CN201804867U - 一种由倒装发光单元阵列组成的发光器件 - Google Patents
一种由倒装发光单元阵列组成的发光器件 Download PDFInfo
- Publication number
- CN201804867U CN201804867U CN2010205201146U CN201020520114U CN201804867U CN 201804867 U CN201804867 U CN 201804867U CN 2010205201146 U CN2010205201146 U CN 2010205201146U CN 201020520114 U CN201020520114 U CN 201020520114U CN 201804867 U CN201804867 U CN 201804867U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led chip
- light
- metal line
- utmost point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 239000002184 metal Substances 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000004020 luminiscence type Methods 0.000 claims description 36
- 230000004888 barrier function Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205201146U CN201804867U (zh) | 2010-09-01 | 2010-09-01 | 一种由倒装发光单元阵列组成的发光器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205201146U CN201804867U (zh) | 2010-09-01 | 2010-09-01 | 一种由倒装发光单元阵列组成的发光器件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201804867U true CN201804867U (zh) | 2011-04-20 |
Family
ID=43874370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205201146U Expired - Lifetime CN201804867U (zh) | 2010-09-01 | 2010-09-01 | 一种由倒装发光单元阵列组成的发光器件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201804867U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103715315A (zh) * | 2013-11-29 | 2014-04-09 | 南京大学扬州光电研究院 | 一种金属反射镜电极高压led芯片的制备方法 |
-
2010
- 2010-09-01 CN CN2010205201146U patent/CN201804867U/zh not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103715315A (zh) * | 2013-11-29 | 2014-04-09 | 南京大学扬州光电研究院 | 一种金属反射镜电极高压led芯片的制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101886759B (zh) | 一种使用交流电的发光器件及其制造方法 | |
CN201741721U (zh) | 板上芯片发光二极管结构 | |
CN101982883A (zh) | 一种由倒装发光单元阵列组成的发光器件及其制造方法 | |
CN102709278A (zh) | 荧光薄膜平面薄片式led阵列光源 | |
TW201115716A (en) | LED package structure for generating similar-circle light-emitting effect by single wire or dual wire bonding method alternatively | |
CN102214776A (zh) | 发光二极管封装结构、照明装置及发光二极管封装用基板 | |
CN103545337A (zh) | 由倒装发光单元阵列组成的立体发光器件及其制造方法 | |
CN101958387A (zh) | 新型led光源模组封装结构 | |
CN201804867U (zh) | 一种由倒装发光单元阵列组成的发光器件 | |
CN202259411U (zh) | 带有镶嵌陶瓷板的led光源封装结构 | |
CN101609864A (zh) | 发光二极管封装结构及封装方法 | |
CN202712178U (zh) | 由倒装发光单元阵列组成的立体发光器件 | |
CN203026552U (zh) | Led发光元器件支架 | |
CN102208402B (zh) | 具有高显色性的led芯片模块、白光led器件及其制造方法 | |
CN202167489U (zh) | 大功率led的cob矩阵封装结构 | |
CN201680214U (zh) | 一种使用交流电的发光器件 | |
CN201994294U (zh) | 板上芯片封装结构以及led灯珠 | |
CN201412705Y (zh) | 高效散热led照明光源 | |
CN202003993U (zh) | 一种大功率led封装结构 | |
CN204257641U (zh) | 具透光平板的发光装置 | |
CN102005445A (zh) | Led光源模块封装结构 | |
CN203800084U (zh) | 一种立体发光led器件 | |
CN102983123A (zh) | 一种具有上下电极led芯片陶瓷基板的led集成模块及其集成封装工艺 | |
CN102969433A (zh) | Led晶片模组化封装工艺 | |
CN203746897U (zh) | 一种led |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Luminescent device formed by inverted luminous cell array and manufacture method thereof Effective date of registration: 20110822 Granted publication date: 20110420 Pledgee: Bank of China, Limited by Share Ltd, Guangzhou, Nansha branch Pledgor: APT (Guangzhou) Electronics Ltd. Registration number: 2011990000321 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20121015 Granted publication date: 20110420 Pledgee: Bank of China, Limited by Share Ltd, Guangzhou, Nansha branch Pledgor: APT (Guangzhou) Electronics Ltd. Registration number: 2011990000321 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Luminescent device formed by inverted luminous cell array and manufacture method thereof Effective date of registration: 20121015 Granted publication date: 20110420 Pledgee: Bank of China, Limited by Share Ltd, Guangzhou, Nansha branch Pledgor: APT (Guangzhou) Electronics Ltd. Registration number: 2012990000604 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 511458 Nansha District, Guangzhou, South Ring Road, No. 33, No. Patentee after: GUANGDONG APT ELECTRONICS LTD. Address before: 3, 511458 floor, International Conference Center, Nansha Information Technology Park, Guangzhou, Nansha District, Guangdong Patentee before: APT (Guangzhou) Electronics Ltd. |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20160214 Registration number: 2012990000604 Pledgor after: GUANGDONG APT ELECTRONICS LTD. Pledgor before: APT (Guangzhou) Electronics Ltd. |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20160217 Granted publication date: 20110420 Pledgee: Bank of China, Limited by Share Ltd, Guangzhou, Nansha branch Pledgor: GUANGDONG APT ELECTRONICS LTD. Registration number: 2012990000604 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110420 |