CN201680214U - 一种使用交流电的发光器件 - Google Patents
一种使用交流电的发光器件 Download PDFInfo
- Publication number
- CN201680214U CN201680214U CN2010202131349U CN201020213134U CN201680214U CN 201680214 U CN201680214 U CN 201680214U CN 2010202131349 U CN2010202131349 U CN 2010202131349U CN 201020213134 U CN201020213134 U CN 201020213134U CN 201680214 U CN201680214 U CN 201680214U
- Authority
- CN
- China
- Prior art keywords
- substrate
- utmost point
- diode
- luminescent device
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202131349U CN201680214U (zh) | 2010-05-24 | 2010-05-24 | 一种使用交流电的发光器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202131349U CN201680214U (zh) | 2010-05-24 | 2010-05-24 | 一种使用交流电的发光器件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201680214U true CN201680214U (zh) | 2010-12-22 |
Family
ID=43345258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010202131349U Expired - Lifetime CN201680214U (zh) | 2010-05-24 | 2010-05-24 | 一种使用交流电的发光器件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201680214U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101886759A (zh) * | 2010-05-24 | 2010-11-17 | 晶科电子(广州)有限公司 | 一种使用交流电的发光器件及其制造方法 |
CN104994634A (zh) * | 2015-06-29 | 2015-10-21 | 宝钢金属有限公司 | 一种ac-led集成芯片 |
-
2010
- 2010-05-24 CN CN2010202131349U patent/CN201680214U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101886759A (zh) * | 2010-05-24 | 2010-11-17 | 晶科电子(广州)有限公司 | 一种使用交流电的发光器件及其制造方法 |
CN101886759B (zh) * | 2010-05-24 | 2012-07-25 | 晶科电子(广州)有限公司 | 一种使用交流电的发光器件及其制造方法 |
CN104994634A (zh) * | 2015-06-29 | 2015-10-21 | 宝钢金属有限公司 | 一种ac-led集成芯片 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Light emitting device using alternating current and manufacturing method thereof Effective date of registration: 20110822 Granted publication date: 20101222 Pledgee: Bank of China, Limited by Share Ltd, Guangzhou, Nansha branch Pledgor: APT (Guangzhou) Electronics Ltd. Registration number: 2011990000321 |
|
AV01 | Patent right actively abandoned |
Granted publication date: 20101222 Effective date of abandoning: 20120725 |
|
AV01 | Patent right actively abandoned |
Granted publication date: 20101222 Effective date of abandoning: 20120725 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20121015 Granted publication date: 20101222 Pledgee: Bank of China, Limited by Share Ltd, Guangzhou, Nansha branch Pledgor: APT (Guangzhou) Electronics Ltd. Registration number: 2011990000321 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model |