种LED模组的构造，其特征在于：所述并联部形态为所述邦定线相互交叉电接触构成的交叉点；该交叉点悬空于所述基板表面；所述绝缘物为配合于该基板表面的绝缘胶；所述交叉点涂覆导电胶。
4.根据权利要求1或2或3所述一种LED模组的构造，其特征在于：所述上表面为高反射率的表面。
5.根据权利要求4所述一种LED模组的构造，其特征在于：所述基板为良导体，所述基板电极和该基板分别串联于该LED串的两端。
6.一种LED模组的制造工艺，其特征在于，包括以下步骤：
1）提供一具有良导热性能的基板；
2）将LED芯片通过一绝缘胶层配合固定于所述基板的上表面；且LED芯片每两个一组构成一LED对，该LED对沿该基板的长度方向排列，且该LED芯片的电极面向上；再将导体材料的基板电极通过一绝缘胶层配合固定于所述基板的上表面；
3）采用打线设备将邦定线打线于基板电极与所述LED芯片的电极；每两个相邻的所述LED对之间设置一个并联部，所述邦定线自该LED对中各个LED芯片的电极引出后连接于该并联部，使该LED对成为一个电气并联的并联单元；所有的所述并联单元通过该并联部相串联构成一LED串；同时使所述基板电极、并联单元构成完整的电气回路；
4）在所述基板的上表面涂覆荧光粉层，该荧光粉层覆盖所述LED芯片、邦定线和绝缘胶层；
其中，所述步骤1）或者步骤2）在该基板表面设置绝缘物，介于该上表面与所述并联部之间。
7.根据权利要求1所述一种LED模组的制造工艺，其特征在于，在所述步骤2）之后在该基板上表面用绝缘胶作为所述绝缘物，再将一过渡芯片通过该绝缘物粘贴配合于该上表面。
8.根据权利要求1所述一种LED模组的制造工艺，其特征在于，所述步骤1）之后即用绝缘胶喷涂于在该基板上表面作为所述绝缘物；所述邦定线在所述LED对之间交叉并电接触构成所述并联部；该并联部成型后涂覆导电胶；并且该并联部采用悬空的状态位于该上表面和绝缘物上方。
9.根据权利要求6或7或8所述一种LED模组的制造工艺，其特征在于：所述基板为良导体；步骤3）中将所述基板电极和该基板分别用该邦定线串联于该LED串的两端。
10.根据权利要求9所述一种LED模组的制造工艺，其特征在于：每个所述LED对中的两个所述LED芯片其连线与所述基板的长度方向夹角为锐角，且每个所述LED对的所述连线倾斜方向一致。
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