CN101022148A - 发光二极管封装结构的制作方法 - Google Patents
发光二极管封装结构的制作方法 Download PDFInfo
- Publication number
- CN101022148A CN101022148A CNA2007100263168A CN200710026316A CN101022148A CN 101022148 A CN101022148 A CN 101022148A CN A2007100263168 A CNA2007100263168 A CN A2007100263168A CN 200710026316 A CN200710026316 A CN 200710026316A CN 101022148 A CN101022148 A CN 101022148A
- Authority
- CN
- China
- Prior art keywords
- base plate
- packaging
- lamp cup
- manufacture method
- conductive electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100263168A CN100438111C (zh) | 2007-01-11 | 2007-01-11 | 发光二极管封装结构的制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2007100263168A CN100438111C (zh) | 2007-01-11 | 2007-01-11 | 发光二极管封装结构的制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101022148A true CN101022148A (zh) | 2007-08-22 |
CN100438111C CN100438111C (zh) | 2008-11-26 |
Family
ID=38709839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100263168A Expired - Fee Related CN100438111C (zh) | 2007-01-11 | 2007-01-11 | 发光二极管封装结构的制作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100438111C (zh) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102130240A (zh) * | 2011-02-22 | 2011-07-20 | 史杰 | 金属支架式led芯片封装工艺 |
CN102376842A (zh) * | 2010-08-11 | 2012-03-14 | 亿广科技(上海)有限公司 | 发光二极管封装结构 |
CN102420282A (zh) * | 2010-09-27 | 2012-04-18 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN102471895A (zh) * | 2010-05-20 | 2012-05-23 | Jx金属商事株式会社 | 表面具有氧化层的电镀银和/或电镀银合金的镀件 |
CN102800788A (zh) * | 2012-07-23 | 2012-11-28 | 厦门市朗星节能照明股份有限公司 | Led封装结构及其镀银基板 |
CN102804425A (zh) * | 2009-06-26 | 2012-11-28 | 法国圣戈班玻璃厂 | 集成了调制折射率的平面光学元件的电致发光二极管 |
CN101794855B (zh) * | 2009-01-30 | 2013-04-03 | 日亚化学工业株式会社 | 半导体发光装置及半导体发光装置的制造方法 |
CN103032684A (zh) * | 2009-03-26 | 2013-04-10 | 东芝照明技术株式会社 | 发光设备及其制造方法 |
CN103280505A (zh) * | 2013-03-08 | 2013-09-04 | 友达光电股份有限公司 | 发光二极管阵列的制作方法及发光二极管显示装置的制法 |
CN104613379A (zh) * | 2015-02-06 | 2015-05-13 | 东莞佰鸿电子有限公司 | 一种蓝宝石印刷电路板led灯具及其制作方法 |
CN104659028A (zh) * | 2013-11-21 | 2015-05-27 | 福建省万邦光电科技有限公司 | 一种led模组的构造及其制造工艺 |
WO2015074551A1 (zh) * | 2013-11-21 | 2015-05-28 | 何文铭 | 一种led模组结构及led模组的制造工艺 |
CN105782909A (zh) * | 2014-12-23 | 2016-07-20 | 常州星宇车灯股份有限公司 | 采用光波导的激光照明光源 |
CN108417697A (zh) * | 2018-02-28 | 2018-08-17 | 易美芯光(北京)科技有限公司 | 一种可调光谱光源实现白光的方法 |
CN109643748A (zh) * | 2016-09-01 | 2019-04-16 | 日机装株式会社 | 光半导体装置及光半导体装置的制造方法 |
CN112259659A (zh) * | 2019-07-22 | 2021-01-22 | 深圳市聚飞光电股份有限公司 | 半导体封装器件、发光装置及半导体集成电路的制作方法 |
CN112259669A (zh) * | 2019-07-22 | 2021-01-22 | 深圳市聚飞光电股份有限公司 | 半导体封装器件、发光装置及半导体集成电路的制作方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102537900A (zh) * | 2012-01-12 | 2012-07-04 | 东莞市登大电子材料有限公司 | 一种新型电路连接件和灯泡壳体 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1463047A (zh) * | 2002-05-30 | 2003-12-24 | 光颉科技股份有限公司 | 提高发光二极管亮度的封装方法 |
JP2005243658A (ja) * | 2003-12-25 | 2005-09-08 | Ngk Spark Plug Co Ltd | 発光ダイオードパッケージ |
KR100593943B1 (ko) * | 2005-04-30 | 2006-06-30 | 삼성전기주식회사 | 발광 다이오드 패키지의 제조 방법 |
-
2007
- 2007-01-11 CN CNB2007100263168A patent/CN100438111C/zh not_active Expired - Fee Related
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101794855B (zh) * | 2009-01-30 | 2013-04-03 | 日亚化学工业株式会社 | 半导体发光装置及半导体发光装置的制造方法 |
CN103032684A (zh) * | 2009-03-26 | 2013-04-10 | 东芝照明技术株式会社 | 发光设备及其制造方法 |
CN102804425A (zh) * | 2009-06-26 | 2012-11-28 | 法国圣戈班玻璃厂 | 集成了调制折射率的平面光学元件的电致发光二极管 |
CN102471895A (zh) * | 2010-05-20 | 2012-05-23 | Jx金属商事株式会社 | 表面具有氧化层的电镀银和/或电镀银合金的镀件 |
CN102471895B (zh) * | 2010-05-20 | 2013-12-18 | Jx金属商事株式会社 | 表面具有氧化层的电镀银和/或电镀银合金的镀件 |
CN102376842A (zh) * | 2010-08-11 | 2012-03-14 | 亿广科技(上海)有限公司 | 发光二极管封装结构 |
CN102420282A (zh) * | 2010-09-27 | 2012-04-18 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN102420282B (zh) * | 2010-09-27 | 2014-07-02 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN102130240B (zh) * | 2011-02-22 | 2012-11-14 | 史杰 | 金属支架式led芯片封装工艺 |
CN102130240A (zh) * | 2011-02-22 | 2011-07-20 | 史杰 | 金属支架式led芯片封装工艺 |
CN102800788A (zh) * | 2012-07-23 | 2012-11-28 | 厦门市朗星节能照明股份有限公司 | Led封装结构及其镀银基板 |
CN102800788B (zh) * | 2012-07-23 | 2015-05-27 | 厦门市朗星节能照明股份有限公司 | Led封装结构及其镀银基板 |
CN103280505A (zh) * | 2013-03-08 | 2013-09-04 | 友达光电股份有限公司 | 发光二极管阵列的制作方法及发光二极管显示装置的制法 |
CN104659028B (zh) * | 2013-11-21 | 2018-06-08 | 莆田康布斯光电科技有限公司 | 一种led模组的构造及其制造工艺 |
CN104659028A (zh) * | 2013-11-21 | 2015-05-27 | 福建省万邦光电科技有限公司 | 一种led模组的构造及其制造工艺 |
WO2015074551A1 (zh) * | 2013-11-21 | 2015-05-28 | 何文铭 | 一种led模组结构及led模组的制造工艺 |
CN105782909A (zh) * | 2014-12-23 | 2016-07-20 | 常州星宇车灯股份有限公司 | 采用光波导的激光照明光源 |
CN105782909B (zh) * | 2014-12-23 | 2021-12-28 | 常州星宇车灯股份有限公司 | 采用光波导的激光照明光源 |
CN104613379B (zh) * | 2015-02-06 | 2017-12-26 | 东莞佰鸿电子有限公司 | 一种蓝宝石印刷电路板led灯具及其制作方法 |
CN104613379A (zh) * | 2015-02-06 | 2015-05-13 | 东莞佰鸿电子有限公司 | 一种蓝宝石印刷电路板led灯具及其制作方法 |
CN109643748A (zh) * | 2016-09-01 | 2019-04-16 | 日机装株式会社 | 光半导体装置及光半导体装置的制造方法 |
CN108417697A (zh) * | 2018-02-28 | 2018-08-17 | 易美芯光(北京)科技有限公司 | 一种可调光谱光源实现白光的方法 |
CN112259659A (zh) * | 2019-07-22 | 2021-01-22 | 深圳市聚飞光电股份有限公司 | 半导体封装器件、发光装置及半导体集成电路的制作方法 |
CN112259669A (zh) * | 2019-07-22 | 2021-01-22 | 深圳市聚飞光电股份有限公司 | 半导体封装器件、发光装置及半导体集成电路的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100438111C (zh) | 2008-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100438111C (zh) | 发光二极管封装结构的制作方法 | |
CN100423306C (zh) | 发光二极管封装的制造方法 | |
CN103718314B (zh) | 发光装置 | |
US8471287B2 (en) | LED package and method for making the same | |
TWI528508B (zh) | 高功率發光二極體陶瓷封裝之製造方法 | |
US7485480B2 (en) | Method of manufacturing high power light-emitting device package and structure thereof | |
CN102544340B (zh) | Led封装结构以及制造它使用的引线框架 | |
US20040000727A1 (en) | LED package and the process making the same | |
CN101355126B (zh) | 侧面发光型发光二极管封装体及其制造方法 | |
TW200923262A (en) | High heat dissipation optic module for light emitting diode and its manufacturing method | |
US20130045550A1 (en) | Package substrate for optical element and method of manufacturing the same | |
CN102593333B (zh) | 发光装置封装及其制造方法 | |
CN201017901Y (zh) | 发光二极管的封装结构 | |
CN104037302B (zh) | 一种led封装组件 | |
CN102683546B (zh) | 半导体封装结构与其制造方法 | |
CN107123721B (zh) | 一种带透镜式led封装结构及封装方法 | |
TW200905912A (en) | Light emitting diode packaging structure and manufacturing method thereof | |
CN103972223B (zh) | Led多杯集成一体化cob光源及其封装方法 | |
KR101363980B1 (ko) | 광 모듈 및 그 제조 방법 | |
CN214099645U (zh) | 一种用于led封装体的支架及led封装体 | |
CN101226975A (zh) | 高功率发光二极管芯片封装结构与制造方法 | |
CN208835057U (zh) | 一种led灯 | |
CN206340574U (zh) | 一种qfn表面贴装式rgb‑led封装支架 | |
CN206992109U (zh) | 一种户外大间距led器件及led显示屏 | |
CN214068745U (zh) | 采用倒装晶片的新型灯珠结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GUANGDONG YINYU SEMICONDUCTOR CO., LTD. Free format text: FORMER OWNER: HESHAN LIDE ELECTRONIC INDUSTRY CO., LTD. Effective date: 20110117 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 529728 NO.301, XIANGHE ROAD, GONGHE TOWN, HESHAN CITY, GUANGDONG PROVINCE TO: 529700 NO.1, KEYUAN WEST ROAD, HIGH-TECH ZONE, JIANGMEN CITY, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20110117 Address after: High tech Zone of Guangdong city in Jiangmen province 529700 Keyuan Road No. 1 Patentee after: Guangdong Yinyu Chip Semiconductor Co., Ltd. Address before: 529728 Guangdong City, Heshan Province town of peace road, No. 301 Patentee before: Heshan Lide Electronic Industry Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081126 Termination date: 20160111 |
|
CF01 | Termination of patent right due to non-payment of annual fee |