CN102969433A - Led晶片模组化封装工艺 - Google Patents

Led晶片模组化封装工艺 Download PDF

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Publication number
CN102969433A
CN102969433A CN2012105167473A CN201210516747A CN102969433A CN 102969433 A CN102969433 A CN 102969433A CN 2012105167473 A CN2012105167473 A CN 2012105167473A CN 201210516747 A CN201210516747 A CN 201210516747A CN 102969433 A CN102969433 A CN 102969433A
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Prior art keywords
led
wire
led chip
wafer
chip
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Pending
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CN2012105167473A
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瞿崧
文国军
严华锋
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Shanghai Dangoo Electronic Trading Co Ltd
Shanghai Dangoo Electronics Co Ltd
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Shanghai Dangoo Electronic Trading Co Ltd
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Priority to CN2012105167473A priority Critical patent/CN102969433A/zh
Priority to PCT/CN2013/000138 priority patent/WO2014086080A1/zh
Publication of CN102969433A publication Critical patent/CN102969433A/zh
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

本发明涉及一种LED晶片模组化封装工艺,具体步骤是:首先将正装或倒装结构的单颗或多颗LED芯片串并联组成LED芯片组,然后用LED芯片贴片设备,将LED芯片组贴到基板或者支架上。单颗或多颗LED芯片串并联组成LED芯片组后,引出导线采用金属导线,金属薄膜导线或者氧化铟锡透明导线,其中,正装LED芯片用金线加上球焊焊点焊接在引出导线上,倒装LED芯片用共晶焊点焊接在引出导线上。LED芯片贴片设备为固晶机或贴片机。本发明使得LED芯片的封装制造工艺更为高效,相比较于传统的LED封装方式,采用最简单的贴片电阻的贴片制造方式,能够大幅提升LED封装制造的速度,增加了产能,同时降低了成本。

Description

LED晶片模组化封装工艺
技术领域
本发明涉及一种LED芯片封装工艺,特别涉及一种模组化的LED芯片封装工艺。
背景技术
    LED是发光二极管 (LED,Lighting emitted diode),是利用在电场作用下,PN结发光的固态发光器件。具有高寿命/环保/节能的特点,是绿色环保的新光源。LED技术日趋发展成熟,目前通常LED发白光是通过蓝色芯片激发黄绿荧光粉,进行波长调和而产生出的白光,市场上大规模生产的暖白光效率达到 120 lm/W,超过大部分传统光源。一般而言,LED是通过MOCVD(Metal-organic Chemical Vapor Deposition,金属有机化合物化学气相沉淀)在蓝宝石衬底或碳化硅衬底上长出p型层、n型层以及p-n结发光层,然后通过点亮、切割、扩散颗粒、分等级等工艺做成不同尺寸的芯片,一般而言有10*10 mil, 10*23 mil, 24*24 mil, 40*40 mil等尺寸,可以承受从10mA~1A的恒流电流驱动。传统的封装是将这些芯片固定在一个封装支架上,通过金线焊接芯片的阴极和阳极,通入电流来驱动LED发出蓝色单波长光,从而激发黄绿荧光粉形成白光。支架一般采用工程塑料或者是带金属热沉的塑料,然后通过底部反射来增加其光萃取率,或者是通过硅胶,树脂或玻璃成型或带二次光学透镜来改变内部材料的折射率,从而增加其出光。
传统的封装方式,对于LED芯片的光利用率相当低,一般来讲,LED芯片背面侧面发出的光经过反射/折射之后,其光利用率不超过40%,而LED芯片在背面侧面发出的光占其整个芯片出光的60%,意味着接近有40%的光是被浪费掉的。另外传统的荧光粉点胶工艺,因为荧光粉贴近温度较高的芯片发热源,从而导致荧光粉效率降低,也会影响出光效果。出光效率的降低则意味着发热量的增加,从而对电子元器件的可靠性产生影响,这都是相互影响的结果。由于LED芯片通过封装成LED组件,然后在分别焊接在铝基板上,配上适合的驱动电源和结构壳体,最后做成整灯进行销售。这中间有过多的环节造成效率和成本的浪费。因此,基于简化的目的,通过设计一种最简单的封装结构,提高整体系统出光效率并降低成本。
发明内容
本发明的目的是为了克服LED芯片封装制造过程中,由于现有制造工艺使LED芯片封装效率低、成本高昂的缺点,提供一种LED晶片模组化封装工艺。
为此,本发明的技术方案是,一种LED晶片模组化封装工艺,具体步骤是:首先将正装或倒装结构的单颗或多颗LED芯片串并联组成LED芯片组,然后用LED芯片贴片设备,将LED芯片组贴到基板或者支架上。
单颗或多颗LED芯片串并联组成LED芯片组后,引出导线采用金属导线,金属薄膜导线或者氧化铟锡透明导线,其中,正装LED芯片用金线加上球焊焊点焊接在引出导线上,倒装LED芯片用共晶焊点焊接在引出导线上。
LED芯片贴片设备为固晶机或贴片机。LED芯片与引出导线焊接所用的焊接材料为焊锡丝、焊锡膏和导电粘结胶。
本发明的有益效果是:本发明的LED晶片模组化封装工艺,使得LED芯片的封装制造工艺更为高效,相比较于传统的LED封装方式,采用最简单的贴片电阻的贴片制造方式,能够大幅提升LED封装制造的速度,增加了产能,同时降低了成本。
附图说明
图1是单颗LED芯片贴在基板上的示意图;
图2是多颗串并联组成的LED芯片模组贴在基板上的示意图。
具体实施方式
下面结合附图和实施例对本发明作进一步说明。
本发明的LED晶片模组化封装工艺,具体步骤是:首先将正装或倒装结构的单颗或多颗LED芯片串并联组成LED芯片组,然后用LED芯片贴片设备,将LED芯片组贴到基板或者支架上。
单颗或多颗LED芯片串并联组成LED芯片组后,引出导线采用金属导线,金属薄膜导线或者氧化铟锡(ITO)透明导线,其中,正装LED芯片用金线加上球焊焊点焊接在引出导线上,倒装LED芯片用共晶焊点焊接在引出导线上。
LED芯片贴片设备为固晶机或贴片机。LED芯片与引出导线焊接所用的焊接材料为焊锡丝、焊锡膏和导电粘结胶。
如图1所示,将单颗水平结构LED芯片2倒装在基板4上,用焊料1将芯片2焊接到 3 焊盘上。 
如图2所示,将多颗串并联组成的水平结构LED芯片2倒装在基板4上,用焊料1将LED芯片2焊接到焊盘3上,再将多块模组化的基板4焊到PCB板6上(铝基板、FR4、FR1、CEM1、CEM3),根据用户需要,将LED颗粒或者LED模组,倒装贴到PCB板上。

Claims (4)

1.一种LED晶片模组化封装工艺,其特征在于,具体步骤是:首先将正装或倒装结构的单颗或多颗LED芯片串并联组成LED芯片组,然后用LED芯片贴片设备,将LED芯片组贴到基板或者支架上。
2.根据权利要求1所述的LED晶片模组化封装工艺,其特征在于:所述单颗或多颗LED芯片串并联组成LED芯片组后,引出导线采用金属导线,金属薄膜导线或者氧化铟锡透明导线,其中,正装LED芯片用金线加上球焊焊点焊接在引出导线上,倒装LED芯片用共晶焊点焊接在引出导线上。
3.根据权利要求1所述的LED晶片模组化封装工艺,其特征在于:所述LED芯片贴片设备为固晶机或贴片机。
4.根据权利要求2所述的LED晶片模组化封装工艺,其特征在于:所述LED芯片与引出导线焊接所用的焊接材料为焊锡丝、焊锡膏和导电粘结胶。
CN2012105167473A 2012-12-06 2012-12-06 Led晶片模组化封装工艺 Pending CN102969433A (zh)

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CN2012105167473A CN102969433A (zh) 2012-12-06 2012-12-06 Led晶片模组化封装工艺
PCT/CN2013/000138 WO2014086080A1 (zh) 2012-12-06 2013-02-16 Led晶片模组化封装工艺

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104485414A (zh) * 2014-12-04 2015-04-01 中山市川祺光电科技有限公司 贴片led灯芯片焊线连线结构及其制作方法
CN111244075A (zh) * 2018-11-28 2020-06-05 深圳Tcl新技术有限公司 Led阵列及led显示屏
CN111244245A (zh) * 2018-11-28 2020-06-05 深圳Tcl新技术有限公司 Led阵列及led显示屏

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101350390A (zh) * 2008-08-21 2009-01-21 旭丽电子(广州)有限公司 一种led封装结构
US20110018021A1 (en) * 2009-07-24 2011-01-27 Lg Innotek Co., Ltd. Light emitting device package and method for fabricating the same
CN202205411U (zh) * 2011-08-17 2012-04-25 深圳市华彩光电有限公司 一种贴片式led显示模组
CN202361105U (zh) * 2011-09-08 2012-08-01 上海新凯元照明科技有限公司 一种三维散热led光源模组

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101740707B (zh) * 2009-12-11 2013-11-06 晶科电子(广州)有限公司 预成型荧光粉贴片及其与发光二极管的封装方法
CN102088017B (zh) * 2010-03-15 2012-07-18 苏州科医世凯半导体技术有限责任公司 Led贴片式封装模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101350390A (zh) * 2008-08-21 2009-01-21 旭丽电子(广州)有限公司 一种led封装结构
US20110018021A1 (en) * 2009-07-24 2011-01-27 Lg Innotek Co., Ltd. Light emitting device package and method for fabricating the same
CN202205411U (zh) * 2011-08-17 2012-04-25 深圳市华彩光电有限公司 一种贴片式led显示模组
CN202361105U (zh) * 2011-09-08 2012-08-01 上海新凯元照明科技有限公司 一种三维散热led光源模组

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104485414A (zh) * 2014-12-04 2015-04-01 中山市川祺光电科技有限公司 贴片led灯芯片焊线连线结构及其制作方法
CN111244075A (zh) * 2018-11-28 2020-06-05 深圳Tcl新技术有限公司 Led阵列及led显示屏
CN111244245A (zh) * 2018-11-28 2020-06-05 深圳Tcl新技术有限公司 Led阵列及led显示屏

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Application publication date: 20130313